AN0835 Multilayer Chip Antenna for 2.4GHz Wireless Communication RainSun Corporation http://www.rainsun.com 1 of 9 Aug, 2006 Ver.1.
AN0835 Multilayer Chip Antenna ◆ Features y Light weight and low profile 8.0mm(L) × 3.5mm(W) × 1.0mm(H) y Omni-directional in azimuth y Lead (Pb) Free ◆ Applications y 2.4GHz wireless communications y 2.4GHz Modules y Bluetooth System y 802.11b/g Wireless LAN System Specifications Center frequency Peak gain Operation temperature Storage temperature VSWR Input Impedance Power handling Bandwidth Azimuth beamwidth Polarization RainSun Corporation http://www.rainsun.com 2.
Pin configuration Top view 1 2 Pin No Pin assignment 1 Feed termination 2 Feed point mark 3 Solder termination 3 Dimensions Symbol Dimensions(mm) A 8.00 ± 0.10 B 3.50 ± 0.10 C 1.50 ± 0.02 D 0.50 ± 0.05 E 0.30 ± 0.05 H 1.00 ± 0.20 PCB Foot Print RainSun Corporation http://www.rainsun.com Symbol Dimensions(mm) G 1.0 H 1.9 I 8.0 3 of 9 Aug, 2006 Ver.1.
Recommended Test Board Pattern Top view Bottom view 50 Ohm Transmission line Ground Plane SMA connector Unit : mm Board thickness : 0.6mm Board material : FR4 Fig-1 Testing Setup Measurement Testing Instrument: Anritsu 37369C VNA(Vector Network Analyzer) VNA calibrate with 1 path reflection only calibration sequence on test board feed point. The test board dimension and it’s layout is the same as Fig‐1. RainSun Corporation http://www.rainsun.com 4 of 9 Aug, 2006 Ver.1.
Typical Electrical Characteristics Return loss Smith Chart Marker data: 1 : f=2.556 GHz 2 : f=2.368 GHz 3 : f=2.451 GHz RainSun Corporation http://www.rainsun.com 5 of 9 Aug, 2006 Ver.1.
Typical Radiation Patterns 2.45 GHz H‐Plane 2.45 GHz E‐Plane RainSun Corporation http://www.rainsun.com 6 of 9 Aug, 2006 Ver.1.
Typical Soldering Profile for Lead‐free Process Peak temp 340°C Temperature ( °C ) 340°C 300°C 150°C 5 sec. 25 sec. Pre-heating Time (sec.) Do not exceed 30 secs. Reflow Soldering 10 sec, max Temperature ( °C ) 260°C 230°C 180°C 30 sec. 60 sec. Pre-heating Time (sec.) RainSun Corporation http://www.rainsun.com 7 of 9 Aug, 2006 Ver.1.
Packing Blister Tape Specifications Symbol Dimension Tolerance Unit W 16.00 ± 0.30 mm E 1.75 ± 0.10 mm F 7.50 ± 0.10 mm D 1.50 ± 0.10 mm D1 1.50 +0.25 ‐0.00 mm P0 4.00 ± 0.10 mm P 8.00 ± 0.10 mm P2 2.00 ± 0.10 mm A0 3.70 ± 0.10 mm B0 8.20 ± 0.10 mm K0 1.40 ± 0. 10 mm T 0.30 ± 0.05 mm RainSun Corporation http://www.rainsun.com 8 of 9 Aug, 2006 Ver.1.
Reel Specifications Quantity Per Reel Tape Width (mm) A (mm) C (mm) B (mm) E (mm) W (mm) W1 (mm) 1,000 16 178±1 13±0.2 60±0.5 2.2±0.5 16.7±0.3 19.5±1.0 RainSun Corporation http://www.rainsun.com 9 of 9 Aug, 2006 Ver.1.
