Cinterion® EHS6 Hardware Interface Overview Version: DocId: 04.000 EHS6_HIO_v04.000 M2M.GEMALTO.
Cinterion® EHS6 Hardware Interface Overview Page 2 of 39 2 Document Name: Cinterion® EHS6 Hardware Interface Overview Version: 04.000 Date: 2019-03-05 DocId: EHS6_HIO_v04.000 Status Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS.
Cinterion® EHS6 Hardware Interface Overview Page 3 of 39 Contents 39 Contents 1 Introduction ................................................................................................................. 6 1.1 Key Features at a Glance .................................................................................. 6 1.2 EHS6 System Overview..................................................................................... 9 2 Interface Characteristics ...........................................
Cinterion® EHS6 Hardware Interface Overview Page 4 of 39 Tables 111 Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Signals of the SIM interface (SMT application interface) ............................... GPIO lines and possible alternative assignment............................................ Return loss in the active band........................................................................ Overview of operating modes ........
Cinterion® EHS6 Hardware Interface Overview Page 5 of 39 Figures 111 Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: EHS6 system overview .................................................................................... 9 USB circuit ..................................................................................................... 10 Serial interface ASC0.....................................................................................
Cinterion® EHS6 Hardware Interface Overview Page 6 of 39 1 Introduction 9 1 Introduction This document1 describes the hardware of the Cinterion® EHS6 module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.
Cinterion® EHS6 Hardware Interface Overview Page 7 of 39 1.
Cinterion® EHS6 Hardware Interface Overview Page 8 of 39 1.1 Key Features at a Glance 9 Feature Implementation Interfaces Module interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and allows the use of an optional module mounting socket. For more information on how to integrate SMT modules see also [3].
Cinterion® EHS6 Hardware Interface Overview Page 9 of 39 1.2 EHS6 System Overview 9 Feature Implementation Evaluation kit Evaluation module EHS6 module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75. DSB75 DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter is required to connect the EHS6 evaluation module to the DSB75. 1.
Cinterion® EHS6 Hardware Interface Overview Page 10 of 39 2 Interface Characteristics 21 2 Interface Characteristics EHS6 is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 USB Interface EHS6 supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant.
Cinterion® EHS6 Hardware Interface Overview Page 11 of 39 2.1 Application Interface 21 2.1.2 Serial Interface ASC0 EHS6 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITUT V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). EHS6 is designed for use as a DCE.
Cinterion® EHS6 Hardware Interface Overview Page 12 of 39 2.1 Application Interface 21 2.1.3 Serial Interface ASC1 Four EHS6 GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). EHS6 is designed for use as a DCE.
Cinterion® EHS6 Hardware Interface Overview Page 13 of 39 2.1 Application Interface 21 2.1.4 UICC/SIM/USIM Interface EHS6 has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards.
Cinterion® EHS6 Hardware Interface Overview Page 14 of 39 2.1 Application Interface 21 The figure below shows a circuit to connect an external SIM card holder. V180 CCIN CCVCC SIM 220nF 1nF CCRST CCIO CCCLK Figure 5: External UICC/SIM/USIM card holder circuit The total cable length between the SMT application interface pads on EHS6 and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.
Cinterion® EHS6 Hardware Interface Overview Page 15 of 39 2.
Cinterion® EHS6 Hardware Interface Overview Page 16 of 39 2.1 Application Interface 21 2.1.7 I2C Interface I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-directional line.
Cinterion® EHS6 Hardware Interface Overview Page 17 of 39 2.1 Application Interface 21 2.1.10 PWM Interfaces The GPIO6 and GPIO7 interface lines can be configured as Pulse Width Modulation interface lines PWM1 and PWM2. The PWM interface lines can be used, for example, to connect buzzers. The PWM1 line is shared with GPIO7 and the PWM2 line is shared with GPIO6 (for GPIOs see Section 2.1.6). GPIO and PWM functionality are mutually exclusive. 2.1.
Cinterion® EHS6 Hardware Interface Overview Page 18 of 39 2.2 RF Antenna Interface 21 2.2 RF Antenna Interface The RF interface has an impedance of 50. EHS6 is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, modulation accuracy and harmonic suppression.
Cinterion® EHS6 Hardware Interface Overview Page 19 of 39 2.2 RF Antenna Interface 21 2.2.1 Antenna Installation The antenna is connected by soldering the antenna pad (ANT_GSM, i.e., pad #59) and its neighboring ground pads (GND, i.e., pads #58 and #60) directly to the application’s PCB. The antenna pad is the antenna reference point (ARP) for EHS6. All RF data specified throughout this document is related to the ARP.
Cinterion® EHS6 Hardware Interface Overview Page 20 of 39 2.3 Sample Application 21 2.3 Sample Application Figure 6 shows a typical example of how to integrate a EHS6 module with an application. Usage of the various host interfaces depends on the desired features of the application. Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided, for example reverse current from high state external control lines.
Cinterion® EHS6 Hardware Interface Overview Page 21 of 39 2.3 Sample Application 21 VDDLP Main Antenna GND RF OUT GND AUTO_ON / ON EMERG_RST 100k RESET 150 µF, Low ESR! VDDLP V180 BATT+RF VCORE PWR_IND 22k BATT+BB 53 33pF 204 Power supply 100k 50 µF, Low ESR! 4.7k 33pF EHS6 100k Blocking** Blocking** 4 4 8 3 2 GPIO20...GPIO23/ PCM (DAI) HSIC LPM/ GPIO16...GPIO19/ ASC1/ SPI ASC0 (including GPIO1...
Cinterion® EHS6 Hardware Interface Overview Page 22 of 39 3 Operating Characteristics 23 3 Operating Characteristics 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 4: Overview of operating modes Mode Function Normal GSM / operation GPRS / UMTS / HSPA SLEEP Power saving set automatically when no call is in progress and the USB connection is suspended by host or not present and no active communication via ASC0.
Cinterion® EHS6 Hardware Interface Overview Page 23 of 39 3.2 Power Supply 23 3.2 Power Supply EHS6 needs to be connected to a power supply at the SMT application interface - 2 lines BATT+, and GND. There are two separate voltage domains for BATT+: • BATT+BB with a line for the general power management. • BATT+RF with a line for the GSM power amplifier supply. Please note that throughout the document BATT+ refers to both voltage domains and power supply lines - BATT+BB and BATT+RF.
Cinterion® EHS6 Hardware Interface Overview Page 24 of 39 4 Mechanical Dimensions, Mounting and Packaging 25 4 Mechanical Dimensions, Mounting and Packaging 4.1 Mechanical Dimensions of EHS6 Figure 7 shows the top and bottom view of EHS6 and provides an overview of the board's mechanical dimensions. For further details see Figure 8. Product label Top view Bottom view Figure 7: EHS6– top and bottom view EHS6_HIO_v04.
Cinterion® EHS6 Hardware Interface Overview Page 25 of 39 4.1 Mechanical Dimensions of EHS6 25 Figure 8: Dimensions of EHS6 (all dimensions in mm) EHS6_HIO_v04.
Cinterion® EHS6 Hardware Interface Overview Page 26 of 39 5 Regulatory and Type Approval Information 32 5 Regulatory and Type Approval Information 5.1 Directives and Standards EHS6 is designed to comply with the directives and standards listed below.
Cinterion® EHS6 Hardware Interface Overview Page 27 of 39 5.1 Directives and Standards 32 Table 7: Standards of European type approval ETSI EN 301 908-1 V11.1.1 IMT cellular networks; Harmonised Standard covering the essential requirements of article 3.2 of the Directive 2014/53/EU; Part 1: Introduction and common requirements ETSI EN 301 908-2 V11.1.2 IMT cellular networks; Harmonised Standard covering the essential requirements of article 3.
Cinterion® EHS6 Hardware Interface Overview Page 28 of 39 5.1 Directives and Standards 32 Table 10: Toxic or hazardous substances or elements with defined concentration limits EHS6_HIO_v04.
Cinterion® EHS6 Hardware Interface Overview Page 29 of 39 5.2 SAR requirements specific to portable mobiles 32 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy.
Cinterion® EHS6 Hardware Interface Overview Page 30 of 39 5.3 Reference Equipment for Type Approval 32 5.
Cinterion® EHS6 Hardware Interface Overview Page 31 of 39 5.4 Compliance with FCC and ISED Rules and Regulations 32 5.4 Compliance with FCC and ISED Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M reference application described in Section 5.
Cinterion® EHS6 Hardware Interface Overview Page 32 of 39 5.4 Compliance with FCC and ISED Rules and Regulations 32 Notes (ISED): (EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Cinterion® EHS6 Hardware Interface Overview Page 32 of 39 6 Document Information 36 6 Document Information 6.1 Revision History Preceding document: "Cinterion® EHS6 Hardware Interface Overview" Version 02.770 New document: "Cinterion® EHS6 Hardware Interface Overview" Version 04.000 Chapter What is new 1.1; 2.1.2; 2.1.3 Update the bit rate range for ASC0 and ASC1. 5.1 Update Table 6 and Table 7 regarding versions of standards. 7.1 Update Table 11 regarding ordering numbers. 5.
Cinterion® EHS6 Hardware Interface Overview Page 33 of 39 6.3 Terms and Abbreviations 36 Abbreviation Description BTS Base Transceiver Station CB or CBM Cell Broadcast Message CE Conformité Européene (European Conformity) CHAP Challenge Handshake Authentication Protocol CPU Central Processing Unit CS Coding Scheme CSD Circuit Switched Data CTS Clear to Send DAC Digital-to-Analog Converter DAI Digital Audio Interface dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.
Cinterion® EHS6 Hardware Interface Overview Page 34 of 39 6.
Cinterion® EHS6 Hardware Interface Overview Page 35 of 39 6.3 Terms and Abbreviations 36 Abbreviation Description RoHS Restriction of the use of certain hazardous substances in electrical and electronic equipment.
Cinterion® EHS6 Hardware Interface Overview Page 36 of 39 6.4 Safety Precaution Notes 36 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating EHS6. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.
Cinterion® EHS6 Hardware Interface Overview Page 37 of 39 7 Appendix 38 7 Appendix 7.
Cinterion® EHS6 Hardware Interface Overview Page 38 of 39 7.1 List of Parts and Accessories 38 Table 12: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A.
39 About Gemalto Since 1996, Gemalto has been pioneering groundbreaking M2M and IoT products that keep our customers on the leading edge of innovation. We work closely with global mobile network operators to ensure that Cinterion® modules evolve in sync with wireless networks, providing a seamless migration path to protect your IoT technology investment.
