Toshiba Personal Computer PORTEGE A100 Maintenance Manual TOSHIBA CORPORATION File Number 960-460
Copyright © 2003 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed, with respect to the use of the information contained herein. Toshiba PORTEGE A100 Maintenance Manual First edition October 2003 Disclaimer This manual has been validated and reviewed for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer PORTEGE A100. The procedures described in this manual are intended to help service technicians isola te faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the PORTEGE A100 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 2.5-inch Hard Disk Drive......................................................................................... 1-10 1.3 Keyboard .................................................................................................................. 1-12 1.4 CD-RW/DVD-ROM Drive .........................................
2.15 Wireless LAN Troubleshooting ............................................................................... 2-47 2.16 Bluetooth Troubleshooting ...................................................................................... 2-51 Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ...................................................................
Chapter 4 Replacement Procedures 4.1 Overview .................................................................................................................... 4-1 4.2 Battery pack ............................................................................................................... 4-8 4.3 PC card..................................................................................................................... 4-10 4.4 SD memory card ..................................................
Appendix E Key Layout ..................................................................................................E-1 Appendix F BIOS/KBC/EC Update ...............................................................................F-1 Appendix G Reliability................................................................................................... G-1 Appendix H Key FD.......................................................................................................
Chapter 1 Hardware Overview
1 Hardware Overview 1 1-ii Hardware Overview PORTEGE A100 Maintenance Manual (960-460)
1 Hardware Overview Chapter 1 Contents 1.1 Features ...................................................................................................................... 1-1 1.2 2.5-inch Hard Disk Drive......................................................................................... 1-10 1.3 Keyboard .................................................................................................................. 1-12 1.4 CD-RW/DVD-ROM Drive ...............................................
1 Hardware Overview Figures Figure 1-1 Front of the computer..................................................................................... 1-5 Figure 1-2 System units configuration ............................................................................ 1-5 Figure 1-3 System Block Diagram .................................................................................. 1-6 Figure 1-4 2.5-inch HDD.............................................................................................
1.1 Features 1 1 Hardware Overview Features 1.1 Features The PORTEGE A100 is an ultra thin and lightweight PC realizing cable- less environment on a table by wireless function with a Mobile Intel Pentium M processor realizing high performance. θ Microprocessor Mobile Intel Pentium Processor-M A 1.40GHz Mobile Intel Pentium M with a 1.40GHz internal clock, 400MHz bus and 1.484V core operation. θ Cache memory The Mobile Intel Pentium M processor has 32KB primary cache and 1MB secondary cache (in CPU).
1 Hardware Overview 1.1 Features CRT Supported via a RGB connector. TV-out (depending on the model). Has a TV output terminal. θ Optical device (BTO) Built- in a CD-RW/DVD-ROM drive, CD-ROM drive or DVD- multi drive. θ Keyboard An-easy-to-use 85-key keyboard provides a numeric keypad overlay for fast numeric data entry or for cursor and page control. The keyboard also includes two keys that have special functions in Microsoft Windows XP. It supports software that uses a 101- or 102-key enhanced keyboard.
1.1 Features 1 Hardware Overview θ SD card slot The computer is equipped with a SD Card slot that can accommodate Secure Digital flash memory cards with capacities of 8MB, 16MB, 32MB, 64MB, 256MB and 512MB. SD cards let the user easily transfer data from devices, such as digital cameras and Personal Digital Assistants, that use SD Card flash- memory. The cards have a high- level of security and copy protection features.
1 Hardware Overview 1.1 Features θ Bluetooth (BTO) Depending on the model, the computer is equipped with a dedicated Bluetooth module. This enables a communication to devices that support Bluetooth Version 1.1. It can be switched on or off with a switch on the computer.
1.1 Features 1 Hardware Overview Figure 1-1 shows the front of the computer and Figure 1-2 shows the system units configuration.
1 Hardware Overview 1.1 Features Figure 1-3 shows the system block diagram.
1.1 Features 1 Hardware Overview The PC contains the following components. θ CPU Mobile Intel Pentium M Processor-M • • • • A 1.40GHz Pentium M processor with a 1.40GHz internal clock, 400MHz bus and 1.484V core operation voltage Internal cache memory: 32KB Secondary cache memory: 1MB Internal cache memory: 32KB Integrated NDP θ Memory Two memory slots (DDR266). Memory modules in 256MB and 512MB can be installed to a maximum of 1GB (1,024MB). • 3.
1 Hardware Overview 1.1 Features θ PCI chipset This gate array incorporates the fo llowing elements and functions • North Bridge (Intel Montara GM) − CPU interface and control − DRAM control − AGP master slave interface (Complies with AGP V2.0) − PCI interface (Complies with PCI Rev 2.2) − Built- in graphic (Trident XP) − 555-ball 35x35mm BGA package • South Bridge (Intel ICH4-M) − PCI 3.
1.1 Features 1 Hardware Overview θ PC card controller (YEBISU3S) • • • • • • • • • • • • PCI interface (PCI Revision2) Chipset interface Intel serial interrupt CardBus/PC Card controller (Yenta Version2.2) :2 slots Parallel power supply control (Toshiba style) and serial power supply control (Texas Instruments style) SD memory card controller (SDHC Ver.1.2) SDIO card controller (Ver.1.0) SmartMedia controller (SMHC Ver.01/SMIL 1.
1 Hardware Overview 1.2 1.2 2.5-inch Hard Disk Drive 2.5-inch Hard Disk Drive A compact, high-capacity HDD with a height of 9.5mm. Contains a 2.5- inch magnetic disk and magnetic heads. Figure 1-4 shows a view of the 2.5- inch HDD and Tables 1-1 and 1-2 list the specifications. Figure 1-4 2.5-inch HDD Table 1-1 2.5-inch HDD dimensions Parameter TOSHIBA HDD2182B Standard value TOSHIBA HDD2190B HITACHI GBC0000F410 Outline Width (mm) 69.85 69.85 70.1 max. dimensions Height (mm) 9.5 9.5 9.
1.2 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-2 2.5-inch HDD Specifications Specification Parameter TOSHIBA HDD2182B TOSHIBA HDD2190B HITACHI GBC0000F410 Storage size (formatted) 40GB 40GB 40GB Speed (RPM) Data transfer speed 4,200 154.3-298.0 (Mb/s) Interface transfer rate (MB/s) 175.0-341.7 (Mbits/s) 19.4-37.1 (MB/s) 100 max. (Ultra DMA mode) Track density (Ktpi) 78.9 88.1 70.0 Average seek time (Read) (ms) 12 - 13 typ. 4 typ. 4 typ.
1 Hardware Overview 1.3 1.3 Keyboard Keyboard The keyboard is mounted 85 keys that consist of character key and control key, and in conformity with JIS. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller on the system board. Figure1-5 is a view of the keyboard. See Appendix E about a layout of the keyboard.
1.4 CD-RW/DVD-ROM Drive 1.4 1 Hardware Overview CD-RW/DVD-ROM Drive This drive corresponds CD/CD-ROM (12cm and 8cm), CD-R, CD-RW, DVD-ROM, DVDR and DVD-RW drive and supports format of CD-DA, CD-ROM, Photo CD, CD-I, Video CD, Enhanced CD, CD-TEXT, DVD-ROM, DVD-R and DVD-Video. Table 1-3 CD-RW/DVD-ROM drive dimensions Parameter Standard value Outline Width (mm) 128(Excluding projections) dimensions Height (mm) 12.
1 Hardware Overview 1.5 1.5 CD-ROM Drive CD-ROM Drive This drive corresponds to CD/CD-ROM (12cm and 8cm) disk and supports format of CDDA, CD-ROM, Photo CD and Enhanced CD. This drive reads CD-ROM at maximum 24speed. Table 1-5 CD-ROM drive dimensions Standard value Parameter Outline Width (mm) 128(Excluding a front bezel) dimensions Height (mm) 12.7(Excluding a front bezel) Depth (mm) 129.
1.6 DVD-Multi (CD-R/RW+DVD-RAM/R/RW) Drive 1.6 1 Hardware Overview DVD-Multi (CD-R/RW+DVD-RAM/R/RW) Drive This drive is a combination of CD-R/RW, DVD-R/RW and DVD-RAM Drive. It is full-size and runs either 12cm (4.72- inch) or 8cm (3.15-inch) DVD/CDs without an adaptor.
1 Hardware Overview 1.7 1.7 TFT Color Display TFT Color Display The TFT color display consists of a LCD module and FL inverter board. 1.7.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display images and characters of 262,144 colors with 1024×768 resolution. The video controller is incorporated into the North Bridge (M1644T) chip and can control both internal and external XGA-support displays simultaneously.
1.7 TFT Color Display 1 Hardware Overview 1.7.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-10 lists the FL inverter board specifications. Table 1-10 FL inverter board specifications Specifications Item G71C00011211 Input Voltage (V) Output Voltage MAX (V) 750(MAX) Current MAX (mA) 6.
1 Hardware Overview 1.8 1.8 Power Supply Power Supply The power supply supplies 12 different voltages to the system board. The power supply micro controller has the following functions. 1. Judges that the DC power supply (AC adapter) is connected to the computer. 2. Detects DC output and circuit malfunctions. 3. Controls the battery icon, and DC IN icon. 4. Turns the battery charging system on and off and detects a fully charged battery. 5. Turns the power supply on and off. 6.
1.8 Power Supply 1 Hardware Overview Table 1-11 Power supply output specifications(2/2) Name Voltage [V] Use 1R5-C1V 1.5 1R5-S1V Power circuit 1R5-S1V 1.5 ICH4-M LAN1R5-E1V 1.5 ICH4-M, 82562ET 1R5-P1V 1.5 GMCH-M, ICH4-M MCV 5 PSC M5V 5 PS LEDs, Battery E2PROM S5V 5 Pull-up M3V 3.3 EC/KBC S3V 3.3 ICH4-M R3V 2.8-3.
1 Hardware Overview 1.9 1.9 Batteries Batteries The PC has the following two batteries. θ Main battery θ Real time clock (RTC) battery Table 1-12 lists the specifications for these two batteries. Table 1-12 Battery specifications Battery Name Battery Element Output Voltage Capacity Main battery G71C0000K410 Lithium ion 10.8 V 4,000 mAh Real time clock (RTC) battery GDM710000012 Lithium ion 3V 17 mAh 1.9.
1.9 Batteries 1 Hardware Overview θ Quick Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on and quick charge is used while the system is turned off or in suspend mode. Table 1-13 shows the time required for charging battery. Table 1-13 Time required for charges of battery Main battery Charging Time Second battery Charging Time Normal charge About 3~12 hours About 2.5~9 hours Quick charge About 2.5 hours About 2.
1 Hardware Overview 1.10 AC Adapter 1.10 AC Adapter The AC adapter is also used to charge the battery. Table 1-15 lists the AC adapter specifications. Table 1-15 AC adapter specifications Parameter Specification G71C0002S310 Input voltage Input frequency Input current 1-22 AC 90 to 264V 50Hz/60Hz Less than 71W or 183VA Output voltage DC 15V Output current 4.
Chapter 2 Troubleshooting Procedures
2 Troubleshooting Procedures 2 2-ii PORTEGE A100 Maintenance Manual (960-460)
2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-2 2.3 Power Supply Troubleshooting.................................................................................. 2-6 2.4 2.5 2.6 2.7 Procedure 1 Power Supply Icon Check............................
2 Troubleshooting Procedures 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2.15 2.16 2-iv Display Troubleshooting.......................................................................................... 2-38 Procedure 1 Diagnostic Test Program Execution Check ......................... 2-38 Procedure 2 Connector and Cable Check................................................. 2-38 Procedure 3 Replacement Check..............................................................
2 Troubleshooting Procedures Procedure 3 Antenna Check ..................................................................... 2-53 Procedure 4 Replacement Check.............................................................. 2-53 Figures Figure 2-1 Troubleshooting flowchart ............................................................................. 2-3 Figure 2-2 A set of tool for debug port test ................................................................... 2-19 Figure 2-3 Antenna Test jig ..
2 Troubleshooting Procedures 2-vi PORTEGE A100 Maintenance Manual (960-460)
2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. 2. 3. 4. 5. 6. 7. 8. Power supply System Board 3.5" USB FDD 2.5" HDD Keyboard Display Optical Drive Touch pad 9. Modem 10. LAN 11. Sound 12. SC card slot 13. Wireless LAN 14.
2 Troubleshooting Procedures 2.2 2.2 Troubleshooting Flowchart Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which FRU malfunctions. Before going through the flowchart steps, check the following: q Make sure that Toshiba Windows® XP is installed on the hard disk. Non-Toshiba operating systems can cause the computer malfunction. q Make sure all optional equipment is removed from the computer. q Make sure the USB FDD is empty.
2.
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart 2.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), then perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting Procedures 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting Procedure 1 2 Troubleshooting Procedures Power Supply Icon Check The following two icons indicate the power supply status: q Battery icon q DC IN icon The power supply controller uses the power supply status with the Battery icon and the DC IN icon as listed in the tables below. Table 2-1 Battery icon Battery icon Power supply status Lights orange Battery is charged and the external DC is input. It has no relation with ON/OFF of the system power.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting When icons are blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter and cut off the power supply to the computer by force. 2. Re-attach the battery pack and the AC adapter. If icons are still blinking after the operation above, check the followings: Check 1 If the DC IN icon blinks orange, go to Procedure 2. Check 2 If the DC IN icon does not light, go to Procedure 3.
2.3 Power Supply Troubleshooting Procedure 2 2 Troubleshooting Procedures Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. q Start q Error code (8 bit) “1” “0” Interval between data bits The error code begins with LSB (Least Significant bit) Example: Error code 11h (Error codes are given in hexadecimal format.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting q Main Battery Error code Meaning 20h Overvoltage is detected. 21h Main battery charge current is over 6.05A. 22h Main battery discharge current is over 0.5A when there is no load. 23h Main battery charge current is over 3.1A when AC adapter is not connected. 24h Abnormal current has been sensed 0[A]. 25h Main battery charge current is over 0.3A. q Second Battery Error code Meaning 30h Overvoltage is detected.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures q 1R5-C1 output Error code Meaning 50h 1R5-C1 voltage is over 1.8V when the computer is powered on/off. 51h 1R5-C1 voltage is 1.275V or less when the computer is powered on. 52h 1R5-C1 voltage is 1.275V or less when the computer is booting up. 53h 1R5-C1 voltage is 1.275V or less while the computer is suspended. 54h 1R5-C1 voltage is abnormal during shutdown. (CV support) 55h 1R5-C1 voltage is 1.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting q E5V output (CH0) Error code Meaning 90h E5V voltage is over 6.00V when the computer is powered on/off. 91h E5V voltage is 4.50V or less when the computer is powered on. 92h E5V voltage is 4.50V or less when the computer is booting up. 93h E5V voltage is 4.50V or more when the computer is powered off. 94h E5V voltage is 4.50V or less while the computer is suspended.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures q 1R25-P1V output (CH1) Check 2 Error code Meaning D0h 1R25-P1V voltage is over 1.50V when the computer is powered on/off. D1h 1R25-P1V voltage is 1.063V or less when the computer is powered on. D2h 1R25-P1V voltage is 1.063V or less when the computer is booting up. D3h 1R25-P1V voltage is 1.063V or more when the computer is powered off. D4h 1R25-P1V voltage is 1.063V or less while the computer is suspended.
2 Troubleshooting Procedures Procedure 3 2.3 Power Supply Troubleshooting Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform starting from Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If these cables are connected correctly, go to Check 2. Check 2 Replace the AC adapter and the AC power cord with new ones.
2.3 Power Supply Troubleshooting Procedure 5 2 Troubleshooting Procedures Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4. Check 1 Replace the AC adapter with a new one. If the AC adapter is still not functioning properly, perform Check 2. Check 2 Replace the system board with a new one.
2 Troubleshooting Procedures 2.4 2.4 System Board Troubleshooting System Board Troubleshooting This section describes how to determine if the system board is defective. Start with Procedure 1 and continue with the other procedures as instructed.
2.4 System Board Troubleshooting Procedure 1 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. q If an error message is shown on the display, perform Check 1. q If there is no error message, go to Procedure 2. q If MS-DOS or Windows XP is properly loaded, go to Procedure 4.
2 Troubleshooting Procedures Check 3 2.4 System Board Troubleshooting The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (24) or (25) is displayed, go to Procedure 5. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures in Section 2.7. If error message (19), (20) or (21) is displayed, go to the 2.5” HDD Troubleshooting Procedures in Section 2.6.
2.4 System Board Troubleshooting Procedure 2 2 Troubleshooting Procedures Debug Port (D port) Check on Boot Mode Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows: 1. Connect the debug test cable to the connector PJ325 of the system board. For disassembling to connect the test cable, refer to Chapter 4. 2. Connect the debug port test cable and RS-232C cross-cable to the test board. 3.
2 Troubleshooting Procedures 2.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 D port status (2/7) D port status Inspection items F005h Details Saving scan code Setting TASK_1ms_TSC F006h Controlling fan Initializing sound items (for BEEP) Enabling system speaker Releasing mute Making the volume max. Key input Disabling USB once Beeping Waiting for key-input Reading CHGBIOSA.EXE/CHGFIRMA.EXE Resetting FDC Setting parameters for 2HD(1.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 D port status (3/7) D port status F102h Inspection items Checking and initializing CMOS Details Configuring cache memory Enabling L1/L2 cache memory Testing CMOS for access (only in Cold Boot) When a error is detected, HLT.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 D port status (4/7) D port status Inspection items F105h Details Initializing and testing( only in Cold Boot) a PIT Setting a test pattern to the channel 0 of a PIT#0 Checking whether the test pattern can be read.
2 Troubleshooting Procedures 2.
2.
2 Troubleshooting Procedures 2.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Check 1 If the D port status error code F11Ah is displayed, go to the 3.5” USB FDD Troubleshooting Procedures in Section 2.5 or the 2.5” HDD Troubleshooting Procedures in Section 2.6. Check 2 If any other D port status error code is displayed, perform Procedure 3.
2 Troubleshooting Procedures Procedure 3 2.4 System Board Troubleshooting Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board and I/O unit. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. USB Floppy Disk test 6. Hard Disk test 7. Real Timer test 8. NDP test 9. Expansion test 10. CD-ROM/DVD-ROM 11.
2.5 USB 3.5” FDD Troubleshooting 2 Troubleshooting Procedures 2 2.5 USB 3.5” FDD Troubleshooting This section describes how to determine if the USB 3.5” FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.5 USB 3.5” FDD Troubleshooting Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the FDD of the computer, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-4.
2.5 USB 3.5” FDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector Check and Replacement Check The USB FDD connector may be disconnected from the system board. Check visually that the connector is connected firmly. Check 1 Make sure the USB FDD cable is firmly connected to the PJ4700 or PJ4701 of the system board. System board USB FDD PJ4700 or PJ4701 If any of the connections are loose, reconnect firmly and repeat Procedure 2. If there is still an error, go to Check 2.
2 Troubleshooting Procedures 2.6 2.6 2.5” HDD Troubleshooting 2.5” HDD Troubleshooting This section describes how to determine if the 2.5” HDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Partition Check Procedure 2: Message Check Procedure 3: Format Check Procedure 4: Diagnostic Test Program Execution Check Procedure 5: Connector Check and Replacement Check Caution: The contents of the 2.
2.6 2.5” HDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure of no floppy disk in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
2 Troubleshooting Procedures Procedure 3 2.6 2.5” HDD Troubleshooting Format Check The computer’s 2.5" HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the 2.5" HDD, start with Check 1 below and perform the other steps as required. Refer to the MS-DOS Manual for the operation of MS-DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format the 2.5" HDD using MS-DOS FORMAT command. Type as FORMAT C:/S/U. If the 2.
2.6 2.5” HDD Troubleshooting Procedure 4 2 Troubleshooting Procedures Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-5.
2 Troubleshooting Procedures Procedure 5 2.6 2.5” HDD Troubleshooting Connector Check and Replacement Check The HDD is connected to the connector PJ1800 of the system board. The connecting portion may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks to check the connecting portion: Check 1 Make sure the HDD is firmly connected to the system board.
2.7 Keyboard Troubleshooting 2.7 2 Troubleshooting Procedures Keyboard Troubleshooting To determine if the computer’s keyboard is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test in the Diagnostic Program.
2 Troubleshooting Procedures 2.8 2.8 Display Troubleshooting Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Cable Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check The Display Test program is stored on the Diagnostics disk.
2.8 Display Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check The display unit has a FL inverter board, Display module, System board, LCD harness and Display ON/OFF sensor. Any of the components may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, then perform the following che cks: (1) If characters or graphics are not displayed on the internal display, perform Check 1.
2 Troubleshooting Procedures 2.9 2.9 Optical drive Troubleshooting Optical drive Troubleshooting To check if the optical drive is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program.
2.10 Touch Pad Troubleshooting 2 Troubleshooting Procedures 2.
2 Troubleshooting Procedures 2.11 Modem Troubleshooting 2.11 Modem Troubleshooting To check if the modem is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Modem test program available as part of the maintenance test program. This program checks the modem.
2.12 LAN Troubleshooting 2 Troubleshooting Procedures 2.12 LAN Troubleshooting To check if the computer’s LAN is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check To check the LAN function, execute the LAN test program subtest 03 (LAN loop-back test). See Chapter 3 for information on how to perform the test.
2 Troubleshooting Procedures 2.13 Sound Troubleshooting 2.13 Sound Troubleshooting To check if the sound function is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound test program available as part of the maintenance test program.
2.13 Sound Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check Check 1 If the speaker or internal microphone is not working properly, it may be faulty. Replace it with a new one following the step in Chapter 4. If they are still not working properly, go to Check 3. Check 2 If the external microphone or the headphone is not working properly, the system board may be faulty. Replace it with a new one following the step in Chapter 4.
2 Troubleshooting Procedures 2.14 SD Card Slot Troubleshooting 2.14 SD Card Slot Troubleshooting To check if the SD card/Smart Media slot is good or no good, follow the troubleshooting procedures below as instructed. Procedure 1: Check on Windows XP Procedure 2: Connector/Replacement Check Procedure 1 Check on Windows XP Insert the SD card into the slot. Check if the installed Windows recognizes automatically the SD card and the data in the SD card can be read.
2.15 Wireless LAN Troubleshooting 2 Troubleshooting Procedures 2.15 Wireless LAN Troubleshooting To check if the Wireless LAN is good or no good, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting- Receiving Check Procedure 2: Antenna Connection Check Procedure 3: Antenna Capability Check Procedure 4: Replacement Check Procedure 1 Transmitting-Receiving Check Make sure the wireless communication switch on the computer is turned ON. If it is not, turn ON.
2 Troubleshooting Procedures Procedure 2 2.15 Wireless LAN Troubleshooting Antenna Connection Check The wireless LAN function wiring diagram is shown below: PJ2102 Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, perform the following checks: Check 1 The wireless LAN board and the system board may be disconnected. Make sure the wireless LAN board is firmly connected to the PJ2101 of the system board.
2.15 Wireless LAN Troubleshooting Procedure 3 2 Troubleshooting Procedures Antenna Capability Check Use an antenna test cable to check the antennas' connection. Follow the steps below. Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, perform the following checks: 1. Disassemble the computer and disconnect the wireless LAN antennas (white and black) from the wireless LAN board.
2 Troubleshooting Procedures Procedure 4 2.15 Wireless LAN Troubleshooting Replacement Check Check if the wireless LAN board, the connector board and the system board are connected properly. Any of these components may be damaged. Disassemble the computer following the steps described in Chapter 4 and replace the board with a new one. Check 1 The wireless LAN board may be defective or damaged. Disassemble the computer following the steps described in Chapter 4 and replace the board with a new one.
2.16 Bluetooth Troubleshooting 2 Troubleshooting Procedures 2.16 Bluetooth Troubleshooting This section describes how to determine if the computer's Bluetooth is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.16 Bluetooth Troubleshooting Antennas' Connection Check The Bluetooth function wiring diagram is shown below: PJ3002 Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch is “On”. If the switch is “Off”, turn it “On”. If the Bluetooth module is still not functioning properly, perform Check 2.
2.16 Bluetooth Troubleshooting Procedure 3 Check 1 2 Troubleshooting Procedures Antenna Check Use an antenna test cable to check the antennas' connection. Follow the steps below: 1. Disassemble the computer and disconnect the Bluetooth antenna cable connected to the Bluetooth module. Refer to Chapter 4, Replacement Procedures, for detailed steps of disassembling. 2. Connect the end of the antenna test cable to the multimeter. 3. Connect the Bluetooth antenna cable to the antenna test cable.
2 Troubleshooting Procedures 2-54 2.
Chapter 3 Tests and Diagnostics
3 Tests and Diagnostics 3 3-ii PORTEGE A100 Maintenance Manual (960-460)
3 Tests and Diagnostics Chapter 3 Contents 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ................................................................................... 3-3 3.3 Subtest ........................................................................................................................ 3-7 3.4 System Test.........................................................
3 Tests and Diagnostics 3.23 3.24 3.25 3.26 Running Test............................................................................................................ 3-55 3.23.1 Function Description.......................................................................... 3-55 3.23.2 Operations ........................................................................................... 3-55 Floppy Disk Drive Utilities....................................................................................
3.1 The Diagnostic Test 3 3 Tests and Diagnostics Tests and Diagnostics 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test program to test the functions of the computer’s hardware modules. They are grouped into the Service Program Modules and the Test Program Modules. The Diagnostic Test consists of 10 programs. Wireless LAN test, Sound/LAN/modem test, Bluetooth test and IEEE1394 test are also supported. Note: To start the diagnostics, follow these steps: 1.
3 Tests and Diagnostics 3.1 The Diagnostic Test You will need the following equipment to perform some of the Diagnostic test programs.
3.2 Executing the Diagnostic Test 3.2 3 Tests and Diagnostics Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the test program disk (No.1) in the floppy disk drive. 2. Release the lock of the power switch and turn on the computer by pressing the F12. Select the FDD in the display for selecting booting unit. Then press ENTER and the following menu appears: TOSHIBA personal Computer XXXX DIAGNOSTICS version XXX (c) Copyright TOSHIBA Corp.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test 3. Set the highlight bar to 1 and press Enter. The following TEST MENU will appear: TOSHIBA Personal Computer XXXX DIAGNOSTICS Version XXX (c) Copyright TOSHIBA Corp.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 4. Select the option you want to execute on the test menu and press Enter.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Selecting NO in TEST LOOP terminates the test and returns to the subtest menu after one test cycle is complete.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the option to execute and press Enter. Selecting YES in ERROR STOP stops the test program when an error is occurred and displays the error status.
3 Tests and Diagnostics 3.3 3.3 Subtest Subtest Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. 1 2 3 4 3-8 Test Name SYSTEM MEMORY KEYBOARD DISPLAY Subtest No.
3.3 Subtest 3 Tests and Diagnostics Table 3-1 Subtest names (2/2) No. 5 8 9 Test Name FLOPPY DISK HARD DISK REAL TIMER Subtest No.
3 Tests and Diagnostics 3.4 3.4 System Test System Test To execute the System Test, select 1-SYSTEM TEST from the DIAGNOSTIC TEST menu, press Enter and follow the directions on the screen. The System test consists of five subtests. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM Checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board.
3.4 System Test Subtest 07 3 Tests and Diagnostics DMI read This subtest displays the information in the Flash-ROM in the following format. Model Name Version Number Serial Number Model Number PCN/BND Number UUID Number : : : : : : XXXXXXXXXXX XXXXXXXXXXXX XXXXXXXX XXXXXX-XXXXX XXXXXXXXXXXX/XXXXXXXXXXX XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX Press [Enter] to EXIT To exit this subtest and return to the SYSTEM test menu, press Enter. Subtest 08 DMI write The following messages appear in order.
3 Tests and Diagnostics Subtest 10 3.4 System Test Temperature surveillance test This subtest measures the CPU temperature to see if the cooling functions of the computer are effectively working. When the subtest starts, the following message appears on the display: CPU TEMP = XX deg C Throttling level = XXXXh The number of the CPU TEMP indicates the CPU temperature at the moment in decimal notation. For example, if the number is 37, the CPU temperature is 37 degrees.
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3 Tests and Diagnostics 3.5 3.5 Memory Test Memory Test To execute the Memory Test, select 2-MOMORY TEST from the DIAGNOSTIC TEST menu, press Enter and follow the directions on the screen. The Memory test consists of five subtests. Set the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional Memory This subtest writes test data to conventional memory (0 to 640 KB), and reads and compares the result with the original data. The test address is displayed per 4 KB.
3.5 Memory Test Subtest 06 3 Tests and Diagnostics Stress This test prepares the write/read buffer (size:1b30h) and produce write date in the write buffer. The write data is written in the area larger than 1 MB and read into the read buffer then repeated to compare until maximum size. Test data: ffh, ffh, ffh, ffh, ffh 00h, 00h, 00h, 00h, 00h ffh, ffh, ffh, 00h, ffh 00h, 00h, 00h, ffh, 00h 00h, ffh, ffh, ffh, ffh 00h, 00h, 00h, 00h, aah These data are generated repeatedly by 1b30h size.
3 Tests and Diagnostics 3.6 3.6 Keyboard Test Keyboard Test To execute the Keyboard Test, select 3-KEYBOARD TEST from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Keyboard test contains six subtests that test the computer’s keyboard actions. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key display When you execute this subtest, the keyboard layout is drawn on the display as shown below.
3.6 Keyboard Test 3 Tests and Diagnostics PRESS [Enter] KEY Subtest 05 USB Port 1,2 test This subtest checks USB. The USB TEST Module (ZD0003P01) and USB Cable (ZD0003P02) must be connected to the computer. The following message will appear. Select a port to be tested and press Enter. Test port number select (1:Port1, 2:Port1, 0:Port1&2) ? If the test ends successfully, OK is displayed. If nothing is displayed, there may be a problem with the USB port.
3 Tests and Diagnostics Subtest 06 3.6 Keyboard Test Touch Pad test This subtest checks the functions of the pointing device as shown below. A) Direction of touch pad. B) Touch pad switch function check. This test reports the response of touch pad, and touch pad switch. When you touch the touch pad and slide your finger towards the upper left, the display changes according to the following illustration.
3.6 Keyboard Test Subtest 07 3 Tests and Diagnostics Internet button test This subtest checks moving of the Internet button. Press the Internet button after the following message appears. Press [Internet button] button If the test ends successfully, the display returns to the KEYBOARD TEST menu. Subtest 08 Mail button test This subtest checks moving of the Mail button. Press the Mail button after the following message appears.
3 Tests and Diagnostics 3.7 3.7 Display Test Display Test To execute the Display Test, select 4-DISPLAY TEST from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Display test contains eight subtests that test the display in various modes. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM Read/Write for VGA This subtest writes the constant data (AAh and 55h) and the address data to the video RAM (16MB).
3.7 Display Test Subtest 04 3 Tests and Diagnostics Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 64K] 640*480 16M] 800*600 64K] 800*600 16M] 1024*768 64K] 1024×768 16M] The display below appears on the screen when this subtest is executed.
3 Tests and Diagnostics Subtest 06 3.7 Display Test “H” Pattern Display This subtest displays a full screen of “H” patterns.
3.8 USB Floppy Disk Test 3.8 3 Tests and Diagnostics USB Floppy Disk Test Caution: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. Otherwise, the contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5-FLOPPY DISK TEST from the DIAGNOSTIC TEST MENU, press Enter. 1. The following message will appear.
3 Tests and Diagnostics Subtest 01 3.8 USB Floppy Disk Test Sequential read This subtest performs a Cyclic Redundancy Check (CRC) that continuously reads all the tracks (track: 0 to 39/0 to 79) on a floppy disk. The start track is specified at the start of the FDD test. Subtest 02 Sequential read/write This subtest continuously writes data pattern B5ADADh to all the tracks (track: 0 to 39/0 to 79) on a floppy disk. The data is then read and compared to the original data.
3.9 Hard Disk Test 3.9 3 Tests and Diagnostics Hard Disk Test To execute the Hard Disk Test, select 8-HARD DISK TEST from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. The hard disk test contains eight subtests that test the hard disk drive functions. Caution: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 09or 10 is executed.
3 Tests and Diagnostics Subtest 01 3.9 Hard Disk Test Sequential read This subtest is a sequential reading of all the tracks on the HDD starting at track 0 to maximum track. When all the tracks on the HDD have been read, the test starts at the maximum track and reads the tracks on the HDD sequentially back to track 0. Subtest 02 Address uniqueness This subtest writes unique address data to each sector of the HDD track-by-track.
3.9 Hard Disk Test Subtest 04 3 Tests and Diagnostics Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder (to check the data interference in the neighbor track) to compare. After the third pass, it tests the motor-off function. (HDD motor is turned off, stops for 20 minutes and is turned on.
3 Tests and Diagnostics 3.10 Real Timer Test 3.10 Real Timer Test To execute the Real Timer Test, select 9-REAL TIMER TEST from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The real timer test contains three subtests. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time This subtest displays and changes the current date and time stored in the real time clock.
3.10 Real Timer Test Subtest 03 Caution: 3 Tests and Diagnostics Real time carry When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increments. Make sure the date and time are displayed in the following format and they move forward correctly. Current date : Current time : 12-31-1999 23:59:58 PRESS [Enter] KEY TO EXIT TEST Press Enter to exit.
3 Tests and Diagnostics 3.11 NDP Test 3.11 NDP Test To execute the NDP test, select 10-NDP TEST from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The NDP test contains one subtest. Subtest 01 NDP This test checks the following functions of NDP. This test can be executed when NDP is installed. NDP is installed when the bit 1 of configuration byte is “1”. q q q q q Control word Status word Bus Addition Multiplication Press Ctrl + Break to exit.
3.12 Expansion Test 3 Tests and Diagnostics 3.12 Expansion Test To execute the expansion test, select 11-EXPANSION TEST from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The expansion test contains three subtests. Note: To execute this subtest, the PC card wraparound connector is required.
3 Tests and Diagnostics Subtest 03 3.12 Expansion Test RGB monitor ID test Connect a CRT monitor for this subtest. This subtest is conducted with VESA commands.
3.13 CD-ROM/DVD-ROM Test 3 3 Tests and Diagnostics Tests and Diagnostics 3.13 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM Test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The CD-ROM/DVD-ROM Test contains five subtests that test the modem functions. Note: For the subtest 01, 02 and 03, use the dedicated test media: TOSHIBA CD-ROM TEST DISK for CD-ROM and DVD-ROM TESTDISC TSD-1 for DVD-ROM.
3 Tests and Diagnostics 3.14 Wireless LAN (Calexico) Test 3.14 Wireless LAN (Calexico) Test This section describes how to perform the wireless LAN transmitting-receiving test with the test program. Note: Use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a reference machine to perform this test. An access point is also required. In this test, the following items are tested. (1) Communication test (Main antenna, Aux.
3.15 Wireless LAN (Atheros 11b/g or 11a/b/g) Test 3 Tests and Diagnostics 3.15 Wireless LAN (Atheros 11b/g or 11a/b/g) Test This section describes how to perform the wireless LAN transmitting-receiving test with the test program. Note: Use another computer (with Atheros 11b/g or 11a/b/g wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform this test. When conducting this test, make sure that any wireless network device using 2.4GHz band other than IEEE 802.
3 Tests and Diagnostics 3.15 Wireless LAN (Atheros 11b/g or 11a/b/g) Test Setting the responder machine Note: Release the write-protection of the floppy disk for the test. Insert a floppy disk containing the test program into the floppy disk drive of the responder machine and turn on the responder machine. The Wireless LAN test menu will appear. ############################################################### #### Atheros WLAN sub system repair test VX.
3.15 Wireless LAN (Atheros 11b/g or 11a/b/g) Test 3 Tests and Diagnostics -------------------------------------------- To proceed the test, press any key. When the tester machine has passed the test, "OK" message will appear in the tester machine. Press Enter to return to the main menu. When the tester machine has not passed the test, "NG" message will appear in the tester machine. Pressing Enter on the screen shows the following message.
3 Tests and Diagnostics 3.16 Bluetooth Test 3.16 Bluetooth Test This section describes how to perform the Bluetooth test program to check if the Bluetooth functions of computer are working properly. To start the Bluetooth test program, follow the steps below: Note: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test. Insert a floppy disk containing the test program into the target machine and turn on the target machine.
3.16 Bluetooth Test Subtest 01 3 Tests and Diagnostics BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter. The following message will appear: ---------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.16 Bluetooth Test If the target machine has any problem, it displays Error CODE. The following message is displayed. ---------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3.16 Bluetooth Test 3 Tests and Diagnostics If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-2 Error code for Bluetooth test (BD_ADDR) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection. Hardware Failure. Page Timeout.
3 Tests and Diagnostics 3.16 Bluetooth Test Table 3-2 Error code for Bluetooth test (BD_ADDR) (2/2) Error code Meaning 0x20 Unsupported LMP Parameter Value. 0x21 Role Change Not Allowed. 0x22 LMP Response Timeout. 0x23 LMP Error Transaction Collision. 0x24 LMP PDU Not Allowed. 0x25 Not Exist 0x26 Not Exist 0x27 Not Exist 0x28 Not Exist 0x29 Not Exist 0x2a Not Exist 0x2b Not Exist 0x2c Not Exist 0x2d Not Exist 0x2e Not Exist 0x2f Not Exist ** See the Specification of the Bluetooth System in detail.
3.16 Bluetooth Test 3 Tests and Diagnostics When the Bluetooth test menu is displayed, press T to select the test and press Enter in the test machine. The following message will appear: ---------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.16 Bluetooth Test Testing is finished A>_ If the target machine has any problem, the following message “INCOMPLETE” is displayed with the Error CODE. ---------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3.16 Bluetooth Test 3 Tests and Diagnostics If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-3 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection. Hardware Failure. Page Timeout.
3 Tests and Diagnostics 3.16 Bluetooth Test Table 3-3 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3.17 Sound/LAN/Modem Test 3 Tests and Diagnostics 3.17 Sound/LAN/Modem Test To execute the Sound/LAN/Modem Test, use the Test Diagnostics disk (No.3). Finish the tests of the Diagnostics disk (No.1) by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MSDOS. Insert the Test program disk (No.2) in the floppy disk drive and turn on the power.
3 Tests and Diagnostics Subtest 02 3.17 Sound/LAN/Modem Test Sign wave This subtest is executed by loading Playwave. In this subtest, the control of the sound volume can be also tested. Connect headphones and make sure the sound (musical scale: do, re, mi, fa, so, la, si, do) is come out from the right and left headphones. Subtest 03 LAN This subtest checks the operation of mini-PCI I/F by the loopback in the chip. The large “OK” is displayed if no error occurred.
3.18 IEEE 1394 Test 3 Tests and Diagnostics 3.18 IEEE 1394 Test To execute the IEEE 1394Test, use the Test Diagnostics disk (No.4). Finish the tests of the Diagnostics disk (No.1) by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MSDOS. Insert the Test program disk (No.3) in the floppy disk drive and turn on the power.
3 Tests and Diagnostics 3.19 Error Status Code 3.19 Error Status Code Table 3-4 lists the error status codes for the Diagnostic Test.
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3 Tests and Diagnostics 3.20 HDC Status 3.20 HDC Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXX The hard disk test error status is displayed on the screen by a four-digit number. The hard disk controller error status is composed of two bytes; the first byte displays the contents of the HDC error status register and the second byte displays the HDC error register.
3.20 HDC Status 3 Tests and Diagnostics Table 3-6 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There was no ID field. 3 —— Not used 2 ABT (Abort) “0” … Not used “1” … Illegal command error or a command abort error.
3 Tests and Diagnostics 3.21 3.21 FDD Cleaning FDD Cleaning 3.21.1 Function Description This function cleans the heads in the 3.5-inch FDD by executing a series of head load/seek and read operations. A cleaning disk is necessary to perform this program. 3.21.2 Operations 1. Selecting test 4-HEAD CLEANING from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS – FLOPPY DISK HEAD CLEANING : V6.00 Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3.22 Log Utilities 3.22 3 Tests and Diagnostics Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can also store data on a floppy disk or output the data to a display or a printer. If the power switch is turned off, the error information will be lost. The error information is displayed in the following order: 1. 2. 3. 4. 5. 6. 7. 8. 9.
3 Tests and Diagnostics 3.22 Log Utilities 3.22.2 Operations Selecting 5-LOG UTILITIES and pressing Enter in the DIAGNOSTIC MENU logs error information into RAM or onto a floppy disk.
3.23 Running Test 3.23 3 Tests and Diagnostics Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. 2. 3. 4. 5. 6. System test (subtest 01) Memory test (subtests 01,02, 04, 06) Display test (subtest 01) FDD test (subtest 02) HDD test (subtests 01) Real timer test (subtest 02) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.23.
3 Tests and Diagnostics 3.23 Running Test 4. After specifying of the Serial #A test, the following message will appear: Mount the work disk(s) on the drive(s), then press [Enter] key. [Warning : The contents of the disk(s), will be destroyed.] 5. This program is executed in the above mentioned ways. To exit the program, press Ctrl + Break.
3.24 Floppy Disk Drive Utilities 3 Test and Diagnostics Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3.24.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT Caution: This program is only for testing a floppy disk drive. The option is different from the MS-DOS FORMAT command. This program formats the floppy disk in the following formats.
3 Test and Diagnostics 3.24.2 3.24 Floppy Disk Drive Utilities Operations 1. Selecting 7-FDD UTILITIES from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 - FORMAT COPY DUMP HDD-ID EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) When FORMAT program is loaded, the following message is displayed: DIAGNOSTICS - FLOPPY DISK FORMAT : V6.
3.24 Floppy Disk Drive Utilities 3 Test and Diagnostics (e) Typing 1 displays the message from step (c) above. Typing 2 returns the test to the DIAGNOSTIC MENU. 3. COPY program (a) When FORMAT program is loaded, the following message is displayed: FLOPPY DISK FORMAT & COPY : V6.00 Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message below: Insert source disk into drive A: Press any key when ready.
3 Test and Diagnostics 3.24 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP program is loaded, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : V7.00 Drive type select (1:FDD, 2:HDD) ? (b) Select a format type number. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message appears: Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
3.24 Floppy Disk Drive Utilities 3 Test and Diagnostics (j) Set the LBA number you want to dump. The system will access the disk and dump a list. (k) The following message will appear. To finish the dump, select 3. Press number key (1:up, 2:down, 3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU.
3 Test and Diagnostics 3.24 Floppy Disk Drive Utilities 5. HDD-ID READ program Loading HDD ID READ program displays the following HDD ID configuration: [HDD ID Read (V5.10)] [Drive ID code (h) = No. of Cylinders Removable Cylinders = No. of Heads = Unformat Bytes/Track = Unformat Bytes/Sector = Sectors/Track = Gap Length = Sync. Bytes = Reserved (h) = Serial No. = Controller Type (h) = Sector Buffers = ECC Bytes = Firmware Rev. = Model No.
3.25 System Configuration 3.25 3 Test and Diagnostics System Configuration 3.25.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type 2. VGA Controller 3. MS-DOS Version 4. BIOS ROM version (1st ID, 2nd ID) 5. BOOT ROM version 6. KBC version 7. PS Micon Version 8. Total Memory Size 9. Battery Code 10. Sound System 11. The number of Co-processor 12. The number of PCMCIA Slots 13. Modem Type 14. LAN Type 15.
3 Test and Diagnostics 3.25.2 3.25 System Configuration Operations 1. Selecting 7-SYSTEM CONFIGURATION from the DIAGNOSTIC MENU and pressing Enter displays the following system configuration: System Configuration Display : Ver X.
3.26 SETUP 3.26 3 Test and Diagnostics SETUP 3.26.1 Function Description This program displays the current system setup information as listed below: 1. Memory (a) Total 2. System Date/Time (a) System Date (b) System Time 3. Battery 4. Password 5. Boot Priority (a) Boot Priority (b) HDD Priority (c) Network Boot Protocol 6. Display (a) Power On Display (b) LCD Display Stretch (c) TV Type 7.
3 Test and Diagnostics 3.26 SETUP 12. Peripheral (a) Internal Pointing Device (b) Hard Disk Mode 13. LEGACY Emulation (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation 14.
3.26 SETUP 3 Test and Diagnostics 3.26.2 Accessing the SETUP Program Selecting 0-SETUP from the DIAGNOSTICS MENU and pressing Enter displays the followings: SYSTEM SETUP (1/2) ACPI BIOS version = X.
3 Test and Diagnostics 3.26 SETUP Moving Within the SETUP Menu and Changing Values 1. Press ß and à to move between the columns horizontally. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press Fn+à(END) to accept the changes you made.
3.26 SETUP 3 Test and Diagnostics SETUP Options The SETUP screen is divided into 14 functionally related groups. This section describes each group and its option. 1. Memory This group of options displays the computer’s memory. Total This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Sets the date and time with Space and Backspace key.
3 Test and Diagnostics 3.26 SETUP Low Power The following shows low power settings. BATTERY SAVE OPTIONS Processing Speed CPU Sleep Mode Display Auto off HDD Auto off System Auto off LCD Brightness Cooling Method 3-70 = = = = = = Low Enabled 03Min. 03Min. 30Min.
3.26 SETUP 3 Test and Diagnostics Note: In boot mode, the System Auto Off (*1) item does not appear. Display of the LCD Brightness will be changed in the condition below: (*2) Operating the battery (*3) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS. For details, see Battery Save Options below. Battery Save Options (a) Processing Speed This feature changes the CPU processing speed. High Makes the CPU processing speed high.
3 Test and Diagnostics 3.26 SETUP (d) HDD Auto Off Use this option to set the duration of the HDD automatic power off function. This option stops the rotation of the HDD if you do not read or write to the HDD more than the duration set. To protect the HDD, Disabled can not be set to. xx Min. Automatically turns off the power to the hard disk drive if it is not used for the duration set. The duration xx can be set to from 0.1 to 30 minutes or Disabled.
3.26 SETUP 3 Test and Diagnostics 4. Password This option sets or resets the user password for power on and instant security (Fn+F1). Registered The user password has been registered. Not registered The user password has not been registered. For details on setting the user password, refer to the User’s Manual. 5. Boot Priority (a) Boot Priority Use this option to set the priority for booting of the computer and the priority for the HDD for booting.
3 Test and Diagnostics 3.26 SETUP (c) Network Boot Protocol Use this option to set the starting method via a network. PXE Sets to PXE protocol. (Default) RPL Sets to RPL protocol. 6. Display This group of options configures the computer’s display. (a) Power On Display This option is used to select the display when booting up. Auto-Selected Selects an external monitor if one is connected. Otherwise it selects the internal LCD.
3.26 SETUP 3 Test and Diagnostics 7. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) Power-up Mode Use this option to choose between resume and boot mode. Boot Turns on boot mode. (Default) Resume Turns on resume mode. (b) CPU Cache Use this option to enable or disable the CPU cache. Enabled Enables the CPU cache. (Default) Disabled Disables the CPU cache.
3 Test and Diagnostics 3.26 SETUP (e) Auto Power On This option displays setting for Wake-up on LAN. When Windows XP is operating, this function is disabled. Enabled Indicates auto power on and Wake-up on LAN is set. Disabled Indicates auto power on and Wake-up on LAN is not set. When “Enabled” is set, the following subwindow appears. Auto power on and Wake-up on LAN is set in the options subwindow. To set alarm time, use Space and BackSpace.
3.26 SETUP 3 Test and Diagnostics (g) Power Button Lamp This option specifies a lamp pattern of power button. Table 3-7 Lamp pattern of power button Status Power ON Standby Power off/halt Mode 1(default) Lights blue. Lights yellow. Lights orange. Mode 2 Lights blue. Lights green and orange alternately. Lights green and blue alternately. Mode 3 Blinks in order of green, orange and blue Lights yellow. Lights orange. Off Does not light.
3 Test and Diagnostics 3.26 SETUP Displays an address and interrupt level for the hard disk drive. (b) CD-ROM Displays an address and interrupt level for the CD-ROM drive. (c) PC Card Displays an address and interrupt level for a PC card type of hard disk drive that can boot the computer, when the computer is booted by the drive. 10. PCI Bus This option displays the interrupt level for the PCI Bus in the computer. It is for information only and cannot be changed. PCI BUS = IRQ11 11.
3.26 SETUP 3 Test and Diagnostics (b) Hard Disk Mode Use this item to select the hard disk mode. Enhanced IDE (Normal) : Select this mode when the HDD is used for Windows XP Tablet PC Edition. (Default) Standard IDE : Select this mode when using an OS which does not support the Enhanced IDE. When this mode is selected, up to 528MB is logically available and the rest of the capacity is not usable.
3 Test and Diagnostics Disabled 3-80 3.26 SETUP Disables built-in LAN functions.
Chapter 4 Replacement Procedures
4 Replacement Procedures 4 4-ii PORTEGE A100 Maintenance Manual (960-460)
4 Replacement Procedures Chapter 4 4.1 Contents Overview .............................................................................................................. 4-1 Safety Precautions.......................................................................................... 4-2 Before you Begin ........................................................................................... 4-3 Disassembly Procedures ................................................................................
4 Replacement Procedures 4.17 LED board.......................................................................................................... 4-34 4.18 System board...................................................................................................... 4-35 4.19 2nd Battery Board/Heat sink/CPU ...................................................................... 4-37 4.19.1 2nd Battery board........................................................................... 4-37 4.19.
4 Replacement Procedures Figure 4-13 Removing the memory module ................................................................ 4-21 Figure 4-14 Removing the HDD assembly .................................................................. 4-23 Figure 4-15 Removing the HDD .................................................................................. 4-24 Figure 4-16 Removing the wireless LAN module ....................................................... 4-25 Figure 4-17 Removing the MDC module.........
4 Replacement Procedures Figure 4-56 to 4-63 Replacing LG Phillips fluorescent lamp (1) to (8) ...........
4.1 Overview 4 4 Replacement Procedures Replacement Procedures 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual.
4 Replacement Procedures 4.1 Overview Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. Danger: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion.
4.1 Overview 4 Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2.1 Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
4 Replacement Procedures 4.1 Overview Disassembly Procedures Three main types of cable connector are used. θ Pressure plate connector θ Spring connector θ Normal pin connector When disconnecting a pressure plate connector, draw the tab on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, draw enough the pressure plate and insert the cable into the connector.
4.1 Overview 4 Replacement Procedures Assembly Procedures After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. θ Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. θ Check that all cables and connectors are securely connected.
4 Replacement Procedures 4.1 Overview Screw Tightening Torque Use the following torque when tightening screws. Caution: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. Note: To tighten screws quickly and accurately, an electric screwdriver is recommended. θ M2 (2mm) 0.167 N•m (1.7 kgf •cm) θ M2.5 (2.5mm) 0.294 N•m(3.
4.1 Overview 4 Replacement Procedures Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw F: Flat bind screw S: Super thin head screw T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.) Example: B6 ...
4 Replacement Procedures 4.2 4.2 Battery pack Battery pack Removing the battery pack The following describes the procedure for removing the battery pack. (See Figure 4-1.) Caution: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all other external devices from the computer. 3. Turn the computer upside down. 4.
4.2 Battery pack 4 Replacement Procedures Installing a battery pack The following describes the procedure for installing a battery pack. (See Figure 4-2.) Caution: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispose always the used batteries pack in accordance with the laws and ordinances of your local authority. Use only the batteries approved by Toshiba.
4 Replacement Procedures 4.3 4.3 PC card PC card Removing the PC card The following describes the procedure for removing the PC card. (See Figure 4-3.) Caution: Insert or remove the PC card in accordance with any instructions in the PC card manual or the manuals of the computer system you are using. 1. Push the eject button. It will pop out when you release it. Press it once more to eject the PC card. 2. Pull out the PC card and remove it.
4.4 SD memory card 4.4 4 Replacement Procedures SD memory card Removing the SD memory card The following describes the procedure for removing the SD memory card. (See Figure 4-4.) Caution: Insert or remove the SD memory card in accordance with any instructions in the SD memory card manual or the manuals of the computer system you are using. 1. Push the SD memory card. It will pop out partly when you release, so pull out the card.
4 Replacement Procedures 4.5 4.5 Connector panel Connector panel Removing the connector panel The following describes the procedure for removing the connector panel. (See Figure 4-5.) 1. Open the connector panel. 2. Push the center of the connector panel to bend it and remove the connector panel. Connector panel Figure 4-5 Removing the connector panel Installing a connector panel The following procedure describes the procedure for installing a connector panel. (See Figure 4-5.) 1.
4.6 Keyboard holder/Keyboard 4.6 4.6.1 4 Replacement Procedures Keyboard holder/Keyboard Keyboard holder Removing the keyboard holder The following describes the procedure for removing the keyboard holder. (See Figure 4-6.) 1. Open the display. 2. Insert your fingers to the slots at the both sides and lift up the keyboard holder. Slots Keyboard holder Figure 4-6 Removing the keyboard holder Installing a keyboard holder The following describes the procedure for installing a keyboard holder.
4 Replacement Procedures 4.6.2 4.6 Keyboard holder/Keyboard Keyboard Removing the keyboard The following describes the procedure for removing the keyboard. (See Figure 4-7, 4-8.) 1. Remove the following screws fixing the keyboard. • M2×4Z BIND screw x2 M2×4Z BIND Keyboard Figure 4-7 Removing the keyboard 2. Lift the upper side of the keyboard and pull down to the front. 3. Remove the keyboard cable from the connector PJ3200 on the system board.
4.6 Keyboard holder/Keyboard 4 Replacement Procedures 4. Remove the keyboard. Installing a keyboard The following describes the procedure for installing a keyboard. (See Figure 4-7, 4-8.) 1. Set the keyboard on the palm rest with the back up and connect the keyboard cable to the connector PJ3200 on the system board. 2. Turn down the keyboard on the palm-rest and insert the latches under the palm rest. 3. Fix the keyboard with the following screws.
4 Replacement Procedures 4.7 4.7 Optical drive Optical drive Removing the optical drive The following describes the procedure for removing the optical drive. (See Figure 4-9,4-23.) The optical drive can be removed and installed with the battery pack (4.2) and keyboard (4.6) removed. 1. Remove the following screw (figure 4-23, ƒ) fixing the optical drive. • M2.5×12B FLAT BIND screw x1 2. Insert a screwdriver into the hole from the space for a battery pack to push the rear of the optical drive. M2.
4.8 Palm rest/Touch pad 4.8 4.8.1 4 Replacement Procedures Palm rest/Touch pad Palm rest Removing the palm rest The following describes the procedure for removing the palm rest. (See Figure 4-10, 4-11.) Caution: The touch pad is stuck to the palm rest with adhesives, so it can not be removed. When a touch pad is broken, replace a palm rest with a touch pad. 1. Turn over the computer and remove the following screw fixing the palm rest.
4 Replacement Procedures 4.8 Palm rest/Touch pad 3. Remove the following screws fixing the palm rest. • M2×3C S-THIN screw x2 • M2.5×12B FLAT BIND screw x1 M2×3C S-THIN M2.5×12 B FLAT BIND Palm rest PJ3201 Figure 4-11 Removing the palm rest 4. Remove the two latches on the upper side of palm rest and remove the palm rest toward the left upper. Installing a palm rest The following describes the procedure for installing a palm rest. (See Figure 4-10, 4-11.) 1.
4.8 Palm rest/Touch pad 4 Replacement Procedures 4. Turn over the computer and fix the palm rest with the following screw. • 4.8.2 M2×4Z BIND screw x1 Touch pad Removing the touch pad board The following describes the procedure for removing the touch pad board. (See Figure 4-12.) Caution: The touch pad board can be replaced, but the touch pad is stuck to the palm rest with adhesives, so it can not be removed. When a touch pad is broken, replace with a palm rest and a touch pad.
4 Replacement Procedures 4.8 Palm rest/Touch pad 1. Hook the hole of the metal of the touch pad board to the latch of the touch pad and set the touch pad board. 2. Fix the touch pad board with the following screws. • M2×3C S-THIN screw x2 3. Connect the two flat cables.
4.9 Memory module 4.9 4 Replacement Procedures Memory module Caution: The power must be turned off when you remove the memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend the memory module. Removing the memory module To remove the memory module(s), confirm that the computer is in boot mode.
4 Replacement Procedures 4.9 Memory module 2. Push down the memory module until it is latched firmly Caution: The power must be turned off when you insert the memory module. Inserting a memory module with the power on risks damaging the module or the computer itself. Never press hard or bend the memory module.
4.10 HDD 4 Replacement Procedures 4.10 HDD Removing the HDD The following describes the procedure for removing the HDD. (See Figure 4-14, 4-15.) Caution: Take care not to press on the top or bottom of the HDD. Pressure may cause data loss or damage to the device. 1. Remove the following screw fixing the HDD slot cover and remove the cover. • M2.5×12B FLAT BIND screw x1 2. Hold the HDD tab and pull out the HDD assembly. M2.
4 Replacement Procedures 4.10 HDD 4. Detach the HDD bracket from the HDD. HDD M3×4S FLAT BIND HDD bracket M3×4S FLAT BIND Figure 4-15 Removing the HDD Installing a HDD The following describes the procedure for installing a HDD. (See Figure 4-14, 4-15.) 1. Fix the HDD bracket to the HDD with the following screws. • M3×4S FLAT BIND screw x4 2. Insert the HDD assembly into the HDD slot. Insert the tab into the gap between the chassis of the computer and the HDD assembly. 3.
4.11 Wireless LAN module 4 Replacement Procedures 4.11 Wireless LAN module Removing the wireless LAN module To remove the wireless LAN module, perform the following procedure. (See Figure 4-16.) 1. Peel off the glass tape on the wireless LAN antenna cables. 2. Remove the white and black antenna cables from the wireless LAN module. 3. Open the latches fixing the wireless LAN module and remove the wireless LAN module.
4 Replacement Procedures 4.12 MDC module 4.12 MDC module Removing the MDC module To remove the MDC module, perform the following procedure. (See Figure 4-17.) 1. Remove the following screws fixing the MDC module. • M2×3C S-THIN screw x2 2. Remove the MDC cable from the MDC module. M2×3C S-THIN MDC cable MDC module Figure 4-17 Removing the MDC module Installing a MDC module To install a MDC module, perform the following procedure. (See Figure 4-17.) 1. Fix the MDC module with the following screws.
4.13 RTC battery 4 Replacement Procedures 4.13 RTC battery Removing the RTC battery To remove the RTC battery, perform the following procedure. (See Figure 4-18.) 1. Remove the RTC battery cable from the connector PJ8760 on the system board. 2. Turn up the insulator and remove the RTC battery. RTC battery Insulator Insulator PJ8760 Figure 4-18 Removing the RTC battery Installing a RTC battery To remove a RTC battery, perform the following procedure. (See Figure 4-18.) 1.
4 Replacement Procedures 4.14 Internal microphone/Cover latch 4.14 Internal microphone/Cover latch 4.14.1 Internal microphone Removing the internal microphone To remove the internal microphone, perform the following procedure. (See Figure 4-19.) 1. Remove the internal microphone cable from the connector PJ6003 on the system board. 2. Remove the internal microphone from the slot.
4.14 Internal microphone/Cover latch 4 Replacement Procedures 4.14.2 Cover latch Removing the cover latch To remove the cover latch, perform the following procedure. (See Figure 4-20.) 1. Remove the following screws fixing the cover latch. • M2.5×4Z BIND screw x2 2. Remove the cover latch. M2.5×4Z BIND Cover latch Figure 4-20 Removing the cover latch Installing a cover latch To install a cover latch, perform the following procedure. (See Figure 4-20.) 1. Set the cover latch. 2.
4 Replacement Procedures 4.15 Bluetooth module 4.15 Bluetooth module Removing the Bluetooth module To remove the Bluetooth module, perform the following procedure. (See Figure 4-21.) 1. Remove the flat cable from the connector of the Bluetooth module. 2. Remove the following screw and Bluetooth module. • M2×3C S-THIN screw x1 3. Disconnect the bluetooth antenna cable from the Bluetooth module.
4.16 Cover assembly 4 Replacement Procedures 4.16 Cover assembly Removing the cover assembly To remove the cover assembly, perform the following procedure. (See Figure 4-22, 4-23, 424.) 1. Remove the LCD cable and LED board cable from the connectors PJ5600 and PJ9500 on the system board.
4 Replacement Procedures 4.16 Cover assembly 2. Remove the following screws. • M2.5×8B BIND screw x13 (•) • M2.5×4B FLAT BIND screw x3 (‚) • M2.5×12B FLAT BIND screw x1 (When the optical drive is not removed.
4.16 Cover assembly 4 Replacement Procedures 3. Release the latches at left lower of the cover assembly and remove the cover assembly. Cover assembly Latches Figure 4-24 Removing the cover assembly Installing a cover assembly To install a cover assembly, perform the following procedure. (See Figure 4-22, 4-23, 4-24.) 1. Mount the cover assembly on the base assembly. 2. Fix the cover assembly with the following screws. • M2.5×8B BIND screw x13 (•) • M2.5×4B FLAT BIND screw x3 (‚) • M2.
4 Replacement Procedures 4.17 LED board 4.17 LED board Removing the LED board To remove the LED board, perform the following procedure. (See Figure 4-25.) 1. Remove the flat cable from the LED board. 2. Remove the LED board from the slot. LED board Flat cable Figure 4-25 Removing the LED board Installing a LED board To install a LED board, perform the following procedure. (See Figure 4-25.) 1. Connect the flat cable to the connector on the LED board. 2. Insert the LED board into the slot.
4.18 System board 4 Replacement Procedures 4.18 System board Removing the system board To remove the system board, perform the following procedure. (See Figure 4-26.) 1. Open the insulator covering the connector PJ8770 on the system board. 2. Remove the CPU FAN cable from the connector PJ8770. 3. Remove the following screws fixing the system board. • M2.5×12B FLAT BIND screw x1 • M2.5×4B FLAT BIND screw x1 System board M2.5x12B FLAT BIND PJ8770 M2.
4 Replacement Procedures 4.18 System board Installing a system board To install a system board, perform the following procedure. (See Figure 4-26.) 1. Set the system board on the base cover in place and fix it with the following screws. • M2.5×12B FLAT BIND screw x1 • M2.5×4B FLAT BIND screw x1 2. Connect the CPU FAN cable to the connector PJ8770 on the system board. 3. Cover the connector PJ8770 with the insulator.
4.19 2nd Battery board/Heat sink/CPU 4 Replacement Procedures 4.19 2nd Battery board/Heat sink/CPU 4.19.1 2nd Battery board Removing the 2 nd battery board To remove the 2nd battery board, perform the following procedure. (See Figure 4-27.) 1. Remove the following screws fixing the 2nd battery board and remove the connector of the 2nd battery board from the connector PJ9501 on the system board then remove the 2nd battery board. • M2.5×4B FLAT BIND screw x2 M2 x 4Z BIND Holder M2.
4 Replacement Procedures 4.19 2nd Battery board/Heat sink/CPU 4.19.2 Heat sink Removing the heat sink To remove the heat sink, perform the following procedure. (See Figure 4-27, 4-28.) 1. Remove the following screws fixing the heat sink and holder and remove the heat sink. • M2×4Z BIND screw x2 Installing a heat sink To install a heat sink, perform the following procedure. (See Figure 4-27, 4-28.) 1.
4.19 2nd Battery board/Heat sink/CPU 4 Replacement Procedures 4.19.3 CPU Removing the CPU Caution: The temperature of CPU may become high. Be sure to work after it has become low. To remove the CPU perform the following procedure. (See Figure 4-29.) 1. Turn the cam counterclockwise 90 degrees with a minus screwdriver to release the lock. 2. Remove the CPU.
4 Replacement Procedures 4.19 2nd Battery board/Heat sink/CPU Installing a CPU To remove a CPU perform the following procedure. (See Figure 4-30.) 1. Make sure the mark of cam is in the position of “Releasing”. 2. Set the CPU in place on the CPU socket. Triangle mark socket CPU socket CPU Figure 4-30 Installing a CPU Caution: When setting the CPU on the socket, make sure that the triangle mark on the CPU come to the right position. (Refer to the above figure.) 3.
4.20 CPU fan 4 Replacement Procedures 4.20 CPU fan Removing the CPU fan To remove the CPU fan, perform the following procedure. (See Figure 4-31.) 1. Remove the following screws fixing the CPU fan. • M2.5×4B FLAT BIND screw x2 2. Remove the CPU fan from the base assembly. M2.5×4B FLAT BIND CPU fan Figure 4-31 Removing the CPU fan Installing a CPU fan To install a CPU fan, perform the following procedure. (See Figure 4-31.) 1.
4 Replacement Procedures 4.21 Speaker 4.21 Speaker Removing the speaker To remove the speakers, perform the following procedure. (See Figure 4-32.) 1. Peel off two acetate tapes fixing the speaker cable. 2. Remove the following screws fixing the speaker holders. • M2×3Z S-THIN screw x2 (Left) • M2×3Z S-THIN screw x1 (Right) M2×3Z S-THIN Insulator Speaker(L) Acetate tape Speaker(R) Figure 4-32 Removing the speaker holders 3. Remove the speakers from the speaker holders. 4.
4.21 Speaker 4 Replacement Procedures Installing a speaker To remove a speaker, perform the following procedure. (See Figure 4-32.) 1. Set the speakers in the speaker holders. 2. Fix the speaker holders with the following screws. • M2×3Z S-THIN screw x2 (Left) • M2×3Z S-THIN screw x1 (Right) 3. Place the speaker cable and stick the insulator in two places to fix the cables. 4. Stick two acetate tapes to fix the speaker cable.
4 Replacement Procedures 4.22 LCD unit / FL inverter 4.22 LCD unit / FL inverter Removing the LCD unit / FL inverter To remove the LCD unit and FL inverter, perform the following procedure. (See Figure 4-33 to 4-37.) 1. Peel off the mask seals and remove the following screws.
4.22 LCD unit / FL inverter 4 Replacement Procedures 2. Release the latches and remove the display mask from the bottom. Display mask Figure 4-34 Removing the display mask 3. Remove the screws fixing the FL inverter. Remove the connector of the both sides and remove the FL inverter.
4 Replacement Procedures 4.22 LCD unit / FL inverter 4. Remove the following screws fixing the LCD unit. • M2×4Z BIND screw x4 M2×4Z BIND Guide hole Figure 4-36 Removing the screws 5. Put a soft cloth on the keyboard not to damage the surface of the LCD and pull down the top of the LCD on the soft cloth. Peel off the glass tape on the LCD connector on the back of the LCD unit.
4.22 LCD unit / FL inverter 6. 4 Replacement Procedures Disconnect the LCD cable and remove the LCD unit. Glass tape LCD LCD cable Soft cloth Figure 4-37 Removing the LCD unit Installing a LCD unit / FL inverter To install a LCD unit and FL inverter, perform the following procedure. (See Figure 4-33 to 4-37.) 1. Connect the LCD cable to the connector on the back of the LCD and fix with the glass tape. 2. Put the LCD unit on the LCD with the guide hole into the guide and fix with the following screws.
4 Replacement Procedures 4.23 LCD cable/Wireless LAN antenna / Bluetooth antenna 4.23 LCD cable/Wireless LAN antenna / Bluetooth antenna 4.23.1 LCD cable Removing the LCD cable To remove the LCD cable, perform the following procedure. (See Figure 4-38.) 1. Remove the right side hinge cover (viewing from the front). 2. Peel off the acetate tape fixing the LCD cable and two acetate tapes fixing the insulator. 3. Take the LCD cable out of the hinge hole.
4.23 LCD cable/Wireless LAN antenna / Bluetooth antenna 4 Replacement Procedures 2. Set the hinge cover. When setting, do not make the LCD cable and Bluetooth antenna cables pinched, and do not mistake the direction. 3. Open the insulator wrapping the LCD cable, wrap the LCD cable fixing and apply the acetate tape at two points of the insulator and one point of the LCD cable. 4.23.2 Wireless LAN antenna Removing the wireless LAN antenna To remove the wireless LAN antenna, perform the following procedure.
4 Replacement Procedures 4.23 LCD cable/Wireless LAN antenna / Bluetooth antenna 3. Peel off the insulator and remove the wireless LAN antenna cable from the hinge hole. Insulator Antenna cable Figure 4-40 Removing the wireless LAN antenna cable Installing a wireless LAN antenna To install a wireless LAN antenna cable LCD cable, perform the following procedure. (See Figure 4-39, 4-40.) 1.
4.23 LCD cable/Wireless LAN antenna / Bluetooth antenna 4 Replacement Procedures 4.23.3 Bluetooth antenna Removing the Bluetooth antenna To remove the Bluetooth antenna, perform the following procedure. (See Figure 4-41.) 1. Peel off the four acetate tapes and Bluetooth antenna. 2. Remove the right side hinge cover (viewing from the front). 3. Remove the Bluetooth antenna cable from the hinge hole.
4 Replacement Procedures 4.23 LCD cable/Wireless LAN antenna / Bluetooth antenna Installing a Bluetooth antenna To install a Bluetooth antenna, perform the following procedure. (See Figure 4-41.) 1. Pass the Bluetooth antenna cable with the LCD cable through the hinge hole and lay down them in place. Pass the cable near the MDC module under the insulator. 2. Set the hinge cover. Do not make the wireless LAN antenna pinched and do not mistake the direction. 3.
4.24 Hinge assembly 4 Replacement Procedures 4.24 Hinge assembly Removing the hinge assembly To remove the hinge assembly, perform the following procedure. (See Figure 4-42, 4-43) 1. Remove the following screws fixing the hinge assembly on the LCD cover side. • M2.5×4B FLAT BIND screw x2 (left) • M2.5×4B FLAT BIND screw x2 (right) M2.5 ×4B FLAT BIND Hinge LCD cover Hinge Figure 4-42 Removing the hinge assembly (LCD cover side) 2.
4 Replacement Procedures 4.24 Hinge assembly 3. Take both the hinges out of the holes. M2.5×4B FLAT BIND Hinge Hinge Figure 4-43 Removing the hinge assembly (base side) Installing a hinge assembly To install a hinge assembly, perform the following procedure. (See Figure 4-42, 4-43.) 1. Fix the hinges to the LCD cover with the following screws. • M2.5×4B FLAT BIND screw x2 (left) • M2.5×4B FLAT BIND screw x2 (right) 2. Fix the hinges to the base with the following screws. Caution: 4-54 • M2.
4.25 Fluorescent lamp 4 Replacement Procedures 4.25 Fluorescent lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp assembly (hereafter refer to fluorescent lamp) is different for each LCD module. Refer to the appropriate procedure. Type Part.No Supplier Section 12.1 inch G33C0000J110001 TDM 4.25.1 12.1 inch G33C0000H110001 LG Phillips 4.25.2 Note: 1.When working with a LCD module, always use a flat, grounded table. 2.
4 Replacement Procedures 4.25.1 4.25 Fluorescent lamp Replacing the 12.1 inch TDM fluorescent lamp The following describes the procedure for replacing the fluorescent lamp. (See Figure 4-44 to 4-55.) Disassembling the module 1. Peeing of tape and insulating sheet 1) Put quietly the module on a flat plate without foreign objects with the front up. Check for dusts on the desk to protect the module from being scratched. Put a protection sheet (soft cloth) on the surface.
4.25 Fluorescent lamp 4 Replacement Procedures 3) Peel off one X-PCB insulating sheet and spread it without it out of the side of bezel. Caution: 1. Keep the X-PCB insulating sheet being on the bezel. 2. Be careful not to damage the TAB.
4 Replacement Procedures 4.25 Fluorescent lamp 2. Removing screws 1) Remove 4 screws on the side of left and the side of right. Caution: When removing screws, use a Phillips screwdriver with bit of No.0.
4.25 Fluorescent lamp 3. 4 Replacement Procedures Removing bezel 1) Turn over the module with the insulating sheet. 2) Releases latches of the bezel and frame (3 points). 3) Lift up slowly the bottom side (Back light side) of bezel and release latches (3 points)at the upper to remove the bezel. Note that the bezels at the upper and lower are fixed with double-sides tape. Caution: 1. When releasing the upper latches, do not damage the TAB. 2. When removing the bezel, do not deform the bezel.
4 Replacement Procedures 4.25 Fluorescent lamp 4. Opening PCB 1) Open the PCB horizontally. Caution: Do not damage the TAB.
4.25 Fluorescent lamp 4 Replacement Procedures 5. Removing PCB-ASSY cell 1) Remove the PCB-ASSY cell from the back light unit. 2) Remove thoroughly remaining double-sided tape on the back of cell. Caution: 1. One point of the upper of cell is fixed with double sided tape. Peel off slowly so as not to break the cell. 2. Be careful not to peel off the light-shield tape at the upper, lower, right and left. ?? Cell with PCB Remove the cell while peeling off the double -sided tape (1 point).
4 Replacement Procedures 4-62 4.
4.25 Fluorescent lamp 4 Replacement Procedures Disassembling the module 1. Check of back light for replacement 1) Refer to the following figure. The sheet shall not be out of the frame.
4 Replacement Procedures 4.25 Fluorescent lamp 2. Assembling PCB ASSY 1) Back light unit for replacement: Remove the peeled-tape on the double-sided tape at the upper of frame. 2) Light the backlight on. 3) Make sure that there is no dust, foreign object, scratch and like that on the backlight and the back of cell. Set the PCB-ASSY cell on the back light unit. Caution: 1. Push it as far as it will go at the left upper. 2. Do not damage the TAB.
4.25 Fluorescent lamp 4 Replacement Procedures 3. Folding TAB/PCB and temporal fixing 1) Fold the X- TAB(X-PCB) to the back of back light unit. Caution: Do not damage the TAB. Fold the X-PCB to the back.
4 Replacement Procedures 4.25 Fluorescent lamp 4. Bezel set 1) Hook the upper side (TAB side) of bezel to the three latches of frame. • 2) Latch the side. 3) Mate the lamp side. ‚ Caution: 1. Do not damage the TAB. 2. Make sure the three latches of bezel are hooked. 3. The PCB GND-CU shall be within the bezel. PCB GND-CU shall be within bezel. Folding of reflector shall be within bezel. PCB GND-CU shall be within the bezel.
4.25 Fluorescent lamp 4 Replacement Procedures 5. Fixing PCB and bezel with screws 1) Fix the right side ( 2 points, viewing from the back) with a screw in order of • and ‚. 2) Fix the left side ( 2 points, viewing from the back) with a screw in order of ƒ and „. Caution: 1. Keep the order of screwing. No floating shall be. 2. The torque of screw driving shall be 0.1666N/m (1.7Kgf.cm). 3. Use a Phillips screwdriver with the bit of No.
4 Replacement Procedures 4.25 Fluorescent lamp 6. Sticking tape and insulating sheet 1) Stick the X-PCB insulating sheet. • 2) Stick the lower side (lamp side) of bezel tape.‚ 3) Stick the FL cable tape.ƒ„ Caution: 1. When sticking the insulating sheet, do no bend it. 2. When sticking tape and insulating sheet, do not damage the leading part of lamp cable and let not it out of the display part.
4.25 Fluorescent lamp 4.25.2 4 Replacement Procedures Replacing the 12.1 inch LG Phillips fluorescent lamp The following describes the procedure for replacing the fluorescent lamp. (See Figure 4-56 to 4-63.) 1. Disassembly of outside tape/ Cover shield 1) Disassembly of Tape adhesive used for B/L Wire fixing Caution: Pressure or stress should not be given on B/L Wire. 2) Disassembly of Cover shield(S) Caution: 1. Pressure or stress should not be given on Gate TCP. 2.
4 Replacement Procedures 4.25 Fluorescent lamp 2. Disassembly of Top case 1) Disassembly of Top Case Caution: Pressure or stress should not be given on Top Case and Gate TCP.
4.25 Fluorescent lamp 4 Replacement Procedures 3. Disassembly of Source PCB and Gate PCB 1) Disassembly of Gate PCB Caution: Pressure or stress should not be given on PCB and TCP during removing double tape. 2) Disassembly of Source PCB Caution: Pressure or stress should not be given on PCB and TCP during removing double tape.
4 Replacement Procedures 4.25 Fluorescent lamp 4. Disassembly of Board ASSY, Tape Adhesive, Sheets, Light guide, Plates and Lamp ASSY 1) Disassembly of Board ASSY. Caution: This process should be made in Clean room with no scratch nor particle on polarizer and B/L ASSY. 2) Disassembly of Tape Adhesives used for Sheets fixing (5Point). 3) Disassembly of Sheets and Light guide. Caution: No penetration of foreign body is indispensable with no scratch on the surface of each sheet.
4.25 Fluorescent lamp 4 Replacement Procedures 5. Assembly of Lamp ASSY, Plates, Sheets, Light guide, Tape Adhesive and Board ASSY 1) Detaching a protect film from Double Tape at the Lamp ASSY 2) Assembly of Lamp ASSY and Screw Caution: The Maximum value of torque with Screw should be below 2.0kgf.cm. 3) Assembly of Plates, Light Guide and Sheets.
4 Replacement Procedures 4.25 Fluorescent lamp 5) Assembly of Board ASSY (Gate PCB fixing with Double Tape.) Caution: Pressure or stress should not be given on PCB and TCP. Figure 4-60 Replacing LG Phillip fluorescent lamp (5) 6. Assembly of Source PCB and Gate PCB 1) Assembly of Source PCB Caution: 4-74 Stress should not be given on TCP.
4.25 Fluorescent lamp 4 Replacement Procedures 2) Assembly of Gate PCB Caution: Stress should not be given on TCP.
4 Replacement Procedures 4.25 Fluorescent lamp 7. Assembly of Top Case 1) Assembly of Top Case Caution: Pressure should not be given on Gate TCP.
4.25 Fluorescent lamp 4 Replacement Procedures 8. Assembly of outside Tape and Cover shield 1) Assembly of Tape shield and Tape Adhesive used for Top case fixing Caution: Pressure or stress should not be given on Top case during this process. 2) Assembly of Cover shield(G) Caution: Pressure or stress should not be given on control PCB. 3) Assembly of Cover shield(S) Caution: 1. Pressure or stress should not be given on Gate TCP. 2.
Appendices
Appendices App-ii PORTEGE A100 Maintenance Manual (960-460)
Appendices Appendix Contents Appendix A Handling the LCD Module..........................................................................A-1 Appendix B Board Layout................................................................................................B-1 B.1 System Board Front View..............................................................................B-1 B.2 System Board Back View ..............................................................................B-3 B.
Appendices C.20 PJ3000 MDC I/F connector (30pin) .......................................................... C-17 C.21 PJ8800 DC-IN connector (2pin) ................................................................ C-18 C.22 PJ8810 Main battery connector (10pin)..................................................... C-18 C.23 PJ8760 RTC battery connector (2pin) ....................................................... C-18 C.24 PJ8770 FAN connector (3pin) ................................................
Appendices Figures Figure B-1 System board layout (front) ...........................................................................B-1 Figure B-2 System board layout (Back) ...........................................................................B-3 Figure B-3 2nd battery board layout..................................................................................B-5 Figure B-4 LED board layout...........................................................................................
Appendices Tables Table B-1 System board (front) .....................................................................................B-2 Table B-2 System board (back)......................................................................................B-4 Table B-3 2nd battery board ...........................................................................................B-5 Table B-4 LED board......................................................................................................
Appendices Table C-26 PJ6004 Headphone connector (6pin) ......................................................... C-19 LED Board Table C-27 PJ9600 System Board1 I/F connector (20pin) ........................................... C-20 2nd Battey Board Table C-28 PJ9650 System Board1 I/F connector (50pin) ............................................ C-21 Table C-29 PJ8500 2nd battery Connector (10pin) ........................................................ C-22 Table D-1 Scan codes ..................
Appendices App-viii PORTEGE A100 Maintenance Manual (960-460)
Apx. A Handling the LCD Module Appendices Apx. A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendices Apx. A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4.
Apx. A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendices Apx. A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
Apx. A Handling the LCD Module Appendices 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization.
Appendices A-6 Apx.
Apx. B Board Layout Appendices Apx. B Appendix B Board Layout B.
Appendices Apx.
Apx. B Board Layout Appendices B.
Appendices Apx.
Apx. B Board Layout Appendices B.
Appendices Apx. B Board Layout B.
Apx. C Pin Assignment Apx. C Appendices Pin Assignment Appendix C Pin Assignment System Board C.1 PJ1400/PJ1401 Memory 1/2 connector (200pin) Table C-1 Memory 1/2 connector (200pin)(1/4) Pin No. Signal name I/O Pin No.
Appendices Apx. C Pin Assignment Table C-1 Memory1/2 connector (200pin)(2/4) Pin No. Signal name I/O Pin No.
Apx. C Pin Assignment Appendices Table C-1 Memory1/2 connector (200pin)(3/4) Pin No. Signal name I/O Pin No.
Appendices Apx. C Pin Assignment Table C-1 Memory 1/2 connector (200pin)(4/4) Pin No. C.2 Signal name I/O Pin No. Signal name I/O I/O 196 GND - 195 SMBCLK-P3P 197 P3V - 198 GND - 199 N.C - 200 N.C - PJ5600 LCD connector (41pin) Table C-2 LCD connector (41pin) C-4 Pin No. Signal name I/O Pin No.
Apx. C Pin Assignment C.3 Appendices PJ5620 CRT I/F connector (15pin) Table C-3 CRT I/F connector (15pin) Pin No. C.4 Signal name I/O Pin No. Signal name I/O 1 RED-PXP O 2 GREEN-PXP O 3 BLUE-PXP O 4 N.C - 5 GND - 6 GND - 7 GND - 8 GND - 9 P5V - 10 GND - 11 N.C - 12 (DDCSDA-P3P) O 13 (HSYNC-B3P) O 14 (VSYNC-B3P) O 15 DDCACK -P3P O PJ5640 TV out I/F connector (3pin) Table C-4 TV out I/F connector (3pin) Pin No. Signal name I/O Pin No.
Appendices C.5 Apx. C Pin Assignment PJ1800 HDD I/F connector (44pin) Table C-5 HDD I/F connector (44pin) Pin No. C-6 Signal name I/O Pin No.
Apx. C Pin Assignment C.6 Appendices PJ1801 CD-ROM I/F connector (50pin) Table C-6 CD-ROM I/F connector (50pin) Pin No. Signal name I/O Pin No.
Appendices C.7 Apx. C Pin Assignment PJ4700 USB1 connector (8pin) Table C-7 USB1 connector (8pin) Pin No. C.8 Signal name 1 USBPOV-E5V 3 USBP0-S3P 5 USBPOV-E5V 7 USBP1-S3P I/O Pin No. Signal name I 2 USBP0-S3N I/O 4 GND I 6 USBP1-S3N I/O 8 GND I/O I/O I/O - PJ4701 USB2 connector (8pin) Table C-8 USB2 connector (8pin) Pin No. C.9 Signal name 1 USBP1V-E5V 3 USBP2-S3P 5 USBP1V-E5V 7 USBP3-S3P I/O Pin No.
Apx. C Pin Assignment C.10 Appendices PJ2100 PC card I/F connector (150pin) Table C-10 PC card I/F connector (150pin) (1/3) Pin No. Signal name I/O Pin No.
Appendices Apx. C Pin Assignment Table C-10 PC card I/F connector (150pin)(2/3) Pin No. C-10 Signal name I/O Pin No.
Apx. C Pin Assignment Appendices Table C-10 PC card I/F connector (150pin) (3/3) Pin No. Signal name I/O Pin No.
Appendices C.11 Apx. C Pin Assignment PJ3200 Keyboard connector (34pin) Table C-11 Keyboard connector (34pin) C.12 Pin No. Signal name I/O Pin No.
Apx. C Pin Assignment C.13 Appendices PJ6002 External microphone connector (6pin) Table C-13 External microphone connector (6pin) Pin No. C.14 Signal name I/O Pin No. Signal name I/O 1 A-GND - 2 (MICIN-PXP) I 3 (25VREF-P2V) - 4 N.C. - 5 N.C. - 6 (INTMIC) I PJ6003 Internal microphone connector (2pin) Table C-14 Internal microphone connector (2pin) Pin No. 1 C.15 Signal name INTMIC I/O Pin No.
Appendices C.16 Apx. C Pin Assignment PJ2102 Mini PCI I/F connector (124pin) Table C- 16 Mini PCI I/F connector (124pin)(1/2) Pin No. C-14 Signal name I/O Pin No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 N.C. - 9 N.C. - 10 N.C. - 11 N.C. - 12 N.C. - 13 P3V - 14 N.C. - 15 GND - 16 N.C. - 17 PIRQD-P3N O 18 P5V - 19 P3V - 20 PIRQG-P3N O 21 N.C. - 22 N.C.
Apx. C Pin Assignment Appendices Table C-16 Mini PCI I/F connector (124pin)(2/2) Pin No. Signal name I/O Pin No.
Appendices C.17 Apx. C Pin Assignment PJ3002 Bluetooth connector (20pin) Table C-17 Bluetooth connector (20pin) Pin No. C.18 Signal name I/O Pin No. Signal name I/O 1 BT-E3V - 2 N.C. - 3 N.C. - 4 USBP4-S3N 5 USBP4-S3P I/O 6 N.C. - 7 N.C. - 8 (BTIFOF-S3N) I 9 N.C. - 10 GND - 11 N.C. - 12 N.C. - 13 (BTRS T-S3P) I 14 N.C. - 15 N.C. - 16 N.C. - 17 N.C. - 18 BTMDL-P3N O 19 N.C.
Apx. C Pin Assignment C.20 Appendices PJ3000 MDC I/F connector (30pin) Table C-20 MDC I/F connector (30pin) Pin No. Signal name I/O Pin No.
Appendices C.21 Apx. C Pin Assignment PJ8800 DC-IN connector (2pin) Table C-21 DC-IN connector (2pin) Pin No. 1 C.22 Signal name ADPDC I/O Pin No. - 2 Signal name GND I/O - PJ8810 Main battery connector (10pin) Table C-22 Main battery connector (10pin) Pin No. C.23 Signal name I/O Pin No.
Apx. C Pin Assignment C.25 Appendices PJ6001 Speaker connector (4pin) Table C-25 Speaker connector (4pin) Pin No. C.26 Signal name I/O Pin No. Signal name I/O 1 VO+(VROUTR) O 2 VO- O 3 VO+(VROUTL) O 4 VO- O PJ6004 Headphone connector (6pin) Table C-26 Headphone connector (6pin) Pin No. Signal name I/O Pin No. Signal name I/O 1 GND - 2 HEADL-PXP O 3 HEADR-PXP O 4 GND - 5 HPIN-P3N I 6 N.C.
Appendices Apx. C Pin Assignment LED Board C.27 PJ9600 System Board1 I/F connector (20pin) Table C-27 System Board1 I/F connector (20pin) Pin No. C-20 Signal name I/O Pin No.
Apx. C Pin Assignment Appendices 2nd Battery Board C.28 PJ9650 System Board1 I/F connector (50pin) Table C-28 System Board1 I/F connector (50pin) Pin No. Signal name I/O Pin No.
Appendices C.29 Apx. C Pin Assignment PJ8500 2 nd battery Connector (10pin) Table C-29 2nd battery Connector (10pin) Pin No. C-22 Signal name I/O Pin No.
Apx. D Keyboard Scan/Character Codes Apx. D Appendices Keyboard Scan/Character Codes Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
Appendices Apx. D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) Cap No.
Apx. D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
Appendices Apx. D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Code set 1 Keytop Make Code set 2 Break Make Note Break 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode.
Apx. D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Cap Key Code set 1 Code set 2 No.
Appendices Apx. D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Apx. D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Cap No.
Appendices Apx. D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Pause Shift Code set 1 Code set 2 Make Make Common* E1 1D 45 E1 Ctrl* 46 E0 C6 E0 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Apx. E Key Layout Apx.
Appendices E-2 Apx.
Apx. F BIOS/KBC/EC Update Apx. F Appendices ÉÉBIOS Rewrite Procedures Appendix F BIOS/KBC/EC Update When updating the BIOS and EC/KBC set floppy diskette including updated program into the floppy drive and turn on the computer while holding down following key. • In case of updating the BIOS (Tilde key) • In case of updating the KBC/EC Tab The power is automatically turned off as soon as the beep sound is heard and completion message is displayed when updating has been finished.
Appendices F-2 Apx.
Apx. G Reliability Apx. G Appendices Reliability Appendix G Reliability The following table shows MTBF (Mean Time Between Failures) for the system.
Appendices G-2 Apx.
Apx. H Key FD Apx. H Appendices Reliability Appendix H Key FD This Appendix explains how to make a key FD. 1. Start the setup program. 2. Set the cursor to Not Registered of PASSWORD and press Space or BackSpace key. The screen to input the password appears. If the password has been set, Registered is displayed PASSWORD item. Then cancel the password first and set a new one. 3. Enter a password. The number of words shall be within ten. The character "*" is displayed as you enter a word. 4.
Appendices H-2 Apx.
