LE920A4 Auto HW User Guide Doc#: 1VV0301261 Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Titan assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions.
LE920A4 HW User Guide Doc#: 1VV0301261 USAGE AND DISCLOSURE RESTRICTIONS I. License Agreements The software described in this document is the property of Titan and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. II. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law.
LE920A4 HW User Guide Doc#: 1VV0301261 APPLICABILITY TABLE This documentation applies to the following products: Table 1: Applicability Table Module Name Description LE920A4-NA North America regional variant (AT&T, T-Mobile) LE920A4-NV (*) North America regional variant (Verizon) LE920A4-EU Europe regional variant HE920A-EU (*) Non-LTE Europe variant LE920A4-CN China variant LE920A4-AP (*) APAC variant (*) Variants which were not designed yet Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 CONTENTS 1. INTRODUCTION .............................................................................................9 Scope ............................................................................................................. 9 Audience......................................................................................................... 9 Contact Information, Support ..........................................................................
LE920A4 HW User Guide Doc#: 1VV0301261 4.3.6. SD Card Pads @ 2.95V .................................................................................44 4.3.7. SIM Card Pads @2.95V.................................................................................45 5. HARDWARE COMMANDS ...........................................................................46 Turning on the Module ...................................................................................46 Initialization and Activation State ..
LE920A4 HW User Guide Doc#: 1VV0301261 8.3.2. Ethernet Control Interface ..............................................................................70 Serial Ports ....................................................................................................71 8.4.1. Modem Serial Port 1 ......................................................................................72 8.4.2. Modem Serial Port 2 ......................................................................................74 8.4.
LE920A4 HW User Guide Doc#: 1VV0301261 Stencil............................................................................................................99 PCB Pad Design ............................................................................................99 Recommendations for PCB Pad Dimensions (mm)........................................99 Solder Paste ................................................................................................100 10.7.1. Solder Reflow .......................
LE920A4 HW User Guide Doc#: 1VV0301261 1. Introduction Scope Introduction Scope This document introduces the Titan LE920A4 module and presents possible and recommended hardware solutions for developing a product based on this module. All the features and solutions detailed in this document are applicable to all module variants, where “module” refers to the variants listed in the applicability table. If a specific feature is applicable to a specific product only, it will be clearly marked.
LE920A4 HW User Guide Doc#: 1VV0301261 Introduction Text Conventions http://www.tustitan.com To register for product news and announcements or for product questions contact Titan Technical Support. Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Titan appreciates feedback from the users of our information.
LE920A4 HW User Guide Doc#: 1VV0301261 Introduction Related Documents Related Documents Table 2: Related Documents Document Title Document Number Ref 1: LE920A4 AT Command User Guide 80490ST10778A Ref 2: LE920A4 Software Guide 1VV0301332 Ref 3: Generic EVB HW User Guide 1VV0301249 Ref 4: LE920A4 Interface Board HW User Guide 1VV0301248 Ref 5: Digital Voice Interface_Application_Note 80000NT11246A Ref 6: Titan_LE920A4_LE910Cx_WiFi_Interface_Application_Note_r1 80490NT11511A Ref 7: Antenna Det
LE920A4 HW User Guide Doc#: 1VV0301261 2.
LE920A4 HW User Guide Doc#: 1VV0301261 General Product Description General Functionality and Main Features General Functionality and Main Features The LE920A4 family of automotive cellular modules features an advanced LTE and multiRAT modem together with a powerful on-chip application processor and a rich set of interfaces.
LE920A4 HW User Guide Doc#: 1VV0301261 General Product Description General Functionality and Main Features Function Interfaces Features Rich set of interfaces, including: SD/MMC Card Interface supporting SD3.0 standard SDIO for external WiFi transceiver supporting SDIO3.0 standard SGMII for external Ethernet transceiver (optional) o o o o o USB2.0 – USB port is typically used for: o o o o o o o o o o o o o Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 General Product Description Function Major software features Features Advanced security features o o o FOTA (optional) Titan Unified AT command set Java VM (optional) with the following features: o o o o 2 Boot integrity of firmware up to customer applications Disable/secure re-enable of debug Embedded security Rich and standardized application environment for customer applications State-of-the-art and high performance Java SE8 embedded Virtual Machine
LE920A4 HW User Guide Doc#: 1VV0301261 General Product Description Block Diagram Block Diagram Figure 1 shows an overview of the internal architecture of the module. It includes the following sub-functions: Application processor, Modem subsystem and Location processing with their external interfaces. These three functions are contained in a single SOC.
LE920A4 HW User Guide Doc#: 1VV0301261 General Product Description Environmental Requirements Environmental Requirements 2.5.1. Temperature Range Table 4: Temperature Range Operating temperature range -20 ~ +55°C This range is defined by 3GPP (the global standard for wireless mobile communication). Titan guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the module with in this range.
LE920A4 HW User Guide Doc#: 1VV0301261 General Product Description Frequency Bands Frequency Bands The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE modes conform to the 3GPP specifications. 2.6.1. RF Bands per Regional Variant Table 5 summarizes of all region variants within the module family, showing the supported band sets in each variant.
LE920A4 HW User Guide Doc#: 1VV0301261 2.6.2. General Product Description Frequency Bands Reference Table of RF Bands Characteristics Table 6: RF Bands Characteristics Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset PCS 1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 80 MHz DCS 1800 1710 ~ 1785 1805 ~ 1880 512 ~ 885 95 MHz GSM 850 824.2 ~ 848.8 869.2 ~ 893.
LE920A4 HW User Guide Doc#: 1VV0301261 Mode Freq. Tx (MHz) TDSCDMA 1900 – B39 1880 ~ 1920 LTE 2100 – B1 1920 ~ 1980 General Product Description Frequency Bands Freq.
LE920A4 HW User Guide Doc#: 1VV0301261 Mode LTE 800 – B19 Freq. Tx (MHz) 830 ~ 845 General Product Description Freq. Rx (MHz) 875 ~ 890 Channels Tx: 24000 ~ 24149 Tx-Rx Offset 45 MHz Rx: 6000 ~ 6149 LTE 800 – B20 832 ~ 862 791 ~ 821 Tx: 24150 ~ 24449 -41 MHz Rx: 6150 ~ 6449 LTE 1500 – B21 LTE 850+ – B26 1447.9 ~ 1462.9 1495.9 ~ 1510.
LE920A4 HW User Guide Doc#: 1VV0301261 General Product Description RF parameters RF parameters 2.7.1. Sensitivity The module’s typical sensitivity levels are as follows: -108 dBm @ 2G -113 dBm @ 3G/TD-SCDMA -102 dBm @ 4G FDD/TDD (BW=5 MHz) 2.7.2. Output power LE920A4 typical values for Max output level are as follow: 2G: - LB: 33dBm - HB: 30dBm 3G/TD-SCDMA: 24dBm 4G (FDD & TDD):23dBm @1RB.
LE920A4 HW User Guide Doc#: 1VV0301261 3. Module Connections Pin-out Module Connections Pin-out Table 7: Pin-out PAD Signal I/O Function Type Comment USB HS 2.0 Communication Port D19 USB_D+ I/O USB differential data(+) F19 USB_D- I/O USB differential data(-) A18 USB_VBUS AI Power sense for the internal USB transceiver B19 USB_ID AI USB ID for supporting USB2.0 OTG Power Asynchronous UART AH19 C103/TXD I Serial data input (TXD) from DTE 1.
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Signal Module Connections Pin-out I/O Function Type K19 SPI_MOSI O SPI data Master Output Slave Input 1.8V N18 SPI_CS O SPI chip select output 1.8V Comment SD/MMC Card Interface AH17 SD/MMC_CM D I/O SD command 1.8/2.95V AD17 SD/MMC_CLK O SD card clock 1.8/2.95V Y17 SD/MMC_DAT A0 I/O SD Serial Data 0 1.8/2.95V AF17 SD/MMC_DAT A1 I/O SD Serial Data 1 1.8/2.95V AB17 SD/MMC_DAT A2 I/O SD Serial Data 2 1.8/2.
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Signal Module Connections Pin-out I/O Function Type Comment LTE-WiFi Coexistence AS3 WCI_TX O Wireless coexistence interface TXD 1.8V AT2 WCI_RX I Wireless coexistence interface RXD 1.8V SIM Card Interface 1 A10 SIMCLK1 O External SIM 1 signal – Clock 1.8/2.85V B11 SIMRST1 O External SIM 1 signal – Reset 1.8/2.85V B9 SIMIO1 I/O External SIM 1 signal - Data I/O 1.8/2.
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Module Connections Pin-out Signal I/O Function Type D1 EAR2_MT- AO Earphone signal output2, phase - Audio C2 MIC2_MT+ AI Mic signal input2, phase + Audio B1 MIC2_MT- AI Mic signal input2, phase - Audio Comment Digital Voice Interface (DVI) D11 DVI_WA0 O Digital Voice interface (WA0 master output) 1.8V C8 DVI_RX I Digital Voice interface (Rx) 1.8V D9 DVI_TX O Digital Voice interface (Tx) 1.
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Signal Module Connections Pin-out I/O Function Type Comment GPS Section S1 ANT_GPS I GPS antenna (50 Ohm) RF V2 GPS_LNA_EN O Enables the external regulator for GPS LNA 1.8V W3 GPS_SYNC O GPS sync signal for Dead Reckoning 1.
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Signal Module Connections Pin-out I/O Function Type Comment HSIC Interface A14 HSIC_DATA I/O High-speed inter-chip interface data 1.2V Optional A16 HSIC_STB I/O High-speed inter-chip interface strobe 1.2V Optional I2C Interface C14 I2C_SCL I/O I2C clock 1.8V Internal PU 2.2 kΩ to 1.8V D13 I2C_SDA I/O I2C Data 1.8V Internal PU 2.2 kΩ to 1.
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Signal Module Connections Pin-out I/O Function AA0 GND - Ground AC0 GND - Ground AE0 GND - Ground AG0 GND - Ground AJ0 GND - Ground AL0 GND - Ground AN0 GND - Ground AR0 GND - Ground AV0 GND - Ground ZZ1 GND - Ground F1 GND - Ground M1 GND - Ground P1 GND - Ground U1 GND - Ground W1 GND - Ground Y1 GND - Ground AB1 GND - Ground AF1 GND - Ground AH1 GND - Ground AK1 GND - Ground AU1
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Signal Module Connections Pin-out I/O Function AG2 GND - Ground AJ2 GND - Ground AL2 GND - Ground AN2 GND - Ground AR2 GND - Ground D3 GND - Ground P3 GND - Ground AP3 GND - Ground C4 GND - Ground AR4 GND - Ground AT4 GND - Ground AP5 GND - Ground AS5 GND - Ground AU5 GND - Ground A6 GND - Ground C6 GND - Ground AR6 GND - Ground AT6 GND - Ground D7 GND - Ground AP7 GND - Ground AS7
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Signal Module Connections Pin-out I/O Function AV8 GND - Ground U9 GND - Ground W9 GND - Ground Y9 GND - Ground AP9 GND - Ground AS9 GND - Ground T10 GND - Ground V10 GND - Ground X10 GND - Ground AA10 GND - Ground AR10 GND - Ground AT10 GND - Ground AV10 GND - Ground U11 GND - Ground W11 GND - Ground Y11 GND - Ground AP11 GND - Ground AS11 GND - Ground AU11 GND - Ground A12 GND - Gr
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Signal Module Connections Pin-out I/O Function AP13 GND - Ground AS13 GND - Ground AR14 GND - Ground AT14 GND - Ground AV14 GND - Ground B15 GND - Ground AP15 GND - Ground AS15 GND - Ground AU15 GND - Ground AN16 GND - Ground AR16 GND - Ground AT16 GND - Ground AV16 GND - Ground B17 GND - Ground AK17 GND - Ground AM17 GND - Ground E18 GND - Ground G18 GND - Ground T18 GND - Ground V18
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Signal Module Connections Pin-out I/O Function A20 GND - Ground L20 GND - Ground N20 GND - Ground AV20 GND - Ground Type Comment Reserved C0 Reserved - Reserved E0 Reserved - Reserved G0 Reserved - Reserved J0 Reserved - Reserved L0 Reserved - Reserved AT0 Reserved - Reserved K1 Reserved - Reserved AM1 Reserved - Reserved G2 Reserved - Reserved J2 Reserved - Reserved L2 Reserved - Reserved AV2 Reser
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Signal Module Connections Pin-out I/O Function N4 Reserved - Reserved R4 Reserved - Reserved T4 Reserved - Reserved V4 Reserved - Reserved AG4 Reserved - Reserved AJ4 Reserved - Reserved AL4 Reserved - Reserved AV4 Reserved - Reserved ZZ5 Reserved - Reserved F5 Reserved - Reserved AM5 Reserved - Reserved AN6 Reserved - Reserved AV6 Reserved - Reserved ZZ7 Reserved - Reserved AM7 Reserved - Reserved AP1
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Signal Module Connections Pin-out I/O Function L16 Reserved - Reserved N16 Reserved - Reserved R16 Reserved - Reserved T16 Reserved - Reserved V16 Reserved - Reserved X16 Reserved - Reserved AA16 Reserved - Reserved AC16 Reserved - Reserved AE16 Reserved - Reserved AG16 Reserved - Reserved AJ16 Reserved - Reserved AL16 Reserved - Reserved F17 Reserved - Reserved H17 Reserved - Reserved K17 Reserved - Re
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Signal Module Connections Pin-out I/O Function AJ20 Reserved - Reserved AL20 Reserved - Reserved AN20 Reserved - Reserved R18 Reserved - Reserved S19 Reserved - Reserved U19 Reserved - Reserved L18 Reserved - Reserved J18 Reserved - Reserved H1 Reserved - Reserved AE4 Reserved - Reserved AC4 Reserved - Reserved Type Comment WARNING: GPIO_20 and WCI_RX are used as special HW flags during boot.
LE920A4 HW User Guide Doc#: 1VV0301261 Module Connections Signals That Must Be Connected Signals That Must Be Connected Table 8 lists the signals that must be connected even if not used by the end application.
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Module Connections Signals That Must Be Connected Signal Notes AH19 C103/TXD If not used, connect to a test point AF19 C104/RXD If not used, connect to a test point AA18 C105/RTS If flow control is not used, connect to GND AK19 C106/CTS If not used, connect to a test point AB19 TX_AUX If not used, connect to a test point AD19 RX_AUX If not used, connect to a test point AD1 Antenna MAIN antenna AU9 ANT_DIV S1 ANT_GPS J2, L2, F3, H3, K3, E
LE920A4 HW User Guide Doc#: 1VV0301261 PAD Module Connections Signals That Must Be Connected Signal Notes AB19 TX_AUX If not used, connect to a test point AD19 RX_AUX If not used, connect to a test point AD1 Antenna MAIN antenna AU9 ANT_DIV S1 ANT_GPS J2, L2, F3, H3, K3, E4, AN14 Reserved Connect to a test point for Titan internal use AN4 GPIO_20 If not used, connect to a test point AT2 WCI_RX If not used, connect to a test point Rev. 4.7.
1 GND GND 5 Page 40 of 124 ED ED GND RFU TGPIO TGPIO _21 _22 MIC2 EAR2 RESERV RESERV RESERV _MT+ ED ED ED GND RESERV JTAG_T ED ORIGIN RESERV ED T GND ANT GND U V GND GND _GPS W X Y GND GND AA AB GND GND AC AD GND GND AE AF GND ANT 1 AG AH GND GND AJ AK GND GND AL AM GND GND ANT 2 GND GND GND LNA GND GND GND GND GND GND RFU GND RFU RESERV RESERV GPS_PP ED ED S RFU RFU WiFi WiFi_SD WiFi_SD WiFi_SD WiFi_SD WiFi_SD WiF
LE920A4 HW User Guide Doc#: 1VV0301261 4. Electrical Specifications Absolute Maximum Ratings – Not Operational Electrical Specifications Absolute Maximum Ratings – Not Operational WARNING: A deviation from the value ranges listed below may harm the module. Table 9: Absolute Maximum Ratings – Not Operational Symbol Parameter Min Max Unit VBATT Battery supply voltage on VBATT pin -0.5 +6.0 [V] VBATT TRANSIENT Transient voltage on pin VBATT (< 10 ms) -0.5 +7.
LE920A4 HW User Guide Doc#: 1VV0301261 Electrical Specifications Logic Level Specifications Logic Level Specifications Unless otherwise specified, all the interface circuits of the module are 1.8V CMOS logic. Only few specific interfaces (such as USIM and SD Card) are capable of dual voltage I/O. The following tables show the logic level specifications used in the module’s interface circuits. The data specified in the tables below is valid throughout all drive strengths and the entire temperature ranges.
LE920A4 HW User Guide Doc#: 1VV0301261 4.3.3. Electrical Specifications Logic Level Specifications 1.8V SD Card Pads Table 13: Operating Range – SD Card Pads Working at 1.8V Pad Parameter Min Max Unit Comment VIH Input high level 1.27V 2V [V] VIL Input low level -0.3V 0.58V [V] VOH Output high level 1.4V -- [V] VOL Output low level 0 0.
LE920A4 HW User Guide Doc#: 1VV0301261 4.3.5. Electrical Specifications Logic Level Specifications Dual Voltage Pads - Absolute Maximum Ratings Table 15: Absolute Maximum Ratings - Not Functional Parameter Min Max Input level on any digital pin when on -0.3V +3.6V Input voltage on analog pins when on -0.3V +3.6 V 4.3.6. SD Card Pads @ 2.95V Table 16: Operating Range – For SD Card Pads Operating at 2.95V Pad Parameter Min Max Unit VIH Input high level 1.9V 3.
LE920A4 HW User Guide Doc#: 1VV0301261 4.3.7. Electrical Specifications Logic Level Specifications SIM Card Pads @2.95V Table 17: Operating Range – For SIM Pads Operating at 2.95V Pad Parameter Min Max Unit VIH Input high level 2.1V 3.1V [V] VIL Input low level -0.3V 0.55V [V] VOH Output high level 2.25V 3.1V [V] VOL Output low level 0V 0.
LE920A4 HW User Guide Doc#: 1VV0301261 5. Hardware Commands Turning on the Module Hardware Commands Turning on the Module To turn on the module, the ON/OFF pad must be asserted low for at least 1 second and then released. The maximum current that can be drained from the ON/OFF pad is 0.1 mA. This pin is internally pulled up; customers should expect to see ~ 800 mV on the output. Figure 3 illustrates a simple circuit to power on the module using an inverted buffer output.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Commands Initialization and Activation State Figure 4: Module Initialization and Activation VBATT 1 Sec < T_Hold < 2 Sec ON_OFF T_RDY < 20 Sec SW_RDY OK to Send AT commands 18 Sec < T_PWRMON < 20 Sec V_AUX PWRMON All interfaces and pins configured OFF State Initialization State Active State NOTE: During SW initialization of the module, the SW configures all pads and interfaces to their desired mode.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Commands Turning off the Module NOTE: To avoid a back-powering effect, it is recommended not to apply any HIGH logic level signal to the digital pins of the module when it is powered OFF or during an ON/OFF transition.
LE920A4 HW User Guide Doc#: 1VV0301261 5.3.1. Hardware Commands Turning off the Module Shutdown by Software Command The module can be shut down by a software command. When a shutdown command is sent, the module goes into the Finalization state and at the end of the finalization process shuts down PWRMON. The duration of the finalization state can differ according to the current situation of the module, so a value cannot be defined.
LE920A4 HW User Guide Doc#: 1VV0301261 5.3.2. Hardware Commands Turning off the Module Shutdown by ON/OFF Pad To turn off the module, the ON/OFF pad must be asserted low for at least 2.5 seconds and then released. Use the same circuitry and timing for power-on. When the hold time of ON/OFF is above 2.5 seconds, the module goes into the Finalization state and in the end shuts down PWRMON.
LE920A4 HW User Guide Doc#: 1VV0301261 5.3.3. Hardware Commands Turning off the Module Unconditional Hardware Shutdown via SHDN Pad To unconditionally shut down the module, the SHDN_N pad must be tied low for at least 200 milliseconds and then released.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Commands Unconditional Hardware Reset Unconditional Hardware Reset To unconditionally restart the module, the RESET_N pad must be asserted low for a period of 500-2000 milliseconds and then released. Figure 9 shows a simple circuit for this action.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Commands Powering OFF the Module Powering OFF the Module Powering OFF the module should be done gracefully allowing the module to complete all ongoing and pending tasks while properly handling all memory buffers. In the case where a complete power supply shut down is needed, the following procedure should be followed: 1. Perform HW shut down as described in section 5.3 2. Wait for HW Shut down procedure to complete (monitor PWRMON pin) 3.
LE920A4 HW User Guide Doc#: 1VV0301261 6. Power Supply Power Supply Requirements Power Supply The power supply circuitry and board layout are very important parts of the full product design, with critical impact on the overall product performance. Read the following requirements and the guidelines carefully to ensure a good and proper design. Power Supply Requirements The module’s power requirements are as follows: Table 18: Power Supply Requirements Nominal supply voltage 3.
LE920A4 HW User Guide Doc#: 1VV0301261 Mode LTE (22 dBm) Power Supply Power Supply Requirements Average (Typ.
LE920A4 HW User Guide Doc#: 1VV0301261 Power Supply General Design Rules NOTE: In GSM/GPRS mode, RF transmission is not continuous, but is packed into bursts at a base frequency of about 216 Hz with relative current peaks as high as about 2.0A. Therefore, the power supply must be designed to withstand these current peaks without big voltage drops. This means that both the electrical design and the board layout must be designed for this current flow.
LE920A4 HW User Guide Doc#: 1VV0301261 Power Supply General Design Rules Figure 11 shows an example of a linear regulator with 5V input. Figure 11: Linear Regulator with 5V Input 6.2.1.2. + 12V Input Source Power Supply Design Guidelines The desired output for the power supply is 3.8V. Due to the big difference between the input source and the desired output, a linear regulator is unsuitable and must not be used.
LE920A4 HW User Guide Doc#: 1VV0301261 Power Supply General Design Rules Figure 12 and Figure 13 show an example of a switching regulator with 12V input. Figure 12: Example of Switching Regulator with 12V Input – Part 1 Figure 13: Example of Switching Regulator with 12V Input – Part 2 Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 6.2.1.3. Power Supply General Design Rules Battery Source Power Supply Design Guidelines The desired nominal output of the power supply is 3.8V, and the maximum allowed voltage is 4.2V. Hence, a single 3.7V Li-Ion cell battery type is suitable for powering the module. WARNING: Do not use any Ni-Cd, Ni-MH, and Pb battery types directly connected to the module. Their use can lead to overvoltage on the module and damage it. Use only Li-Ion battery types.
LE920A4 HW User Guide Doc#: 1VV0301261 Power Supply General Design Rules NOTE: The thermal design for the power supply must be made keeping an average consumption at the maximum transmitting level during calls of LTE/HSPA/GPRS plus average consumption in GPS Tracking mode.
LE920A4 HW User Guide Doc#: 1VV0301261 Power Supply General Design Rules For this reason, while a voltage drop of 300-400 mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application does not have audio interface but only uses the data feature of the module, this noise is not so disturbing, and the power supply layout design can be more forgiving.
LE920A4 HW User Guide Doc#: 1VV0301261 7. Antenna(s) GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements Antenna(s) Antenna connection and board layout design are the most important parts in the full product design, and they have a strong influence on the product’s overall performance. Read carefully and follow the requirements and the guidelines for a good and proper design.
LE920A4 HW User Guide Antenna(s) Doc#: 1VV0301261 GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines Furthermore, if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC approval requirements: NOTE: This device is to be used only for mobile and fixed application.
LE920A4 HW User Guide Antenna(s) Doc#: 1VV0301261 GSM/WCDMA/TD-SCDMA/LTE Antenna – Installation Guidelines GSM/WCDMA/TD-SCDMA/LTE Antenna – Installation Guidelines Install the antenna in a location with access to the network radio signal. The antenna must be installed such that it provides a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. The antenna must not be installed inside metal cases.
LE920A4 HW User Guide Doc#: 1VV0301261 Antenna(s) GPS/GNSS Antenna Requirements GPS/GNSS Antenna Requirements The module supports an active antenna. It is recommended to use antennas as follows: An external active antenna (17dB typ. Gain, GPS only) An external active antenna plus GNSS pre-filter (17dB typ. Gain) NOTE: The external GNSS pre-Filter is required for the GLONASS application.
LE920A4 HW User Guide Doc#: 1VV0301261 Antenna(s) GPS/GNSS Antenna Requirements Table 23: Antenna Line on PCB Requirements Characteristic impedance 50 Ohm Max attenuation 0.3 dB Avoid coupling with other signals. Cold End (Ground Plane) of the antenna must be equipotential to the module’s ground pads. Furthermore, if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC requirements. This device is to be used only for mobile and fixed application. 7.5.4.
LE920A4 HW User Guide Doc#: 1VV0301261 8. Hardware Interfaces GPS/GNSS Antenna Requirements Hardware Interfaces Table 24 summarizes all the hardware interfaces of the module. Table 24: Hardware Interfaces SGMII For Ethernet PHY support Ethernet Control For controlling an external Ethernet PHY HSIC x1 SDIO x2 (for SD/MMC card and for WLAN) USB USB2.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces USB Port USB Port The module includes a Universal Serial Bus (USB) transceiver, which operates at USB high-speed (480 Mbits/sec). It can also operate with USB full-speed hosts (12 Mbits/sec). It is compliant with the USB 2.0 specification and can be used for control and data transfers as well as for diagnostic monitoring and firmware update. The USB port is typically the main interface between the module and OEM hardware.
LE920A4 HW User Guide Doc#: 1VV0301261 8.1.1. Hardware Interfaces HSIC Interface (Optional) USB OTG support In order to support USB OTG, an additional 5V power supply as well as some additional connectivity should be added externally.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces Ethernet Connectivity (optional) Ethernet Connectivity (optional) Ethernet connectivity can be optionally added to LE920A4 by adding an external PHY. PHY connectivity uses SGMII interface for Data and a few additional signals for PHY control. Further details can be found at 8.3.1.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces Serial Ports NOTE: ETH_INT_N is a 1.8V input. It has an internal pull up to 1.8V inside the module thus it should be connected to an open drain interrupt pin of the Ethernet PHY. In case the PHY does not support 1.8V I/O, proper level shifter needs to be used. Serial Ports The serial port is typically a secondary interface between the module and OEM hardware.
LE920A4 HW User Guide Doc#: 1VV0301261 8.4.1. Hardware Interfaces Serial Ports Modem Serial Port 1 Serial Port 1 is a +1.8V UART with all 8 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces Serial Ports NOTE: To avoid a back-powering effect, it is recommended to avoid any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE: For minimum implementations, only the TXD and RXD lines must be connected. The other lines can be left open provided a software flow control is implemented. NOTE: According to V.
LE920A4 HW User Guide Doc#: 1VV0301261 8.4.2. Hardware Interfaces Serial Ports Modem Serial Port 2 Serial Port 2 is a +1.8V UART with Rx and Tx signals only. Table 28 lists the signals of Serial Port 2. Table 28: Modem Serial Port 2 Signals PAD Signal I/O AB19 TXD_AUX O AD19 RXD_AUX I Function Type Auxiliary UART (Tx Data to DTE) 1.8V Auxiliary UART (Rx Data to DTE) 1.
LE920A4 HW User Guide Doc#: 1VV0301261 8.4.3. Hardware Interfaces Serial Ports RS232 Level Translation To interface the module with a PC COM port or an RS232 (EIA/TIA-232) application, a level translator is required. This level translator must perform the following actions: Invert the electrical signal in both directions Change the level from 0/1.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces Serial Ports Figure 15: RS232 Level Adaption Circuitry Example NOTE: In this case, the length of the lines on the application must be taken into account to avoid problems in the case of High-speed rates on RS232. The RS232 serial port lines are usually connected to a DB9 connector as shown in Figure 16. Signal names and directions are named and defined from the DTE point of view. Figure 16: RS232 Serial Port Lines Connection Layout Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces Peripheral Ports Peripheral Ports In addition to the serial ports, the module supports the following peripheral ports: SPI – Serial Peripheral Interface I2C – Inter-Integrated Circuit SD/MMC Card Interface SDIO Interface 8.5.1. SPI – Serial Peripheral Interface The module’s SPI supports the following: Master mode only 1.8V CMOS level Up to 50 MHz clock rate NOTE: SPI is supported only on the Linux side.
LE920A4 HW User Guide Doc#: 1VV0301261 8.5.2. Hardware Interfaces Peripheral Ports I2C - Inter-integrated Circuit The module supports an I2C interface on the following pins: Table 30: I2C Signals PAD Signal I/O Function Type C14 I2C_SCL O I2C Clock 1.8V D13 I2C_SDA I/O I2C Data 1.8V Comments The I2C interface is used for controlling peripherals inside the module (such as codec, etc.). The I2C can also be used externally by the end customer application.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces Peripheral Ports Table 31 lists the module’s SD card signals. Table 31: SD Card Signals PAD Signal I/O Function Type Comments AH17 SD/MMC_CMD I/O SD command 1.8/2.95V AD17 SD/MMC_CLK O SD card clock 1.8/2.95V Y17 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V AF17 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V AB17 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V W17 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces Peripheral Ports NOTE: SD/MMC is supported only on the Linux side. The VMMC supply is limited to 50 mA max and can be used only to supply the MMC card external pull-up resistors. Pull-up resistors must be placed on the host application board. The card detection input has an internal pull-up resistor. NOTE: The power supply to the SD/MMC card VCC is to be provided by the Host application board.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces Audio Interface Ref 7: Antenna Detection Application Note Table 32: WiFi (SDIO) Control Interface PAD Signal I/O Function Type AB3 WiFi_SD_CMD I/O WiFi SD Command 1.8V AM3 WiFi_SD_CLK O WiFi SD Clock 1.8V AD3 WiFi_SD_DATA0 I/O WiFi SD Serial Data 0 1.8V AF3 WiFi_SD_DATA1 I/O WiFi SD Serial Data 1 1.8V AH3 WiFi_SD_DATA2 I/O WiFi SD Serial Data 2 1.8V AK3 WiFi_SD_DATA3 I/O WiFi SD Serial Data 3 1.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces Audio Interface PAD Signal I/O Function Type E2 EAR2_MT+ AO Earphone Signal Output 2, phase + Analog D1 EAR2_MT- AO Earphone Signal Output 2, phase - Analog C2 MIC2_MT+ AI Mic Signal Input 2, phase + Analog B1 MIC2_MT- AI Mic Signal Input 2, phase - Analog Comment For more details, refer to Ref 5: Digital Voice Interface_Application_Note.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces Audio Interface Table 35: MIC Bias Specification (Pin G6) Parameter Voltage Conditions Load = 1 mA Min Typ Max 1.5V 1.525V 1.55V Max current 2 mA @217 Hz 85 dB @10 kHz 81 dB PSRR Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 8.6.2.2. Hardware Interfaces Audio Interface Analog Output Characteristics Table 36: EAR Output Characteristics (Valid for both EAR1 and EAR2) Parameter Conditions Output impedance Max power output Min Typ 16Ω 32Ω 30 mW 52 mW Max THD < 1% f = 1 kHz Differential mode, RL = 16Ω Max power output THD < 1% 32 mW f = 1 kHz Differential mode, RL = 32Ω Differential mode Full-scale output Single-ended mode 1 VRMS 0.
LE920A4 HW User Guide Doc#: 1VV0301261 8.6.3. Hardware Interfaces Audio Interface Digital Audio The module can be connected to an external codec through the digital interface. The product provides a single Digital Audio Interface (DVI) on the following pins: Table 37: Digital Audio Interface (DVI) Signals PAD Signal D11 DVI_WA0 C8 I/O Function Type COMMENT O Digital Audio Interface (WA0) B-PD 1.8V PCM_SYNC/I2S WS DVI_RX I Digital Audio Interface (RX) B-PD 1.
LE920A4 HW User Guide Doc#: 1VV0301261 8.6.3.1. Hardware Interfaces Audio Interface Short Frame Timing Diagrams Figure 19: Primary PCM Timing Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces Audio Interface Table 38: PCM_CODEC Timing Parameters Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 8.6.3.2. Hardware Interfaces Audio Interface Long Frame Timing Diagrams Figure 20: Auxiliary PCM Timing Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces Audio Interface Table 39: AUX_PCM_CODEC Timing Parameters Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces General Purpose I/O General Purpose I/O The general-purpose I/O pads can be configured to act in three different ways: Input Output Alternate function (internally controlled) Input pads can only be read and report digital values (high or low) present on the pad at reading time. Output pads can only be written to or queried and set the value of the pad output.
LE920A4 HW User Guide Doc#: 1VV0301261 Hardware Interfaces General Purpose I/O NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. 8.7.1. Using a GPIO Pad as Input GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.
LE920A4 HW User Guide Doc#: 1VV0301261 9. Miscellaneous Functions Indication of Network Service Availability Miscellaneous Functions Indication of Network Service Availability The STAT_LED pin status shows information on the network service availability and call status. In the module, the STAT_LED usually needs an external transistor to drive an external LED.
LE920A4 HW User Guide Doc#: 1VV0301261 Miscellaneous Functions VAUX Power Output VAUX Power Output A regulated power supply output is provided to supply power to small devices from the module. This output is active when the module is ON and goes OFF when the module is shut down. The operating range characteristics of the supply are as follows: Table 42: Operating Range – VAUX Power Supply Output voltage Output current Typical Max 1.75V 1.80V 1.
LE920A4 HW User Guide Doc#: 1VV0301261 Miscellaneous Functions ADC Converter ADC Converter 9.4.1. Description The module provides three 8-bit Analog to Digital converters. Each ADC reads the voltage level applied on the relevant pin, converts it, and stores it into an 8-bit word. Table 43 shows the ADC characteristics. Table 43: ADC Parameters Min Max Units 0.1 1.7 Volt AD conversion - 8 bits Resolution - 7 mV Input voltage range 9.4.2.
LE920A4 HW User Guide Doc#: 1VV0301261 Miscellaneous Functions Fuel Gauge (optional) Fuel Gauge (optional) The module can optionally support an external Fuel Gauge solution. In this case, an external IC that is capable of measuring the current flow in and out of the module must be added on the carrier board. Figure 23 shows an example of a typical connectivity of such an external fuel gauge to the module. Detailed design - TBD Figure 23: Fuel Gauge Connectivity Example Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 Miscellaneous Functions GNSS Characteristics GNSS Characteristics 9.7.1. Reciever performance Table 44 specifies the typical GNSS characteristics and expected performance. The values reflect typical environment and conditions. Table 44: GNSS Characteristics Typical Measurement Parameters Notes Standalone or MS-based tracking sensitivity -162.3 dBm Acquisition -157.5 dBm Cold start sensitivity -157.5 dBm Hot 1.1s GPS+GLONASS Simulator test Warm 22.
LE920A4 HW User Guide Board Doc#: 1VV0301261 10. Mounting the Module on Your General Mounting the Module on Your Board General The module is designed to be compliant with a standard Pb free soldering process. Finishing & Dimensions Figure 24 shows the mechanical dimensions of the module. Figure 24: Mechanical Dimensions Rev. 4.7.
LE920A4 HW User Guide Board Doc#: 1VV0301261 Mounting the Module on Your Recommended Foot Print for the Application Recommended Foot Print for the Application Figure 25 shows the recommended footprint for the application board (dimensions are in mm). To facilitate replacing the module if necessary, it is suggested to design the application board with a 1.5 mm placement inhibit area around the module.
LE920A4 HW User Guide Board Doc#: 1VV0301261 Mounting the Module on Your Stencil Stencil Stencil’s apertures layout can be the same as the recommended footprint (1:1). The suggested thickness of stencil foil is greater than 120 µm (~5mil). PCB Pad Design The solder pads on the PCB are recommended to be of the Non Solder Mask Defined (NSMD) type.
LE920A4 HW User Guide Board Doc#: 1VV0301261 Table 45: Recommendations for PCB Pad Surfaces Mounting the Module on Your Solder Paste Layer Thickness Finish Electro-less Ni / Immersion Au Properties (u-inch / um) Good solder ability protection, high shear force values, long shelf life 2 - 8 / 0.05 - 0.2 (ENIG) The PCB must be able to resist the higher temperatures that occur during the lead-free process. This issue should be discussed with the PCB supplier.
LE920A4 HW User Guide Board Doc#: 1VV0301261 Mounting the Module on Your Cleaning Profile Feature Pb-Free Assembly Tsmax to TL – Ramp-up rate 3°C/second max Time maintained above: – Temperature (TL) 217°C – Time (tL) 60-150 seconds Peak temperature (Tp) 245 +0/-5°C Time within 5°C of actual peak temperature (tp) 10-30 seconds Ramp-down rate 6°C/second max. Time 25°C to peak temperature 8 minutes max.
LE920A4 HW User Guide Doc#: 1VV0301261 11.
LE920A4 HW User Guide Doc#: 1VV0301261 Application Guide Bypass Capacitor on Power Supplies Bypass Capacitor on Power Supplies When a sudden voltage step is asserted to the module, or a sudden cut of the power supply occurs, the steep transition causes an overshoot or undershoot. This abrupt voltage transition can affect the device, causing it not to operate or to malfunction. Bypass capacitors are needed to alleviate this behaviour.
LE920A4 HW User Guide Doc#: 1VV0301261 Application Guide SIM Interface SIM Interface This section presents the recommended schematics for the design of SIM interfaces on the application boards. The module supports two external SIM interfaces. 11.3.1. SIM Schematic Example Figure 29 illustrates in particular how to design the application side and which values to assign the components.
LE920A4 HW User Guide Doc#: 1VV0301261 Application Guide EMC Recommendations EMC Recommendations All signals in the module are provided with some EMC protection. Nevertheless, the accepted level differs according to specific pin. Table 47 lists the characteristics.
LE920A4 HW User Guide Doc#: 1VV0301261 11.5.2. Application Guide Antenna Detection Recovery Boot Mode A Recovery Boot Download mode is used if a corrupted boot image was flashed into the device or if all other recovery modes failed. Recovery Boot Download mode is triggered by the WCI_RX signal (PAD AT2). Asserting this signal high (1.8V) during boot will force the system into Recovery Boot Download mode.
LE920A4 HW User Guide Doc#: 1VV0301261 12. Packing System Tray Packing System Tray The module can be packed on trays. The tray is JEDEC compliant, injection molded antistatic Modified Polyphenylene ether (MPPO). It has good thermal characteristics and can withstand a standard baking temperature of up to 125°C, thereby avoiding handling the modules if baking is required. The trays are rigid, thus providing mechanical protection against transport stress.
LE920A4 HW User Guide Doc#: 1VV0301261 Packing System Tray Each tray contains 24 pieces as shown in Figure 30. Figure 30: Tray Packing Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 Packing System Tray Figure 31: Packing Tray Drawing Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 Packing System Tape & Reel Tape & Reel The module can be packed on tape & reels of 200 pieces each. Figure 32: Module Positioning into the Carrier Figure 33: Carrier Tape Detail Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 Packing System Moisture Sensitivity Figure 34: Reel Detail Figure 35: Reel Box Detail Moisture Sensitivity The module is a Moisture Sensitive Device Level 3, in accordance with standard IPC/JEDEC J-STD-020. Observe all the requirements for using this kind of component. Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 13. Safety Recommendations Moisture Sensitivity Safety Recommendations READ CAREFULLY Be sure that the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and must be avoided in the following areas: Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion such as gasoline stations, oil refineries, etc.
LE920A4 HW User Guide Doc#: 1VV0301261 14. Conformity assessment issues FCC/ISED Regulatory notices Conformity assessment issues FCC/ISED Regulatory notices Modification statement Titan has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Titan n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature.
LE920A4 HW User Guide Doc#: 1VV0301261 Conformity assessment issues FCC/ISED Regulatory notices radiofréquence (RF) et RSS-102 de la fréquence radio (RF) ISED règles d'exposition. Gain de l'antenne doit être ci-dessous: Band GSM 850 EGPRS 850 PCS 1900 EGPRS 1900 WCDMA Band 2 WCDMA Band 4 WCDMA Band 5 FDD II FDD IV FDD V FDD VII FDD XII Freq [MHz] 850 850 1900 1900 1900 1700 850 1900 1700 850 700 700 Gain [dBi] 3.64 3.64 2.51 2.51 8.01 5.00 5.00 8.01 5.00 5.00 8.01 5.
LE920A4 HW User Guide Doc#: 1VV0301261 Conformity assessment issues Declaration of Conformity Declaration of Conformity Hereby, Titan declares that the radio equipment type LE920A4-EU is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: www.tustitan.com/RED Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 15.
LE920A4 HW User Guide Doc#: 1VV0301261 Acronyms Declaration of Conformity HSUPA High-Speed Uplink Packet Access I/O Input/Output I2C Inter-Integrated Circuit LTE Long Term Evolution MISO Master Input – Slave Output MOSI Master Output – Slave Input MRDY Master Ready PCB Printed Circuit Board RTC Real Time Clock SD Secure Digital SGMII Serial Gigabit Media-Independent Interface SIM Subscriber Identification Module SOC System-on-Chip SPI Serial Peripheral Interface SRDY Slave Rea
LE920A4 HW User Guide Doc#: 1VV0301261 Acronyms Declaration of Conformity VNA Vector Network Analyzer VSWR Voltage Standing Wave Radio WCDMA Wideband Code Division Multiple Access WCI Wireless Coexistence Interface Rev. 4.7.
LE920A4 HW User Guide Doc#: 1VV0301261 16. Document History Declaration of Conformity Document History Table 50: Document History Revision 4.7.1 Date 2019-11-21 Changes - Telit logo and “Telit” name were replaced to Titan. Section 14.1 - FCC ID and IC were updated from Telit to Titan. 4.7 2019-08-04 Section 2.7.1 – Change Sensitivity results from “Maximum” to “typical” and added TD-SCDMA in 3G section and TDD to 4G section. 4.6 2018-12-18 Section 8.
LE920A4 HW User Guide Doc#: 1VV0301261 Revision 4.2 Document History Declaration of Conformity Date 2017-11-23 Changes Section 2.7 – Renamed from Sensitivity to RF parameters and added TX output power section (2.7.2) Section 3.1 - Removed duplication of description related to USB_VBUS. Section 3.1 – Correct typo related to ETH_INT_N pin. Section 5.2 – Added clarification regarding ON_OFF. Section 7.5 – Added note related to GPS port and GPS LNA. Section 8.1 – Added clarification regarding VBUS supply.
LE920A4 HW User Guide Doc#: 1VV0301261 Revision 3.3 Document History Declaration of Conformity Date 2017-01-03 Changes Remove “Preliminary” label Section 1.5: Updated “Related Documents” table Section 2.3: Added more info on memory supported options Section 3.1: Added PHY control interface Section 3.3: Updated LGA “PinMap” Drawing Section 5.3.3: Added clarification about RESET_N usage Section 5.3.4: Added Figure for SHDN_N power down timing Section 8.1: Added info related to USB OTG Section 8.
LE920A4 HW User Guide Doc#: 1VV0301261 Revision 3.0 Document History Declaration of Conformity Date 2016-09-01 Changes Official Release; Merged and updated the Applicability table (p.2) based on previous Section 1.6 Section 1.5 : Updated the table of related documents Section 2.6.1 : Updated the table of RF bands Section 3.1 : Few updates in the table of pin-out Section 6.1 : Added voltage ripple requirement Section 6.1: Table 18 : Added current consumption values Section 9.
LE920A4 HW User Guide Doc#: 1VV0301261 Revision 2.2 Document History Declaration of Conformity Date 2016-04-12 Changes Official Release; Moved RoHS paragraph from 2.8.3 to 2.5.1 Sections 4.3 & 6.1: VBAT min is 3.4V (not 3.3V) Added Sec. 15.5 (now 9.5): Temperature Monitor Function 2.0 2016-03-23 Official Release; General update – Added Datasheet related sections Added Sec. 1.6: Product Variants Added Sec. 2.2: Applications Added Sec. 2.3: General Functionality Added Sec. 2.
