Hardware Integration Guide SDC-MSD30AG version 1.03 Summit Data Communications, Inc., 526 South Main Street Suite 805 Akron, OH 44311 Tel: 866-434-4300 www.summitdatacom.com © 2006 – 2009 Summit Data Communications, Inc. All rights reserved.
Hardware Integration Guide – SDC-MSD30AG Contents Scope ............................................................................................................................................................. 3 Specifications ................................................................................................................................................ 3 Pin Definitions and Interface Notes .................................................................................................
Hardware Integration Guide – SDC-MSD30AG Scope This document describes key hardware aspects of the Summit MSD30AG 802.11a/b/g SDIO (Secure Digital Input/Output) Radio Module. This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices. Data in this document are drawn from a number of sources and includes information found in the Atheros AR6002 data sheet issued in April of 2008.
Hardware Integration Guide – SDC-MSD30AG Feature Description Thickness 4.5 mm (0.18 in.) Note: With the mating connector, the thickness is 5.1 mm above the board it plugs into. Weight 10 g (0.35 oz.) Mounting 60-pin connector 3 mounting holes (2.36 mm, 0.093 in.
Hardware Integration Guide – SDC-MSD30AG Feature Description 2.4 GHz Operating Channels ETSI: 13 (3 non-overlapping) FCC: 11 (3 non-overlapping) TELEC 14 (4 non-overlapping) KCC: 13 (3 non-overlapping) 5 GHz Operating Channels ETSI: 19 non-overlapping FCC: 23 non-overlapping TELEC: 8 non-overlapping KCC: 8 non-overlapping Wi-Fi Transmit Power Settings 802.11a 15 dBm (30 mW) 13 dBm (20 mW) 10 dBm (10 mW) 802.
Hardware Integration Guide – SDC-MSD30AG Feature Description Wi-Fi Delay Spread 600 ns @ 1 Mbps 500 ns @ 2 Mbps 400 ns @ 5.5 Mbps 400 ns @ 6 Mbps 400 ns @ 9 Mbps 200 ns @ 11 Mbps 350 ns @ 12 Mbps 350 ns @ 18 Mbps 250 ns @ 24 Mbps 250 ns @ 36 Mbps 150 ns @ 48 Mbps 150 ns @ 54 Mbps Operating Systems Supported Windows Mobile 6.5 Windows Mobile 6.1 Windows Mobile 6.0 Windows Mobile 5.0 Pocket PC 2003 Windows Embedded CE 6.0 R2 Windows Embedded CE 6.0 Windows Embedded CE 5.0 Windows Embedded CE 4.
Hardware Integration Guide – SDC-MSD30AG Feature Description Compliance ETSI Regulatory Domain EN 300 328 EN 301 489-1 EN 301 489-17 EN 301 893 EN 60950-1 EU 2002/95/EC (RoHS) FCC Regulatory Domain Part 15.247 Subpart C Initial Grant Test Report Part 15.407 Subpart E Initial Grant Test Report DTS Test Report Industry Canada RSS-210 Initial Grant Test Report RSS-Gen Issue 2 Initial Grant Test Report DTS Test Report TELEC Regulatory Domain Article 2 Item 19, Category WW (2.
Hardware Integration Guide – SDC-MSD30AG Pin Definitions and Interface Notes Pin Definitions Note: In regards to GND (Ground) pins, only one must be tied down. The remaining pins identified as GND can either be tied down or floated, depending on individual radio board design needs. Pin Number Pin Name 1 GND Ground 2 No Connect Not Used. Leave Open (Float) 3 BT_PRIORITY Bluetooth Priority 4 BT_FREQ Bluetooth Frequency 5 No Connect Not Used. Leave Open (Float) 6 No Connect Not Used.
Hardware Integration Guide – SDC-MSD30AG Pin Number Pin Name 25 No Connect Not Used. Leave Open (Float) 26 SYS_RST_L Reset 27 SDIO_DATA_2 SDIO Data 2 28 WLAN_ACTIVE Bluetooth coexistence wireless LAN active signal. See Bluetooth Coexistence 29 VCC3_3 3.3V Module Power See Pin 29 30 GND Ground 31 GND Ground 32 No Connect Not Used. Leave Open (Float) 33 No Connect Not Used. Leave Open (Float) 34 No Connect Not Used. Leave Open (Float) 35 No Connect Not Used.
Hardware Integration Guide – SDC-MSD30AG Pin Number Pin Name 53 No Connect Not Used. Leave Open (Float) 54 No Connect Not Used. Leave Open (Float) 55 SDIO_CMD SDIO Command 56 SDIO_CLK SDIO Clock 57 SDIO_DATA_0 SDIO Data 0 58 SDIO_DATA_3 SDIO Data 3 59 SDIO_DATA_1 SDIO Data 1 60 GND Ground Type Description Note Interface Notes Bluetooth coexistence – BT coexistence can be turned on or off in the SROM using the Summit Manufacturing Utility, or SMU.
Hardware Integration Guide – SDC-MSD30AG Mechanical Specifications Connector Overview MSD30AG connector: Molex 54722-0607 60-pin connector Mating connector (on board): Molex 55560-0607 60-pin connector Mounting Three through-hole mounting with a 60-pin connector. Summit recommends non-metallic screws and a 0.05 mm non-metallic bushing. 11 © 2006 – 2010 Summit Data Communications, Inc. All rights reserved. SDC-MSD30AG_HIG1.
Hardware Integration Guide – SDC-MSD30AG Regulatory Certified Antennas The SDC-MSD30AG provides two Hirose U.FL type antenna connectors to support transmit and receive diversity. For single antenna, non-diversity applications, OEMs are advised to use the Main (not Aux) antenna connector and should disable transmit and receive diversity from the Global tab of the Summit Client Utility (SCU) software utility.
Hardware Integration Guide – SDC-MSD30AG FCC User’s Guide Requirements As outlined in the Operational Description, the SDC-MSD30AG complies with FCC Part 15 Rules for a Limited Modular Approval. To leverage Summit’s grant, the two conditions below must be met for the host device into which the SDC-MSD30AG is integrated: 1. The antenna is installed with 20 cm maintained between the antenna and users. 2.
Hardware Integration Guide – SDC-MSD30AG television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: 1. Reorient or relocate the receiving antenna. 2. Increase the separation between the equipment and receiver. 3. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. 4. Consult the dealer or an experienced radio/TV technician for help.
Hardware Integration Guide – SDC-MSD30AG compliance requirements required with this module installed, such as (but not limited to) digital device emissions and PC peripheral requirements. IMPORTANT! In the event that the two conditions above cannot be met (for example certain device configurations or co-location with another transmitter), then the IC authorization is no longer considered valid and the IC ID cannot be used on the final product.
Hardware Integration Guide – SDC-MSD30AG Labeling Requirements The final end product must be labeled in a visible area with the following notice: Contains IC ID: 6616A-SDCMSD30AG European Union User’s Guide Requirements The integrator must include specific information in the user’s guide for the device into which the SDCMSD30AG is integrated.
Hardware Integration Guide – SDC-MSD30AG In Italy the end-user should apply for a license at the national spectrum authorities in order to obtain authorization to use the device for setting up outdoor radio links and/or for supplying public access to telecommunications and/or network services. This device may not be used for setting up outdoor radio links in France and in some areas the RF output power may be limited to 10 mW EIRP in the frequency range of 2454 – 2483.5 MHz.
Hardware Integration Guide – SDC-MSD30AG Nederland s [Dutch] Hierbij verklaart [naam van de fabrikant] dat het toestel [type van toestel] in overeenstemming is met de essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG. Malti [Maltese] Hawnhekk, [isem tal-manifattur], jiddikjara li dan [il-mudel tal-prodott] jikkonforma mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC. Magyar [Hungarian] Alulírott, [gyártó neve] nyilatkozom, hogy a [.
