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Document ID: PB-ZB-MOD-003-20DS

802.15.4 Family of RF Modules

High Performance and Long Range

802.15.4 STM32W RF Modules

Quickly add wireless capability with these high performance ZigBee compliant modules

READY TO USE SoC RF MODULES

Quickly add wireless networking capabilities to your

products with these ready-to-use DiZiC 802.15.4 RF

Modules. Simple to operate and available in a wide range of

configurations, these ZigBee compliant RF modules are

ideal for industrial sensors, consumer remote controls,

home appliances, and more.

Based on the STM32W108 wireless System-on-Chip

(SoC) from STMicroelectronics, this family of modules offer

outstanding RF performance with a -99 dBm normal RX

sensitivity (configurable to -100 dBm) and +3 dBm

normal mode output power (configurable up to +7 dBm).

With a small form factor and pin-to-pin compatible, DiZiC

802.15.4 RF Modules are available with several software

stack options, including EmberZNet PRO, RF4CE stack, or

proprietary low level MAC / PHY stack.

VERSATILE CONFIGURATIONS

With several possible configurations, select from 3 power

level options, 3 output options, 3 software stack options

and 2 EMI options:

Power Level Options - Choose from a standard power

level (+7 dBm), and two versions of RF front end (PA and

LNA, +20 dBm).

RF Output Options - Choose from a chip antenna, a U.FL

connector, or a single port 50 Ohm RF pad.

The U.FL connector allows, amongst other uses, for

connecting an external antenna, for connecting to an

application board that provides additional filters, or for

connecting to another 50 Ohm coaxial cable TX line. The

single port 50 Ohm RF pad allows for a direct connection

to another board, application module, or external antenna.

Software Stack Options - Choose from EmberZNet

PRO, RF4CE, or a low level PHY / MAC stack.

EmberZNet PRO is an easy to use ZigBee platform for

complex mesh networks. RF4CE (Radio Frequency for

Consumer Electronics) is a new protocol for consumer

remote controlled equipment. Custom applications can be

developed on top of a simple to use and low footprint

PHY/MAC API library.

EMI Options – Choose metal shielding protection where

enhanced electromagnetic interference immunity is

required otherwise standard version without metal

shielding is advisable.

D/Z/C 802.15.4 STM32WRF Module with

RF front end and antenna

Key Features

• STM32W108 ZigBee / IEEE 802.15.4 SoC

• 32-bit ARM Cortex-M3 processor

• 128 kB of Flash and 8 kB of SRAM

• JTAG / SWD (programming and debugging)

• 2.4 GHz ISM supporting 16 channels

• Data rate up to 250 kbit/s

• 128-bit AES encryption

• Peripherals

• 24 GPIOs, SPI, USART, and I2C

• 12-bit ADC with up to 6 inputs

• 2x 16-bit timers

• DMA controller

• Standard module

• RX Sensitivity -99 dBm (-100 dBm Boost)

• TX Power 3 dBm (+7 dBm Boost)

• RF front end options

• Two Front End options

• Both with RX Sensitivity -105 dBm

• Both with TX Power +20 dBm

• RF Options

• Chip antenna, U.FL connector, or single port 50 Ohm

RF pad

• Shielding option for enhanced EMI protection

Ordering Information

DZ_ZB_[P] [O] [S][E], where:

[P] Power level options, one of: S (standard +7 dBm), R (Front End

with Power Level Detect +20 dBm), or T (Front End +20 dBm)

[O] Output options, one of: A (Embedded SMD antenna assembled on

module), P (Single ended 50 Ohm. RF Pad), or U (50 Ohm U.FL

coaxial connector)

[S] Stack options, one of: F (RF4CE stack), X (Proprietary stack), or

Z (EmberZNet PRO stack)

[E] EMI protection options, one of: S (standard, no shielding), or

M (enhanced, with metal shield)

Summary of content (25 pages)

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802.15.4 Family of RF Modules High Performance and Long Range 802.15.4 STM32W RF Modules Quickly add wireless capability with these high performance ZigBee compliant modules READY TO USE SoC RF MODULES Quickly add wireless networking capabilities to your products with these ready-to-use DiZiC 802.15.4 RF Modules. Simple to operate and available in a wide range of configurations, these ZigBee compliant RF modules are ideal for industrial sensors, consumer remote controls, home appliances, and more.
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TABLE OF CONTENT 1 2 3 4 5 6 7 8 9 FEATURE LIST....................................................................................................................................... 3 MODULE VARIANTS............................................................................................................................... 4 2.1 INTRODUCTION ............................................................................................................................ 4 2.2 DIZIC 802.15.
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DIZIC 802.15.4 RF MODULE DZ-ZB-[P]-[O]-[S]-[E] DATA SHEET POWER LEVEL OPTIONS STANDARD FRONT END FRONT END WITH RF POWER LEVEL DETECTOR 1 FEATURE LIST Complete System-on-Chip • 32-bit ARM® Cortex-M3 processor • 2.4 GHz IEEE 802.15.
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2 MODULE VARIANTS 2.1 INTRODUCTION The DZ-ZB is low-power, high sensitivity IEEE 802.15.4 / ZigBee-compliant module. This multi-functional device based on STMicroelectronics STM32W108 fully integrated System-on-Chip [1]. The STM32W108 integrates a 2.4 GHz, IEEE 802.15.4compliant transceiver, 32-bit ARM® Cortex™-M3 microprocessor, Flash and RAM memory, and peripherals of use to designers of ZigBee-based systems [2]. Block diagrams of DZ-ZB Module is show on Figure 2.
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2.3 DIZIC 802.15.4 RF MODULE: POWER LEVEL OPTIONS The following Power Level Options are available: Option S - Standard + 7dBm STM32W chip: System on Chip - where radio, microcontroller, program/user memory, RAM, ZigBee protocols stack are integrated in one chip. Option R - Front End (PA and LNA) with RF output power level detector + 20 dBm STM32W chip: System on Chip - where radio, microcontroller, program/user memory, RAM, ZigBee protocols stack are integrated in one chip.
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3 COMPONENTS OVERVIEW 3.1 STM32W108 – SYSTEM-ON-CHIP The is a fully The is a fully integrated System-on-Chip that integrates a 2.4 GHz, IEEE 802.15.4-compliant transceiver, 32-bit ARM® Cortex™-M3 microprocessor, Flash and RAM memory, and peripherals of use to designers of ZigBee-based systems. Block diagram of STM32W108 is show on Fig. 3.1 below: Fig. 3.
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available with less than 1 μsec a power consumption while retaining RAM contents. To support user-defined applications, onchip peripherals include UART, SPI, TWI, ADC and general-purpose timers, as well as up to 24 GPIOs. Additionally, an integrated voltage regulator, power-on-reset circuit, and sleep timer are available. Finally, the STM32W utilizes standard Serial Wire and JTAG interfaces for powerful software debugging and programming of the ARM Cortex-M3 core.
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3.3 RF FRONT END This is a cost-effective and high performance RF Front End for low-power and low-voltage 2.4-GHz wireless applications. It is a range extender for all existing and future 2.4-GHz low-power RF transceivers, transmitters and System-on-Chip products. It increases the link budget by providing a power amplifier for increased output power, and an LNA with low noise figure for improved receiver sensitivity.
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4 ELECTRICAL CHARACTERISTICS 4.1 PARAMETER CONDITIONS Unless otherwise specified, all voltages are referenced to VSS. 4.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at TA = 25 °C and TA = TAmax (given by the selected temperature range).
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4.3 OPERATING CONDITIONS 4.3.1 General operating conditions Table 4.4 Operating conditions Symbol VDD_PADS TOP Parameter Min. Regulator input voltage (VDD_PADS) Operating temperature range Typ. Max. Unit 2,1 3,6 V -40 85 °C 4.3.2 Electrostatic discharge (ESD) Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination.
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4.4 DC CHARACTERISTICS Table 4.6 DC electrical characteristics Parameter Conditions Typical value for module (Power Level Option) "S" "R" "T" Standard Front End Front End Unit 2,0 - 3,6 V Regulator input voltage (VDD_PADS) Deep Sleep Current Quiescent current, internal RC oscillator disabled Quiescent current, including internal RC oscillator Quiescent current, including 32.768 kHz oscillator Quiescent current, including internal RC oscillator and 32.
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Table 4.6 DC electrical characteristics (cont) Rx current Radio receiver, MAC, and baseband ARM® Cortex-M3 sleeping 20 27 24 mA Total RX current (Radio receiver, MAC and baseband, CPU + IRAM, and Flash memory) VDD_PADS = 3,0 V, 25°C, ARM® Cortex-M3 running at 12 MHz 27 34 31 mA 28 35 32 mA 28 35 32 mA 29 36 33 mA 25°C and 1.8 V core; max. power out (+3 dBm typical) ARM® Cortex-M3 sleeping 26 136 138 mA VDD_PADS = 3.
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4.5 RF CHARACTERISTIC 4.5.1 Receiver Table 4.7 Receiver characteristics Parameter Conditions Frequency range Typical value for module (Power Level Option) "S" "R" "T" Standard Front End Front End 2400 - 2500 Unit MHz Sensitivity (boost mode) 1% PER, 20 byte packet defined by IEEE 802.15.4-2003 -100 TBD -105 dBm Sensitivity 1% PER, 20 byte packet defined by IEEE 802.15.4-2003 -99 TBD -104 dBm Co-channel rejection IEEE 802.15.
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5 MECHANICAL CHARACTERISTICS 5.1 MODULE PAD DIAGRAM Module pad connection diagram is depicted below (top view): Fig. 5.1 Pad connection diagram for modules (top view) © 2010 DiZiC Co. Ltd, 3F, N° 4-2 Jin Xi Street Taipei City 104, TAIWAN All Rights Reserved. All trademarks are property of their respective owners. Subject to change without notice. Document ID: PB-ZB-MOD-003-20DS Email: info@dizic.com | Web: www.dizic.
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5.2 MODULE PAD DESCRIPTION The following table describes the pads of the module. Table 5.1: Pad Description Pad# Signal Direction 1 GND Power Ground supply pad 2 GND Power Ground supply pad 3 VCC Power Power supply pad 4 VCC Power Power supply pad 5 nRESET I PC5 I/O Digital I/O TX_ACTIVE O Logic-level control for external Rx/Tx switch. The STM32W108 baseband controls TX_ACTIVE and drives it high (VDD_PADS) when in Tx mode.
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Table 5.
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Table 5.1: Pad Description (cont) Pad# Signal Direction PA2 I/O TIM2_CH4 (see also Pad 11) O I 15 SC2SCL I/O O SC2SCLK I 16 PA3 I/O SC2nSSEL I TRACECLK (see also Pad 27) O TIM2_CH2 (see also Pad 21) O PA4 I/O ADC4 Analog PTI_EN O TRACEDATA2 O I 17 PA5 I/O ADC5 Analog PTI_DATA O nBOOTMODE I TRACEDATA3 O PA6 I/O High current 18 19 TIM1_CH3 O I Description Digital I/O. Timer 2 channel 4 output. Disable remap with TIM2_OR[7]. Enable timer output in TIM2_CCER .
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Table 5.1: Pad Description (cont) Pad# 20 Signal Direction PB1 I/O SC1MISO O SC1MOSI O SC1SDA I/O SC1TXD O TIM2_CH1 (see also Pad 12) O I 21 PB2 I/O SC1MISO I SC1MOSI I SC1SCL I/O SC1RXD I TIM2_CH2 (see also Pad 16) O I SWCLK I/O JTCK 1 PC2 I/O JTDO O SWO O 22 23 Description Digital I/O. SPI slave data out of Serial Controller 1. Either disable timer output in TIM2_CCER, or disable remap with TIM2_OR[4]. Select SPI with SC1_MODE. Select slave with SC1_SPICR.
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Table 5.1: Pad Description (cont) Pad# Signal Direction PC3 I/O JTDI 1 GND Power PC4 I/O JTMS I SWDIO I/O PB0 I/O VREF Analog O VREF Analog I IRQA I TRACECLK (see also Pad 16) O TIM1CLK I Digital I/O Enable with GPIO_DBGCFG[5] JTAG mode select from debugger. Selected when in JTAG mode (default mode). JTAG mode is enabled after power-up or by forcing nRESET low. Select Serial Wire mode using the ARM-defined protocol through a debugger. Internal pull-up is enabled.
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Table 5.1: Pad Description (cont) Pad# Signal PB7 ADC2 31 IRQC1 TIM1_CH2 PB6 ADC1 IRQB Direction Description I/O High current Digital I/O ADC Input 2 Analog Enable analog function with GPIO_PBCFGH[15:12] I Default external interrupt source C Timer 1 channel 2 output. O Enable timer output in TIM1_CCER. Select alternate output function with GPIO_PBCFGH[15:12]. I Timer 1 channel 2 input .(Cannot be remapped). I/O High current Digital I/O. ADC Input 1.
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6 SOLDERING 6.1 SOLDER TEMPERATURE PROFILE The following Fig. 6.1 illustrates the solder temperature profile for the module. This temperature profile is similar for other RoHS compliant packages, but manufacturing lines should be programmed with this profile in order to guarantee proper solder connection to the PCB. Please note: module can be soldered only once. Reflow Profile Fig. 6.1 Reflow profile 6.2 PROFILE PARAMETERS The following table 6.1 contains the temperature profile parameters.
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6.3 RECOMMENDED FOOTPRINT Top view of recommended footprint for module is shown below on Fig. 6.2: Fig. 6.2 Recommended footprint for modules (top view) For the modules with output option “A” (with Embedded SMD Antenna) it is important to prevent presence of any conductive materials in proximity of the module’s antenna. This requirement is valid for copper traces, ground planes, wires and connectors too.
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7 ORDERING INFORMATION Example: DZ - ZB - P- O- S- E- Manufactured by DiZiC ZigBee Module Power level options S -- Standard + 7dBm R -- Front End with RF Output Power Level Detector + 20 dBm T -- Front End + 20 dBm Output options: A -- Embedded SMD Antenna P -- Single ended 50 Ohm RF Pad U -- U.
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8 LIST OF ACRONYMS This chapter defines a collection of terms that are commonly used when talking about networks in general or ZigBee in particular. AC ACK ADC API ARM BiCMOS BER CMOS CPU CTS dB dBm DC DWT EEPROM EMI ESD FE FPB GPIO HAL HBM HF HVAC I²C IEEE IRQ ISM ITM JTAG LNA MAC MCU MPU PA PCB PER PSD PTI RAM RF RF4CE RSSI RX SMD SPI STM TWI TX UART U.FL VCO ZigBee, ZigBee PRO 802.15.
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9 REFERENCES & REVISION HISTORY [1]. STM32W108HB, STM32W108CB, High-performance, 802.15.4 wireless system-on-chip, Data brief, 20-Aug-2009, Rev. 1 [2]. STM32W108HB, STM32W108CB, High-performance, 802.15.4 wireless system-on-chip, Preliminary data, 01-Mar-2010, Rev. 4 [3]. RN0034, Release notes, STM32W108xx starter and extension kits EmberZNet 4.0.2 GA, Doc ID 16225, 16-Feb-2010, Rev. 2 [4]. RN0047, Release notes, STM32W108xx starter and extension kits ZigBee RF4CE, Doc ID 17098, 23-Feb-2010, Rev. 1 [5].