Product Specs

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Table Of Contents

Product Specification

Spec-BMS002-V1.7 Page

www.sunitec-cn.com

Features

• Supports Bluetooth 5.2 dual-mode (BDR/EDR/ BLE)

specifications

• Support Profile：A2DP1.3, AVRCP1.6,HFP1.8,HSP1.2

SPP1.2 ,DID1.3,

• ARM® Cortex®-M4 with Floating Point Unit (FPU)

application processor

Maximum speed: 208MHz

• Cadence® HiFi Mini® Audio Engine DSP coprocessor

Maximum speed: 416MHz

• low latency 400kB system RAM (SYSRAM) with

maximum speed 208MHz

• USB 2.0 device

• Support maximum three I2C Master mode 400kbps Up

to 3.4Mbps

• Support maximum three UART interface Up to 3Mbps

• Support maximum three SPI master interface, Clock up

to 52MHz

• EMMC/SDIO v2.0, up to 48MHz, 1-bit/4-bit mode

eMMC4.41 ,

• Stand-alone module with on-board PWB antenna and

Bluetooth stack

• Supports high resolution up to 24-bit, 192 kHz audio data

format

• Supports maximum three I2S interface

• Supports to connect max three hosts with HFP/A2DP

profiles simultaneously

• Supports smart phone applications by Bluetooth SPP or

BLE link

• Supports firmware field upgrade by USB/OTA

• Supports five microphones

• Compact surface mount module:28.28 * 15.60 * 4.0 mm

• LGA package 122pin, Flatness is less than 0.05mm

• RoHS compliant

• Ideal for portable battery operated devices

• Internal battery regulator circuitry DSP Audio Processing

• Support for single SCO or Esco link with CVSD/mSBC

coding.

Peripherals

• Built-in lithium-ion and lithium-polymer battery

charger (up to 1A)

• Integrated 1.8V and 3V configurable switching

regulator and low-dropout (LDO) regulator

• Built-in ADC for battery monitoring and voltage

sense

• Built-in ADC for charger thermal protection

• Built-in under voltage protection (UVP)

• An AUX-In port for external audio input

• Multiple I/O pins for control and status

HCI Interface

• High-speed HCI-UART interface (supports up to

3M bps)

BMS002 BT5.2 LE Audio Module

MT2822A

(This Photos are for reference only)

RF/Analog

• Frequency spectrum: 2.402 GHz to 2.480 GHz

• Receive sensitivity: -95 dBm (2 Mbps EDR)

• Crystal : 26MHZ ±20PPM@-20℃~+70℃

• Output Power：8±2dBm (BDR) , 6±2dBm (EDR)

4±2dBm (BLE1M/2M)

• Antenna gain：3.8dBi (peak)

Audio Codec

• SBC,AAC, LDAC

• 24-bit digital-to-analog converter (DAC) with 105dB SNR

• 24-bit analog-to-digital converter (ADC) with 95dB SNR

• Supports up to 24-bit, 192 kHz I2S digital audio

MAC/Baseband Processor

• Supports Bluetooth 5.2 dual-mode

• BDR/EDR transport for audio, voice, and SPP data

exchange

• BLE transport for proprietary transparent service and

Apple Notification Center Service (ANCS) data exchange

Operating Condition

• Operating voltage: 3.2V to 4.6V

• Operating temperature: -20°C to +70°C

Description

The BMS002 LE Audio module is made in China, a fully

qualified Bluetooth 5.2 dual-mode (BDR/EDR/BLE)

module for designers to add wireless audio and voice

applications to their products. The BMS002 products is a

Bluetooth module that provides a complete wireless solution

with Bluetooth stack, integrated PWB antenna, and

worldwide radio certifications in a compact surface-mount

package.

Applications

• Soundbar and Subwoofer (FW dependent)

• Bluetooth portable speaker phone

• Multi-speaker (FW dependent)

• Bluetooth headset

Qualifie

Confidential-Release to Stsapp from Sunitec on 20211110

Summary of content (32 pages)

PAGE 1
® Product Specification Features • Supports Bluetooth 5.2 dual-mode (BDR/EDR/ BLE) specifications • Support Profile：A2DP1.3, AVRCP1.6,HFP1.8,HSP1.2 BMS002 BT5.2 LE Audio Module Qualifie MT2822A 11 21 20 on c te (This Photos are for reference only) fr om Su ni RF/Analog • Frequency spectrum: 2.402 GHz to 2.480 GHz • Receive sensitivity: -95 dBm (2 Mbps EDR) • Crystal : 26MHZ ±20PPM@-20℃~+70℃ • Output Power：8±2dBm (BDR) , 6±2dBm (EDR) 4±2dBm (BLE1M/2M) • Antenna gain：3.
PAGE 2
® Product Specification BMS002 BT5.2 LE Audio Module Featrue......................................................................................... 1 1. DEVICE OVERVIEW .................................................................................................................... 3 1.1 BMS002 Module series.......................................................................................................... 3 2. AUDIO CODEC...........................................................................
PAGE 3
® Product Specification 1. DEVICE OVERVIEW The BMS002 LEAudio modules are built around AIROHA Technology MT2822A SoCs respectively. The MT2822A SoC integrates the Bluetooth 5.0 dual- mode radio transceiver, Power Management Unit (PMU), a crystal and DSP. Users can configure the BMS002 module by using the UI tool and DSP tool, a Windows-based utility. The BMS002 is a BT5.2 Bluetooth sub-system using MT2822A chipset from Bluetooth chipset supplier AIROHA.
PAGE 4
® Product Specification 2. AUDIO CODEC on 20 21 11 10 2.1 Auxiliary ADC Block description The auxiliary ADC includes the following functional blocks: Analog multiplexer- Selects signal from one of the eight auxiliary input pins. Real-world messages, such as temperature, are monitored and translated to the voltage domain.  12-bit A/D converter- Converts the multiplexed input signal to 12-bit digital data. ni te c  Su 2.
PAGE 5
® on 20 21 11 10 Product Specification te c 2.3 Audio downlink (Analog part) St sa pp 38mW Stereo HP driver diff.
PAGE 6
® Product Specification 2.4 Digital controller for class-G amplifier St sa pp fr om Su ni te c on 20 21 11 10 The Class-G amplifier is used for power saving of playback, and it can adjust the HP amplifier power rail according the audio content. The Class-G digital controller detects audio signal amplify and sends a control signal to buck converter through GPIO.
PAGE 7
® Co nf id en t ia l -R el e as e to St sa pp fr om Su ni te c on 20 21 11 10 Product Specification Spec-BMS002-V1.7 Page 7 of 26 www.sunitec-cn.
PAGE 8
® Product Specification 4. Battery charge specification revision 1.2 (BC1.2) 4.1Feature and description 20 21 11 10 USB charging port detection: MT2822A BC1.2 charger detector is used to distinguish the different types of charger. This BC1.2 detector provide a capable to determine several types of charging port which including Standard Downstream Ports (SDP), Charging Downstream Ports (CDP), Dedicated Charger Ports (DCP), Apple charger, non-standard charger. Typically, BC1.
PAGE 9
® Product Specification 5. Bluetooth RF Subsystem 5.1 Bluetooth description Co nf id en t ia l -R el e as e to St sa pp fr om Su ni te c on 20 21 11 10 The MT2822A series Bluetooth (BT) RF subsystem (as shown in Figure 5.1-1) consists of a highly integrated transceiver with tunable on-chip RF band pass filter (BPF) and BT TRX co-matching network.MT2822A series adopts a low intermediate frequency (LIF) receiver architecture.
PAGE 10
® Product Specification 5.3 Basic data rate – Receiver & Transmitter specifications Items Rate Units Min Typ Max -- MHZ 2402 -- 2480 RF Maximum Output Power DH5 dBm RF Maximum Power Control gain step Range DH5 dBm 6 2 8 4 10 8 RF Maximum Receiver Sensitivity@ BER＜0.1% Maximum detectable input power @ BER＜0.
PAGE 11
® Product Specification 6. Module Description as e to St sa pp fr om Su ni te c on 20 21 11 10 6.1 BMS002 module structure Co nf id en t ia l -R el e 6.2BMS002 module pin assignment and pin description Spec-BMS002-V1.7 Page 11 of 26 www.sunitec-cn.
PAGE 12
® Product Specification Table 6.1-1 pp sa St - BT_RFIN DVDD_IO_0 GPIO0 40 DIO PD DVDD_IO_0 GPIO1 23 DIO PD DVDD_IO_0 GPIO2 32 DIO PD DVDD_IO_0 GPIO3 47 DIO PD DVDD_IO_0 GPIO4 en t PD Spec-BMS002-V1.
PAGE 13
® GPIO5 60 DIO PD DVDD_IO_0 GPIO6 67 DIO PD DVDD_IO_0 GPIO7 82 DIO PD DVDD_IO_0 81 DIO PD 68 DIO 75 74 10 DVDD_IO_0 11 PD 21 DIO Alternate Pin Functions:  I2C (1)  UART(1) DMIC(1)  PWM(3)  General purpose input/output, Pin 5 Alternate Pin Functions:  I2C (1) DMIC(1)  PWM(4)   CLKO3 General purpose input/output, Pin 6 Alternate Pin Functions:  UART(1)  I2C(2)  I2S Master(0) PWM(0)   SPI Master(1)  SPI Slave(0)  AUXADC General purpose input/output, Pin 7 Alternate P
PAGE 14
® GPIO13 24 DIO PD DVDD_IO_1 GPIO14 119 DIO PD DVDD_IO_1 GPIO15 46 DIO PD DVDD_IO_1 GPIO16 39 DIO PD DVDD_IO_1 GPIO17 35 DIO PD DVDD_IO_1 GPIO18 11 DVDD_IO_1 21 Hi-Z 20 DIO Co nf id en t ia l -R el e as e to St sa pp fr om Su ni te c on 111  I2S Slave(0)  UART(1)  UART(2) AUXADC  General purpose input/output, Pin 13 Alternate Pin Functions:  PWM(2)  I2S Master(1) I2S Slave(1)  MSDC(0)   DMIC(0) General purpose input/output, Pin 14 Alternate Pin Func
PAGE 15
® DVDD_IO_0 GPIO21 37 DIO PD DVDD_IO_0 GPIO22 44 DIO PD DVDD_IO_0 GPIO23 30 DIO PD DVDD_IO_0 GPIO24 51 DIO PD DVDD_IO_0 GPIO25 58 DIO PD DVDD_IO_0 GPIO26 93 DIO DVDD_IO_0 GPIO27 11 PD 21 DIO PD 97 DIO PD DVDD_MC0 GPIO28 110 DIO PD DVDD_IO_1 GPIO29 Co nf id en t ia l -R el e as e to St sa pp fr om Su ni te c on 20 61 General purpose input/output, Pin 21 Alternate Pin Functions:  I2C(0) I2C(1)  I2S Master(1)   I2S Slave(1)  SPI Master(2) UA
PAGE 16
® GPIO30 65 DIO PD DVDD_IO_0 GPIO31 72 DIO PD DVDD_IO_0 GPIO32 79 DIO PD DVDD_MC0 GPIO33 83 DIO PD DVDD_IO_0 33 DIO PD 11 DVDD_IO_0 21 PD 20 DIO fr pp sa St DVDD_IO_0 GPIO35 en t ia l -R el e as e to GPIO34 DIO PD DVDD_IO_0 GPIO36 25 DIO PD DVDD_IO_0 GPIO37 26 DIO PD DVDD_IO_0 GPIO38 Co nf id 29 Spec-BMS002-V1.
PAGE 17
® Product Specification  SPI Slave(0)  MSDC(0)  UART(2) General purpose input/output, Pin 39 Alternate Pin Functions: I2S Master(0)   I2S Master(1)  I2S Master(2)  SPI Master（2）  SPI Slave(0)  PWM(4) CLKO2  RTC GPIO 0 RTC GPIO 1 RTC GPIO 2 PWRKEY Button SYSRSTB Button DIO PD DVDD_IO_0 GPIO39 98 99 90 86 115 DIO DIO DIO AI DI Hi-Z Hi-Z Hi-Z - RTC_GPIO0 RTC_GPIO1 RTC_GPIO2 PWRKEY SYSRSTB 113 AO - VDIG18 VDIG18 VDIG18 VSYS VIO18 AVDD18_AU D_DRV LED1 Headphone L-ch P-side 114 P - -
PAGE 18
® Product Specification 7. Antenna of BMS002 7.1 Recommended for PWB Antenna design Around of the PWB Antenna should keep out of metal over 15mm, So that RF have a good performance , fr om Su ni te c on 20 21 11 10 See Figure 7.2-1 7.2Module Placement Guidelines Co nf id en t ia l -R el e as e to St sa pp For a Bluetooth-enabled product, the antenna placement affects the overall performance of the system.
PAGE 19
® Co nf id en t ia l -R el e as e to St sa pp fr om Su ni te c on 20 21 11 10 Product Specification Spec-BMS002-V1.7 Page 19 of 26 www.sunitec-cn.
PAGE 20
® Product Specification 8. Electrical Characteristics 10 This section provides an overview of the BMS002 LEAudio module electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. Absolute maximum ratings for the BMS002 module are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability.
PAGE 21
® Product Specification -20C +70C Supply Voltage, (VBAT) 3.0V +5.5V VSYS Voltage (VSYS) 3.0V +5.5V Supply Voltage,(VIO) +1.62V +3.63V Supply Voltage,(DVDD_IO_0-2) +1.62V +3.63V 4.1V +23V 0.7 * VBAT -- -- 0.3 * VBAT 0.7 * VIO -- -- 0.3 * VIO Power key Co nf id en t ia l -R el e as e to St sa pp fr om Su ni te SYRSTB c Supply Voltage, (VBUS) 11 Operating Temperature Range 21 Max on Min 20  TABLE 8-3-1 Recommended Operating Conditions 10 8.
PAGE 22
® Product Specification om fr MAC ID：XXXXXX (last 6 digits) FW Ver: Vxx.xx (V17.03) Customer part NO: 07GBTMS00-1BXBH4-N 07GBTMS00-1BXBM4-N 07GBTMS00-1BXBL4-N Co nf id en t ia l -R el e as e to Label St 10.QR code label information: sa pp Key features of the profile: -Initial Ramp=1-2.
PAGE 23
® Product Specification 11.Certification 11.1 BQB Certification QDID TBD 10 11.2 EMC Certification 3 Europe 4 Argentina 5 6 7 8 9 Japan Malaysia UAE Mexico Peru 21 20 2 United States Canada Certification ID/No. St sa pp fr om Su ni te c 1 Certification STANDARD on No Country 11 The BMS002 module has received the regulatory approval for following countries: as e to The component does not contain any prohibited substance specified in “SS-00259”.
PAGE 24
® 20 om Su ni te c on （plastic tray size :290mm*160mm*6.5mm，qty :35 pcs/ tray） 21 11 10 Product Specification ia l -R el e as e to St sa pp fr （10 trays / package bag） en t （carton size ：310mm*340mm*340mm，6 bags / carton , total :2100pcs/carton ） Co nf id The actual photo （plastic tray photo :35 pcs/ tray） Spec-BMS002-V1.7 Page 24 of 26 www.sunitec-cn.
PAGE 25
® 11 10 Product Specification om Su ni te c on 20 21 （ESD PE bag dimension） Carton box (6bags in per carton box) Co nf id en t ia l -R el e as e to St sa pp fr （Vacuum packing ：10trays per ESD bag) Spec-BMS002-V1.7 Page 25 of 26 www.sunitec-cn.
PAGE 26
® Product Specification 13.Document History Date History 2021-02-18 2021-02-25 2021-03-02 First release Updated pin description Updated BMS002 module structure/packaging V1.3 V1.4 2021-03-25 2021-08-05 V1.5 V1.6 V1.
PAGE 27
IC Warning This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, and (2) This device must accept any interference, including interference that may cause undesired operation of the device. The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device.
PAGE 28
FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
PAGE 29
Requirement per KDB996369 D03 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.
PAGE 30
2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ – Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements. a) Information that includes permitted variances (e.g.
PAGE 31
2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an “omni-directional antenna” is not considered to be a specific “antenna type”)).
PAGE 32
2.10 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification.