Product Folder Order Now Support & Community Tools & Software Technical Documents CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 SimpleLink™ Wi-Fi CC3135MOD Dual-Band Network Processor Module 1 Module Overview 1.1 Features 1 l– • • • • • 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 1.2 • www.ti.
CC3135MOD www.ti.com 1.4 SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 Functional Block Diagrams Figure 1-1 shows the functional block diagram of the CC3135MOD module. CC3135 40 MHz RF_ABG 32.768 kHz WRF_BGN F D 5 GHz SPDT nReset Aband ict HiB F 2.3 V to 3.6 V VBAT str WRF_A ADVANCE INFORMATION MAC/PHY SPI ion s BGN UART Re PM A 32-Mbit SFlash ND External SPI Programming TI Co nf ide nt ia l– Figure 1-1.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com Figure 1-2 shows the CC3135 hardware overview. External MCU Wi-Fi Network Processor Host Interface Hardware 1x UART Wi-Fi Driver TCP/IP Stack RAM Re Radio Synthesizer A Baseband Dual Band Wi-Fi str ARM Cortex ROM DC-DC MAC Processor ADVANCE INFORMATION Crypto Engines Application Protocols Oscillators ict NETWORK PROCESSOR POWER MANAGEMENT RTC ion s 1x SPI ND Figure 1-2.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 Table of Contents 6.2 Module Features 6.3 Power-Management Subsystem .................... 37 1.2 Applications ........................................... 2 6.4 Low-Power Operating Modes ....................... 38 1.3 Description ............................................ 2 6.5 Restoring Factory Default Configuration ............ 38 1.4 Functional Block Diagrams ........................... 3 6.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com 2 Revision History Changes from Original (February 2019) to Revision A ion s Changed Figure 1-1 .................................................................................................................. 3 Deleted footnote from Table 5-5 .................................................................................................. 25 Changed MIC ID in Table 6-3 .................................................................
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 3 Device Comparison Table 3-1 shows the features supported across different CC3x35 modules. Table 3-1. Device Features Comparison DEVICE CC3235MODS CC3235MODSF Onboard Chip CC3135 CC3235S CC3235SF Onboard ANT No No No sFlash 32-Mbit 32-Mbit 32-Mbit Regulatory Certification FCC, IC/ISED, ETSI/CE, MIC FCC, IC/ISED, ETSI/CE, MIC FCC, IC/ISED, ETSI/CE, MIC Wi-Fi Alliance Certification Yes Yes Yes Input Voltage 2.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 3.1 www.ti.com Related Products For information about other devices in this family of products or related products see the links below. The SimpleLink™ MCU Portfolio Offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 4 Terminal Configuration and Functions 4.1 CC3135MOD Pin Diagram Figure 4-1 shows the pin diagram for the CC3135MOD module.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 4.2 www.ti.com Pin Attributes Table 4-1 describes the CC3135MOD pins. NOTE Digital IOs on the CC3135MOD refer to hostless mode, BLE/2.4 GHz coexistence, and antenna select IOs, not general-purpose IOs. TI Co nf ide nt ia l– ND A Re str ADVANCE INFORMATION ict ion s If an external device drives a positive voltage to signal pads when the CC3135MOD is not powered, DC current is drawn from the other device.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 Table 4-1. Pin Description and Attributes DIGITAL I/O BLE COEX CC_COEX_ OUT CC_COEX_ IN STATE AT RESET AND HIBERNATE I/O TYPE(1) CC3135 DEVICE PIN NO.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com Table 4-1. Pin Description and Attributes (continued) DIGITAL I/O HOSTLESS MODE BLE COEX CC_COEX_ OUT CC_COEX_ IN STATE AT RESET AND HIBERNATE I/O TYPE(1) CC3135 DEVICE PIN NO. 26 GND N/A N/A N/A – Power - 27 GND N/A N/A N/A – Power - GND 28 GND N/A N/A N/A – Power - 29 GND N/A N/A N/A – Power - 30 GND N/A N/A N/A – Power - 31 RF_ABG N/A N/A N/A Hi-Z RF 27, 28, 31 2.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 Table 4-1. Pin Description and Attributes (continued) DIGITAL I/O BLE COEX CC_COEX_ OUT CC_COEX_ IN STATE AT RESET AND HIBERNATE I/O TYPE(1) CC3135 DEVICE PIN NO.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 4.3 www.ti.com Signal Descriptions Table 4-2. Signal Descriptions PIN NO.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 Table 4-2. Signal Descriptions (continued) PIN NO.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 4.4 www.ti.com Connections for Unused Pins All unused pins must be left as no connect (NC) pins. Table 4-3 provides a list of NC pins. Table 4-3. Connections for Unused Pins SIGNAL DESCRIPTION DIO Digital input or output No Connect NC SOP Configuration sense-on-power PIN NUMBER ACCEPTABLE PRACTICE Wake up I/O source should not be floating during hibernate. All the I/O pins will float 3, 9, 10, 12, 18, while in Hibernate and Reset states.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 5 Specifications All measurements are references of the module pins, unless otherwise indicated. All specifications are over process and voltage, unless otherwise indicated. 5.1 Absolute Maximum Ratings These specifications indicate levels where permanent damage to the module can occur. Functional operation is not ensured under these conditions.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 5.4 www.ti.com Current Consumption Summary: 2.4 GHz RF Band TA = 25°C, VBAT = 3.6 V TEST CONDITIONS (1) PARAMETER 1 DSSS 6 OFDM 54 OFDM RX (3) MIN TX power level = 0 272 TX power level = 4 188 TX power level = 0 248 TX power level = 4 179 TX power level = 0 223 TX power level = 4 160 1 DSSS 53 54 OFDM 53 Idle connected (4) LPDS Hibernate Shutdown mA mA µA µA 5.
CC3135MOD www.ti.com 5.6 SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 TX Power Control for 2.4 GHz Band The CC3135MOD has several options for modifying the output power of the device when required. For the 2.4 GHz band it is possible to lower the overall output power at a global level using the global TX power level setting. In addition, the 2.
CC3135MOD www.ti.com str ADVANCE INFORMATION ict ion s SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 TI Co nf ide nt ia l– ND A Re Figure 5-2. TX Power and IBAT vs TX Power Level Settings (6 OFDM) Figure 5-3.
CC3135MOD www.ti.com 5.7 SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 TX Power Control for 5 GHz Band 5 GHz power control is done via Image Creator where the maximum transmit power is provided (1). Within Image Creator, power control is possible per channel, region (2), and modulation rates (3). In addition, it is possible to enter an additional back-off (4) factor per channel and modulation rate for further margin to regulatory requirements.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 5.8 www.ti.com Brownout and Blackout Conditions The device enters a brownout condition when the input voltage dips below VBROWNOUT (see Figure 5-4 and Figure 5-5). This condition must be considered during design of the power supply routing, especially if operating from a battery.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 Table 5-1 lists the brownout and blackout voltage levels. Table 5-1. Brownout and Blackout Voltage Levels 5.9 CONDITION VOLTAGE LEVEL UNIT Vbrownout 2.1 V Vblackout 1.67 V Electrical Characteristics for DIO Pins TA = 25°C, VBAT = 3.3 V CIN Pin capacitance VIH High-level input voltage 0.65 × VDD VIL Low-level input voltage –0.5 IIH High-level input current IIL Low-level input current NOM 4 VDD + 0.5 V 0.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com 5.10 WLAN Receiver Characteristics Table 5-2. WLAN Receiver Characteristics: 2.4 GHz Band TA = 25°C, VBAT = 2.3 V to 3.6 V. Parameters are measured at the SoC pin on channel 6 (2437 MHz). TYP –94.5 2 DSSS –92.5 11 CCK –86.5 6 OFDM –89 9 OFDM –88.5 18 OFDM –85 36 OFDM –79 54 OFDM –73 MCS7 (GF) (2) –70 802.11b –2.5 802.11g –8.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 5.11 WLAN Transmitter Characteristics Table 5-4. WLAN Transmitter Characteristics: 2.4 GHz Band TA = 25°C, VBAT = 2.3 V to 3.6 V. (1) Parameters measured at SoC pin on channel 6 (2437 MHz). (2) (3) TEST CONDITIONS MIN TYP 2412 Maximum RMS output power measured at 1 dB from IEEE spectral mask or EVM MHz 16 2 DSSS 16 11 CCK 16.3 6 OFDM 15.3 9 OFDM 15.3 18 OFDM 15 36 OFDM 14 54 OFDM 12.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com 5.12 BLE and WLAN Coexistence Requirements For proper BLE and WLAN 2.4 GHz radio coexistence, the following requirements must be met. Table 5-6. BLE/WLAN Coex (1) Isolation Requirement PARAMETER Port-to-port isolation (1) (2) (3) Band MIN Dual antenna configuration (2) 20 (3) TYP MAX UNIT dB The CC3135MOD modules are compatible with TI BLE modules using an external RF switch.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 5.15 Timing and Switching Characteristics 5.15.1 Power-Up Sequencing For proper start-up of the CC3135MOD module, perform the recommended power-up sequencing as follows: 1. Tie VBAT1 (pin 37) and VBAT2 (pin 40) together on the board. 2. Hold the nRESET pin low while the supplies are ramping up. Figure 5-6 shows the reset timing diagram for the first-time power-up and reset removal.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com 5.15.4 Wakeup From HIBERNATE Mode Timing Figure 5-7 shows the timing diagram for wakeup from HIBERNATE mode. Thib_min Twake_from_hib HIBERNATE HW WAKEUP+FW INIT VBAT nRESET ACTIVE ion s nHIB ACTIVE str Figure 5-7. nHIB Timing Diagram NOTE A Re The internal 32.768-kHz XTAL is kept enabled by default when the chip goes into HIBERNATE mode in response to nHIB being pulled low.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 5.16 External Interfaces This section describes the external interfaces supported by the CC3135MOD module, as follows: • SPI Host • Host UART • External Flash 5.16.1 SPI Host Interface The device interfaces to an external host using the SPI. The CC3135MOD module can interrupt the host using the HOST_INTR line to initiate the data transfer over the interface. The SPI host interface can work up to a speed of 20 MHz.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com Table 5-10 lists the host SPI timing parameters. Table 5-10. Host SPI Timing Parameters PARAMETER NUMBER DESCRIPTION MIN MAX Clock frequency at VBAT = 3.3 V 20 Clock frequency at VBAT = 2.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 5.16.2.1 5-Wire UART Topology Figure 5-10 shows the typical 5-wire UART topology comprised of four standard UART lines plus one IRQ line from the device to the host controller to allow efficient low power mode. Figure 5-10 shows the typical and recommended UART topology because it offers the maximum communication reliability and flexibility between the host and the SimpleLink device.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com Using 3-wire topology requires one of the following conditions to be met: • Host always stays awake or active. • Host goes to sleep, but the UART module has receiver start-edge detection for auto wake up and does not lose data. • Host can always receive any amount of data transmitted by the SimpleLink device because there is no flow control in this direction.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 6 Detailed Description 6.1 Overview The CC3135MOD dual-band Wi-Fi module contains a dedicated Arm® MCU that offloads many of the networking activities from the host MCU. Including an 802.11 a/b/g/n radio, baseband, and MAC with a powerful crypto engine for a fast, secure WLAN and Internet connections with 256-bit encryption. The CC3135MOD module supports station, AP, and Wi-Fi Direct modes.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 6.2.2 www.ti.com Network Stack The network stack features are as follows: • Integrated IPv4, IPv6, and TCP/IP stack with BSD socket APIs for simple Internet connectivity with any MCU, microprocessor, or ASIC NOTE Not all APIs are 100% BSD compliant. Not all BSD APIs are supported. Support of 16 simultaneous TCP, UDP, RAW, SSL\TLS sockets Built-in network protocols: – Static IP, LLA, DHCPv4, DHCPv6 (Stateful) with DAD and Stateless auto configurati
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 Table 6-1. NWP Features (continued) Feature Description Device identity Security Trusted root-certificate catalog TI root-of-trust public key Power management Enhanced power policy management uses 802.11 power save and deep-sleep power modes Transceiver Other Programmable RX filters with event-trigger mechanism Rx Metrics for tracking the surrounding RF environment Security ion s 6.2.2.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 Secure sockets – Protocol versions: SSL v3/TLS 1.0/TLS 1.1/TLS 1.
CC3135MOD www.ti.com 6.2.3 SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 FIPS 140-2 Level 1 Certification The Federal Information Processing Standard (FIPS) Publication 140-2 is a U.S. government computer security standard. It is commonly referred to as FIPS 140-2, and is used to accredit the design and implementation of cryptographic functions, for example within a chip.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 6.4 www.ti.com Low-Power Operating Modes This section describes the low-power modes supported by the module to optimize battery life. 6.4.1 Low-Power Deep Sleep The low-power deep-sleep (LPDS) mode is an energy-efficient and transparent sleep mode that is entered automatically during periods of inactivity based on internal power optimization algorithms.
CC3135MOD www.ti.com 6.6 SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 Hostless Mode The SimpleLink™ Wi-Fi® CC3135MOD device incorporates a scripting ability that enables offloading of simple tasks from the host processor. Using simple and conditional scripts, repetitive tasks can be handled internally, which allows the host processor to remain in a low-power state. In some cases where the scripter is being used to send packets, it reduces code footprint and memory consumption.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 6.7 www.ti.com Device Certification and Qualification The TI CC3135MOD module is certified for FCC, IC/ISED, ETSI/CE, and MIC. Moreover, the module is also Wi-Fi certified with the ability to request a certificate transfer for Wi-Fi alliance members. TI customers that build products based on the TI CC3135MOD can save in testing cost and time per product family.
CC3135MOD www.ti.com 6.7.2 SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 IC/ISED Certification Statement CAUTION IC RF Radiation Exposure Statement: This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body. Déclaration d'exposition aux radiations: str ict The TI CC3135MOD modules are certified for IC as a single-modular transmitter.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 6.8 www.ti.com Module Markings Figure 6-1 shows the SimpleLink™ CC3135 module markings. str Re ND A Figure 6-1. SimpleLink™ CC3135 Module Markings Table 6-3.
CC3135MOD www.ti.com 6.9 SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 End Product Labeling This module is designed to comply with the FCC single modular FCC grant, FCC ID: Z64-CC3135MOD. The host system using this module must display a visible label indicating the following text: Contains FCC ID: Z64-CC3135MOD This module is designed to comply with the IC single modular IC grant, IC: 451I-CC3135MOD.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com 7 Applications, Implementation, and Layout NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 7.1 7.1.1 Application Information BLE/2.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 Figure 7-1 shows the dual antenna implementation of a complete Bluetooth® low energy and WLAN coexistence network with the WLAN operating on either a 2.4- or a 5 GHz band. Note in this implementation no Coex switch is required and only a single GPIO from the BLE device to the CC3135 device is required. BLE Ant. RF WLAN CC3135MOD ict BLE CCxxxx Coex IO str CC_COEX_BLE_IN 7.1.2 Re Figure 7-1.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com Figure 7-2 shows the antenna selection implementation for Wi-Fi, with BLE operating on it's own antenna. Note in this implementation, only a single GPIO from the BLE device to the CC3135MOD device is required. The Antenna switch (3) is controlled by 2 GPIO lines from the CC3135MOD device. Table 4-2 lists which GPIOs can be used for Antenna Selection. Dual Band Ant.
CC3135MOD www.ti.com 7.1.3 SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 Typical Application Figure 7-3 shows the typical application schematic using the CC3135MOD module.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 Table 7-1 lists the bill of materials for a typical application using the CC3135MOD module shown in Figure 7-3. Table 7-1. Bill of Materials PART REFERENCE VALUE MANUFACTURER PART NUMBER DESCRIPTION 2 C1, C2 0.1 uF Murata GRM155R61A104KA01D Capacitor, ceramic, 0.1 uF, 10 V, ±10%, X5R, 0402 1 C3 3.3 pF Murata GJM1555C1H3R3BB01 Capacitor, ceramic, 3.3 pF, 50 V, ±0.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 7.1.4 www.ti.com Power Supply Decoupling and Bulk Capacitors Depending upon routing resistors and battery type, TI recommends adding two 100-µF ceramic capacitors to help provide the peak current drawn by the CC3135MOD module. NOTE The module enters a brown-out condition whenever the input voltage dips below VBROWN (see Figure 5-4 and Figure 5-5).
CC3135MOD www.ti.com 7.2.2 SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 RF Layout Recommendations The RF section of this wireless device gets top priority in terms of layout. It is very important for the RF section to be laid out correctly to ensure optimum performance from the device. A poor layout can cause low-output power, EVM degradation, sensitivity degradation, and mask violations. Figure 7-4 shows the RF placement and routing of the CC3135MOD module.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com Re str ADVANCE INFORMATION ict ion s For optimal RF performance, ensure the copper cut out on the top layer under the RF-BG pin, (pin 31), is as shown in Figure 7-5. TI Co nf ide nt ia l– ND A Figure 7-5.
CC3135MOD www.ti.com 7.2.3 SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 Antenna Placement and Routing The antenna is the element used to convert the guided waves on the PCB traces to the free space electromagnetic radiation. The placement and layout of the antenna are the keys to increased range and data rates. Table 7-2 provides a summary of the recommended antennas to use with the CC3135MOD module. Table 7-2. Antenna Guidelines SR NO. GUIDELINES Place the antenna on an edge or corner of the PCB.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 7.2.4 www.ti.com Transmission Line Considerations The RF signal from the device is routed to the antenna using a Coplanar Waveguide with ground (CPWG) structure. CPW-G structure offers the maximum amount of isolation and the best possible shielding to the RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides additional shielding.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 The recommended values for the PCB are provided for 2-layer boards in Table 7-4 and 4-layer boards in Table 7-5. VALUE UNIT 26 mils S 5.5 mils H 42.1 mils Er (FR-4 substrate) 4.2 F/m UNITS 21 mils S 10 mils H 16 mils Er (FR-4 substrate) 4.5 F/m Re TI Co nf ide nt ia l– ND A PARAMETER str VALUE W ict Table 7-5.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com 8 Environmental Requirements and SMT Specifications 8.1 8.1.1 Temperature PCB Bending The PCB follows IPC-A-600J for PCB twist and warpage < 0.75% or 7.5 mil per inch. 8.2 8.2.1 Handling Environment Terminals 8.2.2 ion s The product is mounted with motherboard through land-grid array (LGA). To prevent poor soldering, do not touch the LGA portion by hand. Falling str 8.3.
CC3135MOD www.ti.com 8.4.3 SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 PCB Surface Finish Requirements A uniform PCB plating thickness is key for high assembly yield. For an electroless nickel immersion gold finish, the gold thickness should range from 0.05 μm to 0.20 μm to avoid solder joint embrittlement. Using a PCB with Organic Solderability Preservative (OSP) coating finish is also recommended as an alternative to Ni-Au. 8.4.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 8.6 www.ti.com Soldering and Reflow Condition • • • • • l– ND A Re str ADVANCE INFORMATION ict ion s • Heating method: Conventional convection or IR convection Temperature measurement: Thermocouple d = 0.1 mm to 0.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 9 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed in this section. 9.1 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of the CC3135MOD and support tools (see Figure 9-1).
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com SimpleLink™ Wi-Fi® Radio Testing Tool The supported devices are: CC3100, CC3200, CC3120R, CC3220, CC3135, and CC3235x. The SimpleLink Wi-Fi Radio Testing Tool is a Windowsbased software tool for RF evaluation and testing of SimpleLink Wi-Fi CC3x20 and CC3x35 designs during development and certification. The tool enables low-level radio testing capabilities by manually setting the radio into transmit or receive modes.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 User's Guides CC3135 and CC3235 SimpleLink™ Wi-Fi® Embedded Programming User Guide UniFlash SimpleLink™ CC31xx/32xx Wi-Fi® and IoC™ Solution ImageCreator and Pro This document describes the installation, operation, and usage of the SimpleLink ImageCreator tool as part of the UniFlash.
CC3135MOD SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 www.ti.com 10 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. 10.1 Mechanical, Land, and Solder Paste Drawings NOTE The total height of the module is 2.4 mm. ion s The weight of the module is 1.8g typical. NOTE 1.
CC3135MOD www.ti.com SWRS225A – FEBRUARY 2019 – REVISED AUGUST 2019 10.2 Package Option Addendum The CC3135MOD is only offered in a 750-unit reel. 10.2.
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