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Cinterion

5G M.2 Data Card

MV31-W

Hardware Interface Description

Version: 01.009a

DocId: MV31-W_HID_v01.009a

Summary of content (76 pages)

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Cinterion® 5G M.2 Data Card MV31-W Hardware Interface Description Version: DocId: 01.009a MV31-W_HID_v01.
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Cinterion® MV31-W Hardware Interface Description Page 2 of 76 2 Document Name: 5G M.2 Data Card MV31-W Version: 01.009a Date: 2022-04-27 DocId: MV31-W_HID_v01.009a Status Public / Preliminary Supported products: FR1 Sub 6 variants (See Section 1.1) GENERAL NOTE THIS DOCUMENT CONTAINS INFORMATION ON THALES PRODUCTS. THALES RESERVES THE RIGHT TO MAKE CHANGES TO THE PRODUCTS DESCRIBED HEREIN. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT THE DISCRETION OF THALES.
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Cinterion® MV31-W Hardware Interface Description Page 3 of 76 Contents 76 Contents 0 Document History ...................................................................................................... 7 1 Introduction ............................................................................................................... 11 1.1 Ordering Information ........................................................................................ 11 1.2 Related Documents ..............................
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Cinterion® MV31-W Hardware Interface Description Page 4 of 76 Contents 76 5 Operation ................................................................................................................... 44 5.1 Operating Modes ............................................................................................. 44 5.2 Operating Temperatures.................................................................................. 44 5.3 Thermal Design Guidelines.............................................
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Cinterion® MV31-W Hardware Interface Description Page 5 of 76 Tables 76 Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Table 20: Table 21: Table 22: Table 23: Table 24: Table 25: Table 26: Table 27: Table 28: Table 29: Table 30: Table 31: Table 32: Table 33: Table 34: Table 35: Table 36: t 5G Modem Card Variants ....................................................
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Cinterion® MV31-W Hardware Interface Description Page 6 of 76 Figures Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Figure 18: Figure 19: Figure 20: Figure 21: Figure 22: Figure 23: Figure 24: Figure 25: Figure 26: Figure 27: Figure 28: Figure 29: Figure 30: Figure 31: Figure 32: Figure 33: Figure 34: Figure 35: Figure 36: Figure 37: t 5G M.
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Cinterion® MV31-W Hardware Interface Description Page 7 of 76 0 Document History 10 0 Document History Preceding document: Cinterion® MV31-W Hardware Interface Description, Version 01.009 New document: Cinterion® MV31-W Hardware Interface Description, Version 01.009a Chapter What is new 2.3 Revised Figure 7 showing H2.3-S5 dimensions. 3.1 Updated electrical characteristics for FULL_CARD_POWER_OFF# (Table 3). 3.2.7 Updated Figure 13 to include second PCIe interface lane. 3.2.8.
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Cinterion® MV31-W Hardware Interface Description Page 8 of 76 0 Document History 10 Preceding document: Cinterion® MV31-W Hardware Interface Description, Version 00.058a New document: Cinterion® MV31-W Hardware Interface Description, Version 00.058b Chapter What is new 3.2.7.1 Revised description of PERST# signal 3.2.8 Added Figure 14 SIM Detection Circuit Preceding document: Cinterion® MV31-W Hardware Interface Description, Version 00.
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Cinterion® MV31-W Hardware Interface Description Page 9 of 76 0 Document History 10 Preceding document: Cinterion® MV31-W Hardware Interface Description, Version 00.050 New document: Cinterion® MV31-W Hardware Interface Description, Version 00.057 Chapter What is new 2.1, 3.1 Changed maximum supply voltage to 4.8V. 5.7 Revised Table 27 Summary of reliability test conditions. 6.2 Revised Table 38 EN-DC Configurations.
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Cinterion® MV31-W Hardware Interface Description Page 10 of 76 0 Document History 10 Preceding document: Cinterion® MV31-W Hardware Interface Description, Version 00.004 New document: Cinterion® MV31-W Hardware Interface Description, Version 00.005 Chapter What is new --- Removed information about FR2 bands. Preceding document: Cinterion® MV31-W Hardware Interface Description, Version 00.003 New document: Cinterion® MV31-W Hardware Interface Description, Version 00.
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Cinterion® MV31-W Hardware Interface Description Page 11 of 76 1 Introduction 75 1 Introduction This document1 describes the hardware of the Cinterion® 5G M.2 Data Card MV31-W product. It helps you quickly retrieve interface specifications, electrical and mechanical details, and information on the requirements to be considered for integrating further components. CAUTION: M.2 Add-in Card are not designed or intended to support Hot-Swap or Hot-Plug connections.
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Cinterion® MV31-W Hardware Interface Description Page 12 of 76 1.2 Related Documents 75 1.2 [1] [2] [3] [4] [5] [6] Related Documents MV31-W Release Note MV31-W Band Combination Configuration User Guide PCI Express® M.2 Specification, Revision 4.0, November 5, 2020, PCI-SIG PCI Express® Card Electromechanical Specification, Revision 1.1, March 28, 2005 Universal Serial Bus Specification1, Revision 2.0,April 27, 2000, USB.ORG Universal Serial Bus 3.2 Specification2 September 22, 2017, USB 3.
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Cinterion® MV31-W Hardware Interface Description Page 13 of 76 1.
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Cinterion® MV31-W Hardware Interface Description Page 14 of 76 2 Product Concept 75 2 Product Concept Figure 1 shows the top view and Figure 2 the bottom view of 5G M.2 Data Card MV31-W. Pin 75 Antenna LTE & Sub 6G RX/GPS L1 Mechanical ground pad Antenna LTE & Sub 6G RX/TX Antenna LTE & Sub 6G RX/GPS L5 Antenna LTE & Sub 6G RX/TX Pin 1 Figure 1: 5G M.2 Data Card MV31-W top view Pin 2 Pin 74 Figure 2: 5G M.2 Data Card MV31-W bottom view t MV31-W_HID_v01.
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Cinterion® MV31-W Hardware Interface Description Page 15 of 76 2.1 Key Features at a Glance 75 2.1 Key Features at a Glance Feature Implementation General Data throughput DL 3.88Gbps (max. theoretical: 4.
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Cinterion® MV31-W Hardware Interface Description Page 16 of 76 2.1 Key Features at a Glance 75 Feature Implementation GNSS Dual-Frequency GNSS: GPS: L1; L5 GLONASS: G1 Beidou: B1 Galileo E1; E5a SIM Dual SIM with eSIM on board, Dual SIM Single Active (DSSA) Power supply 3.3V (typical, min. 3.14V,max. 4.8V) Temperature Normal operation: -30°C to +70°C Extended operation: -40°C to +85°C Storage: -40°C to +85°C Physical Dimensions: 42 mm × 30 mm × 2.6 mm Weight: approx.
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Cinterion® MV31-W Hardware Interface Description Page 17 of 76 2.2 System Overview 75 2.2 System Overview MV31 ANT0 PC / Power supply ANT1 eSIM (optional ) RF antennas ANT2 USB ANT3 Wireless Modem Application connector (75 pin) Connector socket (75 pin) PCIe UIM card holder (optional) SIM card holder Figure 3: 5G M.2 Data Card MV31-W system overview t MV31-W_HID_v01.
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Cinterion® MV31-W Hardware Interface Description Page 18 of 76 2.3 Mechanical Dimensions 75 2.3 Mechanical Dimensions The mechanical dimensions for PCI Express M.2 Cards with a 3042 form factor are specified in [3] and shown in Figure 4, Figure 5 and Figure 7. Figure 4: 5G M.2 Data Card MV31-W Dimensions Figure 5: 5G M.2 Data Card MV31-W Ground area (with gold plating) on bottom side Figure 6: 5G M.2 Data Card MV31-W bottom shield dimensions t MV31-W_HID_v01.
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Cinterion® MV31-W Hardware Interface Description Page 19 of 76 2.3 Mechanical Dimensions 75 The 5G M.2 Data Card MV31-W complies with the single-sided add-in card H2.3-S5: “Stackup Top Mount Single-sided Add-in Card for 2.00 Maximum Top-side Component Height and with Higher Clearance above Motherboard” specified in [3]. values in mm Figure 7: H2.3-S5 single-sided add-in card dimensions The area under the 5G M.
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Cinterion® MV31-W Hardware Interface Description Page 20 of 76 3 Application Connector Interface 75 3 Application Connector Interface 3.1 Pin Assignments and Electrical Description Table 2 matches the 5G M.2 Data Card MV31-W pin assignments at the 75-pin application connector to the pin assignments specified in [3]. Table 3 lists electrical characteristics of the assigned and available pins at the application connector interface. Table 2: Pin assignments Pin 5G M.2 Data Card No.
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Cinterion® MV31-W Hardware Interface Description Page 21 of 76 3.1 Pin Assignments and Electrical Description 75 Table 2: Pin assignments Pin 5G M.2 Data Card No. MV31-W pin name1 Comments PIN Type 1st PCIe® lane Rx+/-, Section 3.2.7 Input PCIe® Reference Clock, Section 3.2.7 Input 47 PERn0 49 PERp0 51 GND 53 REFCLKn 55 REFCLKp 57 GND 59 mmWave_Enable_1 Reserved for mmWave product variant Output 1.8V 61 mmWave_Enable_2 Reserved for mmWave product variant Output 1.
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Cinterion® MV31-W Hardware Interface Description Page 22 of 76 3.1 Pin Assignments and Electrical Description 75 Table 2: Pin assignments Pin 5G M.2 Data Card No. MV31-W pin name1 Comments PIN Type UIM_1 connect to external SIM socket, Section 3.2.8 Output 30 UIM_1_RESET 32 UIM_1_CLK 34 UIM_1_DATA Input/Output 36 UIM_1_PWR Output 38 WLAN_Tx_EN WLAN output to WWAN, Section 3.2.4 Input 1.8V 40 SIM DETECT_2 UIM_2 optionally available, Section 3.2.8 Input 1.
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Cinterion® MV31-W Hardware Interface Description Page 23 of 76 3.1 Pin Assignments and Electrical Description 75 Table 3: Electrical description of connector interface pins Function Pin name IO Signal form and level Power supply 3V3 I VImax = 4.8V VInorm = 3.3V VImin = 3.14V GND Control Sig- W_DISABLE1# nals W_DISABLE2# I I Comment Ground Application Ground VIHmax = 3.36V VIHmin = 2.145V VILmax = 1.
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Cinterion® MV31-W Hardware Interface Description Page 24 of 76 3.1 Pin Assignments and Electrical Description 75 Table 3: Electrical description of connector interface pins Function Pin name IO Signal form and level WWAN/ WiFi Coexistence Control LAA_n79_Tx_EN O VOLmax = 0.45V at I = TBD. VOHmin = 1.35V at I = TBD. VOHmax = 1.8V COEX_RXD I VILmax = 0.54V VIHmin = 1.26V VIHmax = 2.1V For future use. COEX_TXD O VOLmax = 0.45V at I = TBD. VOHmin = 1.35V at I = TBD. VOHmax = 1.
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Cinterion® MV31-W Hardware Interface Description Page 25 of 76 3.1 Pin Assignments and Electrical Description 75 Table 3: Electrical description of connector interface pins Function Pin name IO Signal form and level Comment PCIe® PERST# I RPU: 10K ohm VOHmax = NA VIHmax = 3.8V VIHmin = 2.0V VILmax = 0.8V This line must be driven low by an open drain or open collector driver connected to GND as long as the module turns off. A Low will immediately reset the PCIe interface of the data card.
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Cinterion® MV31-W Hardware Interface Description Page 26 of 76 3.1 Pin Assignments and Electrical Description 75 Table 3: Electrical description of connector interface pins Function Pin name IO Signal form and level Comment 1.8V SIM card interface (2x) UIM_1_RESET UIM_2_RESET O VOLmax = 0.36V at I = 1mA VOHmin = 1.44V at I = 1mA VOHmax = 1.8V UIM_1_DATA UIM_2_DATA I/O VILmax = 0.36V VILmin = -0.3V VIHmin = 1.26V VIHmax = 2.
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Cinterion® MV31-W Hardware Interface Description Page 27 of 76 3.2 Characteristics 75 3.2 Characteristics 3.2.1 Power Supply and Ground The 5G M.2 Data Card MV31-W uses the five 3V3 pins and 11 GND pins listed in Section 3.1. All pins have to be used in parallel. 3.2.2 Control Signals 3.2.2.1 W_DISABLE1#, W_DISABLE2# Signals W_DISABLE1# controls the WWAN part of the data card. When this signal is driven low, the WWAN part is disabled. W_DISABLE2# controls the GNSS part of the data card.
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Cinterion® MV31-W Hardware Interface Description Page 28 of 76 3.2 Characteristics 75 Wake up signal (SMS) MV 31-W Figure 8: Wake-up scenario The WAKE_ON_WWAN# signal is used to wake up the host. It is open drain and should be pulled up at the host side. When MV31-W needs to wake up the host, it will output a one second low pulse, shown in Figure 9. Figure 9: Wake-up signal A typical connection in Platform/System shows Figure 10. MV31‐W 100k WAKE_ON_WWAN# GPIO Platform PCIe Host 3.
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Cinterion® MV31-W Hardware Interface Description Page 29 of 76 3.2 Characteristics 75 3.2.3 Tunable Antenna Interface 3.2.3.1 Antenna Control MV31-W provides a MIPI interface (MIPI_DATA/RFFE2_DATA and MIPI_CLK/RFFE2_CLK) for external antenna tuner application to allow the implementation of antenna tuner solutions, e.g. with QAT3555 antenna impedance tuner (see Figure 11). Figure 11: Sample Antenna Tuner with QAT3555 for one antenna path 3.2.3.
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Cinterion® MV31-W Hardware Interface Description Page 30 of 76 3.2 Characteristics 75 3.2.4 WWAN/WiFi Coexistence Control The signals COEX_RXD, COEX_TXD, LAA_n79_Tx_EN and WLAN_Tx_EN are provided to allow the implementation of wireless coexistence solutions between the radio(s) on the M.2 Data Card and other off-card radio(s). These other radios can be located on another M.2 Card located in the same host platform or as alternate radio implementations.
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Cinterion® MV31-W Hardware Interface Description Page 31 of 76 3.2 Characteristics 75 3.2.6 USB Interface The 5G M.2 Data Card MV31-W has 6 interface lines for USB (see Figure 12) and is acting as peripheral. USB Design General Guidelines: • Reserve choke on all the USB signals in platform for noise debug. • Reserve 0.1uF capacitor on USB3.1 TX/Rx paths. • Co-layout USB3 choke and 0.1uF capacitor on module side for noise debug Notes: All the above components should be covered by shielding cover.
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Cinterion® MV31-W Hardware Interface Description Page 32 of 76 3.2 Characteristics 75 3.2.7 PCI Express® Interface The PCI Express® Interface with a 1st and 2nd lane is compliant to [4]. Please note that with the data card’s USB 3.1 hardware variant the PCIe’s 2nd lane pins are used as USB 3.1 interface pins. PCIe® Design General Guidelines: • All sensitive/high high-speed signals and circuits must be protected from PCIe® corruption, e.g. noisy signal, crosstalk and RF.
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Cinterion® MV31-W Hardware Interface Description Page 33 of 76 3.2 Characteristics 75 3.2.8 SIM/UICC Interface The 5G M.2 Data Card MV31-W provides a SIM/UICC interface at the 75-pin application connector compliant to the ISO/IEC 7816-3 specification. The SIM interface is intended for 1.8V and 3V SIM cards in accordance with GSM 11.12 Phase 2. The following table lists the pins available for the SIM/UICC interface. A second SIM interface is optionally available.
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Cinterion® MV31-W Hardware Interface Description Page 34 of 76 3.2 Characteristics 75 To avoid possible cross-talk from the UIM_1_CLK signal to the UIM_1_DATA signal, be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the UIM_1_DATA line from the UIM_1_CLK line. 3.2.8.
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Cinterion® MV31-W Hardware Interface Description Page 35 of 76 3.2 Characteristics 75 3.2.11 Status The LED_1# signal is provided to enable wireless communication add-in cards to provide status indications to users via system provided indicators. Table 9: Status States Signal State LED Interpretation Low ON Radio is capable of transmitting. High OFF Radio is incapable of transmitting. 3.
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Cinterion® MV31-W Hardware Interface Description Page 36 of 76 3.
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Cinterion® MV31-W Hardware Interface Description Page 37 of 76 4 Antenna Interface 75 4 Antenna Interface MV31-W also provides connectivity for off board antennas. The antennas and their connection interface for this device satisfy the requirements specified in [3]. The antenna elements are typically integrated into the notebook/ultra book /tablet and connected to MV31-W via flexible RF coaxial cables. MV31-W provides four RF connectors (MHF4 type).
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Cinterion® MV31-W Hardware Interface Description Page 38 of 76 4.1 Antenna Interface Specification 75 4.1 Antenna Interface Specification The below Table 13 and Table 14 list RF minimum Rx sensitivity specifications. Measurement conditions: Tamb= 25°C, V3V3 = 3.3V. Table 13: RF antenna interface LTE: Conductive minimum receiver input sensitivity (dBm) LTE band (BW: 10MHz ANT0 ANT1 ANT2 ANT3 MIMO Combined 1 -96 -97 -96 -96 -102.5 2 -96 -97 -95.5 -96 -102 3 -96 -96 -95.5 -96 -102.
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Cinterion® MV31-W Hardware Interface Description Page 39 of 76 4.1 Antenna Interface Specification 75 Table 14: RF antenna interface FR1 (Sub 6G): Conductive minimum receiver input sensitivity (dBm) 5G band1 ANT0 ANT1 ANT2 ANT3 MIMO Combined n1 -92 -91.5 -91.5 -92 -97 n2 -91.5 -91.5 -91.5 -91.5 -97 n3 -91.5 -91 -91 -91.5 -96.5 n5 -91.5 NA NA -91.5 -94 n7 -90.5 -90 -90 -90.5 -95.5 n8 -92.5 NA NA -92.5 -95.5 n12 -90 NA NA -90 -93 n20 -92.5 NA NA -92.
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Cinterion® MV31-W Hardware Interface Description Page 40 of 76 4.1 Antenna Interface Specification 75 Table 15 lists the frequency bands as well as the direction (TX/RX) supported by the four antenna interfaces. Table 15: Antenna interfaces1 Antenna TX. interface RX.
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Cinterion® MV31-W Hardware Interface Description Page 41 of 76 4.1 Antenna Interface Specification 75 Notes: The supported RF antenna directions and bands shown in the above Table 15 apply to the following scenarios, i.e., RF antenna vs band configurations: • LTE only, i.e., if using LTE bands only • 5G (FR1 (Sub 6G)) only, i.e.
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Cinterion® MV31-W Hardware Interface Description Page 42 of 76 4.1 Antenna Interface Specification 75 4.1.1 GNSS Interface Characteristics Table 16: GNSS properties Parameter Conditions Min. Typical Max. Frequency GPS Unit 1574.4 1166.22 1575.42 1176.45 1576.4 1186.68 GLONASS (G1) 1597.5 1601.7 1605.9 Beidou (B1) 1559.1 1561 1563.1 1573.4 1166.22 1575.42 1176.45 1577.5 11.86.68 50% CEP, open sky 1.7 2 m 90% CEP, open sky 1.
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Cinterion® MV31-W Hardware Interface Description Page 43 of 76 4.2 Antenna Interface Connector 75 4.2 Antenna Interface Connector 4.2.1 UMTS/LTE & Sub 6G Antenna Connectors Figure 18 and Figure 19 show the MHF4 type connectors for the UMTS/LTE & Sub 6G antennas. Figure 18: UMTS/LTE & Sub 6G Antenna Connector (male) Figure 19: UMTS/LTE & Sub 6G Antenna Connector (mated plug) t MV31-W_HID_v01.
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Cinterion® MV31-W Hardware Interface Description Page 44 of 76 5 Operation 75 5 Operation 5.1 Operating Modes TBD. 5.
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Cinterion® MV31-W Hardware Interface Description Page 45 of 76 5.3 Thermal Design Guidelines 75 5.3 Thermal Design Guidelines The MV31-W m.2 card temperature rises because electrical energy is turned into heat. Depending on the application itself and housing different methods are recommend to allow the card operate under ideal conditions. The actual temperature of the board depends on different factors such as the radio technology e.g.
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Cinterion® MV31-W Hardware Interface Description Page 46 of 76 5.3 Thermal Design Guidelines 75 5.3.1 Thermal Solutions MV31-W requires to be thermally coupled to the application PCB as well as the stepped EMI shielding to spread and thus mitigate the heat. To ensure an optimum heat spreading on the application PCB, the PCB should have a copper GND plane in each layer, and each layer should be thermally coupled by a large amount of vias.
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Cinterion® MV31-W Hardware Interface Description Page 47 of 76 5.3 Thermal Design Guidelines 75 Heat spot of th e M.2 card is below the lower shield. Allows internally thinner TIM with lower Rth Shield 2.6mm total height Heat sink +0.5mm Shield M.2 CON H2.3 S5 (Typ 2.25mm) +1.3mm Shield 0.8mm M.2 PCB IC IC RF PCB IC M.2 PCB (0.8mm) IC CON Screw TIM (typ. 0.3mm) Application/ System PCB (typ. 1.
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Cinterion® MV31-W Hardware Interface Description Page 48 of 76 5.3 Thermal Design Guidelines 75 Heat spot of th e M.2 card is below the lower shield. Allows internally thinner TIM with lo wer Rth 2.6mm total height Heat pipe Heat pipe +0.5mm Shield +1.3mm Shield 0.8mm M.2 PCB Shield M.2 CON H2.3 S5 (Typ 2.25mm) IC IC (0.8mm) M.2 PCB IC RF PCB IC CON Screw TIM (typ. 0.3mm) Application/ System PCB (typ. 1.
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Cinterion® MV31-W Hardware Interface Description Page 49 of 76 5.4 Power Supply Ratings 75 5.4 Power Supply Ratings The following tables provide sample power supply ratings for selected 4G/5G technologies including carrier aggregations (CA). As a general rule it is recommended to reserve at least 2500mA for the module to be able to handle peak current consumption under all conditions. Table 19 lists selected LTE (4G) power supply ratings at various conditions.
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Cinterion® MV31-W Hardware Interface Description Page 50 of 76 5.4 Power Supply Ratings 75 Table 19: LTE current consumption ratings Description IBATT+1 Average LTE supply current Conditions Unit mA Band Tx power (dBm) Channel Band 12 1dBm 23095 (M) 314 23.4dBm 23060 (L) 581 23.3dBm 23095 (M) 591 23.4dBm 23130 (H) 599 1dBm 23230 (M) 314 23.4dBm 23230 (M) 742 1dBm 23330 (M) 311 23.4dBm 23330 (M) 596 1dBm 23790 (M) 308 23.4dBm 23780 (L) 613 23.
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Cinterion® MV31-W Hardware Interface Description Page 51 of 76 5.4 Power Supply Ratings 75 Table 19: LTE current consumption ratings Description IBATT+1 Average LTE supply current Conditions Unit mA Band Tx power (dBm) Channel Band 28 1dBm 27410 (M) 316 23.5dBm 27260 (L) 656 23.4dBm 27410 (M) 575 23.4dBm 27610 (H) 544 1dBm 27710 (M) 397 22.2dBm 27710 (M) 953 1dBm 36275 (M) 297 23.3dBm 36250 (L) 379 23.3dBm 36275 (M) 377 23.
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Cinterion® MV31-W Hardware Interface Description Page 52 of 76 5.4 Power Supply Ratings 75 Table 19: LTE current consumption ratings Description IBATT+1 Average LTE supply current Conditions Typical rating Band Tx power (dBm) Channel Band 66 1dBm 132422 (M) 376 23.2dBm 132022 (L) 23.5dBm 132422 (M) 965 22.8dBm 132622 (H) 940 1dBm 133297 (M) 321 23.4dBm 133172 (L) 23.3dBm 133297 (M) 557 23.
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Cinterion® MV31-W Hardware Interface Description Page 53 of 76 5.4 Power Supply Ratings 75 Table 20: EN-DC current consumption ratings Description IBATT+ 1 Average EN-DC (FDD) supply current Conditions EN-DC Tx power (dBm) Channel DC_B20-n3 LTE=0dBm NR=0dBm Data transfer measured @minimum and @maximum Pout for mid (M) band DC_B5-n2 channels and NR throughout=319Mbps DC_B12-n7 DC_B12-n66 349500(M) Typical rating Unit 410 mA LTE=0dBm NR=23dBm 1180 LTE=23dBm NR=17.
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Cinterion® MV31-W Hardware Interface Description Page 54 of 76 5.5 Timing Sequence Requirement 75 5.5 Timing Sequence Requirement 5.5.1 Power On Timing Requirement • Requirements: - +3.3V power should be stable earlier than Full_Card_Power_Off - Compliance with PCI Express® Card Electromechanical Specification Figure below shows the M.2 adapter power-up sequence for an adapter from the system power rail.
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Cinterion® MV31-W Hardware Interface Description Page 55 of 76 5.5 Timing Sequence Requirement 75 tPr VBAT_3.3V Full_Card_Power Off# ton1 PECLK ton2 PERST# Figure 27: Power on timing diagram Table 23: Power On information Symbol Minimum value Note tPr 10ms Keep 3.3V power supply before Full_Card_Power_Off# assert. There is no tPr if the power supply is always ready. ton1 150µs Keep PCIe_CLK stable before PERST# is inactive.
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Cinterion® MV31-W Hardware Interface Description Page 56 of 76 5.5 Timing Sequence Requirement 75 5.5.2 • • Power Off Timing Requirement The platform should follow the requirement when the device power is Off by M.2 PIN#6 and when Windows enters S4 and S5. Device Power Off by M.2 PIN#6 (Full_Card_Power_Off): - For Windows10: Platform performs M.
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Cinterion® MV31-W Hardware Interface Description Page 57 of 76 5.5 Timing Sequence Requirement 75 - For Linux: Estimate Software optimization with a minimum power off period. PC MV31‐W M.2 PIN#6 Full_Card_Power_Off If in online mode, put to LPM system(“sync;sync;sync”); There is no CID_MBIM_MSHOSTSHUTDOWN between PC and MV31‐W on Linux. In order to get the power time, it has to be tested on Linux first. system(“sys_shutdown”); Figure 29: Device power off behavior for Linux t MV31-W_HID_v01.
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Cinterion® MV31-W Hardware Interface Description Page 58 of 76 5.5 Timing Sequence Requirement 75 5.5.3 Power Off Timing VBAT_3.
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Cinterion® MV31-W Hardware Interface Description Page 59 of 76 5.5 Timing Sequence Requirement 75 5.5.4 Warm Boot Restart Timing VBAT_3.
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Cinterion® MV31-W Hardware Interface Description Page 60 of 76 5.5 Timing Sequence Requirement 75 BIOS is needed to enable the PCIe® root port D3cold capability. Host Device Set PMCSR.
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Cinterion® MV31-W Hardware Interface Description Page 61 of 76 5.
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Cinterion® MV31-W Hardware Interface Description Page 62 of 76 5.6 Electrostatic Discharge 75 5.6 Electrostatic Discharge The 5G M.2 Data Card MV31-W is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a 5G M.2 Data Card MV31-W module.
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Cinterion® MV31-W Hardware Interface Description Page 63 of 76 5.7 Reliability Characteristics 75 5.7 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Table 27: Summary of reliability test conditions Type of test Conditions Standard Shock Test (Non-operating) Amplitude: 400G, Waveform: 1/2 sine, 2 msec duration, Repetition: 6 times / each axis DIN IEC 60068-2-27 Vibration (Non Operating) Sinusoidal Amplitude: 3.
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Cinterion® MV31-W Hardware Interface Description Page 64 of 76 5.8 Mounting Advice 75 5.8 Mounting Advice Maximum force to the top shielding: 30 N Maximum bending: 0,315 mm (0,75% of 42 mm) Figure 34: Mounting Advice t MV31-W_HID_v01.
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Cinterion® MV31-W Hardware Interface Description Page 65 of 76 5.9 Approval Information 75 5.9 Approval Information The 5G M.2 Data Card MV31-W has been type approved. The reference setup submitted to type approve the MV31-W consisted of the following components: MV31-W, PC as MMI, Power Supply. Approval of mobile computing platforms containing 5G M.2 Data Card MV31-W can therefore be based on the existing module approval together with this document as appropriate technical documentation. 5.9.
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Cinterion® MV31-W Hardware Interface Description Page 66 of 76 5.9 Approval Information 75 Table 30: Standards of European type approval Draft ETSI EN 301 489-17 ElectroMagnetic Compatibility (EMC) standard for radio equipment and serV3.2.3 vices; Part 17: Specific conditions for Broadband Data Transmission Systems; Harmonised Standard for ElectroMagnetic Compatibility Draft EN 301 489-19 V2.2.
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Cinterion® MV31-W Hardware Interface Description Page 67 of 76 5.9 Approval Information 75 Table 33: Standards of the Ministry of Information Industry of the People’s Republic of China SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06). SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).
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Cinterion® MV31-W Hardware Interface Description Page 68 of 76 5.9 Approval Information 75 5.9.2 IEC 62368-1 Classification With respect to the safety requirements for audio/video, information and communication technology equipment defined by the hazard based product safety standard for ICT and AV equipment - i.e., IEC-62368-1 (EN 62368-1) - Cinterion® modules are classified as shown below: Standalone operation of the modules is not possible.
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Cinterion® MV31-W Hardware Interface Description Page 69 of 76 5.9 Approval Information 75 5.9.3 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable 5G M.
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Cinterion® MV31-W Hardware Interface Description Page 70 of 76 5.9 Approval Information 75 5.9.4 Reference Equipment for Type Approval The Thales reference setup submitted to type approve 5G M.2 Data Card MV31-W is shown in the following figure1: LTE / GSM Base Station ANT3 ANT2 ANT1 ANT0 Power Supply SMA SMA MV31‐W PC USB3.0 eSIM SMA SMA 5G Modem Adapter Board Figure 35: Reference equipment for type approval 1.
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Cinterion® MV31-W Hardware Interface Description Page 71 of 76 5.9 Approval Information 75 5.9.5 Compliance with FCC and ISED Rules and Regulations The Equipment Authorization Certification for the Thales reference application described in Section 5.9.
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Cinterion® MV31-W Hardware Interface Description Page 72 of 76 5.10 Safety Precaution Notes 75 5.10 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating 5G M.2 Data Card MV31-W.
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Cinterion® MV31-W Hardware Interface Description Page 73 of 76 6 Appendix 75 6 Appendix 6.1 Product Label Information The label engraved1 on the top of MV31-W comprises the following information. S 1 2 4 3 6 7 9 11 5 8 10 Figure 36: Sample Label of MV31-W Table 36: 5G M.2 Data Card MV31-W label information No.
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Cinterion® MV31-W Hardware Interface Description Page 74 of 76 6.2 Packaging 75 6.2 Packaging 6.2.1 Trays MV31-W is shipped in 5 x 2 ESD trays (dimensions: 229 x 152 x 15mm), pictured in Figure 37. Module orientation can be seen in Figure 37. All modules shall follow the same orientation in the tray. Figure 37: 5x2 Tray t MV31-W_HID_v01.
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Cinterion® MV31-W Hardware Interface Description Page 75 of 76 6.3 Declaration of Conformity 75 6.3 Declaration of Conformity TBD. t MV31-W_HID_v01.
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