Datasheet

SLOS359F − MARCH 2001 − REVISED MAY 2004
    


FEATURES
D Gamma Correction Channels: 10, 6
D Integrated V
COM
Buffer
D Excellent Output Current Drive:
− Gamma Channels: > 30mA at
0.5V Swing to Rails
(1)
− V
COM
: > 150mA at
5V Swing to Rails
(1)
D Large Capacitive Load Drive Capability
D Rail-to-Rail Output
D PowerPAD Package
D Low-Power/Channel: < 340µA
D Wide Supply Range: 4.5V to 16V
D Specified for 0°C to 85°C
D High ESD Rating: 4kV
(1)
See typical characteristic curves for detail.
MODEL
GAMMA
CHANNELS
VCOM CHANNELS
BUF11702 10 1
BUF07702
(1)
6 1
(1)
The BUF07702 is not recommended for new designs. Informa-
tion is provided for reference only. For new designs, the pin-com-
patible BUF07703 is recommended; more information can be
found at www.ti.com.
DESCRIPTION
The BUFxx702 are a series of multi-channel buffers
targeted towards gamma correction in high-resolution
LCD panels. The number of gamma correction
channels required depends on a variety of factors and
differs greatly from design to design. Therefore, various
channel options are offered. For additional space and
cost savings, a V
COM
channel with higher current drive
capability is integrated in the BUF11702 and
BUF07702.
The various buffers within the BUFxx702 are carefully
matched to the voltage I/O requirements for the gamma
correction application. Each buffer is capable of driving
heavy capacitive loads and offers fast load current
switching. The V
COM
channel has increased output
drive of > 100mA and can handle even larger capacitive
loads.
The BUF07702 and BUF11702 is available in the
TSSOP-PowerPAD package for dramatically
increased power dissipation capability. This way, a
large number of channels can be handled safely in one
package.
A flow-through pinout has been adopted to allow simple
PCB routing and maintain the cost-effectiveness of this
solution. All inputs and outputs of the BUFxx702
incorporate internal ESD protection circuits that prevent
functional failures at voltages up to 4kV (HBM) as
tested under MIL-STD-883C Method 3015.
www.ti.com
Copyright 2001−2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
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PowerPAD is a trademark of Texas Instruments Incorporated. All other trademarks are the property of their respective owners.

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