TB1206 Product specification Revision note Date Version Description 2018-12-18 V1.0 The first version ShenzhenTopbandCo.,Ltd.
CONTENT CONTENT 1. OVERVIEW ........................................................................................................................ 1 1.1 Product features .................................................................................................................... 1 1.2 Application field ................................................................................................................... 2 2. ELECTRICAL PARAMETERS .......................................................
TB1206 Product specification 1.Overview TB1206 is a low power consumption embedded Wi-Fi module ,developed by the Shenzhen Topband Co., ltd. It consists of a high level of integration of wireless RF chip ESP8266 and small amounts of peripheral components，With built-in wi-fi network protocol stack and rich library functions.
TB1206 Product specification Supports 802.11 b/g/n. Supports the STA/AP/STA + AP mode Supports WPA/WPA2 security mechanism. Supports WEP/TKIP/AES encryption type. Supports the AT remote upgrade and the clouds OTA upgrade. Supports SmartConfig and AP two types of Matching network (Including Android and iOS devices). 1.2 Application field Intelligent building Smart home Intelligent security Industrial wireless control The baby monitor Wise medical Wise energy 2.Electrical parameters 2.
TB1206 Product specification discharge voltage ( Human body model) Electrostatic discharge voltage ( Machine - - 0.5 KV TAMB=25℃ model) 2.2 Power consumption parameters Table2-2 power consumption parameters Minimum Typical Maximum value values values Tx802.11b，CCK 11Mbps，POUT=+17dBm - 170 - mA Tx802.11g， OFDM 54 Mbps，POUT =+15dBm - 140 - mA Tx802.11n，MCS7，POUT =+13dBm - 120 - mA - 50 - mA - 56 - mA - 56 - mA Modem-sleep① - 15 - mA Light-sleep② - 0.
TB1206 Product specification like switch of Wi-Fi. When Wi-Fi keeps connective, and if there is no data transmission, turn off the circuit of Wi-Fi Modem and pause CPU to save power according to 802.11 standard ( e.g U-APSD ). For example, while it with DTIM3, maintain sleep for 300ms, and receive Beacon package from AP in the awake interval time for 3ms, the current consumption would be 0.9mA. Note ③: Deep-Sleep mode is used for scenes where Wi-Fi needs no to be maintained connective.
TB1206 Product specification value values values OFDM，6Mbps - 37 - dB OFDM，54Mbps - 21 - dB HT20，MCS0 - 37 - dB HT20， MCS7 - 20 - dB 3.4 Receiving sensitivity able 3-4 receiving sensitivity Minimum Typical Maximum value values values DSSS，1Mbps - -98 - dBm CCK11，Mbps - -91 - dBm 6Mbps（1/2 BPSK） - -93 - dBm 54Mbps（3/4 64-QAM） - -75 - dBm HT20，MCS7（65 Mbps，72.2 Mbps） - -72 - dBm Parameter Unit 4.Module interface 4.
TB1206 Product specification Figure 4-1 TB1206 - E appearance size figure Figure 4-2 TB1206 -p appearance size figure 4.2 Pin definition TB1206 pin map is as shown in figure 4-3，Pin function description table is as shown in table 4-1。 Figure 4-3 module pin map Table 4-1 module pin function specification table Pin Name type Functional specifications 1 VCC P 2 EN I 3 IO14 I/O GPIO14；HSPI_CLK 4 IO12 I/O GPIO12；HSPI_MISO 3.
TB1206 Product specification 5 IO13 I/O GPIO13；HSPI_MOSI；UART0_CTS 6 IO15 I/O GPIO15； MTDO；HSPICS；UART0_RTS 7 IO2 I/O GPIO2；UART1_TXD 8 IO0 I/O GPIO0；SPI_CS2 9 GND P 10 IO4 I/O 11 RXD I/O 12 TXD I/O 13 GND P 14 IO5 I/O 15 RST I 16 ADC I A/D conversion pin 17 IO16 I/O Deep sleep wake up 18 GND P GND GPIO4 GPIO3； Can be used as UART Rx when copying Flash content GPIO1； Can be used as UART Tx when copying Flash content GND GPIO5 An external reset signal (effecti
TB1206 Product specification Wi-Fi performance，Suggested that the module antenna part and other metal components at least above 16 mm distance。 User PCB don't route or has no copper in antenna area，So as not to affect the antenna performance。 5.3 An external antenna connector External antenna connector size is as shown in figure 5-1. Figure 5-1 external antenna connector size chart 6.Encapsulates information and production guidance 6.
TB1206 Product specification Figure 6-2 TB1206 -p mechanical size chart Figure 6-3 TB1206 - E side view Figure 6-4 TB1206 - P side view 6.
TB1206 Product specification Reflow soldering SMT machine AOI monitor 6-8 mm diameter suction nozzle Baking need equipment Cabinet baking box Antistatic, high temperature resistant tray Antistatic high temperature resistant gloves Factory module storage conditions is as follow： Moisture bag must be stored in temperature < 30 ℃，Environment humidity < 85% RH。 Dry packaging products，The shelf life should be 6 months from the date of packing seal。 In the whole process of production， Operators mus
TB1206 Product specification Ramp to Reflow-temperature:25～150°C time：60～90s temperature riseing ramp rate:1～3°C/s. Preheat temperature zone- temperature:150～200°C Reflow soldering area-temperature: greater than217°C time：60-120s. time：60-90s; Peak temperature：235～250°C time： 30～70s. cooling zone- temperature: Peak temperature～180°C, temperature Cooling down ramp rate:-1～-5 °C/s. solder-tin silver copper alloy Lead-free solder (SAC305) Figure 6-5 reflow soldering temperature curve 6.
TB1206 Product specification ESP8266 official BBS. ESP8266 resources collection. FCC Compliance This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
TB1206 Product specification Manufacture: Shenzhen Topband Co., Ltd.
