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ManualsBrandsTRU COMPONENTS ManualsElectronic Component AccessoriesThermoelectric cooler (standard) multi-level 14.6 V 4.2 A 26 W (A x B/C x D/H) 40 x 40/40 x 40/8.1 mm
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Distributed by Conrad Electronic SE • Klaus-Conrad-Str. 1 • D-92240 Hirschau
Datasheet
Item no. 189108
Specification of Thermoelectric Module
Description
The TEC2-127-63-04 is a multistage module designed for greater temperature differential cooling, good for cooling and
heating up to 100 °C applications. It is a 127-63 couples module in size of 40 mm × 40 mm (top) / 40 mm × 40 mm (bottom). If
higher operation or processing temperature is required, please specify, we can design and manufacture according to your special
requirements.
Features Application
High Temperature Differential
No moving parts, no noise, and solid-state
Compact structure, small in size, light in weight
Environmental friendly
RoHS compliant
Precise temperature control
Exceptionally reliable in quality, high performance
Performance Specification Sheet
Th (°C
)
27
50
Hot side temperature at environment: dry air, N
2
DT
max
(°C
)
91
101
Temperature Difference between cold and hot side of the module when
cooling capacity is zero at cold side
U
max
(Voltage)
14.6
16.4
Voltage applied to the module at DT
max
I
max
(Amps)
4.2
4.2
DC current through the modules at DT
max
Q
Cmax
(Watts)
26.0
28.6
Cooling capacity at cold side of the module under DT=0
°C
AC resistance (Ohms)
3.05
3.37
The module resistance is tested under AC
Tolerance (%)
± 10
For thermal and electricity parameters
Geometric Characteristics Dimensions in millimeters
Infrared (IR) Sensors
CCD Sensor
Gas Analyzers
Calibration Equipment
CPU cooler and scientific instrument
Photonic and medical systems
Guidance Systems
Ordering Option
Thickness
(mm)
Flatness/ Parallelism (mm)
Lead wire length(mm)
Standard/Optional length
0:6.95±0.3
0: Face II 0.013/0.013 Face III 0.015/0.015
150±5/Specify
1: 6.95±0.2
1: Face II 0.01/0.01, Face III 0.013/0.013
150±5/Specify
2: 6.95±0.1
2: Face II 0.008/0.008, Face III 0.01/0.01
150±5/Specify
Eg. TF02: Thickness 6.95±0.3(mm) and Face II 0.01/0.01, Face III 0.013/0.013(mm)
Manufacturing Options
A. Solder: C. Ceramics:
1. T100: BiSn (Melting Point=138ºC) 1. Alumina (Al
2
O
3
, white 96%)(AlO)
2. T200: CuSn (Melting Point= 227 °C) 2. Aluminum Nitride (AlN)
B. Sealant: D. Ceramics Surface Options:
1. NS: No sealing (Standard) 1. Blank ceramics (not metalized)
2. SS: Silicone sealant 2. Metalized (Copper-Nickel plating)
3. EPS: Epoxy sealant
4. Customer specify sealing

Summary of content (3 pages)