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LE940B6

HW User Guide

Rev.2.2 – 2020-01-10

Provided to Dekra under NDA

Distribution is Prohibited except for

Dekra employees with a Need to know

Summary of content (111 pages)

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e id ov Pr d to D ra A pt d to r fo ee N ce a ex D rN d ith w ite s ib de un oh Pr ee oy pl em is ek Rev.2.
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LE940B6 HW User Guide SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE e id ov Pr ek COPYRIGHTS is em n D tio ra to bu d It is possible that this publication may contain references to, or information about Titan products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Titan intends to announce such Titan products, programming, or services in your country.
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LE940B6 HW User Guide COMPUTER SOFTWARE COPYRIGHTS e id ov Pr d to bu ek D tri is D The Titan and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Titan and other 3rd Party supplied computer programs stored in semiconductor memories or other media.
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LE940B6 HW User Guide TITAN HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
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LE940B6 HW User Guide APPLICABILITY TABLE This documentation applies to the following products: Table 1: Applicability Table Module Name Description LE940B6-NA AUTO North America regional variant (AT&T and T-Mobile) ov Pr LE940B6-NV AUTO D North America region variant (Verizon, AT&T and TMobile) d China variant ek D rN A pt d to r fo ee N ce a ex ith d w ite s ib de oh un Pr ra is ee oy pl em n D tio ra to bu LE940B6-CN AUTO ek D e id Rest of World variant (Euro
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LE940B6 HW User Guide CONTENTS 1. INTRODUCTION ............................................................................................ 10 Scope ............................................................................................................. 10 Audience......................................................................................................... 10 Contact Information, Support .......................................................................... 11 Text Conventions .......
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LE940B6 HW User Guide 5. HARDWARE COMMANDS ............................................................................ 47 Turning on the LE940B6 Module .................................................................... 47 Initialization and Activation State .................................................................... 47 Turning off the LE940B6 Module .................................................................... 51 5.3.2. Hardware Shutdown ...............................................
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LE940B6 HW User Guide 8.5.1. Analog Audio .................................................................................................. 82 8.5.2. Digital Audio ................................................................................................... 82 General Purpose I/O ....................................................................................... 83 8.6.1. Using a GPIO Pad as Input ............................................................................ 84 8.6.2.
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LE940B6 HW User Guide FCC/IC Regulatory Notices .......................................................................... 102 RED Regulatory Notices ............................................................................... 104 14. SAFETY RECOMMENDATIONS ................................................................. 106 15. ACRONYMS................................................................................................. 107 16. DOCUMENT HISTORY ........................................
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LE940B6 HW User Guide 1. Introduction Scope This document introduces the Titan LE940B6 module and presents possible and recommended hardware solutions for developing a product based on the LE940B6 module. All the features and solutions detailed in this document are applicable to all LE940B6 variants, where “LE940B6” refers to the variants listed in the applicability table. ov Pr If a specific feature is applicable to a specific product only, it will be clearly marked.
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LE940B6 HW User Guide Contact Information, Support For general contact, technical support, to report documentation errors and to order manuals, contact Titan Technical Support via Team forge CollabNet. https://ctf.tustitan.com/ Alternatively, get in touch with your usual Titan contact. For more information about Titan visit: ov Pr http://www.tustitan.com e id Titan appreciates feedback from the users of our information.
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LE940B6 HW User Guide Related Documents Table 2: Related Documents Document Title Document Number Ref 1: LE940B6 AT Command Reference Guide 80514ST10767A Ref 2: LE940B6 SW User Guide 1VV0301296 ov Pr 1vv0300704 Ref 4: SIM Integration Design Guide 80000NT10001A e id is D Ref 3: Titan EVK2 User Guide Ref 5: Titan - Antenna Detection Application Note to ek bu d tri D tio ra Document Organization ra is Description Pr Chapter Title Introduction Provides the scope of this document,
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LE940B6 HW User Guide Chapter# Chapter Title Description Application Guide 12 Packing System 13 Conformity Assessment Issues 14 Safety Recommendations e id D rN A pt d to r fo ee N ce a ex ith d w ite s ib de oh un Pr ra ek is ee oy pl em n D tio ra to bu d tri Document History ek D 16 Acronyms16 is D 15 ov Pr 11 ow kn Rev. 2.
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LE940B6 HW User Guide 2. Product Description Overview LE940B6 is Titan’s platform for automotive telematics on-board units (OBU's) for applications, such as automotive telematics and eCall, based on the following technologies: e id tio ra to bu d In its most basic use case, LE940B6 can be applied as a wireless communication frontend for telematics products, offering GNSS and mobile communication features to an external host CPU through its rich interfaces.
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LE940B6 HW User Guide General Functionality and Main Features The LE940B6 family of automotive cellular modules features an LTE and multi-RAT modem together with a powerful on-chip application processor and a rich set of interfaces. The major functions and features are listed below: • • e id d is ek n D tio to bu em • ov Pr tri • • ra ek D • is D • • • Multi-RAT with LTE carrier aggregation (Rel. 10, Cat.
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LE940B6 HW User Guide Environmental Requirements 2.4.1. Temperature Range Operating temperature range -20 ~ +55°C. ov Pr This range is defined by 3GPP (the global standard for wireless mobile communication). Titan guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the module with in this range. -40 ~ +85°C. D e id d to tio ra ek bu D tri is Titan guarantees full functionality within this range as well.
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LE940B6 HW User Guide Operating Frequency Bands The operating frequencies in WCDMA and LTE modes conform to the 3GPP specifications. 2.5.1. RF Bands per Regional Variant Table 4 summarizes all region variants within the LE940B6 family, showing the supported band sets in each variant and the supported band pairs for 2x carrier aggregation.
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LE940B6 HW User Guide 2.5.2. Reference Table of RF Bands Characteristics Table 5: RF Bands Characteristics Mode Freq. Tx (MHz) PCS 1900 Freq. Rx (MHz) 1850.2 ~ 1909.8 1930.2 ~ 1989.8 ov Pr DCS 1800 D 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz 925.2 ~ 959.8 975 ~ 1023, 1 ~ 124 45 MHz Tx: 9612 ~ 9888 190 MHz e id 95 MHz d to 2110 ~ 2170 ra Pr Tx: 1312 ~ 1513 Tx: 4132 ~ 4233 ex ce 875 ~ 885 Tx: 4162 ~ 4188 pt Tx: 2712 ~ 2863 WCDMA 800 – B19 830 ~ 845 1845 ~ 1879.
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LE940B6 HW User Guide Mode Freq. Tx (MHz) TDSCDMA 2000 – B34 Freq. Rx (MHz) 2010 ~ 2025 Channels 2010 ~ 2025 Tx-Rx Offset Tx: 10050 ~ 10125 0 MHz Rx: 10050 ~ 10125 D LTE 2100 – B1 1880 ~ 1920 1880 ~ 1920 1920 ~ 1980 2110 ~ 2170 to ra de Rx: 1950 ~ 2399 ce Rx: 2750 ~ 3449 pt ee N 925 ~ 960 45 MHz to 1844.9 ~ 1879.9 Tx: 21800 ~ 2149 1710 ~ 1770 2110 ~ 2170 Tx: 22150 ~ 22749 95 MHz kn Rx: 3800 ~ 4149 ow LTE AWS+ – B10 1749.9 ~ 1784.
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LE940B6 HW User Guide Mode Freq. Tx (MHz) LTE 700a – B12 Freq.
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LE940B6 HW User Guide Mode Freq. Tx (MHz) LTE TDD 1900 – B39 Freq.
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LE940B6 HW User Guide LE940B6 Mechanical Specifications 2.7.1. Dimensions The LE940B6 module’s overall dimensions are: • • • Length: Width: Thickness: Weight ov Pr 2.7.2. 40 mm, +/- 0.20 mm tolerance 40 mm, +/- 0.20 mm tolerance 3.0 mm, +/- 0.15 mm tolerance (with label) e id d to D rN A pt d to r fo ee N ce a ex ith d w ite s ib de oh un Pr ra ek is ee oy pl em n D tio ra ek bu D tri is D The nominal weight of the LE940B6 module is 11 gram. ow kn Rev. 2.
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LE940B6 HW User Guide 3. LE940B6 Module Connections Pin-out Table 6: LE940B6 Pin-out Pad Signal I/O Function Type Comment USB HS 2.0 Communication Port ov Pr USB_VBUS USB differential data (+) I/O USB differential data (-) to bu tri I/O d USB_D- Power sense for the internal USB transceiver e id F19 AI USB_D+ ek D D19 is D A18 C105/RTS I Input for Request To Send signal (RTS) from DTE 1.
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LE940B6 HW User Guide Pad Signal AD19 I/O RXD_AUX Function Type I Auxiliary UART (Rx Data from DTE) 1.8V Comment Asynchronous UART3 UART3_TXD I Serial data input (TXD) from DTE 1.8V AM11 UART3_RXD O Serial data output (RXD) to DTE 1.8V I 1.8V 1.
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LE940B6 HW User Guide Pad Signal I/O T4 JTAG_PTI_DATA 2 I/O MiPi Data 2 1.8V V4 JTAG_PTI_DATA 3 I/O MiPi Data 3 1.8V SIMVCC1 O to External SIM signal – Presence External SIM signal – Data I/O O External SIM signal – Reset ra ib O C18 SIMIN2 I External SIM signal – Presence (active low) E16 SIMIO2 I/O External SIM signal – Data I/O D17 SIMRST2 O External SIM signal – Reset A O Earphone signal output, phase + d ith 1.8/2.
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LE940B6 HW User Guide Pad Signal I/O Function Type EAR1_MT- A O Earphone signal output, phase - B3 MIC1_MT+ AI Microphone input, phase + A2 MIC1_MT- AI Microphone input, phase - G6 MIC_BIAS A O Digital Voice Interface (DVI) I 1.8V Digital Voice interface (WA0 master output) O 1.8V ib SPI data Master output Slave input N18 SPI_CS O SPI Chip select output P19 SPI_CLK O SPI Clock output w 1.8V 1.8V N ce a ex ith d SPI data Master input Slave output 1.
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LE940B6 HW User Guide Pad Signal I/O Function Type GPIO_04 I/O GPIO_04 1.8V F13 GPIO_05 I/O GPIO_05 1.8V E14 GPIO_06 I/O GPIO_06 1.8V R18 GPIO_07 I/O GPIO_07 1.8V S19 GPIO_08 I/O GPIO_08 1.8V U19 GPIO_09 I/O GPIO_09 1.8V I/O GPIO_10 1.8V GPIO_11 I/O GPIO_11 1.8V GPIO_12 1.
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LE940B6 HW User Guide Pad Signal I/O Function Type T16 MAC_TXD[1] O RGMII or RMII TXD[1] 2.5/3.3 V R16 MAC_TXD[2] O RGMII TXD[2] 2.5/3.3 V N16 MAC_TXD[3] 2.5/3.3 V O RGMII Transmit Clock 2.5/3.3 V RGMII Transmit Enable / Error or RMII Transmit Enable 2.5/3.3 V I ek I RGMII or RMII RXD[1] MAC_RXD[2] I RGMII RXD[2] oh D 2.5/3.3 V A ce a ex RGMII Receive Clock rN de 2.5/3.3 V d I ith MAC_RX_CLK RGMII RXD[3] w AC16 I ite s MAC_RXD[3] 2.5/3.
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LE940B6 HW User Guide Pad Signal S1 I/O ANT_GPS Function Type I GPS Antenna RF AI VRTC Backup capacitor - O VIO_1.8V for reference voltage 1.8V I Reset Input Comment Miscellaneous Functions VRTC K17 VIO_1.
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LE940B6 HW User Guide Pad Signal I/O Function Type - Main Power Supply (RF Transmit Power Section) Power AU17 VBATT_PA - Main Power Supply (RF Transmit Power Section) Power AU19 VBATT_PA - Main Power Supply (RF Transmit Power Section) Power - Main Power Supply (RF Transmit Power Section) Power to Ground Ground Ground Ground GND - Ground un C4 GND Ground Ground C6 GND D3 GND - D7 GND - Ground E18 GND - Ground F1 GND - Ground G18 GND - Ground H19 GND -
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LE940B6 HW User Guide Pad Signal I/O Function Type - Ground Ground T2 GND - Ground Ground T18 GND - Ground Ground U1 GND - Ground Ground V18 GND - Ground Ground W1 GND is - Ground Ground X2 GND ek GND Y1 GND - Ground Ground d Ground to Ground Ground GND - Ground un AC2 GND Ground Ground AE2 GND AF1 GND AG2 GND - AH1 GND - Ground AJ2 GND - Ground AK1 GND - Ground AK17 GND - Ground AL18 GND - Ground AM17 GND - Ground Groun
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LE940B6 HW User Guide Pad Signal I/O Function Type - Ground Ground AP3 GND - Ground Ground AP5 GND - Ground Ground AP7 GND - Ground Ground AP9 GND - Ground Ground AP11 GND is - Ground Ground AP13 GND Ground Ground Ground Ground GND - Ground un AR10 GND Ground Ground AR12 GND AR14 GND AR16 GND - AS5 GND - Ground AS7 GND - Ground AS9 GND - Ground AS11 GND - Ground AS13 GND - Ground AS15 GND - Ground Ground AT4 GND - Ground Gr
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LE940B6 HW User Guide Pad Signal I/O Function Type - Ground Ground AT10 GND - Ground Ground AT12 GND - Ground Ground AT14 GND - Ground Ground AT16 GND - Ground Ground AU1 GND is - Ground Ground AU5 GND Ground Ground Ground Ground GND - Ground un L20 GND Ground Ground N20 GND ZZ19 GND A20 GND - AV20 GND - Ground ZZ1 GND - Ground A0 GND - Ground AV0 GND - Ground N0 GND - Ground R0 GND - Ground Ground T0 GND - Ground Ground V
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LE940B6 HW User Guide Pad Signal I/O Function Type - Ground Ground AA0 GND - Ground Ground AC0 GND - Ground Ground AE0 GND - Ground Ground AG0 GND - Ground Ground AJ0 GND is - Ground Ground AL0 GND Ground Ground Ground Ground GND - Ground un AV14 GND Ground Ground AV16 GND AV18 GND T8 GND - V8 GND - Ground X8 GND - Ground AA8 GND - Ground U9 GND - Ground W9 GND - Ground Y9 GND - Ground Ground T10 GND - Ground Ground V10 G
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LE940B6 HW User Guide Pad Signal I/O Function Type - Ground Ground AA10 GND - Ground Ground U11 GND - Ground Ground W11 GND - Ground Ground Y11 GND - Ground Ground T12 GND is - Ground Ground V12 GND Ground Ground Ground Ground GND - Ground un U101 GND Ground Ground W101 GND Y101 GND AR10 1 GND - Ground AT101 GND - Ground AV101 GND - Ground ZZ102 GND - Ground B102 GND - Ground D102 GND - Ground U102 GND - Ground Ground W102 GN
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LE940B6 HW User Guide Pad Signal I/O Function Type GND - Ground Ground AR10 2 GND - Ground Ground AT102 GND - Ground Ground AV102 GND Reserved is C20 Ground Ground - Reserved d bu tri Reserved Reserved E20 Reserved - Reserved G20 Reserved - Reserved J20 Reserved Reserved E2 Reserved - Reserved D1 Reserved C2 un oh Reserved C12 Reserved - Reserved J4 Reserved - Reserved G4 Reserved - Reserved AE4 Reserved - Reserved AC4 Reserved - Rese
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LE940B6 HW User Guide Pad Signal I/O Function - Reserved AF3 Reserved - Reserved AH3 Reserved - Reserved AK3 Reserved - Reserved AM3 Reserved - Reserved AG4 Reserved - Reserved Reserved - Reserved Reserved - Reserved Reserved oh Reserved - Reserved W17 Reserved - Reserved AD17 Reserved - Reserved R20 Reserved - Reserved T20 Reserved - Reserved V20 Reserved - Reserved X20 Reserved - Reserved AA20 Reserved - Reserved d w ex ith ee N ce a
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LE940B6 HW User Guide Pad Signal I/O Function - Reserved AE20 Reserved - Reserved AG20 Reserved - Reserved AJ20 Reserved - Reserved AA16 Reserved - Reserved J16 Reserved - Reserved Reserved - Reserved Reserved - Reserved Reserved oh Reserved - Reserved J0 Reserved - Reserved AM1 Reserved - Reserved AU13 Reserved - Reserved V2 Reserved - Reserved W3 Reserved - Reserved A14 Reserved - Reserved A16 Reserved - Reserved d w ex ith ee N ce a
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LE940B6 HW User Guide Pad Signal I/O Function - Reserved AP1 Reserved - Reserved M17 Reserved - Reserved AN6 Reserved - Reserved AS3 Reserved - Reserved AT2 Reserved - Reserved Reserved Reserved Reserved - Reserved ee Reserved D A Reserved pt ce r fo ee N NOTE: rN Reserved ex - d - un ite ib Reserved Reserved a AV4 oh Reserved Pr AV2 - ith Reserved w AV6 - s Reserved de - ra Reserved is Reserved ek n - AT0 D tio AN20 Reserved oy
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LE940B6 HW User Guide NOTE: Unless otherwise specified, RESERVED pins must be left unconnected (floating). The only exceptions are listed in the following section: LE940B6 Signals That Must Be Connected.
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LE940B6 HW User Guide PAD Signal Notes C103/TXD If not used, connect to a test point AF19 C104/RXD If not used, connect to a test point AA18 C105/RTS If flow control is not used, connect to GND C106/CTS If not used, connect to a test point e id TXD_AUX bu If not used, connect to a test point If not used, connect to a test point D tio ra If not used, connect to a 50 Ohm termination ANT_DIV_1 If not used, connect to a 50 Ohm termination ib For Analysis Recommended to connect to test p
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LE940B6 HW User Guide LGA Pads Layout Figure 2: LGA Pads Layout LE940B6 334 Pads Top View A ZZ 101 1 MIC1_M 2 5 EAR1_M RFU MAC_MD 4 IO SIMRST MAC_TX MAC_TX D[2] D[1] D[0] VAUX/P RFU V GPIO_1 GPIO_1 2 1 SPI_MIS SPI_CL GPIO_0 GPIO_0 GPIO_1 O K 8 9 0 GND F G H J K L M N P R S U T V MAC_RX D[1] D[0] C108/DT C109/DC C107/DS C125/RI R D R NG TXD_AU RXD_AU C104/RX C103/TX C106/CT X X D D S X Y AA AB AC AD AE AF AG AH AL AK AJ AM
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LE940B6 HW User Guide 4. Electrical Specifications Absolute Maximum Ratings – Not Operational D ov Pr WARNING: A deviation from the value ranges listed below may harm the LE940B6 module. e id tri is Table 8: Absolute Maximum Ratings – Not Operational Parameter VBATT Min d bu ek D Symbol Battery supply voltage on pin VBATT -0.3 +6.0 [V] -0.3 +6.
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LE940B6 HW User Guide Logic Level Specifications Unless otherwise specified, all the interface circuits of the LE940B6 are 1.8V CMOS logic. Only few specific interfaces (such as MAC, USIM and SD Card) are capable of dual voltage I/O. D ov Pr The following tables show the logic level specifications used in the LE940B6 interface circuits. The data specified in the tables below is valid throughout all drive strengths and the entire temperature ranges.
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LE940B6 HW User Guide Parameter Min Output low level 4.3.3. Max --- 0.36V 1.8V/2.9V SIM Pads Table 13: Operating Range – 1.8V SIM Pads Input high level D bu d tri Output high level ek D e id is Input low level Min ov Pr Parameter Output low level Max 1.26V 2.1V -0.3V 0.36V 1.26V 2.1V -0.3V 0.36V to tio ra Table 14: Operating Range – 2.9V SIM Pads ra 0.58V de D rN ce Max --- 0.8V ee 2.0V pt N Min A ex a --- to 2.8V --- Output low level --- 0.
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LE940B6 HW User Guide 4.3.5. 2.5V/3.3V EMAC Interface for RMII and RGMII Table 16: Absolute Maximum Ratings – 3.3V EMAC Interface Parameter Min Input level on 3.3V EMAC when on Max -0.3V 3.6V Table 17: Operating Range – 2.5V EMAC Interface ov Pr Parameter D Input high level e id is Max 1.7V 2.5V -0.3V 0.7V 2V --- --- 0.4V D tio ra to bu d Output high level ek D tri Input low level Output low level Min Max ra 2V 3.3V -0.3V 0.8V --- s ib 2.
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LE940B6 HW User Guide 5. Hardware Commands Turning on the LE940B6 Module To turn on the LE940B6 module, the ON_OFF_N pad must be asserted low in the range of 80 - 120 milliseconds and then released. Figure 3 illustrates a simple circuit to power on the module using an inverted buffer output.
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LE940B6 HW User Guide Figure 4: LE940B6 Initialization and Activation VBATT 80ms < Hold Time < 120ms ON_OFF_N 130ms VAUX/PWRMON 250ms Internal State 25 sec ov Pr SW_RDY Initialization Initialization State Activation State e id d D tri is D OFF State AT Commands Available to Pr ra ek is oy pl em n D tio ra ek bu NOTE: To check whether the LE940B6 has completely powered on, monitor the SW_RDY hardware line.
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LE940B6 HW User Guide Figure 5 shows a flow chart for the proper power-up procedure: Figure 5: Power-up Flow Chart Modem ON Procedure START N VBATT > 3.
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LE940B6 HW User Guide Figure 6 shows a flow chart illustrating the AT commands managing procedure. Figure 6: AT Command Managing Flow Chart Start AT CMD START e id is D ov Pr Delay 300 ms d to Go to HW SHUTDOWN Unconditional N AT Answer in 1 sec ? D rN A pt d to r fo ee N ce a ex ith d w ite s ib de oh un Pr ra Go to Modem ON Procedure ee oy pl Start AT CMD END is Y ek n em D tio ra ek bu D tri Enter AT ow kn Rev. 2.
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LE940B6 HW User Guide Turning off the LE940B6 Module Turning off the device can be done in four different ways: • • • • Shutdown by software command using AT#SHDN command Hardware shutdown using ON_OFF_N pad Hardware Unconditional Reset using the RESET_N pad Hardware Unconditional Shutdown using the SHDN_N pad e id ov Pr D tri is D When the device is shut down by a software command or a hardware shutdown, it issues a detach request to the network, informing the network that the device will not be r
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LE940B6 HW User Guide 5.3.1. Shutdown by Software Command The LE940B6 module can be shut down by a software command. When a shutdown command is sent, LE940B6 goes into the Finalization state and at the end of the finalization process shuts down VAUX/PWRMON. The duration of the Finalization state can differ according to the current situation of the module, so a value cannot be defined.
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LE940B6 HW User Guide 5.3.2. Hardware Shutdown To turn off the LE940B6 module, the ON_OFF_N pad must be asserted low in the range of 1150 - 1250 milliseconds and then released. Use the same circuitry and timing for power-on. ov Pr When the ON_OFF_N is asserted low for a period in the range 1150 - 1250 milliseconds and then released, LE940B6 goes into the Finalization state and in the end shuts down VAUX/PWRMON.
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LE940B6 HW User Guide 5.3.3. Unconditional Hardware Reset (RESET_N) To unconditionally restart the LE940B6 module, the RESET_N pad must be tied low in the range 1300 - 1800 milliseconds and then released. Figure 9 shows a simple circuit for this action.
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LE940B6 HW User Guide 5.3.4. Unconditional Hardware Shutdown To unconditionally shut down the LE940B6 module, the SHDN_N pad must be tied low for at least 200 milliseconds and then released. Figure 10 shows a simple circuit for applying an unconditional shutdown.
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LE940B6 HW User Guide Figure 11 shows a flow chart of the proper turn off procedure. Figure 11: Turn Off Procedure e id ov Pr to D rN A pt d to r fo ee N ce a ex ith d w ite s ib de oh un Pr ra ek is ee oy pl em n D tio ra ek bu d tri is D D ow kn Rev. 2.
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LE940B6 HW User Guide 6. Power Supply The power supply circuitry and board layout are very important parts of the full product design, with critical impact on the overall product performance. Read the following requirements and guidelines carefully to ensure a good and proper design. Power Supply Requirements ov Pr The LE940B6 power requirements are as follows: Table 19: Power Supply Requirements D Nominal supply voltage 3.
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LE940B6 HW User Guide Mode Average (Typ.) Mode Description Operative Mode (LTE) LTE data call (Non-CA BW 5 MHz, RB=1) 600 mA LTE data call (CA BW 20 + 20 MHz, Full RB, FDD 300 Mbps DL / 50 Mbps UL) without Ethernet cable connection and Loopback mode.
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LE940B6 HW User Guide Mode Average (Typ.) Mode Description Operative Mode (GSM) GSM Tx and Rx mode 360 mA GSM 1800/1900 PL0 300 mA ov Pr GSM 850/900 PL5 GSM voice call tri d 750 mA bu GSM 850/900 PL5 550 mA EGPRS 4 Tx + 1 Rx ra 500 mA Pr DCS 1800/1900 PL2 is 550 mA ib de oh un GPRS Sending Data mode (MCS-5) ee oy pl GSM 850/900 PL8 ek n em D tio ra DCS 1800/1900 PL0 GPRS Sending Data mode (CS-4) to ek D e id is D GPRS 4 Tx + 1 Rx D *** 3.
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LE940B6 HW User Guide e id ov Pr d to ek bu D tri is D NOTE: In GSM/GPRS mode, RF transmission is not continuous, but is packed into bursts at a base frequency of about 216 Hz with relative current peaks as high as about 2.0A. Therefore, the power supply must be designed to withstand these current peaks without big voltage drops. This means that both the electrical design and the board layout must be designed for this current flow.
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LE940B6 HW User Guide Figure 12 shows an example of linear regulator with 5V input. Figure 12: Example of Linear Regulator with 5V Input e id ov Pr tio D n de ib A ex D d rN ite pt ce d to r fo ee ow kn • N • a • ith • w • un oh s • ra Pr ee oy pl is ek The desired output for the power supply is 3.8V. Due to the big difference between the input source and the desired output, a linear regulator is unsuitable and must not be used.
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LE940B6 HW User Guide Figure 13 and Figure 14 show an example of switching regulator with 12V input. Figure 13: Example of Switching Regulator with 12V Input – Part 1 e id ov Pr is D Figure 14: Example of Switching Regulator with 12V Input – Part 2 to D rN A pt d to r fo ee N ce a ex ith d w ite s ib de oh un Pr ra ek is ee oy pl em n D tio ra ek bu d tri D ow kn Rev. 2.
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LE940B6 HW User Guide Battery Source Power Supply – Design Guidelines 6.2.1.3. • The desired nominal output for the power supply is 3.8V, and the maximum allowed voltage is 4.2V. Hence, a single 3.7V Li-Ion cell battery type is suitable for supplying the power to the LE940B6 module. e id to D s ib de oh Thermal Design Guidelines un Pr ra is 6.2.2.
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LE940B6 HW User Guide The current consumption is up to about 1250 mA continuously at the maximum Tx output power (23 dBm). Therefore, make sure on the PCB used to mount LE940B6, that the area under the LE940B6 module is as large as possible. Make sure that the LE940B6 is mounted on the large ground area of application board and provide many ground vias to dissipate the heat. 6.2.3.
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LE940B6 HW User Guide • The power supply input cables must be kept separate from noise sensitive lines, such as microphone/earphone cables. e id ov Pr to D rN A pt d to r fo ee N ce a ex ith d w ite s ib de oh un Pr ra ek is ee oy pl em n D tio ra ek bu d tri is D D ow kn Rev. 2.
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LE940B6 HW User Guide 7. Antenna(s) Antenna connection and board layout design are the most important parts in the full product design, and they have a strong influence on the product’s overall performance. Read carefully and follow the requirements and guidelines for a good and proper design.
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LE940B6 HW User Guide • • • • e id ov Pr tio to bu d tri ra ek D • is D • • • Keep, if possible, at least one layer of the PCB used only for the ground plane. If possible, use this layer as reference ground plane for the transmission line. Surround the PCB transmission line with ground (on both sides). Avoid having other signal tracks facing the antenna line track directly. Avoid crossing any un-shielded transmission line footprint with other tracks on different layers.
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LE940B6 HW User Guide Secondary Antenna Requirements This product includes an input for a second Rx antenna to improve radio sensitivity. The function is called Antenna Diversity. Since there is no antenna connector on the LE940B6 module, the antenna must be connected to the LE940B6 antenna pad by means of a transmission line implemented on the PCB. ov Pr If the antenna is not directly connected at the antenna pad of the LE940B6 (AU9), a PCB line is required to connect to it or to its connector.
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LE940B6 HW User Guide A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance from coplanar ground plane = 0.3 mm on each side. The line uses a reference ground plane on Layer 3, while copper is removed from Layer 2 underneath the line. Height of trace above the ground plane is 1.335 mm. Calculated characteristic impedance is 51.6 Ω, estimated line loss is less than 0.1 dB. The line geometry is shown below.
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LE940B6 HW User Guide Figure 16 illustrates the return loss plot of line under test. Figure 16: Return Loss Plot of Line Under Test e id ov Pr to ra ek is em n D tio ra ek bu d tri is D D D rN A pt d to r fo ee N ce a ex ith d w ite s ib ee Figure 17: Line Input Impedance de oh un Pr oy pl Figure 17 shows the line input impedance (in Smith Chart format, once the line has been terminated to a load of 50 Ω) . ow kn Rev. 2.
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LE940B6 HW User Guide 8. Hardware Interfaces Table 23 summarizes all the hardware interfaces of the LE940B6 module. Table 23: LE940B6 Hardware Interfaces LE940B6 (XMM7272 CAT6) RMII/RGMII USB USB2.0 D SPI Master only, up to 26 MHz (104 MHz @ Kernel CLK/4) For sensors, audio control tri d x1 UART for AT (up to 4.8 Mbps) bu UART ek D e id is I2C ov Pr Ethernet tio ra to x1 UART for diagnosis (up to 4.8 Mbps) x1 UART for GNSS or external controller (up to 4.
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LE940B6 HW User Guide USB Port The LE940B6 module includes a Universal Serial Bus (USB) transceiver, which operates at USB high-speed (480Mbits/sec). It can also operate with USB full-speed hosts (12Mbits/sec). It is compliant with the USB 2.0 specification and can be used for control and data transfers as well as for diagnostic monitoring and firmware update.
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LE940B6 HW User Guide NOTE: USB_VBUS input power is internally used to detect the USB port and start the enumeration process. It is not used for supplying power to the internal LE940B6 USB HW block. ov Pr e id d to ra ek is oy pl em n D tio ra ek bu D tri is D NOTE: Even if USB communication is not used, it is still highly recommended to place an optional USB connector on the application board.
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LE940B6 HW User Guide Serial Ports The serial port is typically a secondary interface between the LE940B6 module and OEM hardware. The following serial ports are available on the module: • • • Modem Serial Port 1 (Main) Modem Serial Port 2 (Auxiliary) Modem Serial Port 3 (GNSS) tri is n em Modem Serial Port 1 is ek 8.2.1. D tio ra to bu d Depending on the type of serial port on OEM hardware, level translator circuits may be needed to make the system operate.
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LE940B6 HW User Guide RS232 Pin# Signal Pad No.
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LE940B6 HW User Guide NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. ov Pr e id d ek bu D tri is D NOTE: The Auxiliary UART is used as the SW main debug console. It is required to place test points on this interface even if not used. Modem Serial Port 3 tio ra to 8.2.3.
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LE940B6 HW User Guide 8.2.4. RS232 Level Translation To interface the LE940B6 with a PC COM port or an RS232 (EIA/TIA-232) application, a level translator is required. This level translator must perform the following actions: • • Invert the electrical signal in both directions Change the level from 0/1.
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LE940B6 HW User Guide As an example, RS232 level adaption circuitry could use a MAXIM transceiver (MAX218). In this case, the chipset is capable of translating directly from 1.8V to the RS232 levels (example on 4 signals only).
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LE940B6 HW User Guide Peripheral Ports In addition to the LE940B6 serial ports, the LE940B6 supports the following peripheral ports: • • • SPI – Serial Peripheral Interface I2C - Inter-integrated circuit Ethernet – Ethernet PHY Interface ov Pr SPI – Serial Peripheral Interface 8.3.1. The LE940B6 SPI supports the following: D e id tio ra to bu d tri is Master Mode only 1.
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LE940B6 HW User Guide 8.3.2. I2C - Inter-integrated Circuit The LE940B6 I2C is an alternate function of GPIO 1-15 pins. Available only from Modem side as SW emulation of I2C on GPIO lines. Any GPIO can be configured as SCL or SDA. LE940B6 supports I2C Master Mode only. e id d ek bu D tri is D ov Pr NOTE: SW emulated I2C on GPIO lines is supported only from the modem side. For more information, refer to Ref 1: LE940B6 AT Command Reference Guide for command settings.
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LE940B6 HW User Guide PAD Signal I/O Function Type MAC_GTX_CLK O RGMII Transmit Clock 2.5/3.3V G16 MAC_TXEN_ER O RGMII Transmit Enable /Error or RMII Transmit Enable 2.5/3.3V AL16 MAC_RXD[0] I RGMII or RMII RXD[0] 2.5/3.3V AJ16 MAC_RXD[1] I RGMII or RMII RXD[1] 2.5/3.3V AG16 MAC_RXD[2] I RGMII RXD[2] 2.5/3.3V I RGMII RXD[3] 2.5/3.3V RGMII Receive Clock 2.5/3.3V RGMII Receive Data Available/Error or RMII Receive Error 2.5/3.3V I Ethernet PHY Reset Output 2.5/3.3V 2.5/3.
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LE940B6 HW User Guide Audio Interface The LE940B6 module supports analog and digital audio interfaces. 8.5.1. Analog Audio The LE940B6 module provides an analog audio interface, a single differential input for the audio to be transmitted (Uplink), and a balanced output for the received audio (Downlink).
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LE940B6 HW User Guide General Purpose I/O The general-purpose I/O pads can be configured to act in three different ways: • • • Input Output Alternative function (internally controlled) D ov Pr Input pads can only be read, reporting digital values (high / low) present at the reading time. Output pads can only be written or queried and set values on the pad output. Alternative function can be internally controlled by LE940B6 firmware and act according to the implementation.
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LE940B6 HW User Guide NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. ov Pr e id d ek bu D tri is D NOTE: LE940B6 GPIOs can also be used as alternate I2C function. Refer to Section 8.3.2, I2C - Inter-integrated Circuit. Using a GPIO Pad as Input tio ra to 8.6.1.
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LE940B6 HW User Guide 9. Miscellaneous Functions Indication of Network Service Availability The STAT_LED pin status shows information on the network service availability and call status. In the LE940B6 module, the STAT_LED usually needs an external transistor to drive an external LED. ov Pr The status indicated in Table 33 is configurable. Refer to Ref 1: LE940B6 AT Command Reference Guide for the full description of this function.
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LE940B6 HW User Guide VAUX Power Output A regulated power supply output is provided to supply small devices from the module. This output is active when the module is ON and goes OFF when the module is shut down. The operating range characteristics of the supply are as follows: Table 34: Operating Range – VAUX Power Supply Min D Output current 1.75V Max 1.80V 1.
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LE940B6 HW User Guide Fuel Gauge (TBD) The LE940B6 module can optionally support an external Fuel Gauge solution. In this case, an external IC that is capable of measuring the current flow in and out of the module must be added on the carrier board. Figure 24 shows an example of a typical connectivity of such an external fuel gauge to the LE940B6 module.
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LE940B6 HW User Guide 10. Mounting the Module on your Board General The LE940B6 module is designed to be compliant with a standard lead-free soldering process as defined in JESD22b102d, table 3b. The number of reflows must not exceed two. This limits Tmax to 245 °C. e id d to D rN A pt d to r fo ee N ce a ex ith d w ite s ib de oh un Pr ra ek is ee oy pl em n D tio ra ek bu D tri is D ov Pr Finishing & Dimensions ow kn Rev. 2.
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LE940B6 HW User Guide Recommended Footprint for the Application Figure 25 shows the top view of the module, which has 334 pads (dimensions are in mm). To facilitate replacing the LE940B6 module if necessary, it is suggested to design the application board with a 1.5 mm placement inhibit area around the module. These regions are highlighted in Figure 25.
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LE940B6 HW User Guide Stencil Stencil’s apertures layout can be the same as the recommended footprint (1:1). The suggested thickness of stencil foil is greater than 120 µm. PCB Pad Design The solder pads on the PCB are recommended to be of the Non Solder Mask Defined (NSMD) type. ov Pr Figure 26: PCB Pad Design e id to D rN A pt d to r fo ee N ce a ex ith d w ite s ib de oh un Pr ra ek is ee oy pl em n D tio ra ek bu d tri is D D ow kn Rev. 2.
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LE940B6 HW User Guide Recommendations for PCB Pad Dimensions (mm) Figure 27: PCB Pad Dimensions e id ov Pr to D tio ra ek bu d tri is D D de A r fo 3-7 / 0.05-0.15 Properties kn Good solder ability protection, high shear force values ow Electro-less Ni / Immersion Au Layer Thickness (um) to Finish d Table 36: Recommendations for PCB Pad Surfaces D rN Holes in pad are allowed only for blind holes and not for through holes.
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LE940B6 HW User Guide The PCB must be able to resist the higher temperatures, which occur during the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste. Solder Paste 10.7.1. ov Pr We recommend using only “no clean” solder paste to avoid the cleaning of the modules after assembly.
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LE940B6 HW User Guide Table 37: Solder Profile Characteristics Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max Preheat 150°C – Temperature max (Tsmax) 200°C – Time (min to max) (ts) 60-180 seconds D Tsmax to TL is e id ov Pr – Temperature min (Tsmin) – Ramp-up rate tri d bu ek D Time maintained above: 60-150 seconds D tio ra 245 +0/-5°C ek is Time within 5°C of actual peak Pr 6°C/second max ee oh Ramp-down rate un oy pl Temperature (tp)
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LE940B6 HW User Guide 11.
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LE940B6 HW User Guide Bypass Capacitor on Power Supplies When a sudden voltage step to or a cut from the power supplies is asserted, the steep transition causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect the device causing it to not operate or to malfunction. ov Pr Bypass capacitors are needed to alleviate this behavior. The behavior can appear differently depending on the various applications.
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LE940B6 HW User Guide SIM Interface This section presents the recommended schematics for the design of SIM interfaces on the application boards. The LE940B6 supports two external SIM interfaces. 11.3.1. SIM Schematic Example Figure 30 illustrates in particular how to design the application side and what values to assign the components.
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LE940B6 HW User Guide EMC Recommendations All LE940B6 signals are provided with some EMC protection. Nevertheless, the accepted level differs according to the specific pin. Table 39 lists the characteristics.
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LE940B6 HW User Guide Antenna Detection The LE940B6 module provides an antenna detection application. Many automotive applications require to detect if the antenna is shorted to ground or the battery of the vehicle for fault tracing. Basically, antenna detection is performed by means of its DC characteristics, splitting the DC and RF paths. Refer to Ref 5: Titan - Antenna Detection Application Note.
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LE940B6 HW User Guide 12. Packing System The LE940B6 module is packed on trays. ov Pr The tray is JEDEC compliant, injection molded antistatic Modified Polyphenylene ether (MPPO). It has good thermal characteristics and can withstand the standard baking temperature of up to 125°C, thereby avoiding the need of handling the modules if baking is required. The trays are rigid, thus providing mechanical protection against transport stress. In addition, they are re-usable and so environmentally sustainable.
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LE940B6 HW User Guide Each tray contains 24 modules as shown in Figure 31. Figure 31: Tray Packing e id ov Pr to D rN A pt d to r fo ee N ce a ex ith d w ite s ib de oh un Pr ra ek is ee oy pl em n D tio ra ek bu d tri is D D ow kn Rev. 2.
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LE940B6 HW User Guide Tray Drawing LE940B6 is packaged on trays. Each tray contains 21 pieces with the following dimensions: Figure 32: Tray Drawing e id ov Pr to D rN ith d w ite s ib de oh un Pr ra ek is ee oy pl em n D tio ra ek bu d tri is D D A pt r fo d Moisture Sensitivity ee N ce a ex WARNING: These trays can withstand a maximum temperature of 125°C.
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LE940B6 HW User Guide 13. Conformity Assessment Issues FCC/IC Regulatory Notices Manual Information to the End User D ov Pr The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
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LE940B6 HW User Guide - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
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LE940B6 HW User Guide RED Regulatory Notices 2014/53/EU Directive Hereby, Titan Automotive Solutions NV declares that the radio equipment type LE940B6-RW is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: www.tustitan.com/RED ov Pr RF Exposure Information (MPE) e id d to bu ek D tri is D This device has been tested and meets applicable limits for Radio Frequency (RF) exposure.
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LE940B6 HW User Guide Table 42: RED Antenna Specifications Mode Band LTE FDD 2100 – B1 3.5 FDD 1800+ – B3 3.5 FDD 2600 – B7 4.0 FDD 900 – B8 3.0 3.0 FDD 700 APT – B28 3.0 2100 – B1 3.5 900 – B8 3.0 d D e id FDD 800 – B20 tri is ov Pr D WCDMA 3.5 to ek bu 1800 – B3 GSM Antenna Gain (dBi) 3.
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LE940B6 HW User Guide 14. Safety Recommendations READ CAREFULLY Be sure that the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and must be avoided in the following areas: • D ov Pr • Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion, such as gasoline stations, oil refineries, etc.
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LE940B6 HW User Guide 15.
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LE940B6 HW User Guide SOC System-on-Chip SPI Serial peripheral interface UART Universal asynchronous receiver transmitter ov Pr UMTS Universal mobile telecommunications system D USB Universal serial bus e id tri is Wideband code division multiple access d Wireless Coexistence Interface D rN A pt d to r fo ee N ce a ex ith d w ite s ib de oh un Pr ra ek is ee oy pl em n D tio ra WCI to bu ek D WCDMA ow kn Rev. 2.
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LE940B6 HW User Guide 16. Document History Table 43: Document History Revision Rev 2.2 Date Changes 2020-01-10 Replaced Telit logo and name were by Titan ones. FCC and IC ID updated from Telit to Titan. 2018-03-15 Added NCC warning at the last page D e id 2018-01-04 Sec. 3.2 Fixed Table 44: Mandatory Signals Sec. 4.3.3 Deleted 1.2V EMIC Pads d Rev. 1.9 bu 2017-10-24 Sec. 2.5.1 Updated Table 4, RF Bands per Regional Variant tio ra to ek D tri is Rev. 2.0 ov Pr Rev. 2.1 ek n Sec. 5.
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LE940B6 HW User Guide Revision v. 1.6 Date Changes 2016-11-15 Official Release Sec. 2.7: Updated the Mechanical Specifications Sec. 3.1: Added VPP pin for eFuse Sections 3.1, 3.3, 4.3.6, 8: SD / MMC interfaces were deleted - they are not supported by the chipset vendor. ov Pr e id Sec. 5.1: Updated the Power on Hold time. Sec. 5.3.2: Updated the section of Hardware Shutdown d Sec. 5.3.3: Updated the Unconditional reset Hold time. to Sec. 6.
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LE940B6 HW User Guide Revision Rev. 1.5 Date Changes 2016-09-20 (Interim version) Page 2, Table 1: Updated the Applicability table Sec. 2: Updated the General Product Description Sec. 2.5.1, 2.5.2: Updated the RF bands tables Sec. 3.1: Updated the pin description in the Pin-out table ov Pr Sec. 4.3: Added tables of logic level specifications e id Sec. 6.1: Added Table 20 - Power Supply Requirements d Sec. 8: Gathered the description of all hardware interfaces into this section to Sec. 8.