MODULE OF APP LPBUC BT57799 Product Specification 1. Introduction 1.1 General Description BT57799 wireless module is designed base on MT7601 . It is a wifi module which can support far than 100M communication.It operates at 2.412~2.462GHz, 2.422~2.452GHz and supports IEEE802.11b/g/n 1T1R , wireless data rate can reach up to 150Mbps. Figure 1 Top View Figure 2 Bottom View Note: The above pictures are for reference only 1.2 Features Operating Frequencies : 2.412~2.462GHz, 2.422~2.
Connect to the external antenna through the IPEX connector Power Supply:3.3V±0.2V 1.3 Applications Imaging platforms (printers, digital still cameras, digital picture frames) Gaming platforms Consumer electronic devices (DTV,DVD players, Blu-ray players.etc.) Tablet, notebook, E-book Other devices which need to be supported by wireless network 2. Functional Block Diagram Figure 3 MT7601UN block diagram 3. Product Technical Specifications 3.
Infrastructure, Working Mode Ad-Hoc 802.11b: 1, 2 ,5.5,11Mbps Wireless Data Rate 802.11g: 6,9,12,18,24,36,48,54Mbps 802.11n: MCS0~7，HT20 reach up to72.2Mbps, HT40 reach up to150Mbps Rx Sensitivity -94dBm (Min) Antenna Type Connect to the external antenna through the Ipex connector Dimension(L*W*H) 15.7x 13x 2.1mm (LxWxH)，Tolerance: ±0.15mm Power Supply 3.3V±0.2V Power Consumption Standby :100mA@3.3V (Max) TX mode :265mA@3.
TX mode 255 265 225 238 RX mode 90 95 92 96 6Mbps 802.11g 54Mbps Supply current Typ. Max. Typ. Max. TX mode 256 264 138 146 RX mode 90 94 95 98 7.2Mbps 802.11n HT20 72.2Mbps Supply current Typ. Max. Typ. Max. TX mode 255 263 152 155 RX mode 90 94 98 99 15Mbps 802.11n HT40 150Mbps Supply current Typ. Max. Typ. Max. TX mode 252 262 138 143 RX mode 90 95 98 99 3.4 RF Specifications 802.11b: ≤-20dB@11Mbps TX Constellation Error(EVM) 802.
4. Pin Assignments Figure 4 Pin Assignments (Top view) Pin No： Pin Name Type Description 1 GND P Ground 2 GND P Ground 3 UDP I/O USB Transmitter/Receiver Differential Pair 4 UDM I/O USB Transmitter/Receiver Differential Pair 5 VDD33 3.
5. Application Information 5.1 Supported Platform Operating System CPU Framework Driver XP/WIN7/WIN8/8.1/WIN10 X86 Platform Enable ARM ,MIPSII Enable Linux（kernel 2.6.24~4.2） 5.2 Typical Application Circuit Figure 5 Recommended Layout Pattern NOTE： USB differential pair need to keep 90ohm impedance.
6. Mechanical Specifications Module dimension: Typical ( L*W * H): 15.7mm*13.0mm*2.1mm Figure 6 Tolerance : +/-0.15mm Module dimension 7. Others 7.1 Package Information Figure 7 Package Information 7.2 Storage Temperature and Humidity 1. Storage Condition: Moisture barrier bag must be stored under 30℃, humidity under 85% RH.
The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity indicator cards must be blue, <30%. 2. Products require baking before mounting if humidity indicator cards reads > 30% temp < 30℃, humidity < 70% RH, over 96 hours. Baking condition: 125℃, 12 hours. Baking times: 1 time. 7.3 Recommended Reflow Profile Reflow soldering shall be done according to the solder reflow profile,Typical Solder Reflow Profile is illustrated in Figures 15.
FCC Warning: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
IC Warning: If the IC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module.
