CE910-DUAL Hardware User Guide 1vv0301010 Rev .
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 APPLICABILITY TABLE PRODUCT CE910-DUAL Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 Contents 1. 2. 3. Introduction ...................................................................................................................... 8 1.1. Scope ............................................................................................................................ 8 1.2. Audience....................................................................................................................... 8 1.3.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 5.2.6. 6. Power Supply PCB layout Guidelines .............................................................................. 30 Antenna........................................................................................................................... 32 6.1. CDMA Antenna Requirements ................................................................................... 32 6.2. CDMA antenna – PCB line Guidelines ........................
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 12.4. Stencil ..................................................................................................................... 53 12.5. PCB Pad Design ...................................................................................................... 53 12.6. Recommendations for PCB Pad Dimensions (mm) ............................................... 53 12.7. Solder Paste ............................................................
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 1. Introduction 1.1. Scope The aim of this document is the description of typical hardware solutions useful for developing a product with the Telit CE910-DUAL module. 1.2. Audience This document is intended for Telit customers who are about to implement their applications using our CE910-DUAL modules. 1.3.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 1.4. Document Organization This document contains the following chapters: Chapter 1: “Introduction” provides a scope for this document, target audience, contact and support information, and text conventions. Chapter 2: “General Product Description” gives an overview of the features of the product. Chapter 3: “CE910-DUAL Module Connections” deals with the pin out configuration and layout.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 1.5. Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module. If these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 2. General Product Description 2.1. Overview The aim of this document is the description of typical hardware solutions useful for developing a product with the Telit CE910-DUAL module. In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 2.2. Product Specifications CE910-DUAL Specifications Air Interface CDMA 1xRTT Frequency Bands 800/1900MHz Data Service CDMA 1xRTT: 153.6 Kbps (full-duplex) Max. RF out power CDMA BC0: Power class 3 (24.5dBm) for 1xRTT CDMA BC1: Power class 2 (24.5dBm) for 1xRTT Typical conducted sensitivity CDMA BC0: Better than –108dBm CDMA BC1: Better than –107dBm Device dimensions 28.2mm(L) x 28.2mm(W) x 2.4mm(T) : 2 shields * 2.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 2.3. Audio Message SMS (MO/MT) Approvals Analog audio interface ( 1 EAR/MIC) Regulatory: FCC, IC Carrier: Verizon, Sprint (TBD) RoHS Compliance As a part of Telit’s corporate policy of environmental protection, the CE910-DUAL complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive 2002/95/EG). Reproduction forbidden without written authorization from Telit Communications S.p.A.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 3. CE910-DUAL Module Connections 3.1. Pin-Out Pin Signal I/O Function USB HS 2.0 Communication Port I/O USB differential Data(+) B15 USB_D+ I/O USB differential Data(+) C15 USB_DI Power sense for the internal USB transceiver A13 VBUS Asynchronous UART – Prog.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .
CE910-DUAL Hardware User Guide 1vv0301010 Rev .
CE910-DUAL Hardware User Guide 1vv0301010 Rev .
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 NOTE: Almost all pins not in use must be left disconnected.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 3.1.1 LGA Pads Layout Top View NOTE: The pin defined as RES must be considered RESERVED and not connected on any pin in the application. The related area on the application has to be kept empty. Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 4. Hardware Commands 4.1. Turning on the CE910-DUAL module To turn on the CE910-DUAL, the pad ON_OFF* must be tied low for at least 1 second and then released. The maximum current that can be drained from the ON_OFF* pad is 0.1 mA. A simple circuit to power on the module is illustrated below: 4.1.1.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 During the Initialization state, any kind of AT-command is not available. DTE must wait for the Activation state to communicate with CE910-DUAL. To check if the CE910-DUAL has powered on, the hardware line VAUX/PWRMON must be monitored. When VAUX/PWRMON goes high, the module has powered on. NOTE: Do not use any pull up resistor on the ON_OFF* line. It is pulled up internally.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 2. To drive the ON_OFF* pad directly with an ON/OFF button: 4.2. Turning off the CE910-DUAL module Turning off the device can be done in two ways: By software command (see CE910-DUAL Software User Guide) By hardware shutdown When the device is shut down by software command or by hardware shutdown, it issues a detach request to the network that informs the network that the device will no longer be reachable.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 4.2.1. Shutdown by Software Command The CE910-DUAL can be shut down by a software command. When a shutdown command is sent, the CE910-DUAL goes into the finalization state and will shut down PWRMON at the end of this state. The period of the finalization state can vary according to the state of the CE910-DUAL so it cannot be fixed definitely.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 TIP: To check if the device has powered off, hardware line VAUX/PWRMON must be monitored. When VAUX/PWRMON goes low, the device has powered off. 4.3. Hardware Unconditional Shutdown To unconditionally shutdown the CE910-DUAL, the pad HW_SHUTDOWN* must be tied low for at least 800 milliseconds and then released.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 TIP: The unconditional hardware Shutdown must always be implemented on the boards and the software must use it only as an emergency exit procedure. For example: To drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2): 4.4. Summary of Turning ON and OFF the Module The chart below describes the overall sequences for turning the module ON and OFF.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 5. Power Supply The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product’s overall performance. Read carefully the requirements and the guidelines that follow for a proper design. 5.1.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 Max Power Mode 750(TBD) CDMA 1x call (*1)The off current is the total supply current from the main battery with the XO regulator ON, 19.2MHz XO ON and others are OFF. (*2) Standby current consumption depends on network configuration or module configuration. NOTE: The Operating Voltage Range MUST never be exceeded. Special care must be taken in order to fulfill min/max supply voltage requirement.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. A protection diode must be inserted close to the power input in order to save the CE910-DUAL from power polarity inversion. An example of a linear regulator with 5V input: 5.2.3. +12V Input Source Power Supply Design Guidelines The desired output for the power supply is 3.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 A protection diode must be inserted close to the power input in order to save the CE910-DUAL from power polarity inversion. This can be the same diode as for spike protection. An example of switching regulator with 12V input is in the schematic below: 5.2.4. Battery Source Power Supply Design Guidelines The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V. A single 3.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 Average current consumption during CDMA 1x @PWR level max : 750 mA NOTE: The average consumption during transmissions depends on the power level at which the device is requested to transmit via the network. The average current consumption hence varies significantly.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 The protection diode must be placed close to the input connector where the power source is drained. The PCB traces from the input connector to the power regulator IC must be wide enough to ensure no voltage drops occur when the 1A current peaks are absorbed. While a voltage drop of hundreds of mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 6. Antenna The antenna connection and board layout design are the most important parts in the full product design and they strongly reflect on the product’s overall performance. Read carefully and follow the requirements and the guidelines for a proper design. 6.1.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 This transmission line shall fulfill the following requirements: Antenna Line on PCB Requirements Characteristic Impedance 50Ohm Max Attenuation 0.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 6.3. switching ICs, take care of shielding them with a metal frame cover. If EM noisy devices are not present around the line use of geometries like Micro strip or Grounded Coplanar Waveguide are preferred since they typically ensure less attenuation when compared to a Strip line having same length. CDMA Antenna installation Guidelines Install the antenna in a place covered by the CDMA signal.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 7. USB Port The CE910-DUAL module includes a Universal Serial Bus (USB) transceiver, which operates at USB Full-speed (12Mbits/sec). It is compliant with the USB 2.0 specification and can be used for diagnostic monitoring, control and data transfers.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 8. Serial Port The serial ports on the Telit CE910-DUAL are the interface between the module and OEM hardware. At this moment 1 serial port is available on the module: Modem Serial Port 1 (Main) Several configurations can be designed for the serial port on the OEM hardware. The most common are: RS232 PC comport Microcontroller UART@1.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. Pin Signal I/O N14 M15 N15 M14 P14 L14 P15 R14 DCD - dcd_uart RXD - Tx_uart TXD - Rx_uart DTR - dtr_uart DSR - dsr_uart RTS - rts_uart CTS - cts_uart RI - ri_uart O O I I O I O O Function Type Data Carrier Detect Transmit line *see Note Receive line *see Note Data Terminal Ready Data Set Ready Request to Send Clear to Send Ring Indicator B-PU, 1.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 NOTE: High-speed UART supports up to 4Mbps. Please refer to the AT command User Guide in detail. WARNING: Consider a mechanical design and a low-capacitance ESD protection device to protect CE910-DUAL or customer specific requirements from ESD event to UART port (M15, N15, P15 and L14). Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 8.2. RS232 Level Translation In order to interface the Telit CE910-DUAL with a PC com port or a RS232 (EIA/TIA-232) application, a level translator is required. This level translator must: Invert the electrical signal in both directions Change the level from 0/1.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 NOTE: In this case the length of the lines on the application has to be taken into account to avoid problems in case of High-speed rates on RS232. The RS232 serial port lines are usually connected to a DB9 connector with the following layout: Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 9. Audio Section Overview The CE910-DUAL provides one differential input for audio to be transmitted(Uplink) and a balanced output for audio to be received(Downlink). The bias for the microphone has to be as clean as possible; the first connection (single ended) is preferable since the Vmic noise and ground noise are fed into the input as common mode and then rejected.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 9.1. MIC connection If a “balanced way” is anyway desired, much more care has to be taken to VMIC noise and ground noise; also the 33pF-100ohm-33pF RF-filter has to be doubled (one each wire). TIP: Since the J-FET transistor inside the microphone acts as RF-detector-amplifier, ask vendor for a microphone with anti-EMI capacitor (usually a 33pF or a 10pF capacitor placed across the output terminals inside the case).
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 9.2. LIN-IN connection If the audio source is not a mike but a different device, the following connections can be done. Place 100nF capacitor in series with both inputs, so the DC current is blocked. Place the 33pF-100Ohm-33pF RF-filter, in order to prevent some EMI field to get into the high impedance high gain MIC inputs.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 9.3. EAR connection The audio output of the CE910-DUAL is balanced, this is helpful to double the level and to reject common mode (click and pop are common mode and therefore rejected). These outputs can drive directly a small loudspeaker with electrical impedance not lower than 32Ohm. TIP: in order to get the maximum audio level at a given output voltage level (dBspl/Vrms), the following breaking through procedure can be used.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 10. General Purpose I/O The general-purpose I/O pads can be configured to act in three different ways: Input Output Alternate function (internally controlled) Input pads can only be read and report the digital value (high or low) present on the pad at the read time. Output pads can only be written to set the value of the pad or queried.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 10.1. Logic Level Specification Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The following table shows the logic level specifications used in the CE910-DUAL interface circuits: Absolute Maximum Ratings -Not Functional Parameter Min Max Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.3V Operating Range - Interface levels (1.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 10.2. Using a GPIO Pad as Input The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device is connected with the GPIO input, the pad has interface levels different from the 1.8V CMOS. It can be buffered with an open collector transistor with a 4.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 10.4. 10.4.1. Using the Temperature Monitor Function Short Description The Temperature Monitor is a function of the module that permits control of its internal temperature and if properly set (see the #TEMPMON command on AT Interface guide) raises to High Logic level a GPIO when the maximum temperature is reached. 10.5.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 10.6. RTC Bypass Output The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital part, allowing only RTC to be active when all the other parts of the device are off. To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery. NOTE: NO devices must be powered from this pin. 10.7.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 11. ADC section 11.1. Description The on board ADC is 12-bit converter. It is able to read a voltage level in the range of 0 ~ 1.2 volts applied on the ADC pin input and store and convert it into 12 bit word. Parameter Min Max Units Input Voltage range 0 1.2 Volt AD conversion - 12 bits Resolution - < 1 mV Input Resistance 1 Mohm The CE910-DUAL provides one Analog to Digital Converter.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 12. Mounting the Module on your Board 12.1. General The CE910-DUAL has been designed in order to be compliant with a standard lead-free SMT process. 12.2. Module Finishing & Dimensions The CE910-DUAL overall dimensions are: Length : 28.2 mm Width : 28.2 mm Thickness : 2.40* mm (2 shields) Weight : 4.7 g (2 shields) Top view Bottom view (Dimensions in mm) * Thickness 2.05 mm(T) version(1 shield) is coming soon.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 12.3. Recommended foot print for the application 144 pins < Top View > In order to easily rework the CE910-DUAL it is suggested to consider having a 1.5 mm placement inhibit area around the module on the application. It is also suggested, as a common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 12.4. Stencil Stencil’s apertures layout can be the same as the recommended footprint (1:1). A suggested thickness of stencil foil is less than 120 µm. 12.5. PCB Pad Design Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB. Copper pad Solder mask Copper pad PCB Solder Mask Defined 12.6.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB Pad Surfaces: Finish Electro-less Ni / Immersion Au Layer thickness (um) 3 ~ 7 / 0.05 ~ 0.15 Properties good solder ability protection, high shear force values The PCB must be able to resist the higher temperatures which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 12.7. Solder Paste Solder Paste Lead free Sn/Ag/Cu We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly. 12.7.1.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 12.8. Debug in production To test and debug the mounting of CE910-DUAL, we strongly recommend foreseeing test pads on the host PCB, in order to check the connection between the CE910-DUAL itself and the application and to test the performance of the module connecting it with an external computer.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 13. Packing System The CE910-DUAL modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling. 13.1. Tray Drawing (1VV0700591-0A) WARNING: These trays can withstand a maximum temperature of 65℃. 13.2. Moisture Sensibility The CE910-DUAL is a Moisture Sensitive Device level 3, in accordance with standard IPC/JEDEC J-STD-020.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 14. Application Design Guide 14.1. Download and Debug Port One of the following options should be chosen in the design of host system in order to download or upgrade the Telit’s software and debug CE910-DUAL when CE910-DUAL is already mounted on a host system. Users who use both of UART and USB interfaces to communicate CE910-DUAL - Must implement a download method in a host system for upgrading CE910-DUAL when it’s mounted.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 15. Conformity Assessment Issues (Problèmes d'évaluation de conformité) The CE910-DUAL is FCC/IC Approved as module to be installed in other devices. This device should be used only for fixed and mobile applications and if the final product after integration is intended for portable use, a new application and FCC is required. Le CE910-DUAL est approuvé FCC/IC comme module à installer dans d'autres dispositifs.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 avec le gain autorisé maximum et l'impédance d’antenne exigée pour chaque type d'antenne indiqué. Les types d'antenne non inclus dans cette liste, ayant un gain supérieur au gain maximum indiqué pour ce type, sont strictement interdits pour un usage avec ce dispositif.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 16. Safety Recommendations READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion such as gasoline stations, oil refineries, etc.
CE910-DUAL Hardware User Guide 1vv0301010 Rev .0 – 2012-07-10 17. Document History Revision 0 Date 2012-07-10 Changes Initial release Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
