Taisync WLN210-BM User Manual www.taisync.
Contents 1. Package Contents ............................................................................. 3 2. Hardware Description ...................................................................... 4 2.1. System block diagram ........................................................... 4 2.2. Connecter............................................................................... 5 2.3. Debug .................................................................................... 6 2.4. Interface board ...
1. Package Contents Model:WLN210-BM 40-pin connector Fan interface Debug Serial port RF PORT RF PORT WLN210-BM-c Antenna (2dbi) (5dbi) Note: We provide different shielding structures according to different environment, so the WLN210-BM series contains three different types of structures currently. We number it WLN210-BM-a/b/c,there are supplementary pictures in the back.
2. Hardware Description Taisync RF Transmission board is Software Defined Radio Architecture. The system is able to integrate the latest advanced communication technologies, like orthogonal frequency division multiplex (OFDM) modulation, Multiple Input Multiple Output (MIMO), low density parity check (LDPC)code, etc. and has the ability to keep evolving to accommodate future applications. 2.1.System block diagram Parameters Specifications Radio Frequency 2.4GHz Bandwidth 10Mhz, 20MHz Max.
Data Input Ethernet MII (or 100Base-TX) RF interface MMCX Dimensions (mm) 75mmX45mm Power Input 5.0V/1.5A Max. Power Consumption 5.5W 2.2.Connecter Pin definition on 40-Pin connector Part number: DF12B-40Ds-0p5V_86, Manufacture: HRS Pin Net Level 1 FPGA_DONE LVCMOS(3.3V) 2 MCU_UART2_RX LVCMOS(3.3V) UART2 3 FPGA_GPIO1 LVCMOS(3.3V) GPIO 4 MCU_UART2_TX LVCMOS(3.3V) UART2 5 MII_RXC LVCMOS(3.3V) FPGA_MII 6 MII_TXC (ETH_TDP) LVCMOS(3.3V) 7 MII_RXD0 LVCMOS(3.
17 SBUS_PPM LVCMOS(3.3V) Remote signal 18 CAN_TX LVCMOS(3.3V) CAN 19 FPGA_GPIO2 LVCMOS(3.3V) GPIO 20 CAN_RX LVCMOS(3.3V) CAN 21 FPGA_GPIO3 LVCMOS(3.3V) GPIO 22 FPGA_SPI_SCK LVCMOS(3.3V) SPI 23 FPGA_GPIO4 LVCMOS(3.3V) GPIO 24 FPGA_SPI_MOSI LVCMOS(3.3V) SPI 25 FPGA_PROG LVCMOS(3.3V) 26 FPGA_SPI_CS LVCMOS(3.3V) SPI 27 MCU_RST LVCMOS(3.3V) MCU_RST 28 FPGA_SPI_MISO LVCMOS(3.
Pin Signal name 1 MCU1_JTMS-SWDIO Signal description Level attributes Remarks LVCMOS(3.3V) MCU_DEBUG 2 MCU1_JTCK-SWCLK LVCMOS(3.3V) 3 NRST# MCU_RST LVCMOS(3.3V) 4 GND Ground POWER 5 3.3V Power source POWER 6 JTAG_TCK 7 JTAG_TMS LVCMOS(3.3V) LVCMOS(3.3V) FPGA_JTAG 8 JTAG_TDO LVCMOS(3.3V) 9 JTAG_TDI LVCMOS(3.3V) 10 MCU1_USART1_RX 11 12 LVCMOS(3.3V) MCU1_USART1_TX debugging serial port GND Ground POWER LVCMOS(3.3V) 2.4.
MB_HDMI&USB-OUT Supports a HDMI video onput interface. MB_HDMI-IN Supports a HDMI video input interface. PPM/S.bus port(in & out) Interface definition and line order: 凸 G V+ G L H(PPM/SBUS, GND, POWER(3.3V), GND, CAN_L, CAN_H). Can bus is not supported now. USB port This port supports connecting mobile phone to output video. Power port Power supply port for the whole module.
3. Other structure 3.1.
3.2.
3.3.HDMI -out module(WLN210-BM-c) 4. Unit combination 4.1.Air unit Air unit(video input with HDMI port): transmission board, MB_HDMI-IN board. Air unit(video input with LAN port): transmission board, MB_LAN board. 4.2.Ground unit Ground unit(video output with HDMI&USB port): transmission board, MB_HDMI&USB-OUT board. Ground unit(video output with LAN port): transmission board, MB_LAN board.
4.3.System setup Any combination of the air unit and the ground unit can setup communication. Choose different combinations according to different application scenarios. 5. Software Program 5.1.Transmission board Tranmission board needs to program baseband and MCU1 firmware. Tranmission board can be programed for air unit or ground unit. 5.2.Interface board MB_LAN board can be programed for air unit or ground unit. MB_HDMI-IN board can only be programed for air unit.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver.
OEM Integration Instructions： This device is intended only for OEM integrators under the following conditions： The module can be used to installation in other host. The antenna must be installed such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmit or antenna. The module shall be only used with the integral antenna(s) that has been originally tested and certified with this module.
Antenna Specification: Antenna Name Frequency Band (GHz) TX Paths Max Peak Gain (dBi) RP-SMA Antenna 2.4 ~ 2.5 1 5.0 (Ant 1) PCB Antenna 2.4 ~ 2.5 1 2.0 (Ant 2) Note: The device can only use the Ant 1 When it is working at 2.5MHz Bandwidth.
