Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Op-amp, buffer amplifer Buffer SOIC 8

FEATURES DESCRIPTION

APPLICATIONS

Self-Referenced, AC-Coupled, Single-Supply Buffer

Ω

OUT

≈

Ω

Input Z

< 2

Ω

to 20MHz

200

Ω

BUF602

www.ti.com

...................................................................................................................................................... SBOS339B – OCTOBER 2005 – REVISED MAY 2008

High-Speed, Closed-Loop Buffer

• Wide Bandwidth: 1000MHz

The BUF602 is a closed-loop buffer recommended for

a wide range of applications. Its wide bandwidth

• High Slew Rate: 8000V/ µ s

(1000MHz) and high slew rate (8000V/ µ s) make it

• Flexible Supply Range:

ideal for buffering very high-frequency signals. For

± 1.4V to ± 6.3V Dual Supplies

AC-coupled applications, an optional mid-point

+2.8V to +12.6V Single Supply

reference (V

REF

) is provided, reducing the number of

• Output Current: 60mA (continuous)

external components required and the necessary

supply current to provide that reference.

• Peak Output Current: 350mA

• Low Quiescent Current: 5.8mA

The BUF602 is available in a standard SO-8

surface-mount package and in an SOT23-5 where a

• Standard Buffer Pinout

smaller footprint is needed.

• Optional Mid-Supply Reference Buffer

• Low Impedance Reference Buffers

• Clock Distribution Circuits

• Video/Broadcast Equipment

• Communications Equipment

• High-Speed Data Acquisition

• Test Equipment and Instrumentation

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (27 pages)

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BUF602 www.ti.com ...................................................................................................................................................... SBOS339B – OCTOBER 2005 – REVISED MAY 2008 High-Speed, Closed-Loop Buffer FEATURES DESCRIPTION 1 • Wide Bandwidth: 1000MHz • High Slew Rate: 8000V/µs • Flexible Supply Range: ±1.4V to ±6.3V Dual Supplies +2.8V to +12.6V Single Supply • Output Current: 60mA (continuous) • Peak Output Current: 350mA • Low Quiescent Current: 5.
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BUF602 SBOS339B – OCTOBER 2005 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
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BUF602 www.ti.com ...................................................................................................................................................... SBOS339B – OCTOBER 2005 – REVISED MAY 2008 ELECTRICAL CHARACTERISTICS: VS = ±5V Boldface limits are tested at +25°C. At RL = 100Ω, unless otherwise noted.
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BUF602 SBOS339B – OCTOBER 2005 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS: VS = +5V Boldface limits are tested at +25°C. At RL = 100Ω to VS/2, unless otherwise noted.
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BUF602 www.ti.com ...................................................................................................................................................... SBOS339B – OCTOBER 2005 – REVISED MAY 2008 ELECTRICAL CHARACTERISTICS: VS = +5V (continued) Boldface limits are tested at +25°C. At RL = 100Ω to VS/2, unless otherwise noted. BUF602ID, IDBV TYP MIN/MAX OVER TEMPERATURE +25°C (2) 0°C to 70°C (3) –40°C to +85°C (3) Maximum Operating Voltage +12.6 +12.6 +12.
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BUF602 SBOS339B – OCTOBER 2005 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS: VS = +3.3V Boldface limits are tested at +25°C. At RL = 100Ω, unless otherwise noted.
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BUF602 www.ti.com ...................................................................................................................................................... SBOS339B – OCTOBER 2005 – REVISED MAY 2008 ELECTRICAL CHARACTERISTICS: VS = +3.3V (continued) Boldface limits are tested at +25°C. At RL = 100Ω, unless otherwise noted.
PAGE 8
BUF602 SBOS339B – OCTOBER 2005 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS: VS = ±5V At TA = +25°C and RL = 100Ω, unless otherwise noted. BUFFER BANDWIDTH vs OUTPUT VOLTAGE BUFFER BANDWIDTH vs LOAD RESISTANCE 3 6 RL = 100Ω VOUT = 0.5VPP VO = 0.2VPP RL = 1kΩ 0 VO = 5VPP −3 VO = 0.
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BUF602 www.ti.com ...................................................................................................................................................... SBOS339B – OCTOBER 2005 – REVISED MAY 2008 TYPICAL CHARACTERISTICS: VS = ±5V (continued) At TA = +25°C and RL = 100Ω, unless otherwise noted.
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BUF602 SBOS339B – OCTOBER 2005 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS: VS = ±5V (continued) At TA = +25°C and RL = 100Ω, unless otherwise noted. POWER-SUPPLY REJECTION RATIO vs FREQUENCY OUTPUT SWING VOLTAGE vs TEMPERATURE 50 4.10 45 ±Output Voltage Swing (V) +PSRR 40 PSRR (dB) 35 30 25 20 15 −PSRR 10 4.05 +VO 4.00 −VO 3.95 5 3.
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BUF602 www.ti.com ...................................................................................................................................................... SBOS339B – OCTOBER 2005 – REVISED MAY 2008 TYPICAL CHARACTERISTICS: VS = +5V At TA = +25°C and RL = 100Ω to VS/2, unless otherwise noted. BUFFER BANDWIDTH vs OUTPUT VOLTAGE HARMONIC DISTORTION vs FREQUENCY −40 3 RL = 100Ω VO = 0.5VPP Gain (dB) Harmonic Distortion (dBc) VO = 2VPP −3 VO = 3VPP −6 VO = 0.
PAGE 12
BUF602 SBOS339B – OCTOBER 2005 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS: VS = +3.3V At TA = +25°C and RL = 100Ω to VS/2, unless otherwise noted. BUFFER BANDWIDTH vs OUTPUT VOLTAGE HARMONIC DISTORTION vs FREQUENCY −40 3 RL = 100Ω VO = 0.5VPP Harmonic Distortion (dBc) Gain (dB) −3 VO = 0.
PAGE 13
BUF602 www.ti.com ...................................................................................................................................................... SBOS339B – OCTOBER 2005 – REVISED MAY 2008 APPLICATION INFORMATION WIDEBAND BUFFER OPERATION The BUF602 gives the exceptional AC performance of a wideband buffer. Requiring only 5.8mA quiescent current, the BUF602 will swing to within 1V of either supply rail and deliver in excess of 60mA at room temperature.
PAGE 14
BUF602 SBOS339B – OCTOBER 2005 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com In the same manner, line inductance and capacitance determine the delay time of a transmission line as shown in Equation 2: t + ǸL T CT The figure shown in Figure 33 makes use of the BUF602 as a line driver.
PAGE 15
BUF602 www.ti.com ...................................................................................................................................................... SBOS339B – OCTOBER 2005 – REVISED MAY 2008 DESIGN-IN TOOLS DEMONSTRATION FIXTURES Two printed circuit boards (PCBs) are available to assist in the initial evaluation of circuit performance using the BUF602 in its two package options. Both of these are offered free of charge as unpopulated PCBs, delivered with a user's guide.
PAGE 16
BUF602 SBOS339B – OCTOBER 2005 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com across the part. PDL will depend on the required output signal and load but would, for a grounded resistive load, be at a maximum when the output is fixed at a voltage equal to 1/2 of either supply voltage (for equal bipolar supplies). Under this condition, PDL = VS2/(4 × RL).
PAGE 17
BUF602 www.ti.com ...................................................................................................................................................... SBOS339B – OCTOBER 2005 – REVISED MAY 2008 INPUT AND ESD PROTECTION The BUF602 is built using a very high-speed complementary bipolar process. The internal junction breakdown voltages are relatively low for these very small geometry devices. These breakdowns are reflected in the Absolute Maximum Ratings table.
PAGE 18
BUF602 SBOS339B – OCTOBER 2005 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com Revision History Changes from Revision A (August 2006) to Revision B ................................................................................................ Page • Changed storage temperature range rating in Absolute Maximum Ratings table from –40°C to +125°C to –65°C to +125°C ..........
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
PAGE 21
PACKAGE MATERIALS INFORMATION www.ti.com 26-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) BUF602IDBVR SOT-23 DBV 5 3000 178.0 9.0 BUF602IDBVT SOT-23 DBV 5 250 178.0 9.0 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 3.23 3.17 1.37 4.0 8.
PAGE 22
PACKAGE MATERIALS INFORMATION www.ti.com 26-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BUF602IDBVR SOT-23 DBV 5 3000 565.0 140.0 75.0 BUF602IDBVT SOT-23 DBV 5 250 565.0 140.0 75.
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