Datasheet

1
FEATURES APPLICATIONS
1
6
Ch2_Out
2
5
V
CC
3
Ch1_Out
GND
Ch1_In
4
Ch2_In
DESCRIPTION/ORDERING INFORMATION
TPD2S017
www.ti.com .......................................................................................................................................................................................... SLLS949 – SEPTEMBER 2009
2-CHANNEL ULTRA-LOW CLAMP VOLTAGE ESD SOLUTION
WITH SERIES-RESISTOR ISOLATION
• Hi-Speed USB
• Ultra-Low Clamp Voltage Ensures the
Protection of Ultra-Low Voltage Core Chipset
• IEEE 1394 Interface
During ESD Events
• Low-Voltage Differential Signaling (LVDS)
• Exceeds ESD Protection to IEC61000-4-2
• Mobile Display Digital Interface (MDDI)/Mobile
Industry Processor Interface (MIPI)
(Level 4)
• HS Signal
• Matching of Series Resistor (R =1 Ω ) of ± 8 m Ω
(Typical)
DBV PACKAGE
• Differential Channel Input Capacitance
(TOP VIEW)
Matching of 0.02 pF (Typical)
• High-Speed Data Rate and EMI Filter Action at
High Frequencies ( – 3 dB Bandwidth, ≈ 3 GHz)
• Available in 6-Pin Small-Outline Transistor
[SOT (DBV)] Package
• Flow-Through Single-In-Line Pin Mapping for
the High-Speed Lines Ensures no Additional
Board Layout Burden While Placing the ESD
Protection Chip Near the Connector
The TPD2S017 provides a robust system-level ESD solution for the high-speed lines interfacing low-voltage,
ESD-sensitive core chipset. This device offers two stage ESD clamps in each line with ≈ 1- Ω series resistor
isolation. This architecture allows the device to generate very low clamp voltage during system level ESD strikes.
Due to the series resistor component, the TPD2S017 provides a controlled filter roll-off for even greater spurious
EMI suppression and signal integrity. This device offers a flow-through pin mapping for ease of board layout. The
monolithic silicon technology allows matching component values, including clamp capacitance, series resistor
matching, etc., between the differential signal pairs. Tight matching of the line capacitance and series resistors
ensure that the differential signal distortion due to added ESD clamp remains minimal, and also allow the part to
operate at high-speed differential data rate (in excess of 1.5 Gbps).
The TPD2S017 confirms the IEC61000-4-2 (Level 4) ESD protection and ± 15 kV HBM ESD protection. This
device is offered in space saving DBV packages.
The TPD2S017 is characterized for operation over ambient air temperature of – 40 ° C to 85 ° C.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
– 40 ° C to 85 ° C SOT (SOT-23) – DBV Reel of 3000 TPD2S017DBVR NFTF
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.