Prepare to take off with AIR SWRU312b
AIR BoosterPack Quick Start Guide The Anaren Integrated Radio (AIR) BoosterPack is designed to provide instant wireless connectivity to the TI LaunchPad Development Tool. Just follow the simple instructions below and you’ll be ‘on the AIR’ in minutes. This kit contains: You may also need/want: Soldering Iron Solder IC Puller X-jumper USB Battery BoosterStack Lite Supporting the AIR BoosterPack for LaunchPad CD Contents Software Firmware User’s Guide Web Resources www.anaren.
Installation & Launch: (continued) 5. Remove the 14-pin DIP ICs from each LaunchPad, and replace with the 20-pin DIP ICs included with the AIR-BoosterPack kit. When properly inserted, the DIP IC ‘pin 1’ notch will be towards the USB port. 6. For proper operation of the UART interface to the computer, the LaunchPad J3 jumpers must be modified: – For LaunchPad v1.4 and earlier, remove the TxD & RxD shunt jumpers, and replaced with an “X-style” crossover pattern (not included).
Installation & Launch: (continued) 10. Launch the ATC – BoosterStack Lite software. The GUI screen will appear, and a trace for hub-node temperature will appear. IMPORTANT NOTE: The BoosterPack is designed to comply with regulations in the following regions: Europe – ETSI (default) North America – FCC / IC If the intended location of use is not within these regions, then you must first check with local regulatory agencies to determine any permissions/license/etc. are required prior to operation.
Disclaimer & Regulatory Information EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. The EVM is not a complete product. It is intended solely for use for preliminary feasibility evaluation in laboratory/ development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems and subsystems.
Disclaimer & Regulatory Information: (continued) EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods.
Industry Canada Industry This device Canada complies with Industry Canada license-exempt RSS standard(s). Operation is subject to thecomplies followingwith twoIndustry conditions: (1) this device mayRSS not standard(s).
RF Exposure To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Caution! The AIR-BoosterPack contains ESD sensitive components.
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
