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ManualsBrandsST Microelectronics ManualsElectronicsSPZB32Wxy1.z series IEE802.15.4 / ZigBeeÂ® Module

Table Of Contents

RAFT

28 July 2011 Doc ID xxxxx Rev 1 1/19

SPZB32Wxy1.z

802.15.4 ZigBee

modules based on the STM32W chipset

Features

■ 2.4 GHz IEEE 802.15.4-compliant SMD

modules based on the ST STM32W chipset

solution featuring:

– Integrated 2.4 GHz transceiver

– PHY and MAC IEEE 802.15.4 features

– Integrated ARM

Cortex-M3 core

– Integrated embedded Flash and RAM

– Integrated encryption (AES-128)

accelerator

■ Power amplified RF performances:

– Up to 20 dBm nominal TX output power

– Up to 105 dBm RX sensitivity

■ Robust Wi-Fi and Bluetooth

coexistence

■ 16 channels (IEEE 802.15.4 channel 11 to 26)

■ Multiple configurable interfaces available

(UART, SPI, I2C, ADC, GPIOs)

■ Industry standard JTAG programming

■ Onboard 24 MHz and 32.768 kHz stable Xtal

■ Less than 2 uA typ power consumption in deep

sleep mode (32.768 Xtal)

■ Multiple antenna options: integrated antenna or

integrated UFL connector

■ Multiple Protocol Stack Options

■ Single voltage supply (2.1 to 3.6 V)

■ FCC and CE compliant qualified

■ Small Form Factor : 16.4 x 26.5 mm

■ Operating temperature range: -40 °C to +85 °C

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Summary of content (19 pages)

PAGE 1
SPZB32Wxy1.z 802.15.4 ZigBee® modules based on the STM32W chipset 2.4 GHz IEEE 802.15.4-compliant SMD modules based on the ST STM32W chipset solution featuring: – Integrated 2.4 GHz transceiver – PHY and MAC IEEE 802.15.
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Contents SPZB32Wxy1.z Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Pin settings . . . . . .
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SPZB32Wxy1.z Description SPZB32Wxy1.z is a series of ready-to-use IEEE 802.15.4/ZigBee compliant and power amplified RF modules optimized for embedded applications that require low data rate communications and high transmission range capabilities based on the STM32W single chip that integrates a 2.4 GHz, IEEE 802.15.4-compliant transceiver together with an ARM® Cortex embedded processor .
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RoHS compliance 2 SPZB32Wxy1.z RoHS compliance ST modules are RoHS compliant and comply with ECOPACK® norms.
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SPZB32Wxy1.z Block diagram Figure 1. SPZB32WxA1.z block diagram 6DD K(Z 8TAL - (Z 8TAL 2& ANTENNA '0)/S *TAG 34- 7 3OC ,.! 0! "0& 3YSTEM 3IGNALS ". W SPZB32WxC1.z block diagram T Figure 2. 6DD - (Z 8TAL AF K(Z 8TAL '0)/S *TAG 34- 7 3O# R 3YSTEM 3IGNALS ,.! 0! "0& 5 &) #ONNECTOR ".
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Pin settings SPZB32Wxy1.z 5 Pin settings 5.1 Pin connections Figure 3.
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Pin description Table 1. Pin description Module pin n° Pin name Direction STM32W pin Description PB5 I/O 43 Digital I/O ADC0 Analog 43 ADC Input 0 TIM2CLK I 43 Timer 2 external clock input TIM1MSK I 43 Timer 1 external clock mask input I/O 27 Digital I/O Analog 27 ADC Input 1 27 Frame signal of PTI (Packet Trace Interface) 27 Embedded serial bootloader activation out of reset SPZB32Wxy1.z 5.
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Pin description (continued) Module pin n° Pin name Direction STM32W pin Description PB4 I/O 20 Digital I/O UART_RTS O 20 UART RTS handshake of Serial Controller 1 TIM2_CH4 I/O 20 Timer 2 channel 4 input / Timer 2 channel 4 output SC1nSSEL I 20 SPI slave select of Serial Controller 1 PA0 I/O 21 Digital I/O O 21 SPI Master data out of Serial Controller 2 I 21 SPI Slave data in of Serial Controller 2 I/O 21 Timer 2 channel 1 input / Timer 2 channel 1 output 22 Digital I/O 22
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Pin description (continued) Module pin n° Pin name Direction STM32W pin Description PB0 I/O 36 Digital I/O VREF (O/I) Analog 36 ADC reference output / ADC reference input TIM1CLK I 36 Timer 1 external clock input TIM2MSK I 36 Timer 2 external clock mask input IRQA I 36 External interrupt source A O 36 Syncronous CPU trace clock I/O 30 Digital I/O O 30 UART transmit data of Serial Controller 1 30 SPI master data out of Serial Controller 1 / SPI slave data out of Serial Cont
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Pin description (continued) Module pin n° Pin name Direction STM32W pin Description PC0 I/O 40 Digital I/O (high current) JRST I 40 JTAG reset input from debugger TRACEDATA1 O 40 Syncronous CPU trace data bit 1 IRQD I 40 External interrupt source D PB7 I/O 41 Digital I/O O 41 Timer 1 channel 2 output I 41 Timer 1 channel 2 input I 41 External interrupt source C 41 ADC input 2 42 Digital I/O Pin settings 10/19 Table 1.
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SPZB32Wxy1.z Electrical characteristics 6 Electrical characteristics 6.1 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol Max. Unit Module supply voltage - 0.3 3.6 V Vin Input voltage on any digital pin - 0.3 Vdd + 0.3 V Tstg Storage temperature -40 +85 °C Tsold Soldering temperature < 10s 250 °C Recommended operating conditions Recommended operating conditions Symbol T Table 3.
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Electrical characteristics SPZB32Wxy1.z 6.4 Digital I/O specifications Table 5. Digital I/O specifications Symbol Parameter Conditions Min. Typ. Max. Unit VIL Low level input voltage 2.1 < Vdd < 3.6 V 0 0.5 x Vdd V VIH High level input voltage 2.1 < Vdd < 3.6 V 0.62 x Vdd Vdd V Iil Input current for logic 0 2.1 < Vdd < 3.6 V -0.5 mA Iih Input current for logic 1 2.1 < Vdd < 3.6 V 0.
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SPZB32Wxy1.z Mechanical dimensions Figure 4. Mechanical dimensions SLWFK PP 7ROHUDQ FHV PP [ T $QWHQQD 6FDOH Pin land pattern (dimensions in mm) 5(&200(1'(' /$1' 3$77(51 723 9,(: SLWFK D Figure 5.
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Soldering 8 SPZB32Wxy1.z Soldering The soldering phase must be carefully executed; in order to avoid undesired melting phenomenon, particular attention must be paid to the set-up of the peak temperature. Below are some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations Table 7. Soldering Profile feature PB free assembly Average ramp up rate (TSMAX to TP) 3 °C / sec max.
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SPZB32Wxy1.z 9 Product approvals Product approvals This series of modules has been designed to meet national regulations for world wide use. Different versions of modules belonging to the same series are orderable as it is specified in the Section 10. They differ in terms of integrated memory size and protocol stack enabled to run while sharing the same manufacturing , design and radios capabilities.
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Product approvals 9.1.1 SPZB32Wxy1.z FCC labeling requirements When integrating the SPZB32W1A1.1 / SPZB32W1C1.1 into the final product, il must be ensured that the FCC labelling requirements, as specified below, are satisfied. Based on the Public Notice from FCC, the product into which our transmitter module is installed must display a label referring to the enclosed module.
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SPZB32Wxy1.z Ordering information scheme 10 Ordering information scheme Table 9. Ordering information scheme SPZB 32Wx y 1 .z 802.15.
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Revision history 11 SPZB32Wxy1.z Revision history Table 10.
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SPZB32Wxy1.z Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.