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SPZB32W1A2.1 / SPZB32W1C2.1

IEEE 802.15.4 Module

Tentative

FEATURES

• Integrated 2.4GHz , IEEE 802.15.4-compliant

transceiver

• 3 dBm nominal TX output power

• -99 dBm RX sensitivity

• RX filtering for co-existence with IEEE

802.11g and Bluetooth devices

• Integrated VCO and loop filter

• Integrated IEEE 802.15.4 PHY and MAC

• 128kB Embedded flash and 8kB integrated RAM

for program and data storage

• 22 GPIO with alternate functions:

• GPIOs

• UART

• I2C

• SPI

• ADC

• 2 16-bit general purpose timers; one 16-bit sleep

timer

• ADC , sigma-delta converter with 12 bit resolution

• On board 24 MHz stable Xtal

• Selectable Integrated RC oscillator ( typ 10KHz)

or 32.768kHz Xtal for low power operation

• 0.8 uA typ power consumption in Deep sleep

mode

• Watchdog timer and power on reset

• Pins available for Non-intrusive debug interface

(SIF)

• Integrated Antenna (SPZB32W1A2.1) or

integrated RF UFL connector for external antenna

(SPZB32W1C2.1)

• Single voltage supply

• FCC and CE compliant

• Small Form Factor : 16.4 x 26.5 mm

APPLICATIONS

• Industrial controls

• Sensor Networking

• Monitoring of remote systems

• Home/Building Automation

• Security systems

• Lighting controls

DESCRIPTION

SPZB32W1A2.1 / SPZB32W1C2.1 are ready-to-use

ZigBee ® modules optimized for embedded applications

requiring short range performances. These high-

performance, very compact modules enable OEMs to easily

add short range reach wireless capability to electronic

devices by optimizing time-to-market, cost and size of their

target applications.

The modules are based on STM32W single chip ZigBee®

solution which integrates a 2.4GHz, IEEE 802.15.4-

compliant transceiver together with an embedded

processor.

24 MHz high stability Xtal is available aboard the modules

to perform the timing requirements as per ZigBee ®

specifications; additionally a 32.768kHz Xtal is provided

for low power operation.

A single supply voltage is requested to power the modules.

An innovative 2.5 GHz RF design and the relevant internal

RF Amplifier aboard ensure the optimal exploitation of the

link budget, an excellent sensitivity and still low power

consumption for battery powered operation.

The voltage supply also determines the I/O ports level

allowing an easy interface with additional peripherals.

A 128kB of embedded flash memory and 8kB of RAM are

available for data and program storage.

To support user defined applications, a number of

peripherals such as GPIO,UART,I2C, ADC and general

purpose timers are available and user selectable.

Modules are available with two different antenna options:

• SPZB32W1A2.1 with integrated ceramic

antenna aboard

• SPZB32W1C2.1 with UFL RF connector for

the connection of an external antenna.

(for details on STM32W refer to the related Datasheet )

Summary of content (12 pages)

PAGE 1
SPZB32W1A2.1 / SPZB32W1C2.1 IEEE 802.15.4 Module Tentative FEATURES • Integrated 2.4GHz , IEEE 802.15.4-compliant transceiver • 3 dBm nominal TX output power • -99 dBm RX sensitivity • RX filtering for co-existence with IEEE 802.11g and Bluetooth devices • Integrated VCO and loop filter • Integrated IEEE 802.15.
PAGE 2
SPZB32W1A2.1 / SPZB32W1C2.1 Contents 1 Block diagram ……………………………………………………………………………. 3 2 Pin Configuration …………………………………………………………………………3 3 Electrical Characteristics ………………………………………………………………. 4 3.1 Absolute Maximum Ratings …………………………………………………………… 4 3.2 Recommended Operating Conditions ……..…………………………………………… 4 3.3 DC Electrical characteristics …………………………………………………………… 4 3.4 Digital I/O Specifications …………………………………………………………….. 4 3.
PAGE 3
SPZB32W1A2.1 / SPZB32W1C2.1 1-BLOCK DIAGRAM Vdd SIF GPIO 32.768 kHz Xtal 24 MHz Xtal STM32W Tranceiver RF antenna balun BPF CONTR SIGN Figure 1. SPZB32W1A2.1 Block diagram Vdd SIF GPIO 32.768 kHz Xtal RF antenna 24 MHz Xtal STM32W Tranceiver balun BPF CONTR SIGN Figure 2. SPZB32W1C2.1 Block diagram 2-PIN CONFIGURATION Figure3.
PAGE 4
SPZB32W1A2.1 / SPZB32W1C2.1 3 – ELECTRICAL CHARACTERISTICS 3.1 - ABSOLUTE MAXIMUM RATINGS Table 1. Absolute maximum ratings Symbol VDD Vin Tstg Tsold. Parameter Module supply voltage Input voltage on any digital pin Storage tempeature Soldering temperature < 10s Min Max Unit - 0.3 - 0.3 -40 3.6 Vdd + 0.3 +85 250 V V °C °C 3.2 - RECOMMENDED OPERATING CONDITIONS Table 2.
PAGE 5
SPZB32W1A2.1 / SPZB32W1C2.1 4 – PIN DESCRIPTION Table 6.
PAGE 6
SPZB32W1A2.1 / SPZB32W1C2.
PAGE 7
SPZB32W1A2.1 / SPZB32W1C2.
PAGE 8
SPZB32W1A2.1 / SPZB32W1C2.
PAGE 9
SPZB32W1A2.1 / SPZB32W1C2.1 6 - SOLDERING Soldering phase has to be carefully executed: in order to avoid undesired melting phenomenon, particular attention has to be taken on the set up of the Peak Temperature.
PAGE 10
SPZB32W1A2.1 / SPZB32W1C2.1 Appendix A - FCC Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
PAGE 11
SPZB32W1A2.1 / SPZB32W1C2.1 A.2 - Special requirement for Modular application The following requirements are fulfilled: 1) The modular transmitter must have its own RF shielding: The RF module used on the board fulfils the emission requirements of the FCC rules without additional shielding. 2) The modular transmitter must have buffered modulation/data inputs: The module has a memory management unit inside of the IC.
PAGE 12
SPZB32W1A2.1 / SPZB32W1C2.1 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.