TB1206 Product specification Revision note Date Version Description 2018-12-18 V1.0 The first version ShenzhenTopbandCo.,Ltd.
CONTENT CONTENT 1. OVERVIEW ........................................................................................................................ 1 1.1 Product features .................................................................................................................... 1 1.2 Application field ................................................................................................................... 2 2. ELECTRICAL PARAMETERS .......................................................
TB1206 Product specification 1.Overview TB1206 is a low power consumption embedded Wi-Fi module ,developed by the Shenzhen Topband Co., ltd. It consists of a high level of integration of wireless RF chip ESP8266 and small amounts of peripheral components,With built-in wi-fi network protocol stack and rich library functions.
TB1206 Product specification Supports 802.11 b/g/n. Supports the STA/AP/STA + AP mode Supports WPA/WPA2 security mechanism. Supports WEP/TKIP/AES encryption type. Supports the AT remote upgrade and the clouds OTA upgrade. Supports SmartConfig and AP two types of Matching network (Including Android and iOS devices). 1.
TB1206 Product specification 2.Electrical parameters 2.1 working conditions Table 2-1 normal working conditions Parameter Working voltage Working temperature Working humidity Storage temperature Minimum Typical Maximum value value value 3.0 3.3 3.6 V -20 - 85 ℃ 10 - 90 %RH -20 - 85 ℃ - - 2 KV TAMB=25℃ - - 0.5 KV TAMB=25℃ Unit Remark Electrostatic discharge voltage ( Human body model) Electrostatic discharge voltage ( Machine model) 2.
TB1206 Product specification Rx 802.11n, length of the packet 1024 byte, - 56 - mA Modem-sleep① - 15 - mA Light-sleep② - 0.9 - mA Deep-sleep③ - 20 - μA Power outages - 0.5 - μA -65dBm Note ①: Modem-Sleep mode is used for scenes where the CPU needs to work all the time, such as applied in PWM or I2S and so on. When Wi-Fi keeps connective, and if there is no data transmission, shut down the circuit of Wi-Fi Modem to save power according to 802.11 standard ( e.g U-APSD ).
TB1206 Product specification 3.Radio frequency characteristics 3.1 Radio frequency (rf) basic characteristics Table 3-1 rf basic features Parameter Instructions Working frequency 2.412~2.462GHz Wi-Fi standard IEEE 802.11b/g/n Data transfer rate (Channel 1-11) 802.11b 1,2,5.5,11(Mbps) 802.11g 6,9,12,18,24,36,48,54(Mbps) 802.11n HT20,MCS0~7 3.2 Output power Max power<20dBm Table 3-2 output power Parameter Under 72.
TB1206 Product specification value values values DSSS,1Mbps - -98 - dBm CCK11,Mbps - -91 - dBm 6Mbps(1/2 BPSK) - -93 - dBm 54Mbps(3/4 64-QAM) - -75 - dBm HT20,MCS7(65 Mbps,72.
TB1206 Product specification 4.Module interface 4.1 Size package TB1206 is divided into TB1206-E and TB1206 - P two types depending on the different types of antenna, TB1206 - E size of the appearance is 18 mm (W) x 14.3 mm (L) x 3.5 mm (H), Its appearance dimensions is as shown in figure 4-1, TB1206 -p appearance size is 18 mm (W) x 21 mm (L) x 3.5 mm (H), Its appearance dimensions is as shown in figure 4-2。 Figure 4-1 TB1206 - E appearance size figure Figure 4-2 TB1206 -p appearance size figure 4.
TB1206 Product specification Table 4-1 module pin function specification table Pin Name type Functional specifications 1 VCC P 2 EN I 3 IO14 I/O GPIO14;HSPI_CLK 4 IO12 I/O GPIO12;HSPI_MISO 5 IO13 I/O GPIO13;HSPI_MOSI;UART0_CTS 6 IO15 I/O GPIO15; MTDO;HSPICS;UART0_RTS 7 IO2 I/O GPIO2;UART1_TXD 8 IO0 I/O GPIO0;SPI_CS2 9 GND P 10 IO4 I/O GPIO4 11 RXD I/O 12 TXD I/O 13 GND P GPIO3; Can be used as UART Rx when copying Flash content GPIO1; Can be used as UART Tx
TB1206 Product specification 5.Antenna information 5.1 Type of antenna TB1206 -E is for the IPX antenna specifications, TB1206 - P is for a PCB antenna specifications。 5.
TB1206 Product specification 6.Encapsulates information and production guidance 6.
TB1206 Product specification Figure 6-3 TB1206 - E side view Figure 6-4 TB1206 - P side view 6.
TB1206 Product specification packing seal。 In the whole process of production, Operators must wear electrostatic ring for each station。 When operating, prevent module from touching water or dirt。 6.3 Reflow soldering temperature curve Recommend the use of lead-free soldering, Reflow soldering less than 2 times.。 Reflow soldering temperature curve are shown in figure 6-5 below. Ramp to Reflow-temperature:25~150°C time:60~90s temperature riseing ramp rate:1~3°C/s.
TB1206 Product specification and EMI characteristics,It is recommended to connect resistance of 10~100 ohms in series on digital I/O line。This prevents too much impact when switching the power supply,and make the signal smooth,It also prevents the release of static electricity (ESD) to a certain extent. Appendix - design information Espressif ESP8266 resources ESP8266 quick start guide. ESP8266 SDK start guide. ESP8266 SDK. ESP8266 download tool. ESP8266 official BBS. ESP8266 resources collection.
TB1206 Product specification FCC Compliance This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
TB1206 Product specification Requirement per KDB996369 D03 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.
TB1206 Product specification 2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ – Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements. a) Information that includes permitted variances (e.g.
TB1206 Product specification 2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc.
TB1206 Product specification 2.10 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification.