TM Technology for Innovators Interface Selection Guide 4Q 2006
➔ Interface Selection Guide Table of Contents Introduction 3 LVDS, xECL, CML . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Multipoint-LVDS (M-LVDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Digital Isolators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 RS-485/422 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction 3 ➔ Interface Selection Guide Texas Instruments (TI) provides complete interface solutions that empower you to differentiate your products and accelerate time-to-market. Our expertise in high-speed, mixed-signal circuits, system-on-a-chip integration and advanced product development processes ensures you will receive the silicon, support tools, software and technical documentation to create and deliver the best products on time and at competitive prices.
LVDS, xECL, CML 4 ➔ Design Considerations Signaling Rate — TI offers repeaters/translators and crosspoint switches with signaling rates up to 4.0 Gbps. Jitter — Reducing jitter, the deviation of a signal timing event from its ideal position, has become a priority for ensuring reliability in high-speed data buses. Skew — Excessive skew, the time delta between the actual and expected arrival constant current driver delivers about 3.5 mA to a 100-W load.
LVDS, xECL, CML 5 ➔ LVDS/LVPECL/CML Repeaters/Translators and Crosspoints Selection Guide Device1 Description Crosspoint Switch Family SN65LVCP22 2X2 Crosspoint Switch: LVDS Outputs SN65LVCP23 2X2 Crosspoint Switch: LVPECL Outputs SN65LVCP40 Dual 1:2 Mux with Equalizer and Pre-Emphasis SN65LVDS1222 2X2 Crosspoint Switch: LVDS Output SN65LVDS2502 4X4 Crosspoint Switch: LVDS Output Repeaters/Translators SN65CML100 LVDS/LVPECL/CML-to-CML Repeater/Translator SN65LVDS1002 LVDS/LVPECL/CML to LVDS Repeater/Trans
LVDS, xECL, CML 6 ➔ LVDS Selection Guide Input Signal Output Signal Signaling Rate (Mbps) — 1 1 1 LVTTL LVDS LVDS, LVTTL LVDS, LVTTL LVDS LVTTL LVTTL, LVDS LVTTL, LVDS 630 400 400 400 — — — — 1.7 1.7 1.7 1.7 2 — 2 2 2 — 2 2 2 2 LVTTL LVDS LVDS, LVTTL LVDS, LVTTL LVDS, LVTTL LVDS LVTTL LVTTL, LVDS LVDS, LVTTL LVDS, LVTTL 400 400 400 400 400 800 1000 100 — — 1.7 — 1.3 1.7 1.7 Transceiver with 2.
LVDS, xECL, CML 7 ➔ LVDS Selection Guide Rx tpd Typ (ns) ICC Max (mA) ESD HBM (kV) Supply Voltage (V) Pin/Package(s) SN65LVDS1 SN65LVDS21 SN65LVDS179 SN65LVDS180 Dual Family — 2.6 3.7 3.7 8 7 12 12 15 15 12 12 3.3 3.3 3.3 3.3 8SOIC, 5SOP 8SOIC, 5SOP 8SOIC, 8VSSOP 14SOIC, 14TSSOP 0.47 0.47 1.35 1.35 SN65LVDS9638 SN65LVDS9637 SN65LVDS049 SN65LVDS050 SN65LVDS051 SN65LVDS1050 SN65LVDS22 Quad Family — 2.1 1.9 3.7 3.7 3.7 4 13 10 35 20 20 20 20 8 8 10 12 12 12 12 3.3 3.3 3.3 3.3 3.3 2.7 3.
Multipoint-LVDS (M-LVDS) ➔ M-LVDS Features • TIA/EIA-899 standard • Driver output current • 11.3 mA vs. 3.5 mA (LVDS) • Receiver thresholds • 50 mV vs. 100 mV (LVDS) • Driver edge rate control • 1 ns min allows ease-of-stub design • Contention provisions • Driver short circuit limited to 43 mA • Drivers, receivers and disabled devices must limit their bus voltage from 0 to 2.
Multipoint-LVDS (M-LVDS) 9 ➔ M-LVDS Selection Guide Device1 SN65MLVD2 SN65MLVD3 SN65MLVD200A SN65MLVD201 SN65MLVD202A SN65MLVD203 SN65MLVD204A SN65MLVD205A SN65MLVD206 SN65MLVD207 SN65MLVD047 No. of Tx — — 1 1 1 1 1 1 1 1 4 No.
Digital Isolators ➔ Design Considerations Technical Information Reliability — Best-in-class, high voltage and functional reliability with > 25 years. The ISO72xx is a family of digital isolators using the industry’s first application of digital capacitive isolation technology. Digital buffers capacitively couple data signals through a silicone-dioxide (SiO2) insulation barrier which provides galvanic isolation of up to 4000 V.
RS-485/422 11 ➔ Design Considerations Interoperability — In general, RS-485 is a superset of RS-422. Compliance with the TIA/EIA standard will ensure reliable data communication in a variety of networks, including Modbus, INTERBUS, PROFIBUS, BACnet and a variety of proprietary protocols. Robustness — RS-485 is a robust interface standard for use in industrial environments. It features a wide common mode range of –7 V to 12 V. Parts from TI are available with ESD protection up to 30 kV.
RS-485/422 12 ➔ RS-485/422 Selection Guide 3/3 3/3 Triple 2/2 Full-Duplex 1/1 Half-Duplex No. of Dr/Rx 0/4 0/4 Quad-Receivers 4/0 Quad-Drivers 4/0 Supply (V) Enables DE, RE DE, RE 3.3 DE, RE DE, RE 3 to 5 5 DE, RE DE, RE DE, RE DE, RE DE, RE DE, RE DE, RE DE, RE DE, RE 5 DE, RE DE, RE DE, RE DE, RE DE, RE DE, RE DE, RE DE, RE DE, RE DE, RE No No No No 3.
RS-232 13 ➔ RS232: IEC6100-4-2 (Level 4) ESD-Protected Devices TI offers new RS-232 devices with systemlevel IEC61000-4-2 electrostatic discharge (ESD) protection. This protection makes the RS-232 interface immune to damage from ESD strikes that may occur while the system is up and running, such as when a connection to the RS-232 cable is made.
RS-232 ➔ RS232 Selection Guide Device MAX3223E MAX3222E SN75C3222E SN65C3222E SN75C3223E SN65C3223E MAX3238E MAX3221E SN65C3221E SN75C3221E MAX3237E ADM2209E MAX232E MAX202E MAX207E MAX208E MAX3386E Data Rate (kbps) 500 500 1000 1000 1000 1000 400 250 1000 1000 1000 960 120 120 120 120 250 Drivers 2 2 2 2 2 2 5 1 1 1 5 10 2 2 5 4 3 Receivers 2 2 2 2 2 2 3 1 1 1 3 6 2 2 3 4 2 SN65C3232E SN75C3232E MAX211E MAX3227E MAX3232E MAX3243E MAX3318E MAX213 MAX202 MAX207 MAX208 MAX211 MAX222 MAX3221 MAX3223 M
RS-232 15 ➔ RS-232 Selection Guide (Continued) Device SN75C1406 SN75C185 SN75C188 TL145406 GD65232 GD75232 GD75323 LT1030 MAX3222 MC1488 MC1489 MC1489A SN65C1154 SN65C1406 SN65C3222 SN75154 SN751701 SN75186 SN75189 SN75189A SN752232 SN75C1154 SN75C189 SN75C189A SN75C198 SN75C3222 SN75LBC187 SN75LBC241 UA9636A UC5170C UC5180C UC5181C Data Rate (kbps) 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 Drivers 3 3 4 3 3 3 5 4 2 4
UARTs (Universal Asynchronous Receiver/Transmitters) ➔ Design Considerations preventing system bottlenecks. When a fast external modem is used, designers should be sure the computer’s UART can handle the modem’s maximum transmission rate. For example, the TL16C550D UART contains a 16-byte buffer, enabling it to support higher sustained transmission rates than the older 8250 UART.
UARTs (Universal Asynchronous Receiver/Transmitters) 17 ➔ UART Selection Guide Device Channel(s) FIFOs Voltage (V) Characterized Temp. (°C) Package(s) Price* Description Universal Asynchronous Receiver/Transmitters (UARTs) TL16C2550 2 16-Byte 1.8/2.5/3.3/5 –40 to 85 TL16C2552 TL16C2752 TL16C450 TL16C451 TL16C452 TL16C550C 2 2 1 1 2 1 16-Byte 64-Byte None None None 16-Byte 1.8/2.5/3.3/5 1.8/2.5/3.3/5 5 5 5 3.3/5 –40 to 85 — 0 to 70 0 to 70 0 to 70 –40 to 85 TL16C550D 1 16-Byte 2.5/3.
CAN (3.3-V and 5-V High-Speed CAN Transceivers) 18 ➔ Design Considerations Bus Protection — Features such as short-circuit protection, thermal shutdown protection, glitch-free power-up and powerdown protection, high-ESD protection, wide common-mode range that provides for common-mode noise rejection, and currentlimiting circuitry to protect the transceivers and system from damage during a fault condition have been incorporated into these devices.
Flatlink™ 3G 19 ➔ FPC cabling typically interconnects the Serializer-Transmitter with the display. Compared to parallel signaling, FlatLink 3G outputs significantly reducing the EMI of the interconnect by over 20 dB. The electromagnetic emission of the device itself is very low and meets the SAE J1752/3 ‘M’-specification. FlatLinkTM 3G – Display SerDes for Mobile Phones FlatLink 3G uses low EMI subLVDS to carry 24-bit color RGB data from applications processors, such as OMAP™ from TI, to the LCD Driver.
SerDes (Serial Gigabit Transceivers and LVDS) ➔ The serial gigabit transceiver family of devices from TI provides low power dissipation while enabling multigigabit transmission over copper backplanes, cable and optical links. The transceivers can be used in a variety of applications, including Gigabit Ethernet, 10-Gigabit Ethernet modules, synchronous optical network (SONET) OC-48 and OC-192 based equipment, wireless infrastructure backplanes and general-purpose backplane applications.
SerDes (Serial Gigabit Transceivers and LVDS) 21 ➔ SerDes (Serial Gigabit Transceivers) Selection Guide Device General Purpose TLK1501 TLK2501 TLK2701 TLK2711 TLK3101 TLK2521 TLK1521 Function Data Rate Serial I/F1 Parallel I/F Power Special Features Price* Single-Ch. 16:1 SerDes Single-Ch. 16:1 SerDes Single-Ch. 16:1 SerDes Single-Ch. 16:1 SerDes Single-Ch. 16:1 SerDes Single-Ch. 18:1 SerDes Single-Ch. 18:1 SerDes Four-Ch. 18:1 Serdes Four-Ch. 18:1 Serdes Four-Ch. of 16:1 Xcvr 0.6-1.5 Gbps 1.6-2.
DVI/PanelBus™ 22 ➔ Design Considerations The Digital Visual Interface (DVI) Specification, is an industry standard developed by the Digital Display Working Group (DDWG) for high-speed digital connection to digital displays. DVI uses Transition-minimized DC balanced (TMDS) data signaling. Single link supports up to 165Mpixels/s – UXGA FPDs, SXGA DCRTs, 720p and 1080i HDTVs.
DVI/PanelBus™ 23 ➔ PanelBus™ HDCP Digital Receiver TI PanelBus™ Digital Transmitters TFP501, TFP503 TFP510, TFP513 Get datasheets at: www.ti.com/TFP501 or www.ti.com/TFP503 Get the datasheets and app reports at: www.ti.com/sc/device/TFP510 or www.ti.com/sc/device/TFP513 The TFP501 and TFP503 are TI PanelBus flat panel display products, part of a comprehensive family of end-to-end DVI 1.0-compliant solutions.
TMDS ➔ TMDS (for HDMI and DVI) Design Considerations Transition Minimized Differential Signaling (TMDS) is the electrical level standard used to transmit Digital Visual Interface (DVI) and High-Definition Multimedia Interface (HDMI) data. Intra-Pair Skew – The time difference between the true and complementary signals of a given differential pair should be kept as small as possible. ESD – External connectors being exposed to the outside world are especially susceptible to electrostatic discharge.
USB Hub Controllers and Peripheral Devices 25 ➔ Universal Serial Bus (USB) The USB standard defines a bus product that requires a host controller and enables plugand-play connectivity. The most recently released final specification, USB 2.0, defines high speed and allows complete backward compatibility with USB 1.1. USB products fall into three categories: hubs, host controllers and peripherals. USB 1.1 supported speeds of up to 12 Mbps and cables up to 5 meters long for these devices. USB 2.
USB Hub Controllers and Peripheral Devices ➔ USB Family of Products USB Devices USB Hub Controllers USB Peripherals USB OTG USB PHY TUSB3210 TUSB3410 TUSB6250 TUSB6020 TUSB1105 TUSB1106 TUSB2551 TUSB2036 TUSB2046B TUSB2077A TUSB2136 TUSB5052 Selection Guide Device Ports I2C Voltage (V) Package Description 2/3 4 7 1/2 1-5 No No No Yes Yes 3.3 3.3 3.3 3.3 3.
Universal Serial Bus (USB) Power Managers 27 ➔ Design Considerations USB High-Power Peripheral Switch With Dual Current Limit + LDO TPS2140/41/50/51—The TPS2140/41/50/51 target high-power USB peripherals such as ADSL modems. The devices contain a power switch and an LDO. The dual-current-limiting switch allows the use of high-value capacitance to stabilize the voltage from the USB bus.
Universal Serial Bus (USB) Power Managers 28 ➔ USB Power Managers Family of Products (Continued) USB High-Power Peripheral Bus Switch + LDO Device TPS2140 TPS2141 TPS2150 TPS2151 Switch Voltage 3.3 V 5.0 V 3.3 V 5.0 V TPS2140/41/50/51 TSSOP-14 Description 3.3-V, 500-mA switch with active-low enable, 250-mA LDO 5.0-V, 500-mA switch with active-low enable, 250-mA LDO 3.3-V, 500-mA switch with active-high enable, 250-mA LDO 5.
PCI Express ® 29 ➔ Design Considerations Device A Device B Device C PCI Express® takes the best features and ideas behind PCI and combines them with more than 10 years of industry “lessons learned.” The result is a robust, scalable, flexible, cost-effective I/O interconnect that will serve the industry for the next 10-15 years.
PCI Express® ➔ PCI Express® Bridge Chip XIO2000A Get samples, datasheets, EVMs and app reports at: www.ti.com/sc/device/XIO2000A TI’s PCI Express bridge chip, the XIO2000A, is an industry first. It is designed for seamless migration from the legacy PCI to the PCI Express interface. It bridges an x1 PCI Express bus to a 32-bit, 33/66-MHz PCI bus capable of supporting up to six PCI devices downstream. The XIO2000A fully supports PCI Express rates of 2.5 Gbps. Its architecture supports the PCI 2.
PCI Express® 31 ➔ x1 PCI Express® to 1394a OHCI Bridge XIO2200A 4-Lane, 4-Port PCI Express Switch XIO3130 Get samples, datasheets, EVMs and app reports at: www.ti.com/sc/device/XIO2200A www.ti.com/sc/pcl-e Key Features • x1 PCI Express Primary Interface • Supports two 1394a ports • Fully-Compliant with 1394 Open Host Controller Interface Specification, Revision 1.
PCI Express® 32 ➔ PCI Express PHY XIO1100 Get samples, datasheets, EVMs and app reports at: www.ti.com/sc/device/XIO1100 The XIO1100 is a PCI Express PHY, compliant with the PCI Express Base Specification Revision 1.1 that interfaces the PCI Express Media Access Layer (MAC) to a PCI Express serial link. It uses a modified version of the “PHY Interface for the PCI Express” (PIPE) interface also referred to as a TI-PIPE interface.
PCI Bridges 33 ➔ Design Considerations Peripheral Component Interconnect (PCI) is an interconnection system between a microprocessor and attached devices in which expansion slots are spaced closely for highspeed operation. A PCI-to-PCI bridge is a high-performance connection path between two PCI buses that allows bridge transactions to occur concurrently on both buses. Burstmode transfers maximize data throughput while the two bus traffic paths through the bridge act independently.
CardBus Power Switches ➔ TPS2211A • Fully integrated VCC and VPP switching for single-slot PC card interface • Low rDS(on) • 3.3-V low-voltage mode • Short-circuit and thermal protection • Compatible with 3.3-V, 5-V and 12-V PC cards Design Considerations ExpressCard Power Switches The TPS2231 and TPS2236 ExpressCard power interface switches provide the total power management solution required by the ExpressCard specification. The TPS2231 and TPS2236 ExpressCard power interface switches distribute 3.
Power Distribution (PCMCIA/CardBus Power Switches, Current-Limiting Power Switches and Power MUX ICs) 35 ➔ Selection Guide Device Number of FETs IOS (min) (A) rDS(on) (mΩ) VIN Range (V) Supply Current (µA) OC Logic Output OT Logic Output Enable Predecessor 30 30 30 30 33 33 33 33 33 70 70 70 70 80 80 80 70 70 70 70 80 80 80 80 80 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.
1394 (FireWire®) ➔ Overview IEEE 1394 high-speed interconnection enables simple, low-cost, high-bandwidth real-time data connectivity between many types of electronic equipment. As a multimedia network standard, 1394 is ideally suited for consumer electronics, computers and peripherals. It is also ideal for situations that benefit from true peer-to-peer operation and maximum flexibility.
1394 (FireWire®) 37 ➔ Technical Information (Continued) • Applications of the cable version are the integration of I/O connectivity of personal computers, peripherals, and consumer electronics using a low-cost, scalable, high-speed serial interface. The 1394 standard provides services such as realtime I/O and live connect/disconnect capability for devices including storage (HDD, CD-ROM, CDRW, MO, ZIP, RAID, SAN, etc.), printers, scanners, cameras, set-top boxes, HDTVs and camcorders.
1394 (FireWire®) ➔ IEEE 1394b 3-Port Cable Transceiver/Arbiter TSB81BA3D Get samples, datasheets and app reports at: www.ti.com/sc/device/TSB81BA3D Key Features • Compliant with IEEE 1394b-2002, IEEE 1394a-2000 and 1394-1995 standards • 3 Bilingual 1394 Ports • 1394b (Beta) Mode at s400 and s800 • 1394a (Data Strobe -DS) Mode at s100, s200 and s400 • Interoperable with link layer controllers using 3.3-V supplies and other 1394 PHYs using 1.8-V, 3.
GTLP (Gunning Transceiver Logic Plus) 39 ➔ Design Considerations Primary Speed — The speed of the GTLP family in parallel backplanes is 4x that of traditional logic. Optimized output edge-rate control (OEC™) circuitry allows clock frequencies in excess of 100 MHz in high-performance system backplane applications. Signal Integrity–TI-OPC™— Overshoot protection circuitry was designed specifically for the GTLP family and incorporated into the GTLP outputs.
GTLP (Gunning Transceiver Logic Plus) 40 ➔ GTLP Selection Guide Device SN74GTLP1394 SN74GTLP1395 SN74GTLP2033 SN74GTLP2034 SN74GTLP21395 SN74GTLP22033 SN74GTLP22034 SN74GTLP817 SN74GTLPH1612 SN74GTLPH1616 SN74GTLPH1627 SN74GTLPH1645 SN74GTLPH1655 SN74GTLPH16612 SN74GTLPH16912 SN74GTLPH16916 SN74GTLPH16927 SN74GTLPH16945 SN74GTLPH306 SN74GTLPH3245 SN74GTLPH32912 SN74GTLPH32916 SN74GTLPH32945 Description 2-Bit LVTTL-to-GTLP Adjustable-Edge-Rate Bus Xcvr w/ Split LVTTL Port, Feedback Path and Selectable Pol
VME 41 ➔ Design Considerations Technical Information Backward compatibility — The VMEH22501/A improves the performance up to 8X of the VMEbus™ without making changes to existing hardware. Full Live Insertion—This device is fully specified for live-insertion applications using IOFF, power-up 3-state and BIAS VCC. Standard Specification — The VMEH22501/A are referenced by the 2eSST VITA 1.5 spec as a device that provides excellent signaling at 40-Mbps data rate.
Clock Distribution Circuits ➔ Clock Selection by Speed and Signaling Type Clock Selection by Number of Outputs and Signaling Type Interface Selection Guide Texas Instruments 4Q 2006
Cross-Reference Guide 43 ➔ The following products have similar functionality: Part Number AGERE BDG1A BDG1A BDGLA BPNGA BRF1A BRF2A BRS2A BRS2B BTF1A AGILENT HDMP1636/1646 ALLEGRO A2525 A2526 A2535 A2536 TI Replacement TB5D1M TB5D2H TB5D2H TB5D1M TB5R1 TB5R1 TB5R2 TB5R2 TB5T1 TNETE2201B TPS2051A TPS2052A TPS2041A TPS2042A ANALOG DEVICES (ADI) ADM1485 SN75LBC176A* ADM1486 SN65HVD1176* ADM3485E SN75HVD10* ADM483E SN65HVD3082E ADM483E SN75LBC176A* ADM485 SN65HVD3085E* ADM485 SN65HVD485E* ADM485 SN75LBC176A
Cross-Reference Guide 44 ➔ The following products have similar functionality: TI Replacement Part Number LINEAR TECHNOLOGY CORP. (LTC) (cont.
Cross-Reference Guide 45 ➔ The following products have similar functionality: Part Number MICREL MIC2505 MIC2506 MIC2507 MIC2514 MIC2524 MIC2525 MIC2526 MIC2527 MIC2563A MIC2564A TI Replacement TPS2024/34 TPS2042A/52A TPS2044A/54A TPS210x TPS2044A/54A TPS2041A/51A TPS2042A/52A TPS2044A/54A TPS2205 TPS2216A NATIONAL SEMICONDUCTOR DS14185 SN75185* DS14196 SN75196 DS1487 SN75HVD06* DS1488 SN75188 DS1489 SN75189 DS14C232 MAX232 DS14C88 SN75C188 DS14C89A SN75C189A DS36276 SN75HVD05* DS3695 SN65HVD3088E* DS36
Cross-Reference Guide 46 ➔ The following products have similar functionality: Part Number PERICOM (cont.
Device Index 47 ➔ Device Page 175 . . . . . . . . . . . . . . .9, 12, 42 176B . . . . . . . . . . . . . . . . . .12 ADM2209E . . . . . . . . . . . . .14 ALS1177 . . . . . . . . . . . . . . .12 ALS1178 . . . . . . . . . . . . . . .12 ALS176 . . . . . . . . . . . . . . . .12 ALS180 . . . . . . . . . . . . . . . .12 CDC208 . . . . . . . . . . . . . . . .42 CDC2351 . . . . . . . . . . . . . . .42 CDC2536 . . . . . . . . . . . . . . .42 CDC2582 . . . . . . . . . . . . . . .42 CDC2586 . . . . . . . . . . . . .
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