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TRANSCEIVER MODULE

DATASHEET

The information in this document is subject to change without notice.

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Integrated Transceiver Modules for WLAN 802.11 b/g/n, Bluetooth,

Bluetooth Low Energy (BLE), and ANT

FEATURES

IEEE 802.11b,g,n,d,e,i compliant

 Typical WLAN Transmit Power:

o 20.0dBm, 11 Mbps, CCK (b)

o 14.5dBm, 54 Mbps, OFDM (g)

o 12.5dBm, 65 Mbps, OFDM (n)

 Typical WLAN Sensitivity:

o -89dBm, 8% PER, 11 Mbps

o -76dBm, 10% PER, 54 Mbps

o -73dBm, 10% PER, 65 Mbps

 Bluetooth 2.1+EDR, Power Class 1.5

 Full support for BLE 4.0 and ANT

 Miniature footprint: 18 mm x 13 mm

 Low height profile: 1.9 mm

 U.FL connector for external antenna

 Terminal for PCB/Chip antenna feeds

 Integrated band-pass filter

 Compact design based on Texas

Instruments WL1271L Transceiver

 Seamless integration with TI OMAP™

application processors

 SDIO Host data path interfaces

 Bluetooth Advanced Audio Interfaces

 Low power operation mode

 RoHS compliant

DESCRIPTION

The module is a high performance 2.4GHz

IEEE 802.11 b/g/n, Bluetooth 2.1+EDR, and

Bluetooth Low Energy (BLE) 4.0 radio in a cost

effective, pre-certified footprint.

The module realizes the necessary PHY/MAC

layers to support WLAN applications in

conjunction with a host processor over a SDIO

interface.

The module also provides a Bluetooth platform

through the HCI transport layer. Both WLAN

and Bluetooth share the same antenna port.

Summary of content (29 pages)

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TRANSCEIVER MODULE DATASHEET Integrated Transceiver Modules for WLAN 802.11 b/g/n, Bluetooth, Bluetooth Low Energy (BLE), and ANT FEATURES IEEE 802.11b,g,n,d,e,i compliant  Typical WLAN Transmit Power: o 20.0dBm, 11 Mbps, CCK (b) o 14.5dBm, 54 Mbps, OFDM (g) o 12.5dBm, 65 Mbps, OFDM (n)  Typical WLAN Sensitivity: o -89dBm, 8% PER, 11 Mbps o -76dBm, 10% PER, 54 Mbps o -73dBm, 10% PER, 65 Mbps  Bluetooth 2.1+EDR, Power Class 1.5  Full support for BLE 4.
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TRANSCEIVER MODULE DATASHEET MODULE FOOTPRINT AND PIN DEFINITIONS To apply the module, it is important to use the module pins in your application as they are designated in below and in the corresponding pin definition table found on pages 3 and 4. Not all the pins on the module may be used, as some are reserved for future functionality. Figure 1 Pinout (Top View) The information in this document is subject to change without notice.
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TRANSCEIVER MODULE DATASHEET PIN DESCRIPTIONS Module Pin Name I/O Type Buffer Type Logic Level 1 VBAT PI - - 2 BT_FUNC5 DO 4 mA 1.8 VDC HOST_WU (*) 3 WL_UART_DBG DIO 4 mA 1.8 VDC WL_UART_DBG 4 WLAN_IRQ DO 4 mA 1.8 VDC WLAN Interrupt Request 5 BT_EN DI - 1.8 VDC Bluetooth Enable 6 FM_EN DI - 1.8 VDC NOT SUPPORTED, CONNECT TO GND 7 WL_RS232_RX DI - 1.8 VDC WLAN TEST UART RX (*) 8 WL_RS232_TX DO 4 mA 1.8 VDC WLAN TEST UART TX (*) 9 FM_I2S_FSYNC DO 4 mA 1.
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TRANSCEIVER MODULE DATASHEET Module Pin Name I/O Type Buffer Type Logic Level 32 FM_AUD_LOUT AO - - 33 AUD_FSYNC DIO 4 mA 1.8 VDC PCM I/F 34 HCI_RX DI 8 mA 1.8 VDC Bluetooth HCI UART RX (*) 35 HCI_RTS DO 4 mA 1.8 VDC Bluetooth HCI UART RTS (*) 36 HCI_TX DIO 8 mA 1.8 VDC Bluetooth HCI UART TX 37 AUD_CLK DO 4 mA 1.8 VDC PCM I/F (*) 38 AUD_OUT DO 4 mA 1.8 VDC PCM I/F (*) 39 HCI_CTS DI 4 mA 1.8 VDC Bluetooth HCI UART CTS (*) 40 AUD_IN DI 4 mA 1.
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TRANSCEIVER MODULE DATASHEET ELECTRICAL SPECIFICATIONS The majority of these characteristics are based on controlling and conditioning the tests using the control software application. Other control conditions may require these values to be re-characterized by the customer. Absolute Maximum Ratings Parameter Min Max Unit Power supply voltage (VBAT)(4)(5) -0.5 +5.5 V Digital supply voltage (VIO) -0.5 2.1 V Voltage on any GPIO -0.5 VIO + 0.5 V Voltage on any Analog Pins(3) -0.5 2.
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TRANSCEIVER MODULE DATASHEET General Characteristics Parameter Min WLAN RF frequency range WLAN RF data rate BT RF frequency Range Typ 2412 1 Max Unit 2472 MHz 65 Mbps 2480 MHz 802.11 b/g/n rates supported 2402 Table 4 General Characteristics Power Consumption - WLAN Parameter Test Conditions Min Typ Max Unit CCK (802.11b) TX Current 2437 MHz, VBAT =3.6V, Tamb=+25°C Po=20dBm, 11 Mbps CCK L=1200 bytes, tdelay (idle)=4 S - 280 - mA OFDM (802.11g) TX Current 2437 MHz, VBAT =3.
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TRANSCEIVER MODULE DATASHEET Power Consumption - Bluetooth Parameter Test Conditions Min Typ Max Unit GFSK TX Current Constant Transmit, DH5, PRBS9 - 45 - mA EDR TX Current Constant Transmit, 2DH5,3DH5, PRBS9 - 43 - mA GFSK RX Current Constant Receive, DH1 - 35 - mA EDR RX Current Constant Receive, 2DH5, 3DH5 - 41 - mA Deep Sleep Current Deep Sleep Mode - 70 - µA Typ Max Unit - 16 mA Table 6Bluetooth Power Consumption DC Characteristics – General Purpose I/O Param
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TRANSCEIVER MODULE DATASHEET WLAN RF Characteristics WLAN Transmitter Characteristics (TA=25°C, VBAT=3.6 V) Parameter Test Conditions Min Typ Max Unit 11 Mbps CCK (802.11b) TX Output Power 11 Mbps CCK , 802.11(b) Mask Compliance, 35% EVM RMS power over TX packet - 20 - dBm 9 Mbps OFDM (802.11g) TX Output Power 9 Mbps OFDM , 802.11(g) Mask Compliance, -8 dB EVM RMS power over TX packet - 19 - dBm 54 Mbps OFDM (802.11g) TX Output Power 54 Mbps OFDM, 802.
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TRANSCEIVER MODULE DATASHEET WLAN Receiver Characteristics (TA=25°C, VBAT=3.6 V) [1] Parameter Test Conditions Min Typ Max Unit 1 Mbps CCK (802.11b) RX Sensitivity 8% PER - -97 - dBm 11 Mbps CCK (802.11b) RX Sensitivity 8% PER - -89 - dBm 9 Mbps OFDM (802.11g) RX Sensitivity 10% PER - -90 - dBm 54 Mbps OFDM (802.11g) RX Sensitivity 10% PER - -76 - dBm 6.5 Mbps OFDM (802.11n) RX Sensitivity 10% PER - -91 - dBm 65 Mbps OFDM (802.
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TRANSCEIVER MODULE DATASHEET Bluetooth RF Characteristics Bluetooth Transmitter GFSK Characteristics, Class 1.5 (TA=25°C, VBAT=3.6 V) Parameter Test Conditions Min Typ Max Bluetooth Spec Unit GFSK RF Output Power - 9.5 - - dBm EDR RF Output Power - 7 - Power Control Step Size 2 4 8 2-8 dB EDR Relative Power -2 1 -4/+1 dB dBm Table 10 Bluetooth Transmitter RF Characteristics Bluetooth Receiver Characteristics (TA=25°C, VBAT=3.
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TRANSCEIVER MODULE DATASHEET BluetoothLow Energy RF Characteristics Bluetooth BLE Transmitter GMSK and EDR Characteristics, Class 1.5 (TA=25°C, VBAT=3.6 V) Test Conditions Parameter Min Typ Max BT Spec Unit GMSK RF Output Power - 10 - - dBm Power Control Step Size 2 4 8 2-8 dB (1) BLE spec = 10dBm max can be achieved using normal system losses due to filters etc, or by reducing value through VS command.
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TRANSCEIVER MODULE DATASHEET WLAN POWER-UP SEQUENCE The following sequence describes device power-up from shutdown. Only the WLAN Core is enabled; the Bluetooth and FM cores are disabled. Figure 2 Power-up Sequence Requirements 1. No signals are allowed on the IO pins if no IO power is supplied, because the IOs are not 'failsafe’. Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can tolerate external voltages with no VDDS and DC2DC". 2.
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TRANSCEIVER MODULE DATASHEET WLAN POWER-DOWN SEQUENCE Notes: 1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41) 2. DC_REQ and CLK_REQ are internal signals shown for reference only Figure 3 Module Power-down Sequence Requirements 1. DC_REQ will go low only if WLAN is the only core working. Otherwise if another core is working (e.g BT) it will stay high. 2. CLK_REQ will go low only if WLAN is the only core working. Otherwise if another core is working and using the FREF (e.
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TRANSCEIVER MODULE DATASHEET BLUETOOTH POWER-UP SEQUENCE The following sequence describes device power up from shutdown. Only the Bluetooth core is enabled; the WLAN core is disabled. Notes: 1. (A) After this sequence is completed, the device is in the low VIO-leakage state while in shutdown 2. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41) 3. DC_REQ, CLK_REQ, and FREF are internal signals shown for reference only Figure 4 Bluetooth Power-up Sequence Power up requirements: 1.
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TRANSCEIVER MODULE DATASHEET BLUETOOTH POWER-DOWN SEQUENCE Notes: 1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41) 2. DC_REQ and CLK_REQ are internal signals shown for reference only Figure 5 Bluetooth Power-down Sequence The module indicates completion of Bluetooth power up sequence by asserting HCI_RTS low. This occurs up to 100 ms after BT_EN goes high. The information in this document is subject to change without notice.
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TRANSCEIVER MODULE DATASHEET ENABLE SCHEME The module has 3 enable pins, one for each core: WL_EN, and BT_EN and FM_EN. Presently, there are 2 modes of active operation now supported: WLAN and Bluetooth. It is recommended that the FM_EN pin be grounded to disable the FM section. It is also recommended that the FM section be disabled by Bluetooth HCI commands. 1. Each core is operated independently by asserting each EN signal to Logic '1'.
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TRANSCEIVER MODULE DATASHEET SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS The slow clock is always supplied from an external source. It is input on the SLOW_CLK pin, and can be a digital signal in the range of VIO only. For slow clock frequency and accuracy refer to Table 14. The external slow clock must be stable before the system exits from shut down mode.
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TRANSCEIVER MODULE DATASHEET BLUETOOTHHCI UART Figure 6 Bluetooth UART Timing Table 15 Bluetooth UART Timing The information in this document is subject to change without notice.
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TRANSCEIVER MODULE DATASHEET Figure 7 Bluetooth UART Data Frame Table 16 Bluetooth UART Data Frame The information in this document is subject to change without notice.
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TRANSCEIVER MODULE DATASHEET SDIO INTERFACE TIMING Table 17 SDIO Interface Read (see Figure 8) Figure 8 SDIO Single Block Read Table 18 SDIO Interface Write (see Figure 9) Figure 9 SDIO Single Block Write The information in this document is subject to change without notice.
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TRANSCEIVER MODULE DATASHEET SDIO CLOCK TIMING Table 19 SDIO Clock Timing Figure 10 SDIO Clock Timing The information in this document is subject to change without notice.
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TRANSCEIVER MODULE DATASHEET SOLDERING RECOMMENDATIONS Recommended Reflow Profile for Lead Free Solder Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.” Figure 11 Reflow Profile The information in this document is subject to change without notice.
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TRANSCEIVER MODULE DATASHEET CLEANING SHIPPING, HANDLING, AND STORAGE In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. Handling    Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads.
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TRANSCEIVER MODULE DATASHEET Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. The information in this document is subject to change without notice.
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TRANSCEIVER MODULE DATASHEET AGENCY CERTIFICATIONS FCC ID: XOQTIWIBLECA, 15.247. IC ID: 8521A-TIWIBLECA, RSS 210 Model: AGENCY STATEMENTS Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
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TRANSCEIVER MODULE DATASHEET Industry Canada Statements This device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.
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TRANSCEIVER MODULE DATASHEET OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS The Module has been certified for integration into products only by OEM integrators under the following conditions: This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada m
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TRANSCEIVER MODULE DATASHEET OEM LABELING REQUIREMENTS FOR END-PRODUCT The module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC certification numbers are not visible when the module is installed inside another device, as such the end device into which the module is installed must display a label referring to the enclosed module.
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TRANSCEIVER MODULE DATASHEET OEM END PRODUCT USER MANUAL STATEMENTS The OEM integrator should not provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product.