ME910G1 HW Design Guide [04.2016] 1VV0301593 Rev. 3 – 2020-03-24 Mod. 0805 2016-08 Rev.
ME910G1 HW Design Guide SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions.
ME910G1 HW Design Guide USAGE AND DISCLOSURE RESTRICTIONS I. License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. II. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law.
ME910G1 HW Design Guide APPLICABILITY TABLE PRODUCTS ME910G1-W1 ME910G1-WW 1VV0301593 Rev.
ME910G1 HW Design Guide Contents NOTICE 2 COPYRIGHTS ................................................................................................ 2 COMPUTER SOFTWARE COPYRIGHTS ...................................................... 2 USAGE AND DISCLOSURE RESTRICTIONS ............................................... 3 I. License Agreements ..................................................................... 3 II. Copyrighted Materials ...............................................................
ME910G1 HW Design Guide 3. PINS ALLOCATION ................................................................... 17 Pin-out ........................................................................................ 17 LGA Pads Layout........................................................................ 27 4. POWER SUPPLY ....................................................................... 28 Power Supply Requirements....................................................... 28 Power Consumption ..........
ME910G1 HW Design Guide 6. RF SECTION .............................................................................. 61 Bands Variants ........................................................................... 61 TX Output power......................................................................... 61 RX Sensitivity ............................................................................. 61 Antenna requirements................................................................. 61 6.4.1.
ME910G1 HW Design Guide Carrier Tape detail ...................................................................... 83 Reel detail................................................................................... 84 Packaging detail ......................................................................... 85 Moisture sensitivity ..................................................................... 85 12. CONFORMITY ASSESSMENT ISSUES .................................... 86 Approvals........................
ME910G1 HW Design Guide 1. INTRODUCTION Scope Scope of this document is to give a description of some hardware solutions useful for developing a product with the Telit ME910G1 module. Audience This document is intended for Telit customers, who are integrators, about to implement their applications using our ME910G1 modules.
ME910G1 HW Design Guide Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
ME910G1 HW Design Guide 2. GENERAL PRODUCT DESCRIPTION Overview The ME910G1 module is a CATM / NBIoT communication product which allows integrators to plan on availability for even the longest lifecycle applications, highly recommended for new designs specified for coverage worldwide.
ME910G1 HW Design Guide Target Market ME910G1 can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example: • • • • • Telematics services Road pricing Pay-as-you-drive insurance Stolen vehicles tracking Internet connectivity Main features Function Features Modem • • • • CATM and NBIoT technologies SMS support (text and PDU) Alarm management Real Time Clock Intefaces • • Main UART is typically used fo
ME910G1 HW Design Guide 2.5.2. ME910G1-WW Band Mode Class RF power (dBm) 850/900MHz GSM 4 33 (+-2dB) 1800/1900MHz DCS/PCS 1 30 (+-2dB) B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B85 (LTE) CATM1 3 23 (+-2dB) B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B28, B66, B71, B85 (LTE) CATNB2 3 23 (+-2dB) RX Sensitivity 2.6.1. ME910G1-W1 Band REFsens (dBm) 3GPP REFsens (dBm)* Typical CATM1 / Band1 -107.6 -102.7 CAT M1 / Band2 -108.0 -100.
ME910G1 HW Design Guide CAT M1 / Band18 -108.0 -102.3 CAT M1 / Band19 -108.0 -102.3 CAT M1 / Band20 -107.8 -99.8 CAT M1 / Band25 -108.0 - CAT M1 / Band26 -108.0 -100.3 CAT M1 / Band27 -108.0 -100.8 CAT M1 / Band28 -107.9 -100.8 CAT M1 / Band66 -107.8 - CAT M1 / Band85 -107.6 - CAT NB2 / Band1 -116.8 -108.2 CAT NB2 / Band2 -116.8 -108.2 CAT NB2 / Band3 -116.8 -108.2 CAT NB2 / Band4 -116.7 - CAT NB2 / Band5 -116.7 -108.2 CAT NB2 / Band8 -116.4 -108.
ME910G1 HW Design Guide CAT NB2 / Band19 -116.8 -108.2 CAT NB2 / Band20 -116.6 -108.2 CAT NB2 / Band25 -116.8 - CAT NB2 / Band26 -116.8 -108.2 CAT NB2 / Band28 -116.9 -108.2 CAT NB2 / Band66 -116.6 -108.2 CAT NB2 / Band71 -115.4 - CAT NB2 / Band85 -116.8 - * 3GPP TS 36.521-1 Release 15 1VV0301593 Rev.
ME910G1 HW Design Guide Mechanical Specifications 2.7.1. Dimensions The overall dimensions of ME910G1-W1 and ME910G1-WW are: • • • 2.7.2. Length: 28.2 mm Width: 28.2 mm Thickness: 2.4 mm Weight This information will be available in a next document revision. Temperature Range Note –20°C to +55°C The module is fully functional(*) within this 3GPP temperature range and meets 3GPP specifications.
ME910G1 HW Design Guide 3. PINS ALLOCATION Pin-out Pin Signal I/O Function USB HS 2.0 COMMUNICATION PORT USB_D+ I/O USB differential Data (+) C15 USB_D- I/O USB differential Data (-) A13 VUSB I Enable pin for the internal USB transceiver. N15 C103/TXD Comment 5 / 3V Internal PD (FW upgrade and Data) B15 Asynchronous Serial Port Type (100K) (FW upgrade and Data with Flow Control) I Serial data input from DTE CMOS 1.
ME910G1 HW Design Guide SIM Card Interface A6 SIMCLK O External SIM signal – Clock 1.8V A7 SIMRST O External SIM signal – Reset 1.8V A5 SIMIO I/O External SIM signal – Data I/O 1.8V A4 SIMIN I External SIM signal – Presence (active low) CMOS 1.8 A3 SIMVCC - External SIM signal – Power supply for the SIM 1.8V Internal PU (470K) Digital Voice Interface (DVI) B9 DVI_WA0 I/O Digital Audio Interface (WA0) 1.8V B6 DVI_RX I Digital Audio Interface (RX) 1.
ME910G1 HW Design Guide DIGITAL IO C8 GPIO_01 I/O GPIO_01 /STAT LED CMOS 1.8V STAT LED is alternate function internal PD (100K) internal PD C9 GPIO_02 I/O GPIO_02 CMOS 1.8V C10 GPIO_03 I/O GPIO_03 CMOS 1.8V (100K) internal PD (100K) internal PD C11 GPIO_04 I/O GPIO_04 CMOS 1.8V B14 GPIO_05 I/O GPIO_05 CMOS 1.8V C12 GPIO_06 I/O GPIO_06 CMOS 1.8V C13 GPIO_07 I/O GPIO_07 CMOS 1.8V K15 GPIO_08 I/O GPIO_08 CMOS 1.8V L15 GPIO_09 I/O GPIO_09 CMOS 1.
ME910G1 HW Design Guide K1 ANTENNA I/O LTE Antenna (50 ohm) RF GNSS Section GNSS Antenna R9 ANT_GNSS I R7 GNSS_LNA_EN O (50 ohm) External GNSS LNA Enable RF CMOS 1.8V Miscellaneous Functions R13 HW_SHUTDOWN* I HW Unconditional Shutdown VBATT Active low R12 ON_OFF*/WAKE* I Input command for power ON and to wake from deep sleep mode 1.8V Active low R11 VAUX/PWRMON O Supply Output for external accessories / Power ON Monitor 1.
ME910G1 HW Design Guide P1 VBATT_PA - Main power supply (Radio PA) Power P2 VBATT_PA - Main power supply (Radio PA) Power E1 GND - Ground Power G1 GND - Ground Power H1 GND - Ground Power J1 GND - Ground Power L1 GND - Ground Power A2 GND - Ground Power E2 GND - Ground Power F2 GND - Ground Power G2 GND - Ground Power H2 GND - Ground Power J2 GND - Ground Power K2 GND - Ground Power L2 GND - Ground Power R2 GND - Ground Power M
ME910G1 HW Design Guide D4 GND - Ground Power M4 GND - Ground Power N4 GND - Ground Power P4 GND - Ground Power R4 GND - Ground Power N5 GND - Ground Power P5 GND - Ground Power R5 GND - Ground Power N6 GND - Ground Power P6 GND - Ground Power R6 GND - Ground Power P8 GND - Ground Power R8 GND - Ground Power P9 GND - Ground Power P10 GND - Ground Power R10 GND - Ground Power M12 GND - Ground Power B13 GND - Ground Powe
ME910G1 HW Design Guide RESERVED C1 RESERVED - RESERVED D1 RESERVED - RESERVED F1 RESERVED - RESERVED B2 RESERVED - RESERVED C2 RESERVED - RESERVED D2 RESERVED - RESERVED B3 RESERVED - RESERVED C3 RESERVED - RESERVED D3 RESERVED - RESERVED E3 RESERVED - RESERVED F3 RESERVED - RESERVED G3 RESERVED - RESERVED K3 RESERVED - RESERVED L3 RESERVED - RESERVED B4 RESERVED - RESERVED C4 RESERVED - RESERVED B5 RESERVED - RESERVED C5 RESERVED - RE
ME910G1 HW Design Guide C7 RESERVED - RESERVED N7 RESERVED - RESERVED P7 RESERVED - RESERVED N8 RESERVED - RESERVED N9 RESERVED - RESERVED A10 RESERVED - RESERVED N10 RESERVED - RESERVED N11 RESERVED - RESERVED P11 RESERVED - RESERVED B12 RESERVED - RESERVED D12 RESERVED - RESERVED N12 RESERVED - RESERVED P12 RESERVED - RESERVED G14 RESERVED - RESERVED J14 RESERVED - RESERVED K14 RESERVED - RESERVED N13 RESERVED - RESERVED L13 RESERVED -
ME910G1 HW Design Guide K13 RESERVED - RESERVED H13 RESERVED - RESERVED G13 RESERVED - RESERVED F13 RESERVED - RESERVED B11 RESERVED - RESERVED B10 RESERVED - RESERVED A9 RESERVED - RESERVED A8 RESERVED - RESERVED E13 RESERVED - RESERVED D13 RESERVED - RESERVED D14 RESERVED - RESERVED A14 RESERVED - RESERVED A12 RESERVED - RESERVED A11 RESERVED - RESERVED H15 RESERVED - RESERVED J15 RESERVED - RESERVED C14 RESERVED - RESERVED H3 RESERVED
ME910G1 HW Design Guide WARNING: Reserved pins must not be connected. Only D13-E13 pins can be connected together in order to be compatible with HE910 module. All pull-up (PU) and pull-down (PD) are about 100K 1VV0301593 Rev.
ME910G1 HW Design Guide LGA Pads Layout TOP VIEW A 1 B C D E F G H J K L M N P ADC_IN1 RES RES GND RES GND GND GND ANT GND VBATT VBATT_PA VBATT_PA R 2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_PA VBATT_PA GND 3 SIMVCC RES RES RES RES RES RES RES RES RES RES GND GND GND GND 4 SIMIN RES RES GND GND GND GND GND 5 SIMIO RES RES GND GND GND 6 SIMCLK DVI_RX RES GND GND GND 7 SIMRST DVI_TX RES RES RES GNSS_LN
ME910G1 HW Design Guide 4. POWER SUPPLY The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design. Power Supply Requirements The external power supply must be connected to VBATT and VBATT_PA pads and must fulfil the following requirements: Value Power Supply Nominal Supply Voltage 3.
ME910G1 HW Design Guide NOTE: The Operating Voltage Range MUST never be exceeded; care must be taken when designing the application’s power supply section to avoid having an excessive voltage drop. If the voltage drop is exceeding the limits it could cause an unintentional power off of ME910G1 module.
ME910G1 HW Design Guide Power Consumption Preliminary data Measure Mode IDLE MODE CATM Typical (mA) AT+CFUN=1 NBIoT Typical (mA) 9.5 AT+CFUN=4 Mode Description 9.2 Normal mode: full functionality of the module Disabled TX and RX; module is not registered on the network 9.0 0.98* 0.87* Paging cycle #256 frames (2.56s DRx cycle) 0.44* 0.47* 81.92s eDRx cycle length (PTW=2.56s, DRX=1.28s) 0.23** -*** 327.68s eDRx cycle length (PTW=2.56s, DRX=1.28s) 0.12** -*** 655.
ME910G1 HW Design Guide ** PSM in between eDRX *** Measurements available in a next document revision NOTE: The reported LTE CAT M1 and LTE CAT NB1 values are an average among all the product variants and bands for each network wireless technology. The support of specific network wireless technology depends on product variant configuration.
ME910G1 HW Design Guide • A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the Module, a 100μF capacitor is usually suited. • Make sure the low ESR capacitor on the power supply output rated at least 10V. An example of linear regulator with 5V input is: Guidelines 4.3.1.2. • +12V Source Power Supply Design Guidelines The desired output for the power supply is 3.
ME910G1 HW Design Guide • Make sure the low ESR capacitor on the power supply output is rated at least 10V. • For Car applications a spike protection diode should be inserted close to the power input, in order to clean the supply from spikes. An example of switching regulator with 12V input is in the below schematic: 4.3.1.3. Battery Source Power Supply Design Guidelines The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single 3.
ME910G1 HW Design Guide NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with ME910G1. Their use can lead to overvoltage on the ME910G1 and damage it. USE ONLY Li-Ion battery types. 4.3.2. Thermal Design Guidelines Worst case as reference values for thermal design of ME910G1 are: • Average current consumption: 250 mA (LTE CAT M1 and NB1 modes) • Average current consumption: 600 mA (GPRS and EDGE modes) • Supply voltage: 4.
ME910G1 HW Design Guide ME910G1 is wide enough to ensure a voltage dropless connection even during an 0.6 A (LTE) or 2A (GSM) current peak. • The protection diode must be placed close to the input connector where the power source is drained. • The PCB traces from the input connector to the power regulator IC must be wide enough to ensure no voltage drops occur when an 2 A current peak is absorbed (valid only for product supporting GSM mode).
ME910G1 HW Design Guide 1VV0301593 Rev.
ME910G1 HW Design Guide VAUX Power Output A regulated power supply output is provided in order to supply small devices from the module, like: level translators, audio codec, sensors, and others. Pin R11 can be used also as PWRMON (module powered ON indication) function, because is always active when the module is powered ON and cannot be set to LOW level by any AT command. Host can only detect deep sleep mode by monitoring of VAUX/PWRMON output pin, since there is no pin dedicated to PSM status indicator.
ME910G1 HW Design Guide 5. DIGITAL SECTION ME910G1 has four main operation states: OFF state: Vbatt is applied and only RTC is running. Baseband is switched OFF and the only change possible is the ON state. ON state: baseband is fully switched on and ME910G1 is ready to accept AT commands. ME910G1 can be idle or connected. Sleep mode state: main baseband processor is intermittently switched ON and AT commands can be processed with some latency. ME910G1 is idle with low current consumption.
ME910G1 HW Design Guide Power On To turn on the ME910G1 the pad ON_OFF*/WAKE* must be tied low for at least 5 second and then released. The maximum current that can be drained from the ON_OFF*/WAKE* pad is 0,1 mA. ON_OFF*/WAKE* pad can make an asynchronous wakeup of the system from the PSM Mode, before the scheduled event of timer T3412 expired. To make asynchronous exit from PSM mode ON_OFF*/WAKE* pin must be set LOW for at least 5 seconds.
ME910G1 HW Design Guide A flow chart showing the proper turn on procedure is displayed below: “Modem ON Proc” START N VBATT>VBATTmin? Y Y PWRMON=ON ? N ON_OFF*/WAKE* = LOW GO TO “HW Shutdown Unconditional” Delay = 5 sec (see note below) ON_OFF*/WAKE*= HIGH PWRMON=ON ? N Y Delay = 1 sec GO TO “Start AT Commands”” “Modem ON Proc” END 1VV0301593 Rev.
ME910G1 HW Design Guide A flow chart showing the AT commands managing procedure is displayed below: “Start AT CMD” START Delay = 300 msec Enter AT AT answer in 1 sec ? N GO TO “HW Shutdown Unconditional” Y GO TO “Modem ON Proc.” “Start AT CMD” END NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ME910G1 when the module is powered off or during an ON-OFF transition. 1VV0301593 Rev.
ME910G1 HW Design Guide For example: 1- Let's assume you need to drive the ON_OFF*/WAKE* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1): 2- Let's assume you need to drive the ON_OFF*/WAKE* pad directly with an ON/OFF button: 1VV0301593 Rev.
ME910G1 HW Design Guide WARNING It is recommended to set the ON_OFF*/WAKE* line LOW to power on the module only after VBATT is higher than 3.20V. In case this condition it is not satisfied you could use the HW_SHUTDOWN* line to recover it and then restart the power on activity using the ON_OFF*/WAKE* line. An example of this is described in the following diagram. After HW_SHUTDOWN* is released you could again use the ON_OFF*/WAKE* line to power on the module.
ME910G1 HW Design Guide WARNING: Not following the recommended shut-down procedures might damage the device and consequently void the warranty. The following flow chart shows the proper turn off procedure: “Modem OFF Proc.” START PWRMON=O N? N Y AT OFF Mode Key ON_OFF*/WAKE* = LOW Delay >= 3 sec AT#SHDN ON_OFF*/WAKE* = HIGH PWRMON=O N? N “Modem OFF Proc.” END Y N Looping for more than Y GO TO “HW SHUTDOWN Unconditional” 1VV0301593 Rev.
ME910G1 HW Design Guide Wake from deep sleep mode ME910G1 supports Power Saving Mode (PSM) functionality defined in 3GPP Release 12. When Periodic Update Timer expires, ME910G1 power off until the next scheduled wakeup time. Asynchronous event controlled by host can wake up from deep sleep mode by asserting ON_OFF*/WAKE* pin LOW for at least 5 seconds. Host can detect deep sleep mode by polling VAUX/PWRMON pin if previously configured.
ME910G1 HW Design Guide WARNING: The hardware unconditional Shutdown must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure. A typical circuit is the following: For example: Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2): 1VV0301593 Rev.
ME910G1 HW Design Guide In the following flow chart is detailed the proper restart procedure: NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ME910G1 when the module is powered off or during an ON-OFF transition. “HW SHUTDOWN Unconditional” START HW_SHUTDOWN* = LOW Delay = 1s Delay = 200ms Disconnect VBATT HW_SHUTDOWN* = HIGH PWRMON = ON Y N “HW SHUTDOWN Unconditional” END 1VV0301593 Rev.
ME910G1 HW Design Guide NOTE: Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the ME910G1 power regulator and improper functioning of the module. To proper power on again the module please refer to the related paragraph (“Power ON”) The unconditional hardware shutdown must always be implemented on the boards and should be used only as an emergency exit procedure.
ME910G1 HW Design Guide 5.6.1. Fast Shut Down by Hardware The Fast Power Down can be triggered by configuration of any GPIO. HI level to LOW level transition of GPIO commands fast power down. Example circuit: NOTE: Consider voltage drop under max current conditions when defining the voltage detector thereshold in order to avoid unwanted shutdown. The capacitor is rated with the following formula: TIP: Make the same plot during system verification to check timings and voltage levels. 5.6.2.
ME910G1 HW Design Guide Communication ports 5.7.1. USB 2.0 HS The ME910G1 includes one integrated universal serial bus (USB 2.0 HS) transceiver. The following table is listing the available signals: PAD Signal I/O Function B15 USB_D+ I/O USB differential Data (+) C15 USB_D- I/O USB differential Data (-) A13 VUSB AI Power sense for the internal USB transceiver. NOTE Accepted range: 3.0V to 5.
ME910G1 HW Design Guide 5.7.2. SPI The ME910G1 Module is provided by a standard 3-wire master SPI interface + chip select control. The following table is listing the available signals: PAD Signal I/O Function Type NOTE D15 SPI_MOSI O SPI MOSI CMOS 1.8V Shared with TX_AUX E15 SPI_MISO I SPI MISO CMOS 1.8V Shared with RX_AUX F15 SPI_CLK O SPI Clock CMOS 1.8V H14 SPI_CS O SPI Chip Select CMOS 1.
ME910G1 HW Design Guide SPI Connections E15 SPI_MISO SPI_MOSI D15 Application F15 SPI_CLK Processor ME910G1 H14 5.7.3. SPI_CS Serial Ports The ME910G1 module is provided with by 2 Asynchronous serial ports: • MODEM SERIAL PORT 1 (Main) • MODEM SERIAL PORT 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware, but the most common are: • RS232 PC com port • microcontroller UART @ 1.
ME910G1 HW Design Guide RS232 Signal PAD Name Usage 1 C109/DCD N14 Data Carrier Detect Output from the ME910G1 that indicates the carrier presence 2 C104/RXD M15 Transmit line *see Note Output transmit line of ME910G1 UART 3 C103/TXD N15 Receive line *see Note Input receive of the ME910G1 UART Pin 4 C108/DTR M14 Data Terminal Ready Input to the ME910G1 that controls the DTE READY condition 6 C107/DSR P14 Data Set Ready Output from the ME910G1 that indicates the module is ready
ME910G1 HW Design Guide NOTE: According to V.24, some signal names are referred to the application side, therefore on the ME910G1 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named C103/TXD) RXD on the application side will be connected to the transmit line (here named C104/RXD) For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can be left open provided a software flow control is implemented.
ME910G1 HW Design Guide NOTE: Due to the shared functions, TX_AUX/RX_AUX port and SPI port cannot be used simultanously. In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ME910G1 when the module is powered off or during an ON/OFF transition. Refer to ME910G1 series AT command reference guide for port configuration. 5.7.3.3.
ME910G1 HW Design Guide • 3 receivers An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218) In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example done on 4 signals only). The RS232 serial port lines are usually connected to a DB9 connector with the following layout: General purpose I/O The ME910G1 module is provided by a set of Configurable Digital Input / Output pins (CMOS 1.8V).
ME910G1 HW Design Guide The following table shows the available GPIO on the ME910G1: PAD Signal I/O C8 GPIO_01 I/O C9 GPIO_02 I/O 1mA INPUT – PD (100K) C10 GPIO_03 I/O 1mA INPUT – PD (100K) C11 GPIO_04 I/O 1mA INPUT – PD (100K) B14 GPIO_05 I/O 1mA INPUT – PD (100K) C12 GPIO_06 I/O 1mA INPUT – PD (100K) C13 GPIO_07 I/O 1mA INPUT – PD (100K) K15 GPIO_08 I/O 1mA INPUT – PD (100K) L15 GPIO_09 I/O 1mA INPUT – PD (100K) G15 GPIO_10 I/O 1mA INPUT – PD (100K) 5.
ME910G1 HW Design Guide NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ME910G1 when the module is powered off or during an ON/OFF transition. Refer to ME910G1 series AT command reference guide for GPIO pins configuration. 5.8.2. Using a GPIO as OUTPUT The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware.
ME910G1 HW Design Guide Registered in idle + power saving It depends on the event that triggers the wakeup (In sync with network paging) Connecting Blinking 1 sec on + 2 sec off The reference schematic for LED indicator, R3 must be calculated taking in account VBATT value and LED type. : External SIM Holder Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a). ADC Converter The ME910G1 is provided by one AD converter. It is able to read a voltage level in the range of 0÷1.
ME910G1 HW Design Guide Item Min Typical Max Unit Input Voltage range 0 - 1.8 Volt AD conversion - - 10 bits Input Resistance 1 - - Mohm Input Capacitance - 1 - pF The ADC could be controlled using an AT command. The command is AT#ADC=1,2 The read value is expressed in mV Refer to SW User Guide or AT Commands Reference Guide for the full description of this function. 1VV0301593 Rev.
ME910G1 HW Design Guide 6. RF SECTION Bands Variants See section 2.2. TX Output power See section 2.5. RX Sensitivity See section 2.6. Antenna requirements The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design.
ME910G1 HW Design Guide 81 MHz in LTE Band 71 48 MHz in LTE Band 85 Impedance Input power 50 ohm ME310G1-W1: > 24dBm Average power ME310G1-WW: > 33dBm Average power VSWR absolute max ≤ 10:1 (limit to avoid permanent damage) VSWR recommended ≤ 2:1 (limit to fulfill all regulatory requirements) 6.4.1.
ME910G1 HW Design Guide • If a Ground plane is required in line geometry, that plane has to be continuous and sufficiently extended, so the geometry can be as similar as possible to the related canonical model; • Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use this layer as reference Ground plane for the transmission line; • It is wise to surround (on both sides) the PCB transmission line with Ground, avoid having other signal tracks facing directly th
ME910G1 HW Design Guide 6.4.2.1. Transmission line design During the design of the ME910G1 interface board, the placement of components has been chosen properly, in order to keep the line length as short as possible, thus leading to lowest power losses possible. A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as needed in this case.
ME910G1 HW Design Guide 6.4.2.2. Transmission Line Measurements An HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated coaxial cable has been soldered at the pad corresponding to RF output; a SMA connector has been soldered to the board in order to characterize the losses of the transmission line including the connector itself. During Return Loss / impedance measurements, the transmission line has been terminated to 50 Ω load.
ME910G1 HW Design Guide Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the following figure: Insertion Loss of G-CPW line plus SMA connector is shown below: 1VV0301593 Rev.
ME910G1 HW Design Guide 6.4.2.3. Antenna Installation Guidelines • Install the antenna in a place covered by the LTE signal with CAT-M1 support. • Antenna must not be installed inside metal cases • Antenna must not be installed according Antenna manufacturer instructions • Antenna integration should optimize the Radiation Efficiency.
ME910G1 HW Design Guide 7. AUDIO SECTION The Telit digital audio interface (DVI) of the ME910G1 Module is based on the I2S serial bus interface standard. The audio port can be connected to end device using digital interface, or via one of the several compliant codecs (in case an analog audio is needed).
ME910G1 HW Design Guide 8. GNSS SECTION ME910G1 module includes a state-of-art receiver that can simultaneously search and track satellite signals from multiple satellite constellations. This multi-GNSS receiver uses the entire spectrum of GNSS systems available: GPS, GLONASS, BeiDou, Galileo, and QZSS. GNSS Signals Pin-out Pin Signal I/O Function R9 ANT_GNSS I GNSS Antenna (50 ohm) O GNSS External LNA Enable R7 GNSS_LNA_EN Type CMOS 1.
ME910G1 HW Design Guide GNSS Antenna Requirements GNSS active antenna must be used or integrated in the application. 8.3.1. GNSS Antenna specification Item Frequency range Gain Impedance Noise Figure of LNA DC supply voltage VSWR 8.3.2. • • • Value 1559.0 ~ 1610.0 MHz 20 ~ 30dB 50 ohm < 1.5 (recommended) DC 1.8 ~ 3.
ME910G1 HW Design Guide Be aware of max bias current in case of unwanted short on antenna cable, decoupling inductor may be demaged. In case of LNA with 1.8V supply, VAUX/POWERMON pin can be used to supply active GNSS antenna GNSS Characteristics This information will be available in a next document revision. 1VV0301593 Rev.
ME910G1 HW Design Guide 9. MECHANICAL DESIGN Drawing PIN B1 Lead Free Alloy: Surface Finishing Ni/Au for all solder pads Dimensions in mm 1VV0301593 Rev.
ME910G1 HW Design Guide 10. APPLICATION PCB DESIGN The ME910G1 modules have been designed in order to be compliant with a standard leadfree SMT process Recommended footprint for the application TOP VIEW 1VV0301593 Rev.
ME910G1 HW Design Guide Solder resist pattern (dimensions in mm) Top Transparent View 1VV0301593 Rev.
ME910G1 HW Design Guide In order to easily rework the ME910G1 is suggested to consider on the application a 1.5 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module. NOTE: In the customer application, the region under WIRING INHIBIT (see figure above) must be clear from signal or ground paths.
ME910G1 HW Design Guide Recommendations for PCB pad dimensions It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself Inhibit area for micro-via Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces: Finish Layer Thickness (um) Electro-less Ni / Immersion Au 3 –7 / 0.05 – 0.
ME910G1 HW Design Guide Thermal performance FR4 is one of the most commonly used PCB materials, it is a flame retardant composite material, composed by fiberglass-reinforced and epoxy laminate. One of the features of the FR4, is to have a very low thermal conductivity. An inexpensive way to improve thermal transfer for FR-4 PCBs is to add thermal vias - plated through-holes (PTH) between conductive layers.
ME910G1 HW Design Guide The stencil should be made from stainless steel and the apertures layout can be the same of the recommended footprint (1:1). The recommended thickness shall be 127 um (5 mil). A stencil thickness of 152 µm (6 mil) can be used as well. Solder paste Various types and grades of solder paste can be used for surface mounting Telit modules. For leadfree applications, a Sn-Ag (SA) or Sn-Ag-Cu (SAC) solder paste can be used.
ME910G1 HW Design Guide – Temperature (TL) 217°C – Time (tL) 60-150 seconds Peak Temperature (Tp) 245 +0/-5°C Time within 5°C of actual Peak 10-30 seconds Temperature (tp) Ramp-down Rate 6°C/second max. Time 25°C to Peak Temperature 8 minutes max. NOTE: All temperatures refer to topside of the package, measured on the package body surface WARNING: THE ME910G1 MODULE WITHSTANDS ONE REFLOW PROCESS ONLY.
ME910G1 HW Design Guide Inspection An inspection of the solder joint between the solder pads of the Telit module and the application PCB should be performed. The best visual inspection tool for inspection of the Telit module solder joints on the PCB is a transmission X-ray, which can identify defects such as solder bridging, shorts, opens, and large voids (Note: small voids in large solder joints are not detrimental to the reliability of the solder joint). 1VV0301593 Rev.
ME910G1 HW Design Guide 11. PACKAGING Tray The ME910 modules are packaged on trays that can be used in SMT processes for pick & place handling.The first Marketing and Engineering samples of the ME910G1 series will be shipped with the current packaging of the xE910 modules (on trays of 20 pieces each).
ME910G1 HW Design Guide 1VV0301593 Rev.
ME910G1 HW Design Guide Reel The ME910 can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier. Carrier Tape detail 1VV0301593 Rev.
ME910G1 HW Design Guide Reel detail 1VV0301593 Rev.
ME910G1 HW Design Guide Packaging detail Moisture sensitivity The ME910G1 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH). b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5.
ME910G1 HW Design Guide 12. CONFORMITY ASSESSMENT ISSUES Approvals Type Approval ME910G1-W1 ME910G1-WW EU RED Yes In progress US FCC Yes In progress CA ISED Yes In progress FCC certificates The FCC Certificate is available here: https://www.fcc.gov/oet/ea/fccid IC/ISED certificates The ISED Certificate is available here: https://smssgs.ic.gc.
ME910G1 HW Design Guide Wireless notice This device complies with FCC/ISED radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS‐102 of the ISED radio frequency (RF) Exposure rules. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body.
ME910G1 HW Design Guide Antennas / Antennes This radio transmitter has been approved by FCC and ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Model Antenna Type ME910G1-W1 Omnidirectional Antenna Gain 2.
ME910G1 HW Design Guide Le présent émetteur radio a été approuvé par ISDE pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. Modèle Type d’Antenne ME910G1-W1 Omnidirectionelle Gain de l’antenne 2.
ME910G1 HW Design Guide Label and compliance information FCC The product has a FCC ID label on the device itself. Also, the OEM host end product manufacturer will be informed to display a label referring to the enclosed module The exterior label will read as follows: “Contains Transmitter Module FCC ID: RI7ME910G1W1” or “Contains FCC ID: RI7ME910G1W1”.
ME910G1 HW Design Guide Information on test modes and additional testing requirements The module has been evaluated in mobile stand-alone conditions.
ME910G1 HW Design Guide Declaration of Conformity Hereby, Telit Communications S.p.A declares that the ME910G1-W1 and ME910G1-W1 Modules are in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: http://www.telit.com\red Text of 2014/53/EU Directive (RED) can be found here: https://eur-lex.europa.
ME910G1 HW Design Guide 13. SAFETY RECOMMENDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: • • Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion such as gasoline stations, oil refineries, etc.
ME910G1 HW Design Guide 14. ACRONYMS TTSC USB HS DTE UMTS WCDMA HSDPA HSUPA UART HSIC SIM SPI ADC DAC I/O GPIO CMOS MOSI MISO CLK 1VV0301593 Rev.
ME910G1 HW Design Guide CS RTC PCB ESR VSWR VNA 1VV0301593 Rev.
ME910G1 HW Design Guide 15. DOCUMENT HISTORY Revision Date 0 2019-04-12 1 2019-08-29 2 2020-01-23 3 2020-03-24 1VV0301593 Rev.
[04.2016] Mod. 0805 2016-08 Rev.
