Toshiba Personal Computer Satellite A50S/TECRA A3X Series Maintenance Manual TOSHIBA CORPORATION File Number 960-534 [CONFIDENTIAL]
Copyright © 2005 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba Satellite A50S/TECRA A3X Series Maintenance Manual First edition September 2005 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer Satellite A50S/TECRA A3X series. NOTE: This Satellite A50S/TECRA A3X series is a BTO-support personal computer. Each model has a different configuration. For each model’s configuration, refer to the parts list dedicated to it. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes Satellite A50S/TECRA A3X series system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 System Block Diagram .............................................................................................. 1-6 1.3 3.5-inch USB Floppy Disk Drive............................................................................. 1-10 1.4 2.5-inch Hard Disk Drive....................................................
2.13 Sound Troubleshooting............................................................................................ 2-45 2.14 Wireless LAN Troubleshooting............................................................................... 2-47 Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ...................................................................
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program .................................................. 3-70 3.30 Sound Test program................................................................................................. 3-84 3.31 SETUP ..................................................................................................................... 3-90 Chapter 4 Replacement Procedures 4.1 Overview...............................................................................................
Appendix C Pin Assignment .......................................................................................... C-1 Appendix D Keyboard Scan/Character Codes ............................................................... D-1 Appendix E Key Layout..................................................................................................E-1 Appendix F Wiring Diagrams.........................................................................................
x [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
Chapter 1 Hardware Overview [CONFIDENTIAL]
1 Hardware Overview 1 1-ii Hardware Overview [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
1 Hardware Overview Chapter 1 Contents 1.1 Features ...................................................................................................................... 1-1 1.2 System Block Diagram .............................................................................................. 1-6 1.3 3.5-inch USB Floppy Disk Drive............................................................................. 1-10 1.4 2.5-inch Hard Disk Drive..........................................................
1 Hardware Overview Figures Figure 1-1 Front of the computer..................................................................................... 1-4 Figure 1-2 System units configuration ............................................................................ 1-5 Figure 1-3 System block diagram.................................................................................... 1-6 Figure 1-4 3.5-inch USB FDD.......................................................................................
1 Hardware Overview Table 1-18 Time required for charges of RTC battery................................................... 1-32 Table 1-19 AC adapter specifications ............................................................................
1 Hardware Overview 1-vi [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
1.1 Features 1 1 Hardware Overview Features 1.1 Features The Satellite A50S/TECRA A3X is a high performance all-in-one PC running a Pentium M or Celeron M processor. Features are listed below. Microprocessor [CPU Easy Replaceable] Microprocessor used is different from each model. Mobile Intel® Pentium® -M model A 730/740/750/760/770/780 Pentium M processor with 533MHz bus operation. Mobile Intel® Celeron ® -M model A 360/370/380/390 Celeron M processor with 400MHz bus operation.
1 Hardware Overview 1.1 Features VRAM The computer has VGA imbedded in North Bridge and VRAM in 128MB(max). Keyboard An easy-to-use 85(US)-/86(UK)-key keyboard. Windows key is supported. The keyboard also supports touchpad as a pointing device. Optical devices A CD-ROM, DVD-ROM, DVD-ROM & CD-R/RW or DVD Super Multi (supporting Double Layer) Drive is supported. Battery The RTC battery is mounted inside the computer.
1.1 Features 1 Hardware Overview LAN/MODEM Connectors for LAN and Modem are separately mounted. RGB The port enables connection of an external monitor. Docking interface port Advanced Port Replicator III can be connected through docking port on the bottom.
1 Hardware Overview 1.1 Features Figure 1-1 shows the front of the computer.
1.1 Features 1 Hardware Overview Figure 1-2 shows the system units configuration.
1 Hardware Overview 1.2 1.2 System Block Diagram System Block Diagram Figure 1-3 shows the system block diagram.
1.2 System Block Diagram 1 Hardware Overview The PC contains the following components. CPU Intel® Mobile Pentium® -M model Pentium-M 1.60GHz (Processor Number ; 730) 1.73GHz (Processor Number ; 740) 1.86GHz (Processor Number ; 750) 2.00GHz (Processor Number ; 760) 2.13GHz (Processor Number ; 770) 2.26GHz (Processor Number ; 780) L1 cache : 64KB (32KB + 32KB) L2 cache : 2MB FSB : 533MHz Core voltage : 1.280~1.356V Intel® Mobile Celeron® -M model Celeron-M 1.40GHz (Processor Number ; 360) 1.
1 Hardware Overview 1.2 System Block Diagram Chipset This gate array has the following elements and functions. ¾ North Bridge (Intel 915GM ) - Support Pentium-M(915GM)/Celeron-M(915GM/910GML) Processor System Bus - System Memory Interface - Memory Controller : DDR333/DDR2-400/DDR2-533, 2GB(max) - Graphics I/F : x16 PCI Express Based Graphics I/F - DMI (Direct Media Interface) - Integrated Display interface - 1,257-ball 40.0mmx37.5mmx2.
1.2 System Block Diagram 1 Hardware Overview VGA controller Imbedded in North Bridge Other main system chips • • • • • • EC/KBC (M306KAFCLRP x 1) PSC (Toshiba-made TMP86PM49UG x 1) Thermal sensor (AnalogDevice-made ADM1032 x 1) Audio AMP (Mitsumi-made MM1517X x1) AC97-CODEC (SigmaTel-made STAC9750TG x1) Clock generator (ICS954204 x1) Mini PCI (Intel/Askey made 802.11b/g or 802.11a/b/g) 2.4 GHz DSSS wireless LAN card is equipped in the mini PCI card slot. Conformity with IEEE 802.11b (WiFi).
1 Hardware Overview 1.3 1.3 3.5-inch USB Floppy Disk Drive 3.5-inch USB Floppy Disk Drive This compact, lightweight and high-reliability FDD can be used with 720KB and 1.44MB floppy disks. Figure 1-4 shows the 3.5-inch FDD. Table 1-1 lists the specifications. Figure 1-4 3.5-inch USB FDD Table 1-1 3.5-inch USB FDD specifications Item Disk used 1-10 Specifications 2DD 2HD Unformatted capacity 1.0MB 2.0MB Formatted capacity 720KB 1.
1.4 2.5-inch Hard Disk Drive 1.4 1 Hardware Overview 2.5-inch Hard Disk Drive The computer has a compact, high-capacity HDD with a height of 9.5 mm. The HDD contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-5 shows a view of the 2.5-inch HDD and Tables 1-2 and 1-3 list the dimensions and specifications. Figure 1-5 2.5-inch HDD Table 1-2 2.5-inch HDD dimensions (1/2) Standard Item TOSHIBA HDD2193VZK01 HDD2194VZK01 Width (mm) 69.85 Height (mm) 9.5 Depth (mm) 100.
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive Table 1-3 2.5-inch HDD specifications (1/2) Specifications Item TOSHIBA HDD2193VZK01 HDD2194VZK01 HDD2191VZK01 40GB 60GB 80GB Storage size (formatted) 5,400 Rotation speed (RPM) 154.3-298.0 Data transfer rate (MB/s) 258.0-394.0 Interface transfer rate (MB/s) 233.0-446.0 100 728 Storage density (Kbpi) 735 728 88.
1.5 CD-ROM Drive 1.5 1 Hardware Overview CD-ROM Drive The CD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD. It is a high-performance drive that reads at maximum 24-speed. The CD-ROM drive is shown in Figure 1-6. The specifications of the CD-ROM drive are described in Table 1-4 and 1-5. Figure 1-6 CD-ROM drive Table 1-4 CD-ROM drive dimensions Item Maker Dimensions Standard TEAC (G8CC0002R220) Width (mm) 128 Height (mm) 12.7 Depth (mm) 129.
1 Hardware Overview 1.5 CD-ROM Drive Table 1-5 CD-ROM drive specifications Specifications Items Transfer Speed Access Time (ms) TEAC (G8CC0002R220) Data transfer rate (MB/s) Burst data transfer rate (MB/s) CD-ROM 1-14 PIO mode 16.7 MB/s (PIO MODE4) DMA mode 16.7 MB/s (Multiword MODE2) Ultra DMA mode 33.3 MB/s (Ultra DMA MODE2) 110 (Random) 240 (Full stroke) Buffer memory Supported formats 33.
1.6 DVD-ROM Drive 1.6 1 Hardware Overview DVD-ROM Drive The DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CDR/RW and DVD. It is a high-performance drive that reads DVD at maximum 8-speed, and reads CD at maximum 24-speed (3,600 KB per second). The DVD-ROM drive is shown in Figure 1-7. The specifications of the DVD-ROM drive are described in Table 1-6 and 1-7.
1 Hardware Overview 1.6 DVD-ROM Drive Table 1-7 DVD-ROM drive specifications (1/2) Specifications Items Transfer Speed Access Time (ms) TSST (G8CC0002W220) Data transfer rate (MB/s) Burst data transfer rate (MB/s) PIO mode 16.7 MB/s (PIO Mode 4) DMA mode 16.7 MB/s (Multi-word DMA Mode 2) Ultra DMA mode 33.
1.6 DVD-ROM Drive 1 Hardware Overview Table 1-7 DVD-ROM drive specifications (2/2) Specifications Items Transfer Speed Access Time (ms) TEAC (G8CC0002E220) Data transfer rate (MB/s) DVD-ROM; 8x (CAV) DVD-Video; 4x (CAV) CD-ROM (Mode1); 24x (CAV) CD-ROM (Mode2); 20x (CAV) CD-DA; 20x (CAV) CD-RW; 24x (CAV) DVD-R/-RW; 8x (CAV) DVD+R/+RW; 8x (CAV) DVD-RAM (4.7GB); 5x (CAV) DVD-RAM (2.6GB); 2.5x (CAV) Burst data transfer rate (MB/s) PIO mode 16.7 MB/s (PIO Mode 4) DMA mode 16.
1 Hardware Overview 1.7 1.7 DVD-ROM & CD-R/RW Drive DVD-ROM & CD-R/RW Drive The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15inch) CD, CD-R/RW and DVD. It is a high-performance drive that reads DVD at maximum 8-speed, and reads CD at maximum 24-speed. The DVD-ROM & CD-R/RW drive is shown in Figure 1-8. The specifications of the DVDROM & CD-R/RW drive are described in Table 1-8 and 1-9.
1.7 DVD-ROM & CD-R/RW Drive 1 Hardware Overview Table 1-9 DVD-ROM & CD-R/RW drive specifications (1/2) Specifications Items Panasonic (G8CC0002J220) Read(KB/s) CD-ROM; 24x (CAV) DVD-ROM MAX 8x CAV Write CD-R 24x (CAV) CD-RW 4x (CLV) High Speed CD-RW 10x (CLV) Ultra Speed CD-RW 24x (CAV) Transfer Speed Burst data transfer rate (MB/s) Access Time (ms) PIO mode 16.6 MB/s (PIO Mode 4) DMA mode 16.6 MB/s (Multi-word DMA Mode 2) Ultra DMA mode 33.
1 Hardware Overview 1.
1.8 DVD Super Multi drive 1.8 1 Hardware Overview DVD Super Multi drive The DVD Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CDR/RW and DVD. It is a high-performance drive that reads CD at maximum 24-speed (3,600 KB per second) and writes DVD-RW at 2-speed, DVD-RAM at 2-speed, DVD-R at4-speed, DVD+R at 2.4-speed and DVD+RW at 2.4-speed. The DVD Super Multi drive is shown in Figure 1-9. The specifications of the DVD Super Multi drive are described in Table 1-10 and 1-11.
1 Hardware Overview 1.8 DVD Super Multi drive Table 1-11 DVD Super Multi drive specifications (1/2) Specifications Items Transfer Speed Access Time (ms) Panasonic (G8CC0002T220) Read(KB/s) DVD-ROM MAX 8x CAV CD-ROM MAX 24x CAV Write CD-R 24x (ZoneCLV) CD-RW 4x (CLV) High Speed CD-RW 10x (CLV) Ultra Speed CD-RW 10x (CLV) DVD-R 8x (ZoneCLV) DVD-R Double Layer 2x (CLV) DVD-RW 4x (ZoneCLV) DVD+R 8x (ZoneCLV) DVD+R Double Layer 2.
1.8 DVD Super Multi drive 1 Hardware Overview Table 1-11 DVD Super Multi drive specifications (2/2) Specifications Items Transfer Speed Access Time (ms) TEAC (G8CC0002S220) Read(KB/s) DVD-ROM 8x (CAV) CD-ROM 24x (CAV) Write CD-R 24x (ZoneCLV) CD-RW 16x (CLV) DVD-R 8x (ZoneCLV) DVD-RW 4x (ZoneCLV) DVD+R 8x (ZoneCLV) DVD+R Double Layer 2.4x (CLV) DVD+RW 4x (ZoneCLV) DVD-RAM 3x (ZoneCLV) Burst data transfer rate (MB/s) PIO mode 16.7 MB/s (PIO Mode 4) DMA mode 16.
1 Hardware Overview 1.9 1.9 Keyboard Keyboard An 85(US)-/86(UK)- key keyboard is mounted on the system unit. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-10 shows a view of the keyboard. See Appendix E for details of the keyboard layout.
1.10 TFT Color Display 1 Hardware Overview 1.10 TFT Color Display The TFT color display has a 15.0-inch (XGA, SXGA+) LCD module and the FL inverter board. 1.10.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 262,144 colors with 1,024 x 768 or 1,400 x 1,050 resolution. North Bridge can control both internal and external XGA or SXGA+ support displays simultaneously.
1 Hardware Overview 1.10 TFT Color Display Table 1-12 LCD module specifications (15.0-inch XGA TFT) (1/2) Specifications Item G33C0002W110 G33C0002Y110 Number of Dots 1,024(W) × 768(H) Dot spacing (mm) 0.297(H)× 0.297(V) Display range (mm) G33C00030110 304.128(H)× 228.096(V) Table 1-12 LCD module specifications (15.0-inch SXGA+ TFT) (2/2) Specifications Item G33C0001X210 Number of Dots 1,400(W)× 1,050(H) Dot spacing (mm) 0.2175(H)× 0.2175(V) Display range (mm) 304.5(H)× 228.
1.10 TFT Color Display 1 Hardware Overview 1.10.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module fluorescent lamp. Table 1-13 lists the FL inverter board specifications. Table 1-13 FL inverter board specifications Item Input Output Specifications Voltage (V) DC5 Power (W) 7 Voltage (V) 750 Current (mA) 6.
1 Hardware Overview 1.11 Power Supply 1.11 Power Supply The power supply supplies 26 different voltages to the system board. The power supply microcontroller has the following functions. 1. 2. 3. 4. 5. 6. 7. 8. Judges if the DC power supply (AC adapter) is connected to the computer. Detects DC output and circuit malfunctions. Controls the battery icon, and DC IN icon. Turns the battery charging system on and off and detects a fully charged battery. Turns the power supply on and off.
1.11 Power Supply 1 Hardware Overview Table 1-14 Power supply output rating Power Supply (Yes / No) Name Voltage [V] S3 S4/S5 G3 Use No No No CPU No No No No No No PTV PGV 1.308 – 0.748 1.05 1.056 1R5-P1V 1.5 No No No 1R8-B1V VG1R8-P1V 2R5-P2V MR0R9-B0V 0R9-P0V 1.8 1.8 2.5 0.9 0.9 Yes No No Yes No No No No No No No No No No No P3V 3.3 No No No E3V 3.3 Yes Yes / No No SD-E3V LAN-E3V LAN2R5-E2V BT-P3V USB0PS-E5V USB1PS-E5V 3.3 3.3 2.5 3.
1 Hardware Overview 1.12 Batteries 1.12 Batteries The PC has the following two batteries. Main battery Real time clock (RTC) battery Table 1-15 lists the specifications for these two batteries. Table 1-15 Battery specifications Battery Name Capacity Material Output Voltage G71C0003V910 G71C0003VA10 G71C0003VD10 4,400mAh G71C0003VE10 Main battery lithium ion (6-cell) G71C0005H110 10.
1.12 Batteries 1 Hardware Overview 1.12.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adaptor and battery are connected to the computer. Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on, and quick charge is used while the system is turned off or in suspend mode.
1 Hardware Overview 1.12 Batteries 1.12.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-18 lists the Time required for charges of RTC battery.
1.13 AC Adapter 1 Hardware Overview 1.13 AC Adapter The AC adapter is used to charge the battery. Table 1-19 lists the AC adapter specifications. Table 1-19 AC adapter specifications (1/2) Item Specifications G71C0002SB10 G71C0004A410 Input voltage 100V/240V Input frequency 50Hz/60Hz No load input power 0.5W or less Output voltage 15.0V Output current 4.
1 Hardware Overview 1-34 [CONFIDENTIAL] 1.
Chapter 2 Troubleshooting Procedures [CONFIDENTIAL]
2 Troubleshooting Procedures 2 2-ii [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-2 2.3 Power Supply Troubleshooting.................................................................................. 2-6 2.4 2.5 2.6 2.7 Procedure 1 Power Status Check ................................
2 Troubleshooting Procedures 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2-iv Display Troubleshooting.......................................................................................... 2-38 Procedure 1 External Monitor Check....................................................... 2-38 Procedure 2 Diagnostic Test Program Execution Check ......................... 2-38 Procedure 3 Connector and Cable Check................................................. 2-39 Procedure 4 Replacement Check ..........
2 Troubleshooting Procedures Figures Figure 2-1 Troubleshooting flowchart............................................................................. 2-3 Figure 2-2 A set of tool for debug port test ................................................................... 2-18 Tables Table 2-1 Battery icon.................................................................................................... 2-6 Table 2-2 DC IN icon.............................................................................
2 Troubleshooting Procedures 2-vi [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. 2. 3. 4. 5. 6. Power supply System Board 3.5” USB FDD 2.5” HDD Keyboard Display 7. 8. 9. 10. 11. 12. Touch pad Optical Drive Modem LAN Sound Wireless LAN 13.
2 Troubleshooting Procedures 2.2 2.2 Troubleshooting Flowchart Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which troubleshooting procedure is executed. Before going through the flowchart steps, check the following: Make sure that Toshiba Windows® OS is installed on the hard disk. Non-Toshiba operating systems can cause the computer malfunction. Make sure all optional equipment is removed from the computer.
2.
2 Troubleshooting Procedures 2.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), then perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting Procedures 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures When the icon is blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter. 2. Re-attach the battery pack and the AC adapter. If the icon is still blinking after the operation above, check the followings: Check 1 If the DC IN icon blinks orange, go to Procedure 2. Check 2 If the DC IN icon does not light, go to Procedure 3. Check 3 If the battery icon does not light orange or green, go to Procedure 4.
2 Troubleshooting Procedures Procedure 2 2.3 Power Supply Troubleshooting Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Off for 2 seconds Error code (8 bit) “1” ON for one second “0” ON for half second Interval between data bits Off for half second The error code begins with the least significant digit. Example: Error code 13h (Error codes are given in hexadecimal format.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures DC power supply (AC adapter) Error code Meaning 10h AC Adapter output voltage is over 16.5V. 11h Common Dock output voltage is over 16.5V. 12h Current from the DC power supply is over 7.00A. 13h Current from the DC power supply is over 0.5A when there is no load. 14h Abnormal current has been sensed. Main Battery Error code Meaning 22h Main battery discharge current is over 0.5A when there is no load.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting E5V output (P61) Error code Meaning 50h E5V voltage is over 6.00V when the computer is powered on/off. 51h E5V voltage is 4.50V or less when the computer is powered on. 52h E5V voltage is 4.50V or less when the computer is booting up. 53h E5V voltage is over 4.50V when the computer is powered off. (EV power is off) 54h E5V voltage is 4.50V or less when the computer is powered off.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures PPV output (P65) Error code Meaning 90h PPV voltage is over 1.80V when the computer is powered on/off. 91h PPV voltage is 0.56V or less when the computer is powered on. 92h PPV voltage is 0.56V or less when the computer is booting up. 93h PPV voltage is over 0.56V when the computer is powered off. (PV power is off) PTV output (P66) Error code Meaning A0h PTV voltage is over 1.26V when the computer is powered on/off.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting PTV output (P75) Error code Meaning D0h PTV voltage is over 2.16V when the computer is powered on/off. D1h PTV voltage is 0.89V or less when the computer is powered on. D2h PTV voltage is 0.89V or less when the computer is booting up. D3h PTV voltage is 0.89V or more when the computer is powered off. (PV power is off) PTV output (P77: MUX_CH1) Error code Meaning E0h PTV voltage is over 1.26V when the computer is powered on/off.
2.3 Power Supply Troubleshooting Procedure 3 2 Troubleshooting Procedures Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If these cables are connected correctly, go to Check 2. Check 2 Replace the AC adapter and the AC power cord with new ones.
2 Troubleshooting Procedures Procedure 5 2.3 Power Supply Troubleshooting Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures. Check 1 Replace the AC adapter with a new one. If the AC adapter is still not functioning properly, perform Check 2. Check 2 Replace the DC-IN harness with a new one.
2.4 System Board Troubleshooting 2.4 2 Troubleshooting Procedures System Board Troubleshooting This section describes how to determine if the system board is defective. Start with Procedure 1 and continue with the other procedures as instructed.
2 Troubleshooting Procedures Procedure 1 2.4 System Board Troubleshooting Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If MS-DOS or Windows OS is properly loaded, go to Procedure 4.
2.4 System Board Troubleshooting Check 3 2 Troubleshooting Procedures The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (23) or (24) is displayed, go to Procedure 4. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures in Section 2.7. If error message (19), (20) or (21) is displayed, go to the 2.5” HDD Troubleshooting Procedures in Section 2.6.
2 Troubleshooting Procedures Procedure 2 2.4 System Board Troubleshooting Debug Port Check Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows; 1. Connect the debug test cable to the connector CN3490 of the system board. For disassembling to connect the test cable, refer to Chapter 4. 2. Connect the debug port test cable and RS-232C cross cable to the test board. 3.
2.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 D port status (2/9) D port status F007H Inspection items Details BTBK_ENTER_SYSTEM_BIOS Transition to System BIOS IRT BIOS Rewite process ICHM.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 D port status (3/9) D port status Inspection items Details Searching entry of “CHGBIOSA.EXE/CHGFIRMA.EXE” from the loaded sector Loading EXE header of “CHGBIOSA.EXE /CHGFIRMA.EXE”, Key input when an error occurred Executing “CHGBIOSA.EXE”/”CHGFIRMA.EXE” IRT F100H IRT_START Cache controll for HyperThreading Disabling cache Initializing H/W (before recognizing DRAM) Initializing MCHM Initializing ICH4M.D31.Func0 Initializing ICH4M.
2 Troubleshooting Procedures 2.
2.
2 Troubleshooting Procedures 2.
2.
2 Troubleshooting Procedures 2.
2.
2 Troubleshooting Procedures Procedure 3 2.4 System Board Troubleshooting Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Printer test 7. Async test 8. Hard Disk test 9. Real Timer test 10. NDP test 11. Expansion test 12.
2.5 3.5” FDD Troubleshooting 2 Troubleshooting Procedures 2 2.5 3.5” FDD Troubleshooting This section describes how to determine if the 3.5” FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.5 3.5” FDD Troubleshooting Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-4.
2.5 3.5” FDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector Check and Replacement Check The USB connector may be disconnected from the system board. Check visually that the connector is connected firmly. Check 1 Make sure the following cables and connectors are firmly connected to the each board.
2 Troubleshooting Procedures 2.6 2.6 2.5” HDD Troubleshooting 2.5” HDD Troubleshooting This section describes how to determine if the 2.5” HDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.6 2.5” HDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure of no floppy disk in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
2 Troubleshooting Procedures Procedure 3 2.6 2.5” HDD Troubleshooting Format Check The computer’s HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required. Refer to the MS-DOS Manual for the operation of MS-DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format an 2.5” HDD using MS-DOS FORMAT command. Type as FORMAT C:/S/U. If the 2.
2.6 2.5” HDD Troubleshooting Procedure 4 2 Troubleshooting Procedures Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-5.
2 Troubleshooting Procedures Procedure 5 2.6 2.5” HDD Troubleshooting Connector Check and Replacement Check The HDD is connected to the connector of the system board. The connecting portion may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks to check the connecting portion: Check 1 Make sure the following connectors are firmly connected to the system board.
2.7 Keyboard Troubleshooting 2.7 2 Troubleshooting Procedures Keyboard Troubleshooting To determine if the computer’s keyboard is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed.
2 Troubleshooting Procedures 2.8 2.8 Display Troubleshooting Display Troubleshooting To check if the computer’s display is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: External Monitor Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector and Cable Check Procedure 4: Replacement Check Procedure 1 External Monitor Check Connect an external monitor to the computer’s external monitor port, then boot the computer.
2.8 Display Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector and Cable Check LCD Module is connected to system board by an LCD/FL cable. FL inverter board is also connected to system board by an LCD/FL cable. In addition, fluorescent lamp is connected to FL inverter board by HV cable. Their cables may be disconnected from system board or FL inverter board. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures.
2 Troubleshooting Procedures Procedure 4 2.8 Display Troubleshooting Replacement Check Fluorescent lamp, FL inverter, LCD module, HV cable and LCD/FL cable are connected to display circuits. Any of these components may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: If fluorescent lamp does not light, perform Check 1.
2.9 Touch Pad Troubleshooting 2.9 2 Troubleshooting Procedures Touch Pad Troubleshooting To determine whether the Touch Pad is faulty or not, perform the following procedures: Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Cable Check Procedure 1 Diagnostic Test Program Execution Check Execute the Touch pad test (ONLY ONE TEST) in the Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics, for more information on how to perform the test program.
2 Troubleshooting Procedures 2.10 Optical Drive Troubleshooting 2.10 Optical Drive Troubleshooting To check if the optical drive is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program.
2.11 Modem Troubleshooting 2 Troubleshooting Procedures 2.11 Modem Troubleshooting To check if the modem is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute Modem test in the LAN/Modem/Bluetooth/IEEE1394 test program.
2 Troubleshooting Procedures 2.12 LAN Troubleshooting 2.12 LAN Troubleshooting To check if the computer’s LAN is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute LAN test in the LAN/Modem/Bluetooth/IEEE1394 test program.
2.13 Sound Troubleshooting 2 Troubleshooting Procedures 2.13 Sound Troubleshooting To check if the sound function is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check Procedure 3 Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound Test in the Diagnostic Program.
2 Troubleshooting Procedures Procedure 3 2.13 Sound Troubleshooting Replacement Check Check 1 The speaker may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem persists, perform Check 3. Check 2 The sound board may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem persists, perform Check 3. Check 3 The system board may be faulty. Replace it with a new one following the instructions in Chapter 4.
2.14 Wireless LAN Troubleshooting 2 Troubleshooting Procedures 2.14 Wireless LAN Troubleshooting To check if the computer's Wireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antennas' Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the ON position.
2 Troubleshooting Procedures Check 3 2.14 Wireless LAN Troubleshooting Make sure the wireless LAN antenna cables (MAIN and AUX) are firmly connected to the connectors on the wirelss LAN card. If the wireless LAN antenna cables are disconnected, connect them firmly and perform Procedure 1. If the wireless LAN is still not functioning properly, go to Procedure 3. Procedure 3 Replacement Check The wirelss LAN card, wireless LAN antennas and the system board are may be damaged.
Chapter 3 Tests and Diagnostics [CONFIDENTIAL]
3 Tests and Diagnostics 3 3-ii [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
3 Tests and Diagnostics Chapter 3 3.1 3.2 Contents The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu ................................................................................. 3-1 3.1.2 H/W (Hardware) initial information setting tool.................................. 3-3 3.1.3 Heatrun test program............................................................................
3 Tests and Diagnostics 3.21.2 3.22 3.23 3.24 3.25 Operations .......................................................................................... 3-46 Log Utilities ............................................................................................................. 3-47 3.22.1 Function Description .......................................................................... 3-47 3.22.2 Operations ..........................................................................................
3 Tests and Diagnostics Tables Table 3-1 Subtest names .................................................................................................... 3-12 Table 3-2 Error codes and error status names .................................................................... 3-35 Table 3-3 Hard disk controller status register contents...................................................... 3-38 Table 3-4 Error register contents...................................................................................
3 Tests and Diagnostics 3-vi [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
3 Tests and Diagnostics 3.1 The Diagnostic Test 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
3.
3 Tests and Diagnostics 3.1 The Diagnostic Test 3.1.2 H/W (Hardware) initial information setting tool The H/W initial information setting tool consists of the following programs. Initial configuration Region write System configuration display E2PROM test (MAC/GUID/DMI) You will need the following equipment to perform some of the programs. The Diagnostics Disk (Main T&D) A LAN wraparound connector (E2PROM test) 3.1.
3.2 Executing the Diagnostic Test 3.2 3 Tests and Diagnostics Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the floppy disk drive. 2. Release the lock of the power switch and turn on the computer with pressing the F12. Select the FDD in the display for selecting booting unit. Then, press Enter and the following menu appears. Microsoft Windows XX Startup Menu --------------------------------------------------------1.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test NOTE: To exit the DIAGNOSTIC TEST MENU, press the Esc key. If a test program is in progress, press Ctrl + Break to exit the test program. If a test program is in progress, press Ctrl + C to stop the test program. Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Select the option you want to execute and press Enter. When you select 1- SYSTEM TEST, the following message will appear: SYSTEM TEST NAME SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter.
3.3 Setting of the hardware configuration 3.3 3 Tests and Diagnostics Setting of the hardware configuration To execute this program, select 2-Repair initial config test in the startup menu, press Enter and follow the directions on the screen. The H/W initial information setting tool consists of four subtests. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Initial configuration This subtest executes the following items and shows their contents in the display.
3 Tests and Diagnostics 3.3 Setting of the hardware configuration Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) Setting of DVD region code (Yes/No) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter. Subtest 02 Region write This subtest executes the setting of the region code for DVD drive based on the destination of the machine.
3.3 Setting of the hardware configuration Subtest 08 3 Tests and Diagnostics System configuration display This subtest displays the information of the system configuration. Confirm the contents and press Enter. For more details on the system configuration information, refer to 3.26 "System configuration". Subtest 09 E2PROM test (MAC/GUID/DMI) It checks whether the MAC address, GUID of IEEE1394 and DMI information are written.
3 Tests and Diagnostics 3.4 3.4 Heatrun Test Heatrun Test To execute this program, select 3-Repair heatrun in the startup menu, press Enter. After selecting this test, the same subtests as 3.24 RUNNING TEST is executed successively. For more details on the procedure and test content, refer to RUNNING TEST. When the heatrun test ends, following message appears in the display.
3.5 Subtest Names 3.5 3 Tests and Diagnostics Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. 3-12 Test Name Subtest No.
3 Tests and Diagnostics 3.5 Subtest Names Table 3-1 Subtest names (2/2) No. Test Name Subtest No.
3.6 System Test 3.6 3 Tests and Diagnostics System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM Checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board. Subtest 02 Fan ON/OFF This subtest turns on/off the fan motor by force with Fan ON/OFF commands.
3 Tests and Diagnostics 3.6 System Test This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.XX *** Model Name Version Number Serial Number Model Number UUID Number : : : : : XXXXXXXXXXX XXXXXXXXXXXX XXXXXXXX XXXXXX-XXXXX XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX Press [Enter] to EXIT To exit this subtest and return to the SYSTEM test menu, press Enter.
3.7 Memory Test 3.7 3 Tests and Diagnostics Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected Mode NOTE: The CONFIG.
3 Tests and Diagnostics 3.8 3.8 Keyboard Test Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
3.9 Display Test 3.9 3 Tests and Diagnostics Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAh and 55h) to the video RAM. The data is read and compared to the original data.
3 Tests and Diagnostics Subtest 04 3.9 Display Test Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 640*480 800*600 800*600 1024*768 1024*768 64K] 16M] 64K] 16M] 64K] 16M] The display below appears on the screen when this subtest is executed.
3.9 Display Test Subtest 06 3 Tests and Diagnostics “H” Pattern Display This subtest displays a full screen of “H” patterns.
3 Tests and Diagnostics 3.10 Floppy Disk Test 3.10 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen.
3.10 Floppy Disk Test 3 Tests and Diagnostics Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK IN PROGRESS SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop ERROR COUNT READ DATA STATUS : XXXXX : XX : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
3 Tests and Diagnostics 3.11 Printer Test 3.11 Printer Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The following messages will appear after selecting the Printer Test from the DIAGNOSTIC TEST MENU. Answer each of the questions with an appropriate response to execute the test. NOTE: An IBM compatible printer must be connected to the system to execute this test. Also, printer port wraparound connector must be connected.
3.11 Printer Test Subtest 02 3 Tests and Diagnostics Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
3 Tests and Diagnostics 3.12 Async Test 3.12 Async Test To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3.13 Hard Disk Test 3 Tests and Diagnostics 3.13 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08,or 09 is executed. Before running the test, the customer should transfer the contents of the hard disk to floppy disk or another hard disk. If the customer has not or cannot perform the back-up, create back-up disks as described below.
3 Tests and Diagnostics 3.13 Hard Disk Test 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
3.13 Hard Disk Test Subtest 04 3 Tests and Diagnostics Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
3 Tests and Diagnostics 3.14 Real Timer Test 3 3.14 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
3.14 Real Timer Test Subtest 03 3 Tests and Diagnostics Real time carry CAUTION: When this subtest is executed, the current date and time are erased.
3 Tests and Diagnostics 3.15 NDP Test 3.15 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3.16 Expansion Test 3 Tests and Diagnostics 3.16 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound NOTE: To execute this subtest, the PC card wraparound connector is required.
3 Tests and Diagnostics Subtest 02 3.16 Expansion Test RGB monitor ID NOTE: To execute this subtest, RGB monitor ID wraparound connector is required. The wiring diagram of the connector is described in Appendix F. Connect a wraparound connector to CRT monitor for the test of ID acquisition. This subtest is executed by using VESA command.
3.17 CD-ROM/DVD-ROM Test 3 Tests and Diagnostics 3.17 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW on the market.
3 Tests and Diagnostics 3.18 Error Code and Error Status Names 3.18 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
3.
3 Tests and Diagnostics 3.
3.19 Hard Disk Test Detail Status 3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eight-digit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status Tables 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There is no ID field in the requested sector.
3.20 ONLY ONE TEST 3.20 3 Tests and Diagnostics ONLY ONE TEST 3.20.1 Program Description This program tests the unique functions of this model. 3.20.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display. ################################################################# ######## ONLY ONE TEST Menu (XXXXXXXXX) ####### ################################################################# * * * 1 ............ Pressed Key Display * * 2 ............
3 Tests and Diagnostics Subtest 01 3.20 ONLY ONE TEST Pressed key display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function that causes the key’s display character to blink. Press Del + Enter to end the test.
3.20 ONLY ONE TEST Subtest 02 3 Tests and Diagnostics Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
3 Tests and Diagnostics Subtest 03 3.20 ONLY ONE TEST GP Button This subtest checks if the GP buttons work properly. The following message appears in the display. Press [Console] Button! Press the indicated button, then following message will appear in the display. Press [Console] Button! OK As the same way, press the indicated buttons and run the button test. If wrong key is pressed, following message will appear in the display.
3.20 ONLY ONE TEST Subtest 05 3 Tests and Diagnostics USB NOTE: When executing this subtest, USB test module and USB cable must be connected. This subtest checks if USB port works properly. The following menu appears in the display. ################################################################# ######## ONLY ONE TEST Menu (XXXXXXXXX) ####### ################################################################# * * * 0 ............ Port 0 (Right side) * * 1 ............ Port 1 (Left side) * * 2 ..........
3 Tests and Diagnostics Subtest 07 3.20 ONLY ONE TEST LED This subtest checks if each LED lights properly. The following message appears in the display in order. Follow the instructions in the display to execute the test. [HDD Access LED test] Confirm the LED of HDD status blinks properly. Press any key and following message appears in the display. [Caps/Num/Overlay BT/W-LAN LED test] Confirm each LED lights properly. (1) Press [Caps Lock ] key ! ...Caps (on/off) (2) Press [Fn + F10 ] key ! ...
3.21 Head Cleaning 3.21 3 Tests and Diagnostics Head Cleaning 3.21.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.21.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3 Tests and Diagnostics 3.22 3.22 Log Utilities Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name, Subtest number (TS-No) 3. Pass count (PASS) 4. Error status (STS) 5. FDD/HDD or memory address (ADDR) 6. Write data (WD) 7.
3.22 Log Utilities 3 Tests and Diagnostics 3.22.2 Operations 1. Select 5 and press Enter in the DIAGNOSTIC MENU, logs error information into RAM or onto a floppy disk.
3 Tests and Diagnostics 3.23 3.23 Running Test Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtests 01) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.23.2 Operations 1.
3.24 Floppy Disk Drive Utilities 3.24 3 Tests and Diagnostics Floppy Disk Drive Utilities 3.24.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. The option is different from the Toshiba MS-DOS FORMAT command.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3.24.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear: Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [Drive #1] Model No.
3 Tests and Diagnostics 3.25 System Configuration 3 3.25 System Configuration 3.25.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3. BIOS ROM version [1st ID, 2nd ID] 4. Boot ROM version 5. EC total version 6. PS Microprocessor version 7. SVP parameter version [Panel/Manufacture code/Product code] 8. Micro code revision [Processor number] 9.
3.25 System Configuration 3 Tests and Diagnostics 3.25.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display: Ver X.XX [Machine Name???] * * * * * * * * * * * * * * * - Processor Type - Chip set - BIOS ROM Version - BOOT ROM Version - EC Total Version - PS Micon Version - SVP Par.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g) 3.26 Wireless LAN Test Program (Intel-made b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3.26 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Using a wrong wireless LAN card (Using unspecified card) • Defective wireless LAN card Checking the connection, execute the subtest again. Subtest02 MAC Address Check This subtest displays the MAC address. Selecting this subtest, following message will appear in the display.
3 Tests and Diagnostics Subtest03 3.26 Wireless LAN Test Program (Intel-made b/g) Antenna check & communication test of 11b mode Caution: To execute subtest 03-05, use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests. Access points are also required. (Access point for 802.11b and 802.11g) Be sure to turn the wireless communication switch ON before executing wireless LAN communication test.
3.26 Wireless LAN Test Program (Intel-made b/g) Subtest04 3 Tests and Diagnostics Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. After finishing the test, OK message will appear in the display. Press any key and return to the test menu. When a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) 3.27 Wireless LAN Test Program (Intel-made a/b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics If a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display. ************************************************************* * * * SKU NG !! * * * * Other Card or Module not found * * * ************************************************************* Press any key and return to the test menu.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Defective wireless LAN card • Disappearance of MAC address data Checking the connection, execute the subtest again.
3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Connection of wireless LAN antenna cable (Main/Aux) • Condition of wireless LAN communication (Interference/obstruction) • Defective wireless LAN card Checking the connection and condition, execute the subtest again.
3 Tests and Diagnostics Subtest05 3.27 Wireless LAN Test Program (Intel-made a/b/g) Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. For more details on procedure and contens of this subtest, refer to Subtest04 Communication test of 11a mode. Subtest06 All the tests of Calexico 11a/b/g Card This subtest checks SKU information, MAC address of Calexico 802.11a/b/g card, antenna connection and communication test of Calexico 802.
3.28 Wireless LAN Test Program (Askey-made) 3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Askey-made) This section describes how to perform the wireless LAN transmitting-receiving test (Askeymade Atheros b/g, a/b/g). Caution: To execute subtest 03-07, use another computer (with Atheros wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests. Another wireless communication tool with 2.4GHz like Bluetooth is interfering with the test.
3 Tests and Diagnostics 3.
3.28 Wireless LAN Test Program (Askey-made) Subtest02 3 Tests and Diagnostics MAC Address Check This subtest displays the MAC address. Selecting this subtest, following message will appear in the display. ************************************************************* * * * MAC Address Check : OK !! * * * ************************************************************* Press any key and return to the test menu. When a defective is detected in the test, following typical cause is considered.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Askey-made) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Connection of wireless LAN antenna cable (Main/Aux) • Condition of wireless LAN communication (Interference/obstruction) • Defective wireless LAN card Checking the connection and condition, execute the subtest again.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear: Microsoft Windows XX Startup Menu ---------------------------------1. LAN 2. Modem 3. Bluetooth 4.
3 Tests and Diagnostics Subtest01 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest02 3 Tests and Diagnostics (GbE) CAUTION: Gigabit Ethernet test is not supported for this model. This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear: Testing adaptor...hit to abort. * External Loopback Test...PASSED Testing completed.
3 Tests and Diagnostics 3.29.2 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. To execute Modem test, press 2 and Enter. Following message will appear: [Modem loopback test !] ICHx MDC Test Program with Modem Sound (Line Test) Version X.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.3 3 Tests and Diagnostics Bluetooth test CAUTION: Bluetooth test is not supported for this model. To execute this test, input 3 and press Enter. Note: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test. Insert a floppy disk containing the test program into the target machine and turn on the target machine.
3 Tests and Diagnostics Subtest01 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the target machine has any problem, it displays Error CODE. The following message is displayed. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection. Hardware Failure.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program When the Bluetooth test menu is displayed, press T to select the test and press Enter in the test machine. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the target machine has any problem, the following message “INCOMPLETE” is displayed with the Error Code. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3 Tests and Diagnostics 3.29.4 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program IEEE1394 test To execute this test, input 4 and press Enter. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. The following menu will appear: ******************************************************************** ******** IEEE1394[XXXXX] Diagnostics program ************** ******************************************************************** * * * 1 ....
3.30 Sound Test program 3 3 Tests and Diagnostics Tests and Diagnostics 3.30 Sound Test program This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Insert the test program disk for Sound test in the floppy disk drive and turn on the power.
3 Tests and Diagnostics 3.30 Sound Test program To return to the Sound test menu, Press 9 and Enter. Then following message will appear in the display. *********************************** ******** May I Restart ? ******* *********************************** Press any key to continue… After pressing any key, the machine starts rebooting and sound test menu will appear in the display. Subtest01 Microphone recording & play This subtest checks the function of the CODEC A/D, D/A converter.
3.30 Sound Test program Subtest02 3 Tests and Diagnostics Sine Wave This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave. (It sounds like a continuous beep). By using wave measurable devices such as an oscilloscope, the data can be measured as a sine wave.
3 Tests and Diagnostics 3.30 Sound Test program 3.30.3 CD Sound (Standard) test To execute the CD Sound (Standard) test, press 3 and Enter. Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared). Following menu appears in the display. For details on use of test media, refer to (1) Test media (Toshiba-made test media). For details on use of audio CD on the market, refer to (2) Audio CD.
3.30 Sound Test program Subtest02 3 Tests and Diagnostics English Narration Selected this subtest, narration in English starts. For more details on the procedure, refer to the subtest01. Subtest03 Test Tone A Caution: Before starting subtest03, be sure to set the sound at proper volume. This subtest plays sine wave while changing its table from 100Hz to 20Hz. Return to the CD Sound (Standard) menu after the test ends.
3 Tests and Diagnostics 3.30 Sound Test program (2) Audio CD Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX SUB-TEST PASS COUNT WRITE DATA ADDRESS XX XXXXX XX XXXXXX : : : : xxxxxxx DIAGNOSTIC TEST VX.
3.31 SETUP 3 Tests and Diagnostics 3.31 SETUP 3.31.1 Function Description This program displays the current system setup information as listed below: 1. Memory 2. System Date/Time 3. Battery (a) Battery Save Mode (b) PCI Express Link ASPM 4. Password 5. HDD Password (a) (b) (c) (d) HDD HDD Password Mode User Password Master Password 6. Boot Priority (a) Boot Priority (b) HDD Priority (c) Network Boot Protocol 7. Display (a) Power On Display (b) LCD Display Stretch (c) TV Type 8.
3 Tests and Diagnostics 3.31 SETUP 11. Drives I/O (a) Built-in HDD (b) CD-ROM 12. PCI Bus 13. Security Controller (a) TPM (b) Clear TPM Owner 14. Peripheral (a) Internal Pointing Device (b) Ext Keyboard “Fn” (c) Parallel Port Mode 15. Legacy Emulation (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation (c) USB Memory BIOS Support Type 16.
3.31 SETUP 3 Tests and Diagnostics 3.31.
3 Tests and Diagnostics NOTE: 3.31 SETUP *1. HDD PASSWORD window shows slightly different display for each model. *2. LCD Display Streatch is displayed only for the model with XGA panel. *3. Dynamic CPU Frequency Mode is displayed only for the model with Pentium-M processor. *4. Language During Bootup is displayed only for the model for TCL (Canada). *5. I/O PORTS window shows slightly different display for each model. *6.
3.31 SETUP 3 Tests and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
3 Tests and Diagnostics 3.31 SETUP SETUP Options The SETUP screen is divided into 14 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Sets the date and time. System Date Sets date. System Time Sets time. 3.
3.31 SETUP 3 Tests and Diagnostics NOTE: Display of the LCD Brightness will be changed in the condition below: (*1) Operating the battery (*2) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS. Battery Save Options Processing Speed This feature changes the CPU processing speed. High CPU operates at 1.60/1.73/1.87/2.00/2.13GHz(Pentium-M), (Default in Full Power Mode) Low CPU operates at half processing speed.
3 Tests and Diagnostics 3.31 SETUP Battery optimized If the CPU becomes too hot, the processing speed is lowered. If the temperature is still too high, the fan turns on. When the CPU temperature falls to a normal range, the fan is turned off and the processing speed is increased. NOTE: Too hot condition may cause defect on the CPU. When the hot condition continues, the power is automatically turned off in resume mode.
3.31 SETUP 3 Tests and Diagnostics 5. HDD Password This option registers, resets or changes the HDD password. (a) HDD Hard disk for setting the password. Built-in HDD The password is set to Built-in HDD. (This cannot be changed.) (b) HDD Password Mode This item registers HDD password and can be selected only for registering HDD password. To change HDD Password Mode when HDD password is registered, delete the registered HDD password first, and then register new password.
3 Tests and Diagnostics 3.31 SETUP CD-ROM→LAN→FDD→HDD: The computer looks for bootable files in the following order: CD-ROM, LAN, FDD and HDD. HDD→FDD→CD-ROM→LAN: The computer looks for bootable files in the following order: HDD, FDD, CDROM and LAN. (Default) (*1) CD-ROM refers to a Optical Disk Drive. (b) HDD Priority Use this option to set the booting priority from HDD.
3.31 SETUP 3 Tests and Diagnostics LCD Display Stretch enables or disables a larger display area of the screen. Enabled Enables the LCD display stretch feature. (Default) Disabled Disables the LCD display stretch feature. (c) TV Type This option allows you to select the type of TV. NTSC (Japan) TV in Japanese system NTSC (US) TV in the U.S.
3 Tests and Diagnostics 3.31 SETUP Available Enable the Execute-Disable Bit function. Not Available Disable the Execute-Disable Bit function. (c) Auto Power On This option displays setting for Auto Power On. Disabled Indicates auto power on is not set. Enabled Indicates auto power on is set. When “Enabled” is selected, the following sub-window appears.
3.31 SETUP 3 Tests and Diagnostics This option selects the language during bootup. This message appears only on the model for TCL (Canada). English Message is displayed in English. (Default) French Message is displayed in French. 9. Configuration This option lets you set the device configuration. All Devices BIOS sets all devices. Setup by OS Initializes devices, which is needed to load an operating system. Operating system initializes other devices.
3 Tests and Diagnostics 3.31 SETUP 10. I/O ports This option controls settings for the serial and parallel ports. (a) Serial Use this option to set the COM level for the serial port.
3.31 SETUP 3 Tests and Diagnostics When you select one of the above options, except for Not Used, a subwindow similar to the one below appears to let you set the DMA. The options for this setting are Channel 1and Channel 3 (Default). DMA OPTIONS = Channel 3 (Default) For most printers, the port should be set to ECP. With some other parallel devices, the setting should be Std. Bi-Direct. 11. Drives I/O This option displays the address and interrupts level for hard disk drive and optical disk drive.
3 Tests and Diagnostics 3.31 SETUP 14. Peripheral Use this option to select the peripheral's mode. (a) Internal Pointing Device This option enables or disables the touch pad Enabled Enables the touch pad. (Default) Disabled Disables the touch pad. (b) Ext Keyboard "Fn" This option enables or disables Fn key function on the external keyboard. Enabled Enables the feature. Disabled Disables the feature. (Default) When “Enabled” is selected, the following sub-window appears.
3.31 SETUP 3 Tests and Diagnostics NOTE: When using Windows, the setting of “Toshiba HW setup” is enabled and the setting of “Parallel Port Mode” is disabled. 15. LEGACY EMULATION (a) USB KB/Mouse Legacy Emulation This option sets the Legacy support condition of the USB keyboard and the USB mouse. Enabled Enables LEGACY support. (Default) USB keyboard/USB mouse are available without the driver.
Chapter 4 Replacement Procedures [CONFIDENTIAL]
4 Replacement Procedures 4 4-ii [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
4 Replacement Procedures Chapter 4 4.1 Contents Overview.................................................................................................................... 4-1 Safety Precautions ................................................................................................ 4-2 Before You Begin ................................................................................................ 4-3 Disassembly Procedures .......................................................................
4 Replacement Procedures 4.21 Latch Assembly ....................................................................................................... 4-61 4.22 Wireless LAN Antenna/Speaker/Hinge................................................................... 4-62 4.23 Fluorescent Lamp..................................................................................................... 4-71 4.23.1 Replacing the 15.0 Inch XGA Samsung Fluorescent Lamp ................. 4-72 4.23.2 Replacing the 15.
4 Replacement Procedures Figures Figure 4-1 Removing Battery Pack....................................................................................... 4-8 Figure 4-2 Removing PC Card ........................................................................................... 4-10 Figure 4-3 Removing Memory Slot Cover ......................................................................... 4-11 Figure 4-4 Removing Memory Module..............................................................................
4 Replacement Procedures Figure 4-30 Removing S-Video board................................................................................ 4-44 Figure 4-31 Removing Fan ................................................................................................. 4-40 Figure 4-32 Opening Insulators .......................................................................................... 4-46 Figure 4-33 Removing System Board..............................................................................
4.1 Overview 4 Replacement Procedures 4 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual. In all cases when removing an FRU, the battery pack must also be removed.
4 Replacement Procedures 4.1 Overview Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. Danger: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion.
4.1 Overview 4 Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2.1 Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
4 Replacement Procedures 4.1 Overview Disassembly Procedures Three main types of cable connector are used. Pressure plate connector Spring connector Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector.
4.1 Overview 4 Replacement Procedures Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. Check that all cables and connectors are securely connected.
4 Replacement Procedures 4.1 Overview Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended. M2 (2mm) 0.167 N·m (1.7 kgf·cm) M2.5 (2.5mm) 0.294 N·m(3.0 kgf·cm) M3 (3mm) 0.549 N·m(5.
4.1 Overview 4 Replacement Procedures Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw F: Thin head screw S: Super thin head screw T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.) Example: B6 ...
4 Replacement Procedures 4.2 4.2 Battery Pack/PC Card Battery Pack/PC Card 4.2.1 Battery Pack Removing the battery pack The following describes the procedure for removing the battery pack (See Figure 4-1). CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all other external devices from the computer. 3.
4.2 Battery Pack/PC Card 4 Replacement Procedures Installing the battery pack The following describes the procedure for reinstalling the battery pack (See Figure 4-1). CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Collect the spent battery packs. Use only the batteries approved by Toshiba. NOTE: Check visually the battery terminals and clean off any dirt with a dry cloth. 1. Turn off the power of the computer. 2.
4 Replacement Procedures 4.2 Battery Pack/PC Card 4.2.2 PC Card Removing the PC card The following describes the procedure for removing a PC card (See Figure 4-2). CAUTION: Insert or remove the PC card in accordance with any instructions in the PC card manual or the manuals of the computer system you are using. 1. Push the eject button. It will pop out when you release it. Then press the eject button once more to eject the PC card. 2. Grasp the PC card and remove it.
4.3 Memory Module 4.3 4 Replacement Procedures Memory Module CAUTION:The power of the computer must be turned off when you remove the memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend the memory module.
4 Replacement Procedures 4.3 Memory Module 4. Open the left and right latches and remove the memory module.
4.3 Memory Module 4 Replacement Procedures Installing the memory module Before installing the memory module, confirm that the computer is not in stanby mode or hibernation mode. Then perform the following procedure (See Figure 4-3, 4-4). 1. Insert the memory module into the connector of the computer slantwise (terminal side first) and press it to connect firmly. CAUTION:The power must be turned off when you insert a memory module.
4 Replacement Procedures 4.4 4.4 MDC MDC Removing the MDC The following describes the procedure for removing an MDC (See Figure 4-5). CAUTION:Since the MDC slot cover is easily broken, remove the memory cover first before removing the MDC slot cover. When replacing the MDC, The power must be turned off when you remove the MDC. Removing an MDC with the power on risks damaging the modem or the computer itself. 1. Turn the computer upside down. 2.
4.4 MDC 4 Replacement Procedures Installing the MDC The following describes the procedure for installing an MDC(See Figure 4-5). 1. Connect the MDC cable to the connector JP1 on the MDC. 2. Set the MDC on the slot and connect the MDC to the connector CN3020 on the system board by pressing it from the top. 3. Fix the MDC using the following screws. • M2x4Z BIND screw x2 4. Install the MDC slot cover and secure it with the supplied screw.
4 Replacement Procedures 4.5 4.5 HDD HDD Removing the HDD The following describes the procedure for removing an HDD (See Figure 4-6 to 4-8). CAUTION: Take care not to press on the top or bottom of the HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Remove the following screw fixing the HDD slot cover and raise the cover to remove. • M2.5x6B THIN BIND screw x1 HDD Slot Cover M2.
4.5 HDD 4 Replacement Procedures 3. Holding the tab, pull horizontally the HDD ASSY to disconnect it from the connector and remove it. HDD ASSY Tab Figure 4-7 Removing HDD ASSY 4. Remove the following screws fixing the HDD. • M3x4S THIN BIND screw x4 5. Remove the HDD holder from the HDD.
4 Replacement Procedures 4.5 HDD Installing the HDD The following describes the procedure for installing an HDD (See Figure 4-6 to 4-8). 1. Install the HDD holder to the HDD with the following screws. • M3x4S THIN BIND screw x4 2. Put the HDD ASSY into the HDD slot and connect it to the connector CN1800 on the system board. 3. Install the HDD slot cover and secure it by using the following screws. • 4-18 M2.
4.6 Wireless LAN card 4.6 4 Replacement Procedures Wireless LAN card CAUTION: The power must be turned off when you remove a wireless LAN card. Removing a wireless LAN card with the power on risks damaging the card or the computer itself. Never press hard or bend the wireless LAN card. Removing the Wireless LAN card The following describes the procedure for removing the wireless LAN card (See Figure 4-9, 4-10). 1. Turn the computer upside down. 2.
4 Replacement Procedures 4.6 Wireless LAN card 3. Disconnect two wireless LAN cables from connectors on the wireless LAN card. 4. Peel off one glass tape and two insulators remove the cables from the guide. 5. Open the left and right latches holding the wireless LAN card and remove the wireless LAN card.
4.7 Cooling Fin/CPU 4.7 4 Replacement Procedures Cooling Fin/CPU Removing the Cooling fin/CPU The following describes the procedure for removing the cooling fin/CPU (See Figure 4-11 to 4-14). 1. Remove the following screws fixing the CPU cover and remove the CPU cover. • M2.5x14B THIN BIND screw x1 • M2.5x18B THIN BIND screw x1 M2.5x18B THIN BIND M2.
4 Replacement Procedures 4.7 Cooling Fin/CPU 2. Remove the following screws securing the CPU holder on the CPU.
4.7 Cooling Fin/CPU 4 Replacement Procedures 3. Lift up the cooling fin and remove it. Cooling Fin Figure 4-13 Removing Cooling Fin 4. Unlock the CPU by rotating counterclockwise the cam on the CPU socket by 90 degrees with a flat-blade screwdriver (in the order shown in the figure below). 5. Remove the CPU.
4 Replacement Procedures 4.7 Cooling Fin/CPU Installing the Cooling fin/CPU The following describes the procedure for installing the cooling fin/CPU (See Figure 4-11 to 4-16). 1. Check that the mark on the cam is in the unlocking position. 2. Attach the CPU to the correct position in the CPU socket. CAUTION: Place the CPU in such direction as shown below. (Pay attention to the position of the triangle mark on the CPU.) Triangle mark Figure 4-15 Installing CPU 3.
4.7 Cooling Fin/CPU 4 Replacement Procedures NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. When installing the cooling fin, make sure the bottom of the fin covers the top of CPU. CPU Chip Figure 4-16 Applying Silicon Grease 5. Install the cooling fin. 6. Place the CPU holder on the cooling fin with its hole fitted to the boss of the cooling fin. Fix the CPU holder with following screws in the order of the marks (1 to 3) on the CPU holder.
4 Replacement Procedures 4.8 4.8 Keyboard Keyboard Removing the Keyboard The following describes the procedure for removing the keyboard (See Figure 4-17 to 4-19). CAUTION:As the keytop may fall out, when handling the keyboard always hold it by the frame and do not touch the keytop. 1. Open the display. 2. Hold the both ends of the keyboard holder and lift it up to remove. CAUTION:When removing the keyboard holder, be careful not to touch the metal parts of the speakers under it.
4.8 Keyboard 4 Replacement Procedures 3. Remove the following screws holding the keyboard. • M2.5×2.8B THIN BIND screw x2 4. Remove the following screw fixing the keyboard hold plate and remove the keyboard hold plate by pulling it to the right side. • M2.5×2.8B THIN BIND screw x1 5. Lift the upper side of the keyboard out and bring it a little to the display. Then turn it face down on the palm rest. M2.5x2.
4 Replacement Procedures 4.8 Keyboard 6. Remove the following screw fixing the keyboard support plate underneath the keyboard. • M2.5x8B THIN BIND screw 7. Remove the keyboard support plate. x2 M2.5x8B THIN BIND Keyboard support plate Keyboard Flexible Cable Glass tape CN3200 Keyboard Figure 4-19 Removing Keyboard support plate 8. Peeling off the glass tape, unlock the connector and remove the keyboard flexible cable from the connector CN3200 of the system board.
4.8 Keyboard 4 Replacement Procedures Installing the Keyboard The following describes the procedure for installing the keyboard (See Figure 4-17 to 4-19). 1. Place the keyboard on the palm rest as its face is down. Connect the keyboard flexible cable to the connector CN3200 on the system board. 2. Stick the glass tape on the connector CN3200. 3. Install the keyboard support plate on the keyboard flexible cable from the front side part and secure it with the following screws. • M2.
4 Replacement Procedures 4.9 4.9 Switch membrane board Switch membrane board Removing the Switch membrane board The following describes the procedure for removing the switch membrane board (See Figure 4-20). 1. Open the display and unlock the connector. Disconnect the switch membrane board cable from the connector CN3280 on the system board. 2. Remove the following screw securing the switch membrane board. • M2.5x2.8B THIN BIND screw x1 3. Slide the switch membrane board to the left and remove it.
4.9 Switch membrane board 4 Replacement Procedures Installing the Switch membrane board The following describes the procedure for installing the switch membrane board (See Figure 4-20). 1. Place the switch membrane board to the left side of the installation position and slide it to the right to install. Then fix it with the following screw. • M2.5x2.8B THIN BIND screw x1 2. Connect the switch membrane board cable to the connector CN3280 on the system board.
4 Replacement Procedures 4.10 Optical Drive 4 4.10 Optical Drive NOTE: Do not apply excessive force to the top of an optical drive. Removing the Optical drive The following describes the procedure for removing the optical drive (See Figure 4-21, 4-22). 1. Turn the computer face down and remove the following screw securing the optical drive assembly. • M2.5x6B THIN BIND screw x1 2. Pull out the optical drive assembly in the direction indicated by arrow to remove. M2.
4.10 Optical Drive 4 Replacement Procedures 3. Remove the following screws fixing the rear bracket from the optical drive assembly. • M2x2.7 STEP screw x2 4. Remove the following screw fixing the side bracket and remove the side bracket. • M2x3S SUPER THIN BIND screw x1 optical drive assembly Side Bracket Rear Bracket M2x3S SUPER THIN BIND M2x2.
4 Replacement Procedures 4.11 Display Assembly 4.11 Display Assembly Removing the Display assembly The following describes the procedure for removing the display assembly (See Figure 4-23 to 4-25). 1. Close the display and turn the computer face down. 2. Remove the following screws from the bottom of the computer. • M2.5x6B • M2.5x14B • M2.
4.11 Display Assembly 4 Replacement Procedures 3. Turn the computer face up. Open the display and disconnect the speaker cables (Blue, Red) from the connectors on the system board. Unlock the connector and disconnect the touch pad cable from the system board. 4. Remove the following screw securing the LCD harness hold plate and remove the LCD harness hold plate. Disconnect the LCD harness from the connector CN5000 on the system board. • M2.5x8B THIN BIND screw x1 5.
4 Replacement Procedures 4.11 Display Assembly 6. Pull out the wireless LAN antenna cables from the slot near the center of the base assembly. NOTE: When removing the display assembly, be careful not to cut or scratch the wireless LAN antenna cables. 7. Unhook the latches between the display assembly and the base assembly. Lift the display assembly up and remove it from the base assembly.
4.11 Display Assembly 4 Replacement Procedures Installing the Display assembly The following describes the procedure for installing the display assembly (See Figure 4-23 to 4-25). 1. Pass the wireless LAN antenna cables through the slot near the center of the base assembly. 2. Install the display assembly on the base assembly from the rear of the computer and secure them with the following screws. • M2x8B • M2.5x8B BIND screw THIN BIND screw x1 x1 3.
4 Replacement Procedures 4.12 Sound Board 4.12 Sound Board Removing the Sound Board The following describes the procedure for removing the sound board (See Figure 4-26). 1. Unlock the connector and disconnect the sound board cable from the connector of CN9510 on the sound board. 2. Remove the following screw to remove the sound board. 3. Unlock the connector and disconnect the sound board cable from the connector CN9500 on the system board • M2.5x4B THIN BIND screw x1 M2.
4.13 Parallel port board / Serial port board / S-Video board 4 Replacement Procedures 4.13 Parallel port board / Serial port board / S-Video board Depending on the model, the machine has a different type board (Parallel port board / Serial port board / S-Video board). Refer to the proper procedures below. 4.13.1 Parallel port board Removing the Parallel port board The following describes the procedure for removing the Parallel port board (See Figure 4-27, 4-28). 1.
4 Replacement Procedures 4.13 Parallel port board / Serial port board / S-Video board 3. Disconnect the USB harness from the connector CN4620 and the parallel port cable from the connector CN3503 on the parallel port board. 4. Remove the parallel port board by lifting it.
4.13 Parallel port board / Serial port board / S-Video board 4 Replacement Procedures Installing the Parallel port board The following describes the procedure for installing the Parallel port board (See Figure 4-27, 4-28). 1. Install the parallel port board on the base assembly. 2. Connect the USB harness to the connector CN4620 and the parallel port cable to the connector CN3503 on the parallel port board. 3. Pass the DC-IN harness, USB harness and parallel port cable along the guide of base assembly.
4 Replacement Procedures 4.13 Parallel port board / Serial port board / S-Video board 4.13.2 Serial port board Removing the serial port board The following describes the procedure for removing the serial port board (See Figure 4-27, 429). NOTE: The procedure 1 and 2 are the same items as parallel port board. Refer to the figure 4-27 in the parallel port board. 1. Remove the DC-IN jack and core from the slot of the base assembly. 2. Remove the following screws to remove the harness holder. • M2.
4.13 Parallel port board / Serial port board / S-Video board 4 Replacement Procedures Installing the Serial port board The following describes the procedure for installing the Serial port board (See Figure 4-27, 4-29). 1. Install the serial port board on the base assembly. 2. Connect the USB harness to the connector CN4630 and the serial port cable to the connector CN3504 on the parallel port board. 3. Pass the DC-IN harness, USB harness and serial port cable along the guide of base assembly.
4 Replacement Procedures 4.13 Parallel port board / Serial port board / S-Video board 4.13.3 S-Video board Removing the S-Video board The following describes the procedure for removing the S-Video board (See Figure 4-27, 430). NOTE: The procedure 1 and 2 are the same items as parallel port board. Refer to the figure 4-27 in the parallel port board. 1. Remove the DC-IN jack and core from the slot of the base assembly. 2. Remove the following screws to remove the harness holder. • M2.
4.13 Parallel port board / Serial port board / S-Video board 4 Replacement Procedures Installing the S-Video board The following describes the procedure for installing the S-Video board (See Figure 4-27, 430). 1. Install the serial port board on the base assembly. 2. Connect the USB harness to the connector PJ4610 and the S-Video harness to the connector PJ5640 on the S-Video board. 3. Pass the DC-IN harness, USB harness and S-Video harness along the guide of base assembly.
4 Replacement Procedures 4.14 Fan 4.14 Fan Removing the Fan The following describes the procedure for removing the fan (See Figure 4-31). 1. Disconnect the fan cable from the connector CN8770 on the system board. 2. Remove the following screws and remove the fan by raising it up. • M2.5x4B THIN BIND screw M2.5x4B x2 THIN BIND CN8770 Fan Figure 4-31 Removing Fan Installing the Fan The following describes the procedure for installing the fan (See Figure 4-31). 1.
4.15 System Board/DC-IN Jack/RTC Battery 4 Replacement Procedures 4.15 System Board/DC-IN Jack/RTC Battery CAUTION: When handling the system board, always hold by the edges. Do not touch the printed circuit face. After replacing the system board with a new one, update the DMI information as described Chapter 3. Also update with the latest BIOS as described in Appendix G “BIOS/KBC/EC Update”.
4 Replacement Procedures 4.15 System Board/DC-IN Jack/RTC Battery 3. Remove the LAN harness and Modem harness from the base assembly. 4. Remove the following screws securing the system board. • M2.5x4B THIN BIND screw x2 5. [Parallel port board model or Serial port board model] Disconnect the parallel port cable or serial port cable from the connector CN3502 on the system board. 6. [S-VIdeo board model] Disconnect the S-Video harness from the connector CN5340 on the system board. 7.
4.15 System Board/DC-IN Jack/RTC Battery 4 Replacement Procedures Installing the System board/DC-IN jack/RTC battery The following describes the procedure for installing the system board/DC-IN jack/RTC battery (See Figure 4-32, 4-33). 1. Connect the Modem harness to the connector CN3011 and the LAN harness to CN4100 on the back of the system board and secure them with glass tapes. 2. Connect the RTC battery cable to the connector CN9990 on the system board. 3.
4 Replacement Procedures 4.16 PC card cover 4.16 PC card cover Removing the PC card cover The following describes the procedure for removing the PC card cover (See Figure 4-34). 1. Remove the following screws securing the PC card cover. • M2x4C SUPER THIN BIND screw x2 2. Release the hooks securing the PC card cover and remove the PC card cover.
4.17 Battery Latch 4 Replacement Procedures 4.17 Battery Latch Removing the Battery latch The following describes the procedure for removing the battery latch (See Figure 4-35, 4-36). 1. While pressing projections of the SB latch button inside each other, push the SB latch button to the bottom of the base assembly to remove. Base Assembly Projection of the SB latch button Figure 4-35 Removing SB Latch Button 2.
4 Replacement Procedures 4.17 Battery Latch Installing the Battery latch The following describes the procedure for installing the battery latch (See Figure 4-35, 4-36). 1. Set the spring to the battery lock L and install it on the base assembly. 2. Install the SB latch button from the bottom of the base assembly and snap their projections to the battery lock L. When installing the button, make sure the triangle mark on the back side is located in the indicated position.
4.18 Battery Lock 4 Replacement Procedures 4.18 Battery Lock Removing the Battery lock The following describes the procedure for removing the battery lock (See Figure 4-34, 4-35). 1. While pressing projections of the battery lock button inside each other, push the button to the bottom of the base assembly to remove. Base Assembly Projection of the battery lock button Figure 4-37 Removing Battery Lock Button 2.
4 Replacement Procedures 4.18 Battery Lock Installing the Battery lock The following describes the procedure for installing the battery latch (See Figure 4-37, 4-38). 1. Set the spring to the battery lock R and install it on the base assembly. 2. Install the battery lock button from the bottom of the base assembly and snap their projections to the battery lock R. When installing the button, make sure the mark on the back side is located in the indicated position.
4.19 Touch Pad 4 Replacement Procedures 4.19 Touch Pad Removing the Touch pad The following describes the procedure for removing the touch pad (See Figure 4-36). 1. Remove the following screws securing the touch pad. • M2.5x4B THIN BIND screw x6 2. Remove the touch pad and touch pad switch by raising. M2.
4 Replacement Procedures 4.19 Touch Pad Installing the Touch pad The following describes the procedure for installing the touch pad (See Figure 4-39). 1. Place the touch pad switch fitting to bosses. 2. Place the touch pad according to the guide pins. 3. Secure the touch pad with the following screws. • 4-56 M2.
4.20 LCD Unit/FL Inverter 4 Replacement Procedures 4.20 LCD Unit/FL Inverter Removing the LCD unit/FL inverter The following describes the procedure for removing the LCD unit and FL inverter (See Figure 4-40 to 4-42). 1. Peel off two mask seals from the front of the display mask and remove the following screws. • M2.5x6B THIN BIND screw x2 2. Insert your fingers between the display mask and the LCD and remove the display mask after unlatching the display mask. Mask Seal Display Mask M2.
4 Replacement Procedures 4.20 LCD Unit/FL Inverter 3. Remove the following screw fixing the FL inverter. • M2x4Z SUPER THIN BIND screw x1 4. Peel off the insulators in the HV cable side and disconnect two cables from the FL inverter. Remove the FL inverter. 5. Remove the following screws fixing the LCD unit. • M2x4Z SUPER THIN BIND screw x4 6. With the bottom edge of the LCD unit resting on the display cover, raise the top edge of the LCD unit.
4.20 LCD Unit/FL Inverter 4 Replacement Procedures 8. Remove the following screws securing the LCD brackets. Remove the LCD brackets from the LCD module.
4 Replacement Procedures 4.20 LCD Unit/FL Inverter Installing the FL inverter/LCD unit The following describes the procedure for installing the LCD unit/FL inverter (See Figure 440 to 4-42). 1. Secure the LCD brackets to the LCD module with the following screws. • M2x3C SUPER THIN BIND screw x4 2. Stand the LCD unit on the display cover and connect the LCD harness to the back of the LCD. Fix it with the cupper tape. 3. Put the LCD unit on the display cover and secure the LCD with the following screws.
4.21 Latch Assembly 4 Replacement Procedures 4.21 Latch Assembly Removing the Latch assembly The following describes the procedure for removing latch assembly (See Figure 4-43). 1. Press the latch assembly in the direction indicated by arrow to remove it from the display cover. Latch Display Cover Hook Spring Figure 4-43 Removing Latch Assembly Installing the Latch Assembly The following describes the procedure for installing the Latch Assembly (See Figure 4-43). 1.
4 Replacement Procedures 4.22 Wireless LAN Antenna/Speaker/Hinge 4.22 Wireless LAN Antenna/Speaker/Hinge Removing the Wireless LAN antenna/Speaker/Hinge The following describes the procedure for removing the wireless LAN antenna, speaker and hinge (See Figure 4-44 to 4-52). 1. Peel off eight glass tapes securing the wireless LAN antenna cables (white and black). Remove the wireless LAN antennas. Turn the display assembly face down and unhook the wireless LAN antenna cable from the guides.
4.
4 Replacement Procedures 4.22 Wireless LAN Antenna/Speaker/Hinge 2. Remove the following screw securing the LCD harness holder to remove it. • M2x4Z M2x4Z SUPER THIN SUPER THIN screw x1 LCD harness Holder Insulator slot Figure 4-45 Removing LCD harness Holder 3. Remove the following screws securing the display cover to the hinges. • M2.5x6C PSP TIGHT screw • M2x5C SUPER THIN screw x4 x2 4. Remove the display cover from the hinges. M2.5x6C PSP TIGHT Display cover M2.
4.22 Wireless LAN Antenna/Speaker/Hinge 4 Replacement Procedures 5. Remove the following screws securing the hinge caps and remove the hinge caps. • M2.5x6B THIN BIND screw x2 6. Remove the LCD harness. 7. Remove the wireless LAN antenna cables. M2.5x6B THIN BIND Hinge Cap Insulator M2.
4 Replacement Procedures 4.22 Wireless LAN Antenna/Speaker/Hinge 8. Remove the following screws securing the optical drive cover from the back of the display assembly. To remove the optical drive cover, pull it out to the right hinge first. • • M2.5x2.8B M2.5x4B M2.5x2.8B U-THIN BIND M2.5x4B THIN BIND U-THIN BIND screw x3 THIN BIND screw x2 M2.
4.22 Wireless LAN Antenna/Speaker/Hinge 4 Replacement Procedures 9. Remove the following screws securing the hinges to the display assembly. • M2.5x4B THIN BIND screw x3 (Right:1, Left: 2) 10. Peel off the accetate tapes securing the speaker cables and take out the cable under the insulator. M2.5x4B THIN BIND Hinge Insulator Hinge Accetate Tape M2.
4 Replacement Procedures 4.22 Wireless LAN Antenna/Speaker/Hinge 11. Remove the following screws securing the speakers. • M2. 5x4B THIN BIND screw x2 CAUTION: When removing the speakers, be careful not to touch the metal part of the speakers. It might damage the speakers. 12. Peel off insulators and pull out the speaker cable (blue) to the front. Pull out the cable from the guide and remove the left speaker. Pull out right speaker to remove. M2.5x4B THIN BIND Insulator M2.
4.22 Wireless LAN Antenna/Speaker/Hinge 4 Replacement Procedures Installing the Wireless LAN antenna/Speaker/Hinge The following describes the procedure for installing the wireless LAN antenna, speaker and hinge (See Figure 4-44 to 4-52). CAUTION: When installing the speakers, be careful not to touch the metal part of the speakers. It might damage the speakers. 1. Install the hinges to the display assembly and secure them with the following screws. • M2.5x4B THIN BIND screw x3 (Right:1, Left: 2) 2.
4 Replacement Procedures 4.22 Wireless LAN Antenna/Speaker/Hinge 6. Install the optical drive cover and secure it with the following screws. When installing, insert the “A” portion (in the figure) first. • M2.5x2.8B • M2.5x4B U-THIN BIND screw x3 THIN BIND screw x2 7. Install the display cover on the display assembly. Secure the hinges and the display cover with the following screws. • M2.5x6C • M2x5C PSP TIGHT screw x4 SUPER THIN screw x2 8.
4.23 Fluorescent Lamp 4 Replacement Procedures 4 4.23 Fluorescent Lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type 15.0 inch (XGA) 15.0 inch (SXGA+) Part No. Supplier Section G33C0002W110 Samsung 4.23.1 G33C0002Y110 Sharp 4.23.2 G33C00030110 LG.Philips 4.23.3 G33C0001X210 LG.Philips 4.23.
4 Replacement Procedures 4.23 Fluorescent Lamp 4.23.1 Replacing the 15.0 Inch XGA Samsung Fluorescent Lamp Disassembling the 15.0 Inch XGA Samsung Fluorescent Lamp To disassemble the 15.0 inch XGA Samsung fluorescent lamp, follow the steps below and refer to figures4-53 to 4-61. 1. Remove the PCB cover. NOTE: When removing the PCB cover, be careful not to damage the COF. PCB cover Figure 4-53 Replacing 15.
4.23 Fluorescent Lamp 4 Replacement Procedures 2. Remove the two screws. Screw Screw Figure 4-54 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (2) 3. Remove the four screws from the top chassis. Screw Screw Screw Screw Figure 4-55 Replacing 15.
4 Replacement Procedures 4.23 Fluorescent Lamp 4. Remove the four bottom hooks and four side hooks (left and right). Then remove the top chassis from the mold frame. Side hook Side hook Bottom hook Figure 4-56 Replacing 15.
4.23 Fluorescent Lamp 4 Replacement Procedures 5. Remove the panel assembly from the mold frame. NOTE: When removing the panel assembly, be careful not to damage the COF. Panel assembly Mold frame Figure 4-57 Replacing 15.
4 Replacement Procedures 4.23 Fluorescent Lamp 6. Remove the sheets and clips. 1) Remove the two clips fixing the sheets. 2) Remove the sheets (protection sheet, prism sheet (L, U), diffusion sheet, LGP and reflection sheet). Clip Clip Sheets Figure 4-58 Replacing 15.
4.23 Fluorescent Lamp 4 Replacement Procedures 7. Remove the lamp back cover. 1) Remove the two screws from the lamp back cover. 2) Remove the lamp back cover. Screw Lamp back cover Screw Figure 4-59 Replacing 15.
4 Replacement Procedures 4.23 Fluorescent Lamp 8. Remove the lamp wire from the wire guide of the mold frame. Lamp wire Figure 4-60 Replacing 15.
4.23 Fluorescent Lamp 4 Replacement Procedures 9. Remove the lamp assembly from the mold frame. Lamp assembly Mold frame Figure 4-61 Replacing 15.
4 Replacement Procedures 4.23 Fluorescent Lamp Assembling the 15.0-inch XGA Samsumg Fluorescent Lamp The assembly procedure of the 15.0-inch XGA Samsung fluorescent lamp is the reverse of the above disassembly procedure.
4.23 Fluorescent Lamp 4 Replacement Procedures 4.23.2 Replacing the 15.0 Inch XGA Sharp Fluorescent lamp Disassembling the 15.0 Inch XGA Sharp Fluorescent lamp To disassemble the 15.0-inch XGA Sharp fluorescent lamp, follow the steps below and refer to Figures 4-62 to 4-71. 1. Turn the LCD module face down, and remove the protection cover S (A), protection cover G (B), fixing tape (C) and fixing tape for lead wire (D). NOTE: 1) Be careful not to damage the TCP or chips.
4 Replacement Procedures 4.23 Fluorescent Lamp 2. Remove the four screws on the sides. Screw loosening torque: 1.2kg•cm Screw Screw Screw Screw Figure 4-63 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (2) 3. Turn the LCD module face up and remove the bezel (E). (E) Bezel (3) Release the hook of the bezel from the lamp cover. < Side view > Hook (1) Release the bezel from the four latches of the lamp cover. (2) Release the two latches (left and right) on the P-chassis.
4.23 Fluorescent Lamp 4 Replacement Procedures 4. Turn the LCD module face down and remove the two screws fixing the board. Then open the bent portion of the TCP of the board and remove the backlight. Screw loosening torque: 1.2kg•cm Screw Screw Figure 4-65 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (4) Do not hold the Do not hold the Raise the board and make this condition. Figure 4-66 Replacing 15.
4 Replacement Procedures 4.23 Fluorescent Lamp 5. Turn the LCD module face up and remove the LCD panel (I) from the backlight unit (H). CAUTION: Wear finger sacks or gloves during the work not to soil or scratch the LCD panel or backlight unit. (I) LCD panel (H) Backlight unit Figure 4-67 Replacing 15.
4.23 Fluorescent Lamp 4 Replacement Procedures 6. Turn the backlight unit (H) removed face down and remove the two screws (D) and lamp cover (J). NOTE: Be careful not to scratch or soil the sheets. (H) Backlight unit Screw loosening torque: 1.2kg•cm (D) Screw (D) Screw (J) Lamp cover Figure 4-68 Replacing 15.
4 Replacement Procedures 4.23 Fluorescent Lamp 7. Turn the backlight unit face up and remove the upper diffusion sheet (K), lens sheet (L) and light guide (M). NOTE: Be careful not to scratch or soil the removed sheets or light guide to reuse them. Do not remove the reflection sheet under the light guide. (K) Upper diffusion sheet (L) Lens sheet (M) Light guide Figure 4-69 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (8) 8. Remove the four double-sided tapes (N, O, P, Q).
4.23 Fluorescent Lamp 4 Replacement Procedures NOTE: Discard the removed tapes. Do not reuse them. (N) Double-sided tape 1 (P) Double-sided tape 3 (O) Double-sided tape 2 (Q) Double-sided tape 4 Figure 4-70 Replacing 15.
4 Replacement Procedures 4.23 Fluorescent Lamp 9. Turn the backlight unit face down and remove the lamp unit (R) from the P-chassis. CAUTION: When removing the lamp unit, be careful not to break the lamp, or bend the reflection sheet. P-chassis Lamp unit (R) Figure 4-71 Replacing 15.
4.23 Fluorescent Lamp 4 Replacement Procedures Assembling the 15.0 Inch XGA Sharp Fluorescent Lamp To assemble the 15.0-inch Sharp XGA fluorescent lamp, follow the steps below and refer to Figures 4-72 to 4-84. 1. Stick the four double-sided tapes (N, O, P, Q) on the P-chassis. Standard for edge of P-chassis (P) Do not make the P-chassis over this line. (N) 0 to 1 mm (Q) (O) Figure 4-72 Replacing 15.
4 Replacement Procedures 4.23 Fluorescent Lamp 2. Turn the backlight unit face down and install a new lamp unit (R) on the P-chassis. NOTE: When install the lamp unit (R), be careful not to bend or damage the reflection sheet. P-chassis (R) Lamp unit Figure 4-73 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (12) Z Z Install the lamp unit without floating. Install the reflection sheet as it is placed inside the reflector. Install the lead wire into this groove.
4.23 Fluorescent Lamp 4 Replacement Procedures 3. Install the lamp cover (J) on the backlight unit and secure it with the two screws (D). (J) Lamp cover Screw tightening torque: 1.0kg•cm (D) Screw (D) Screw Figure 4-75 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (14) 4. Install the light guide (M) on the backlight unit. Insert the light guide straight not to deform the reflector. Backlight unit (M) Light guide Figure 4-76 Replacing 15.
4 Replacement Procedures 4.23 Fluorescent Lamp 5. Place the lens sheet (L) and upper diffusion sheet (K) on the backlight unit with light guide(M). (K) Upper diffusion sheet (L) Lens sheet (M) Light guide Do not make any sheet over the edge of P-chassis. Figure 4-77 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (16) 6. Place the LCD panel (I) on the backlight unit (H).
4.23 Fluorescent Lamp 4 Replacement Procedures NOTE: Make sure there is no dust between the LCD panel and backlight unit. If any dust is found, remove it with crepe tape or others which has no remaining of paste. (I) LCD panel Guide rib Guide rib (H) Backlight unit Guide rib Guide rib Make sure the LCD panel is installed in the guide rib Figure 4-78 Replacing 15.
4 Replacement Procedures 4.23 Fluorescent Lamp 7. Bend the TCP attaching to the source board and secure it with the two screws. Do not hold the edge. Do not hold the edge. Figure 4-79 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (18) Screw Screw Figure 4-80 Replacing 15.
4.23 Fluorescent Lamp 4 Replacement Procedures 8. Install the bezel (E) on the lamp cover and hook the four latches on the lamp cover and two latches on the P-chassis. (E) Bezel (1) Hitch the hook of the bezel on the rib of the P-chassis. Hook (2) Lean the bezel on the lamp cover without interference with the TCP. Figure 4-81 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (20) Make sure of mating of the bezel and the rib of the P-chassis.
4 Replacement Procedures 4.23 Fluorescent Lamp 9. Secure the sides of the unit with the four screws. Screw Screw Screw Screw Figure 4-83 Replacing 15.
4.23 Fluorescent Lamp 4 Replacement Procedures 10. Stick the protection cover G (B), protection cover S (A), fixing tape (C) and fixing tape for lead wire (D). (A) (C) (D) (B) 0 to 1 mm Do not make the tape over the top of the module. The tape MUST NOT appear on the display. Stick the tape according to the outline of the LCD module. Make sure the tape does not appear on the side of the module. Figure 4-84 Replacing 15.
Replacement Procedures 4.23 Fluorescent Lamp 4 4.23.3 Replacing the 15.0 Inch XGA LG.Philips Fluorescent lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. Disassembling the 15.0 Inch XGA LG.Philips Fluorescent lamp To disassemble the 15.0-inch XGA LG.Philips fluorescent lamp, follow the steps below and refer to Figures 4-85 to 4-88. 1.
4.23 Fluorescent Lamp Replacement Procedures 2. Remove the top case. Be careful not to apply excessive force to the source TCP and gate COF. Top case Figure 4-86 Replacing 15.0 Inch LG.
Replacement Procedures 4.23 Fluorescent Lamp 3. Remove the source PCB. 1) Remove the source PCB. Be careful not to apply excessive force to the PCB and TCP. Figure 4-87 Replacing 15.0 Inch LG.
4.23 Fluorescent Lamp Replacement Procedures 4. Remove the board assembly, adhesive tape, light guide and cover assembly bottom. 1) Remove the board assembly. 2) Remove the adhesive tape securing the sheets (four points). 3) Remove the sheets and light guide. NOTE: No penetration of foreign object is indispensable not to scratch the sheets. 4) Remove the screw and cover assembly bottom. NOTE: Maximum value of torque is 1.5kg•cm.
Replacement Procedures 4.23 Fluorescent Lamp Assembling the 15.0-inch XGA LG.Philips Fluorescent lamp To assemble the 15.0-inch XGA LG.Philips fluorescent lamp, follow the steps below and refer to Figures 4-89 to 4-92. 1. Install the cover assembly bottom, sheets, light guide, adhesive tape and board assembly. 1) Secure the cover assembly bottom with the two screws. 2) Install the light guide and sheets. (Secure the reflection sheets with doublesided tape.
4.23 Fluorescent Lamp Replacement Procedures 2. Install the source PCB. 1) Install the source PCB. Be careful not to apply excessive force to the TCP. Figure 4-90 Replacing 15.0 Inch LG.Philips fluorescent lamp (XGA) (6) 3. Install the top case. Figure 4-91 Replacing 15.0 Inch LG.
Replacement Procedures 4.23 Fluorescent Lamp 4. Stick the outside tape and install the cover shield. 1) Install the cover shield. CAUTION: Wear anti-static gloves to prevent circuit damage to the source PCB. 2) Stick the adhesive tape to fix the top case and B/L wire. Cover shield Cover shield Adhesive tape Adhesive tape Adhesive tape Figure 4-92 Replacing 15.0 Inch LG.
4.23 Fluorescent Lamp Replacement Procedures 4.23.4 Replacing the 15.0 Inch SXGA+ LG.Philips Fluorescent lamp CAUTION: When you replace the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD module. Be careful not to let dust or other foreign substances into the LCD module. Disassembling the 15.0 Inch SXGA+ LG.Philips Fluorescent lamp To disassemble the 15.0-inch SXGA+ LG.Philips fluorescent lamp, follow the steps below and refer to Figures 4-93 to 4-96. 5.
Replacement Procedures 4.23 Fluorescent Lamp 6. Remove the top case. Be careful not to apply excessive force to the top case or gate TCP. Top case Figure 4-94 Replacing 15.0 Inch LG.Philips fluorescent lamp (SXGA+) (2) 7. Remove the source PCB and gate PCB. 1) Remove the source PCB. Be careful not to apply excessive force to the PCB or TCP when removing double-sided tape. 2) Remove the gate PCB. Be careful not to apply excessive force to the PCB or TCP when removing double-sided tape.
4.23 Fluorescent Lamp Replacement Procedures Source PCB Gate PCB Figure 4-95 Replacing 15.0 Inch LG.
Replacement Procedures 4.23 Fluorescent Lamp 8. Remove the board assembly, adhesive tape, light guide and cover assembly bottom (L). 1) Remove the board assembly. NOTE: This process should be made in a clean room to prevent scratch or particle on polarizer or B/L assembly. 2) Remove the adhesive tape fixing the sheets (four points). 3) Remove the sheets and light guide. NOTE: No penetration of foreign object is indispensable not to scratch on the surface of each sheet.
4.23 Fluorescent Lamp Replacement Procedures Assembling the 15.0 Inch SXGA+ LG.Philips Fluorescent lamp To assembling the 15.0-inch SXGA+ LG.Philips fluorescent lamp, follow the steps below and refer to figures 4-97 to 4-100. 1. Install the cover assembly bottom (L), sheets, light guide, adhesive tape and board assembly. 1) Remove the protect sheet from the cover assembly bottom (L). 2) Secure the cover assembly bottom (L) with the two screws. NOTE: Maximum value of torque is 2.0kg•cm.
Replacement Procedures 4.23 Fluorescent Lamp NOTE: Be careful not to apply excessive force to the PCB and TCP. Board assembly Adhesive tape Double-sided tape Adhesive Double-sided tape Double-sided tape Double-sided tape Adhesive tape Sheets and light Adhesive tape Screw Cover assembly bottom (L) Screw Figure 4-97 Replacing 15.0 Inch LG.
4.23 Fluorescent Lamp Replacement Procedures 2. Install the source PCB and gate PCB. 1) Install the source PCB. Be careful not to apply excessive force to the TCP. 2) Install the gate PCB. Be careful not to apply excessive force to the TCP. Source PCB Gate PCB Figure 4-98 Replacing 15.0 Inch LG.Philips fluorescent lamp (SXGA+) (6) 3. Install the top case. Be careful not to apply excessive force to the gate TCP.
Replacement Procedures 4.23 Fluorescent Lamp Top case Figure 4-99 Replacing 15.0 Inch LG.
4.23 Fluorescent Lamp Replacement Procedures 4. Stick the out side tape and cover shield. 1) Install the tape shield and adhesive tape to fix the top case. Be careful not to apply excessive force to the top case. 2) Install the cover shield (C). Be careful not to apply excessive force to the control PCB. CAUTION: Wear anti-static gloves to prevent circuit damage caused by ESC. 3) Install the cover shield (G). Be careful not to apply excessive force to the gate TCP.
Replacement Procedures 4-114 [CONFIDENTIAL] 4.
Appendices [CONFIDENTIAL]
Appendices App-ii [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
Appendices Appendix Contents Appendix A Handling the LCD Module......................................................................... A-1 Appendix B Board Layout................................................................................................B-1 B.1 System Board Front View..............................................................................B-1 B.2 System Board Back View ..............................................................................B-3 B.
Appendices C.18 CN5620 RGB I/F Connector (15-pin) ........................................................ C-23 C.19 CN5340 S-Video I/F Connector (5-pin) .................................................... C-23 C.20 CN6001 Speaker Connector (Left) (3-pin) ................................................ C-23 C.21 CN6002 Speaker Connector (Right) (2-pin).............................................. C-24 C.22 CN9500 Sound Board I/F Connector (18-pin)...........................................
Appendices Appendix D Keyboard Scan/Character Codes .............................................................. D-1 D.1 Keyboard Scan/Character Codes .................................................................. D-1 Appendix E Key Layout ...................................................................................................E-1 E.1 Keyboard Layout ...........................................................................................E-1 Appendix F Wiring Diagrams.................
Appendices Figures Figure B-1 System board layout (front) ...........................................................................B-1 Figure B-2 System board layout (back) ...........................................................................B-3 Figure B-3 Sound Board (FLGSN*) layout .....................................................................B-5 Figure B-4 Parallel port Board (FLGCP*) layout ............................................................
Appendices Table C-9 Debug port connector pin assignment (12-pin) ...........................................C-18 Table C-10 Keyboard I/F connector pin assignment (34-pin) ........................................C-19 Table C-11 Touch pad I/F connector pin assignment (4-pin).........................................C-19 Table C-12 Switch board I/F connector pin assignment (10-pin)...................................C-20 Table C-13 FLGCP/FLGSR board I/F connector pin assignment (30-pin)...............
Appendices Table C-41 Serial I/F Connector pin assignment (9-pin)................................................C-33 Table C-42 USB harness I/F connector pin assignment (8-pin) .....................................C-33 Table C-43 USB I/F Connector 1 pin assignment (4-pin) ..............................................C-33 Table D-1 Scan codes (set 1 and set 2) .......................................................................... D-1 Table D-2 Scan codes with left Shift key...................
Appendix. A Handling the LCD Module Appendices Appendix. A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendices Appendix. A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4.
Appendix. A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendices Appendix. A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
Appendix. A Handling the LCD Module Appendices 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization.
Appendices A-6 [CONFIDENTIAL] Appendix.
Appendix. B Board Layout Appendices Appendix. B Appendix B Board Layout B.
Appendices Appendix.
Appendix. B Board Layout B.
Appendices Appendix.
Appendix. B Board Layout B.
Appendices B.4 Appendix.
Appendix. B Board Layout B.
Appendices B.6 Appendix.
Appendix. C Pin Assignment Appendices Appendix. C Appendix C Pin Assignment System Board (FLKSY*) C.1 CN1400 Memory 0 Connector (200-pin) Table C-1 Memory 0 connector pin assignment (200-pin) (1/4) Pin No. Signal name I/O Pin No.
Appendices Appendix. C Pin Assignment Table C-1 Memory 0 connector pin assignment (200-pin) (2/4) Pin No. C-2 Signal name I/O Pin No.
Appendix. C Pin Assignment Appendices Table C-1 Memory 0 connector pin assignment (200-pin) (3/4) Pin No. Signal name I/O Pin No.
Appendices Appendix. C Pin Assignment Table C-1 Memory 0 connector pin assignment (200-pin) (4/4) Pin No. C-4 Signal name I/O Pin No.
Appendix. C Pin Assignment C.2 Appendices CN1410 Memory 1 Connector (200-pin) Table C-2 Memory 1 connector pin assignment (200-pin) (1/4) Pin No. Signal name I/O Pin No.
Appendices Appendix. C Pin Assignment Table C-2 Memory 1 connector pin assignment (200-pin) (2/4) Pin No. C-6 Signal name I/O Pin No.
Appendix. C Pin Assignment Appendices Table C-2 Memory 1 connector pin assignment (200-pin) (3/4) Pin No. Signal name I/O Pin No.
Appendices Appendix. C Pin Assignment Table C-2 Memory 1 connector pin assignment (200-pin) (4/4) Pin No. C.3 Signal name I/O Pin No. Signal Name I/O 195 SMBDAT-P3P I/O 196 GND - 197 SMBCL2-P3P I/O 198 GND - 199 P3V - 200 P3V - CN1800 HDD I/F Connector (44-pin) Table C-3 HDD I/F connector pin assignment (44-pin) Pin No. C-8 Signal Name I/O Pin No. Signal name I/O 1 N.C.
Appendix. C Pin Assignment C.4 Appendices CN1810 Optical Drive I/F Connector (50-pin) Table C-4 Optical drive I/F connector pin assignment (50-pin) Pin No. Signal name I/O Pin No. Signal Name I/O 1 N.C. - 2 N.C. - 3 GND - 4 N.C.
Appendices C.5 Appendix. C Pin Assignment IS2110 PC Card I/F Connector (70-pin) Table C-5 PC card I/F connector pin assignment (70-pin) (1/2) Pin No. C-10 Signal name I/O Pin No.
Appendix. C Pin Assignment Appendices Table C-5 PC Card slot connector pin assignment (70-pin)(2/2) Pin No. Signal name I/O Pin No.
Appendices C.6 Appendix. C Pin Assignment CN2300 Docking I/F connector (240-pin) Table C-6 Docking I/F connector (240-pin)(1/4) Pin No. C-12 Signal name I/O Pin No. A1 DSKDC I A2 1 DCOUT I 3 DOCDT1-S3N 5 EXMSCK-P5P 7 Signal name I/O GND - 2 DCOUT I O 4 P5V I I/O 6 EXKBCK-P5P GND - 8 N.C.
Appendix. C Pin Assignment Appendices Table C-6 Docking I/F connector (240-pin)(2/4) Pin No. Signal name I/O Pin No.
Appendices Appendix. C Pin Assignment Table C-6 Docking I/F connector (240-pin)(3/4) Pin No. C-14 Signal name I/O Pin No. Signal name I/O I 122 DCOUT I I/O 124 IF-P5V I 121 DCOUT 123 DSSCL-S5P 125 M5V I 126 N.C. - 127 GND - 128 N.C. - 129 N.C. - 130 N.C. - 131 GND - 132 N.C. - 133 N.C.
Appendix. C Pin Assignment Appendices Table C-6 Docking I/F connector (240-pin)(4/4) Pin No. Signal name I/O Pin No. Signal name I/O I 182 DCOUT I I/O 184 IF-P5V I 181 DCOUT 183 DSSDA-S5P 185 Reserved - 186 N.C. - 187 GND - 188 N.C. - 189 USBP2-S3P I/O 190 USBP2-S3N 191 GND - 192 N.C. 193 N.C.
Appendices C.7 Appendix. C Pin Assignment CN2200 Mini PCI I/F Connector (124-pin) Table C-7 Mini PCI I/F connector pin assignment (124-pin) (1/2) Pin No. C-16 Signal name I/O Pin No. Signal Name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 N.C. - 9 N.C. - 10 N.C. - 11 N.C. - 12 N.C. - 13 WLON-S3N I 14 N.C. - 15 GND - 16 N.C. - 17 PIRQD-P3N I/O 18 P5V I 19 P3V I 20 PIRQG-P3N 21 N.C. - 22 N.C.
Appendix. C Pin Assignment Appendices Table C-7 Mini PCI I/F connector pin assignment (124-pin) (2/2) Pin No. Signal name I/O Pin No.
Appendices C.8 Appendix. C Pin Assignment CN3010 MDC I/F Connector (12-pin) Table C-8 MDC I/F connector pin assignment (12-pin) Pin No. C.9 Signal name I/O Pin No. Signal Name I/O - 2 Reserved - I/O 4 Reserved - 1 GND 3 M97OT2-P3P 5 GND - 6 E3V - 7 M97SY2-P3P I 8 GND - 9 M97IN2-E3P I/O 10 GND - 11 -M97RS2-P3P I 12 X97BC2-P3P I CN3490 Debug Port Connector (12-pin) Table C-9 Debug port connector pin assignment (12-pin) Pin No. C-18 Signal name I/O Pin No.
Appendix. C Pin Assignment C.10 CN3200 Keyboard I/F Connector (34-pin) Table C-10 C.11 Appendices Keyboard I/F connector pin assignment (34-pin) Pin No. Signal name I/O Pin No.
Appendices C.12 Appendix. C Pin Assignment CN3280 Switch Board I/F Connector (10-pin) Table C-12 Pin No. C.13 Signal name I/O Pin No. Signal Name I/O 1 GND - 2 GND - 3 GND - 4 GPBTND-S3N O 5 GPBTNC-S3N O 6 GPBTNB-S3N O 7 GPBTNA-S3N O 8 PWRSW-S3N O 9 GND - 10 PNLOFF-S3N O CN3502 FLGCP/FLGSR Board I/F Connector (30-pin) Table C-13 Pin No.
Appendix. C Pin Assignment C.14 CN4100 Network I/F Connector (14-pin) Table C-14 Pin No. C.15 Network I/F connector pin assignment (14-pin) Signal name I/O Pin No. Signal Name I/O 1 ACT-E3N I 2 LINK-E3N I 3 LAN-E3V I 4 LAN-E3V I 5 N.C. - 6 N.C. - 7 BIDDN-EXN I/O 8 BIDDP-EXP I/O 9 BIDCN-EXN I/O 10 BIDCP-EXP I/O 11 BIDAP-EXP I 12 BIDAN-EXN I 13 BIDBP-EXP O 14 BIDBN-EXN O CN4611 USB harness I/F Connector (8-pin) Table C-15 Pin No. C.
Appendices C.17 Appendix. C Pin Assignment CN5000 LCD I/F Connector (41-pin) Table C-17 Pin No. C-22 LCD I/F connector pin assignment (41-pin) Signal name I/O Pin No.
Appendix. C Pin Assignment C.18 Appendices CN5620 RGB I/F Connector (15-pin) Table C-18 Pin No. C.19 Signal name I/O Pin No. Signal Name I/O 1 MRED-PXP I 2 MGREEN-PXP I 3 MBLUE-PXP I 4 N.C. - 5 GND - 6 GND - 7 GND - 8 GND - 9 DDC-P5V I 10 GND - 11 N.C. - 12 CRTSDA-P5P I/O 13 MHSYNC-P3P I/O 14 MVSYNC-P3P I/O 15 CRTSCL-P5P I/O CN5340 S-Video I/F Connector (5-pin) Table C-19 Pin No. C.
Appendices C.21 Appendix. C Pin Assignment CN6002 Speaker Connector (Right) (2-pin) Table C-21 Pin No. 1 C.22 Speaker connector (right) pin assignment (2-pin) Signal name I/O Pin No. I 2 SPOUT(R+) Signal Name I/O SPOUT (R-) I CN9500 Sound Board I/F Connector (18-pin) Table C-22 Pin No. Sound Board I/F connector pin assignment (18-pin) Signal name I/O Pin No.
Appendix. C Pin Assignment C.24 CN8020 1st Battery Connector (10-pin) Table C-24 Pin No. C.25 1st Battery connector pin assignment (10-pin) Signal name I/O Pin No. Signal Name I/O 1 CHGVL O 2 BTMP1 O 3 DCHG I 4 M5V I 5 PSCL-S5P O 6 PSDA-S5P O 7 GND - 8 DBT10V-S5N O 9 GND - 10 GND - CN9990 RTC Battery Connector (3-pin) Table C-25 Pin No. C.26 Appendices RTC Battery connector pin assignment (3-pin) Signal name I/O Pin No.
Appendices Appendix. C Pin Assignment Sound Board (FLGSN*) C.27 J6070 External Microphone Connector (6-pin) Table C-27 Pin No. C.28 External Microphone Connector pin assignment (6-pin) Signal name Signal Name I/O A-GND - 2 MICIN-PXP O 3 MMREFV O 4 A-GND - 5 N.C. - 6 MMREFV O J6310 Pin No. Headphone Connector (6-pin) Headphone Connector pin assignment (6-pin) Signal name I/O Pin No.
Appendix. C Pin Assignment Appendices Switch Board (FLKSW*) C.30 PJ3280 System Board I/F Connector (10-pin) Table C-30 Pin No. System board I/F Connector pin assignment (10-pin) Signal name I/O Pin No.
Appendices Appendix. C Pin Assignment Parallel Board (FLGCP*) C.31 CN3503 System Board I/F Connector (30-pin) Table C-31 Pin No. C-28 System board I/F Connector pin assignment (30-pin) Signal Name I/O Pin No. Signal name I/O 1 GND - 2 GND - 3 N.C.
Appendix. C Pin Assignment C.32 CN4613 Parallel I/F Connector (25-pin) Table C-32 Pin No. C.33 Parallel I/F Connector pin assignment (25-pin) Signal name I/O Pin No.
Appendices Appendix. C Pin Assignment S-Video Board (FLGCS*) C.35 PJ4610 USB harness I/F Connector (8-pin) Table C-35 Pin No. C.36 USB harness I/F connector pin assignment (8-pin) Signal name I/O - 2 USBP0-S3N I/O 3 USBP0-S3P I/O 4 USBP0-4 I/O 5 USBP0-5 I/O 6 USBP3-S3N I/O 7 USBP3-S3P I/O 8 USBP3-8 I/O PJ4612 USB I/F Connector 1 (4-pin) USB I/F Connector 1 pin assignment (4-pin) Signal name I/O Pin No.
Appendix. C Pin Assignment C.39 Appendices PJ5641 S-Video Connector (4-pin) Table C-39 Pin No. S-Video Connector pin assignment (4-pin) Signal name I/O Pin No.
Appendices Appendix. C Pin Assignment Serial Board (FLGSR*) C.40 CN3504 System Board I/F Connector (30-pin) Table C-40 Pin No. C-32 System board I/F Connector pin assignment (30-pin) Signal Name I/O Pin No. Signal name I/O 1 P3V - 2 P3V - 3 KRSSDM-P3N O 4 N.C. - 5 GND - 6 N.C. - 7 BDSR-P3N I 8 BCTS-P3N I 9 BRXD-P3P I 10 BRING-P3N I 11 BDCD-P3N I 12 BDTR-P3N O 13 BTXD-P3P O 14 BRTS-P3N O 15 GND - 16 GND - 17 N.C. - 18 N.C. - 19 N.C. - 20 N.
Appendix. C Pin Assignment C.41 CN3440 Serial I/F Connector (9-pin) Table C-41 Pin No. C.42 Serial I/F Connector pin assignment (9-pin) Signal name I/O Pin No. Signal Name I/O 1 BDCD-P3N O 2 BRXD-P3P O 3 BTXD-P3P I 4 BRTR-P3N I 5 GND - 6 BDSR-P3N O 7 BRTS-P3N I 8 BCTS-P3N O 9 BRING-P3N O CN4630 USB harness I/F Connector (8-pin) Table C-42 Pin No. C.43 Appendices USB harness I/F connector pin assignment (8-pin) Signal name I/O Pin No.
Appendices C-34 Appendix.
Appendix. D Keyboard Scan/Character Codes Appendices Appendix. D Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
Appendices Appendix. D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
Appendix. D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
Appendices Appendix. D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode.
Appendix. D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Cap Key Code set 1 No.
Appendices Appendix. D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Appendix. D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Cap No.
Appendices Appendix. D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Shift Code set 1 Code set 2 Make Make Pause Common * E1 1D 45 E1 Ctrl* E0 46 E0 C6 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix. E Key Layout Appendix. E Key Layout Appendix E E.
Appendices E-2 [CONFIDENTIAL] Appendix.
Appendix. F Wiring Diagrams Appendices Appendix. F Appendix F F.1 Wiring Diagrams RGB Monitor ID Wraparound Connector (15-pin to 15-pin) Figure F-1 RGB monitor ID wraparound connector F.
Appendices F-2 [CONFIDENTIAL] Appendix.
Appendix. G BIOS/KBC/EC Update Appendix. G Appendices BIOS Rewrite Procedures Appendix G BIOS/KBC/EC Update To update the BIOS, KBC or EC, insert the FD for update into the FDD. Then turn on the power of the computer while pressing the following key until the power LED blinks. For BIOS update: ~ (tilde key ; See the following pictures.) (US) For KBC or EC update: (UK) Tab When the update is completed, the message will appear and the beep will sound. Then the power of the computer is turned off.
Appendices G-2 Appendix.
Appendix. H Reliability Appendix. H Appendices Reliability Appendix H Reliability The following table shows the MTBF (Mean Time Between Failures) of system.
Appendices H-2 Appendix.
