ion s CC3235MODSF SimpleLink™ Wi-Fi® and IoT Solution With MCU LaunchPad™ Hardware TI Co nf ide nt ia l– ND A Re str ict User's Guide Literature Number: SWRU548A February 2019
Contents 1 Introduction ......................................................................................................................... 6 ........................................................................................ 6 1.2 LAUNCHCC3235MOD Key Features ................................................................................. 7 1.3 What's Included .......................................................................................................... 7 1.4 REACH Compliance ....
www.ti.com 3.2 CAN ICES-3(B) and NMB-3(B) Certification and Statement ...................................................... 50 3.3 End Product Labeling .................................................................................................. 51 3.4 Device Classifications .................................................................................................. 51 3.5 FCC Definitions ....................................................................................................
User's Guide SWRU548A – February 2019 CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD) str ict ion s Start your design with the industry's first programmable FCC, IC/ISED, ETSI/CE, and MIC Certified SimpleLinkTM Wi-Fi® CC3235MOD Dual-Band Wireless Microcontroller Module with built-in DualBand (2.4 GHz and 5 GHz) Wi-Fi® connectivity.
www.ti.com TI Co nf ide nt ia l– ND A Re str ict ion s Figure 1.
Introduction www.ti.com 1 Introduction 1.1 CC3235MODSF LaunchPad™ Created for the Internet of Things (IoT), the SimpleLink CC3235MODx is a wireless module with built-in Dual-Band Wi-Fi connectivity for the LaunchPad ecosystem, which integrates a high-performance Arm® Cortex®-M4 MCU and lets customers develop an entire application with one device. With on-chip Wi-Fi, Internet, and robust security protocols, no prior Wi-Fi experience is required for fast development.
Introduction www.ti.com LAUNCHCC3235MOD Key Features • • • • 1.3.1 ion s ict Kit Contents • • • 1.3.2 CC3235MODSF LaunchPad development tool (LAUNCHCC3235MOD) Micro USB cable Quick start guide Software Examples • 1.4 str What's Included l– 1.3 Re • • A • • • • • • • The LAUNCHCC3235MOD SimpleLink LaunchPad includes the following features: CC3235MODSF, SimpleLinkTM Dual-Band Wi-Fi® module solution – Integrated MCU – 40.0-MHz Crystal – 32.
Introduction 1.5 www.ti.com Regulatory Compliance Certifications in Process Indoor Usage Restrictions: The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range. BE BG HR CY CZ DK EE FI FR DE EL HU IE IT LV LT LU MT NL PL PT RO SK SI ES SE UK ion s 1.6 AT First Steps: Out-of-Box Experience 1.6.1 ict An easy way to get started with the EVM is by using its preprogrammed out-of-box experience code.
Introduction www.ti.com With the onboard XDS110 debug probe, debugging and downloading new code is simple. A USB connection between the EVM and a PC through the provided USB cable is all that is needed. 1.8 Trademarks TI Co nf ide nt ia l– ND A Re str ict ion s SimpleLink, Texas Instruments, LaunchPad, BoosterPack, Code Composer Studio are trademarks of Texas Instruments. Arm, Cortex are registered trademarks of Arm Limited. IAR Embedded Workbench is a registered trademark of IAR Systems AB.
Hardware 2 www.ti.com Hardware Figure 2 shows the CC3235MODSF LaunchPad EVM. TI Co nf ide nt ia l– ND A Re str ict ion s Figure 2.
Hardware www.ti.com 2.1 Block Diagram Figure 3 shows a functional block diagram of the CC3235MODx module. Figure 3. CC3235MODx Functional Block Diagram CC323 5 40 MHz RF_ANT1 32.768 kHz WRF_BGN F 5 GHz SPDT nReset Aba nd F str WRF_A PM Re 2.3 V to 3.
Hardware www.ti.com Figure 4 shows a functional block diagram of the LAUNCHCC3235MOD SimpleLink LaunchPad. Figure 4. LAUNCHCC3235MOD Functional Block Diagram Acc BMA280 FTDI FT2232D and SWD Circuit JTAG and SWD INT (GPIO13) UART (Flashing) I 2C Temperature Sensor TMP116 ion s USB Connector CC3235MODSF12MOBR VCC str Reverse Protection Re Two AA Battery Connectors ict LDO 3.
Hardware www.ti.com Hardware Features • • • 2.2.1 ion s • • CC3235MODSF, SimpleLinkTM Dual-Band Wi-Fi® module solution with integrated MCU 40-pin LaunchPad™ standard that leverages the BoosterPack™ ecosystem TI Standard XDS110-based JTAG emulation with serial port for flash programming Supports both 4-wire JTAG and 2-wire SWD Two buttons and a RGB LED for user interaction Virtual COM port UART through USB on PC Onboard chip antenna with U.
Hardware Wi-Fi network processor subsystem: – Wi-Fi® core: • 802.11 a/b/g/n 2.4 GHz and 5 GHz • Modes: • Access Point (AP) • Station (STA) • Wi-Fi Direct® (only supported on 2.4 GHz) • Security: • WEP • WPA™/WPA2™ PSK • WPA2 Enterprise – Internet and application protocols: • HTTPs server, mDNS, DNS-SD, DHCP • IPv4 and IPv6 TCP/IP stack • 16 BSD sockets (fully secured TLS v1.2 and SSL 3.
Hardware ict TI Co nf ide nt ia l– • ND • A Re • Power-Management Subsystem: – Integrated DC/DC converters support a wide range of supply voltage: • VBAT wide-voltage mode: 2.3 V to 3.6 V • VIO is always tied with VBAT – Advanced low-power modes: • Shutdown: 1 µA, hibernate: 5.5 µA • Low-power deep sleep (LPDS): 120 µA • Idle connected (MCU in LPDS): 710 µA • RX traffic (MCU active): 59 mA • TX traffic (MCU active): 223 mA – Wi-Fi TX Power • 2.4 GHz: 16.5 dBm at 1 DSSS • 5 GHz: 15.
Hardware 2.2.2 www.ti.com XDS110-Based Onboard Debug Probe To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard debug probe, which eliminates the need for expensive programmers. The CC3235MODSF LaunchPad has the XDS-110-based debug probe (see Figure 5), which is a simple and low-cost debugger that supports nearly all TI Arm device derivatives. TI Co nf ide nt ia l– ND A Re str ict ion s Figure 5.
Hardware www.ti.com 2.2.3 Debug Probe Connection: Isolation Jumper Block The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from the XDS110 domain into the CC3235MOD target domain. This includes JTAG signals, application UART signals, and 3.3-V and 5-V power.
Hardware 2.2.4 www.ti.com Application (or "Backchannel") UART The board supports a USB-based virtual COM port, using the Tiva™ Arm® MCU. The LaunchPad is shipped with the UART lines from the CC3235MODSF connected to the UART on the Tiva MCU. The CC3235MODSF's UART can also be routed to the 20-pin connector for use as a GPIO or external UART. The selection is performed using jumpers on the board. Figure 6 shows the UART routed to USB COM port.
Hardware www.ti.com 2.2.5 JTAG Headers The headers are provided on the board to isolate the CC3235MOD from the onboard XDS110-based JTAG emulator. These jumpers are shorted by default when the board is shipped from TI. Figure 5 and Table 1 are for default configurations, and Figure 8 shows the external emulator connection. To connect an external emulator, remove the isolation block JTAG jumpers and place the external emulator on the JTAG IN connector.
Hardware 2.2.6 www.ti.com Using the XDS110 Debug Probe with a Different Target The XDS110 debug probe on the LaunchPad development kit can interface to most Arm® Cortex®-M devices, not just the onboard target CC3235MODSF device. This functionality is enabled by the J2 10-pin Cortex-M JTAG connector (see Figure 9) and a 10-pin cable, such as the FFSD-05-D-06.00-01-N (sold separately from the LaunchPad development kit). l– ND A Re str ict ion s Figure 9.
Hardware www.ti.com 2.2.7 Power Connections The board accommodates various power methods, including through the onboard XDS110 as well as external or BoosterPack plug-in module power (see Figure 10). TI Co nf ide nt ia l– ND A Re str ict ion s Figure 10.
Hardware 2.2.7.1 www.ti.com XDS110 USB Power The most common power-supply scenario is from USB through the XDS110 debugger. This provides 5-V power from the USB and also regulates this power rail to 3.3 V for XDS110 operation and 3.3-V to the target side of the LaunchPad development kit. Power from the XDS110 is controlled by jumper J101. When the board is powered from the USB connector, ensure that the jumpers are placed on the following headers, shown in Figure 11.
Hardware www.ti.com 2.2.7.2 BoosterPack Plug-in Module and External Power Supply Headers J19 and J20 are present on the board to supply external power directly when USB power is not available. Use the following precautions before using the board with an external power supply. 1. 2. 3. 4. Remove the USB cable. Ensure that jumpers are only placed on the headers shown in Figure 12. Use a jumper wire to connect VBAT and BRD. Plug in the external power supply on J20 with the correct polarity.
Hardware www.ti.com Table 2. External Supply Connections and Enable Jumpers (continued) 2.2.8 Reference Use Comments J26 LED EN If uninstalled, the LEDs connected to the GPIO are disabled; this can be used to enable low-power measurements. Reset Pullup Jumper Table 3 lists the reset pullup jumper. Table 3. Reset Pullup Jumper Comments RESET pullup Install this jumper to enable the pullup resistor on the nRESET pin of the device, when the board is powered from an external supply.
Hardware www.ti.com I2C Connection 2.2.10 The board features an accelerometer and a temperature sensor for the out-of-box demo. These are connected to the I2C bus, and can be isolated using the jumpers provided (shown as yellow jumpers J23 and J24 in Figure 13). A Re str ict ion s Figure 13. I2C Connections ND By removing J23 and J24, the accelerometer and the temperature sensors are isolated from the I2C bus.
Hardware 2.2.11 www.ti.com Sense on Power (SOP) The CC3235MODx device can be set to operate in four different modes based on the state of the sense on power (SOP) lines. The SOP lines are pins 23, 24, and 34 on the CC3235MODx module. Table 6 shows the state of the device and Figure 14 shows the SOP jumpers. Binary Value Function 100 Flash programming 000 Functional mode + 4-wire JTAG 001 Functional mode + SWD 010 Functional mode + flash ion s Table 6.
Hardware www.ti.com 2.2.12 Push-Buttons and LED Indicators Table 7 lists the push-button definitions. Table 7. Push-Button Definitions Use Comments SW1 RESET This is used to reset the CC3235MOD device. This signal is also output on the 20-pin connector to reset any external BoosterPack which may be stacked. The reset can be isolated using the RST jumper at the isolation block. SW2 GPIO_13 When pushed, GPIO_13 is pulled to VCC. SW3 GPIO_22 When pushed, GPIO_22 is pulled to VCC.
Hardware 2.5 www.ti.com BoosterPack™ Header Pin Assignment The BoosterPack header pinout specification is at Build Your Own BoosterPack. Also see the BoosterPack Pinout Standard. ion s The CC3235MODSF LaunchPad follows this standard, with the exception of naming. (P1:P4 is used instead of J1:J4.). See Figure 15 for the CC3235MODSF LaunchPad pin-mapping assignments and functions. TI Co nf ide nt ia l– ND A Re str ict Figure 15.
Layout Guidelines www.ti.com 3 Layout Guidelines The integrator of the CC3235MODx modules must comply with the PCB layout recommendations described in the following subsections to preserve and minimize the risk with regulatory certifications for FCC, ISED/IC, ETSI/CE, and MIC. Also, TI recommends that customers follow the guidelines described in this section to achieve similar performance. 3.1 LAUNCHCC3235MOD Board Layout The reference layout consists of a four-layer design.
Layout Guidelines www.ti.com Figure 17 shows the LAUNCHCC3235MOD first inner layer. TI Co nf ide nt ia l– ND A Re str ict ion s Figure 17.
Layout Guidelines www.ti.com Figure 18 shows the LAUNCHCC3235MOD second inner layer. TI Co nf ide nt ia l– ND A Re str ict ion s Figure 18.
Layout Guidelines www.ti.com Figure 19 shows the LAUNCHCC3235MOD bottom layer. TI Co nf ide nt ia l– ND A Re str ict ion s Figure 19.
Layout Guidelines www.ti.com 3.2 General Layout Recommendations Ensure that the following general layout recommendations are followed: • Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. • Do not run signal traces underneath the module on a layer where the module is mounted. 3.3 RF Layout Recommendations Figure 20 shows the RF placement and routing of the CC3235MODSF module. TI Co nf ide nt ia l– ND A Re str ict Figure 20.
Layout Guidelines www.ti.com Use the following RF layout recommendations for the CC3235MODx module: • RF traces must have 50-Ω impedance. • RF trace bends must be made with gradual curves, and 90 degree bends must be avoided. • RF traces must not have sharp corners. • There must be no traces or ground under the antenna section. • RF traces must have via stitching on the ground plane beside the RF trace on both sides. • RF traces must be as short as possible.
Layout Guidelines www.ti.com 3.4 Antenna Placement and Routing The antenna is the element used to convert the guided waves on the PCB traces to the free space electromagnetic radiation. The placement and layout of the antenna are the keys to increased range and data rates. Table 9 provides a summary of the recommended antennas to use with the CC3235MODx module. Table 9. Antenna Guidelines SR NO. 2 Ensure that no signals are routed across the antenna elements on all the layers of the PCB.
Layout Guidelines www.ti.com Figure 23 shows the top view of the coplanar waveguide with GND and via stitching. Figure 23. CPW With GND and Via Stitching (Top View) S ict ion s W str The recommended values for the PCB are provided for 2-layer boards in Table 10 and for 4-layer boards in Table 11. PARAMETER VALUE UNIT mils 5.5 H 42.1 Er (FR-4 substrate) 4.2 mils mils F/m l– S A 26 ND W Re Table 10. Recommended PCB Values for 2-Layer Board (L1 to L2 = 42.
Operational Setup and Testing www.ti.com 4 Operational Setup and Testing A compatible BoosterPack can be stacked on top of the LaunchPad using the two, 20-pin connectors. The connectors do not have a key to prevent the misalignment of the pins or reverse connection. Ensure that the VCC and 5-V pins are aligned with the BoosterPack header pins. On the CC3235MODSF LaunchPad, a small white symbol is provided near pin 1 (see Figure 24) to orient all BoosterPacks.
Operational Setup and Testing 4.1 www.ti.com Measuring the CC3235MOD Current Draw To measure the current draw of the CC3235MOD device using a multimeter, use the VBAT jumper on the J101 isolation block. The current draw measured in this mode includes only the CC3235MOD device, Serial Flash, any current drawn through the BoosterPack plug-in module headers. However, if a GPIO of the CC3235MOD is driving a high current load like the LED, then that is also included in this measurement. 4.1.
Operational Setup and Testing www.ti.com 4.2 4.2.1 RF Connections AP Connection Testing By default, the board ships with the 2.4 GHz and 5 GHz RF signals routed to the onboard chip antenna, as shown in Figure 25. Re str ict ion s Figure 25. Using Onboard Antenna (Default Condition) ND A A U.FL connector J17 provides a way to test in the lab using a compatible cable. Alternatively, trackpads for an SMA connector J15 are provided onboard to replace the J17 U.
Operational Setup and Testing 4.3 4.3.1 www.ti.com Design Files Hardware Design Files Schematics can be found in Section 7.2.All design files, including schematics, layout, Bill of Materials (BOM), Gerber files, and documentation are available for download from LAUNCHCC3235MOD. 4.4 Software 5 ion s All design files, including firmware patches, software example projects, and documentation are available from the CC3235 Software Development Kit.
Additional Resources www.ti.com 6 Additional Resources 6.1 CC3235MODx Product Page For more information on the CC3235MOD device, visit the CC3235MOD product page, which includes the CC3235MODx SimpleLink™ Wi-Fi® Wireless and Internet-of-Things Solution, a Single-Chip Wireless MCU data sheet and key documents such as the CC32xx SimpleLink™ Wi-Fi® and Internet-of-Things Technical Reference Manual. 6.2 Download CCS, IAR 6.
Assembly Drawing and Schematics www.ti.com 7 Assembly Drawing and Schematics 7.1 Assembly Drawing TI Co nf ide nt ia l– ND A Re str ict ion s Figure 28.
Assembly Drawing and Schematics www.ti.com 7.2 Schematics Figure 29.
Assembly Drawing and Schematics www.ti.com Figure 30. Schematics (2 of 5) VCC_Buffer VCC_LDO_3V3 USB-INTERFACE C19 0.
Assembly Drawing and Schematics www.ti.com Figure 31.
Assembly Drawing and Schematics www.ti.com Figure 32.
Assembly Drawing and Schematics www.ti.com Figure 33. Schematics (5 of 5) BOOSTER PACK INTERFACE P1 ANA_IN3 +3.
Revision History www.ti.com Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (February 2019) to A Revision .................................................................................................. Page Added last paragraph to Section 1.6.2 ................................................................................................. 8 Added Section 6.3 ..........................................................
User's Guide SWRU548A – February 2019 Manual Information to the End User The OEM integrator must be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual must include all required regulatory information and warnings as shown in this manual. 2 RF Function and Frequency Range str ict The CC3235MODSM2MOB and CC3235MODSF12MOB devices are designed to operate in the WLAN 2.
FCC and IC Certification and Statement • www.ti.com This device must accept any interference received, including interference that may cause undesired operation of the device. CAUTION FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body.
FCC and IC Certification and Statement www.ti.com CAUTION IC RF Radiation Exposure Statement: This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body. Déclaration d'exposition aux radiations: ion s Cut équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé.
FCC and IC Certification and Statement www.ti.com Mobile: (§2.1091) (b)— A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter’s radiating structures and the body of the user or nearby persons. Per §2.
EU Certification and Statement www.ti.com 4.3 Waste Electrical and Electronic Equipment (WEEE) Waste Electrical and Electronic Equipment (WEEE) This symbol means that according to local laws and regulations your product and/or battery shall be disposed of separately from household waste. When this product reaches its end of life, take it to a collection point designated by local authorities. Proper recycling of your product will protect human health and the environment. 4.
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