HS3002 Series Datasheet
HS3002
Product description
The HS 3002 is a Qualcomm
®
chipset-based HSDPA
(UMTS 3G) cellular module with a 100-pin Molex®
I/O and Board-to-Board (B2B) RF connectors. This
module will excel in applications requiring low power
consumption, extended temperatures, multiple
radio choices, and optional audio support. With
dual-band HSDPA (UMTS 3G) and GPRS/EDGE radios
available in two SKUs and optional SIM, the HS 3002
is designed to meet your global integration objectives.
The HS 3002 is certied with AT&T, PTCRB, GCF, and
other regulatory bodies for international use.
Profiles
The modular architecture is shared across all
platforms and powered by a programmable rules
engine. The network router, control, and automation
capabilities provide manufacturers with a exible
structural design for rapid product development and
deployment.
This Module preseverse the same 100-pin I/O
and B2B RF connectors in the HS300x series; a
compatible x-y size and mounting; and the same
rmware API. Another benet of an HS300x family
transition is that you can even reuse most of your
valuable script features. This compatibility allows
a single design and integration effort to support
worldwide deployments across multiple carriers.
Key Benefits
• Leading-edge silicon solutions from Qualcomm
• 100-pin connector form factor is compatible
across technologies
• SIM carrier provides smallest overall system size
• SMS
• Voice
• Packet Data
• TCP/IP and UDP/IP software stack with Packet As-
sembler Disassembler
• Network router and control/automation
UMTS | HSDPA 3.6
Connectorized
28.0 mm
4.5 mm
27.0 mm
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