User's Manual

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SPZB260C-PRO

SPZB260A-PRO

ZigBee® MODULE

June 2009

FEATURES

• Integrated 2.4 GHz, IEEE 802.15.4 compliant

transceiver (PHY and MAC)

• + 3 dBm nominal TX output power

(at UFL connector level)

• + 5 dBm in boost mode

• -95 dBm typ RX sensitivity

• RX filtering for co-existence with IEEE

802.11g and Bluetooth devices

• Integrated VCO and loop filter

• Enabled access to EZSP over synchronous serial

interface (SPI) or to EZSP over asynchronous

serial (UART)

• Integrated EmberZNet network stack version 3.1.1

for SPI access

• Embedded flash and integrated RAM for program

and data storage

• On board 24 MHz stable Xtal

• Integrated RC oscillator ( typ 10KHz) for low

power operation

• Operation over the industrial temperature range of

-40°C to +85°C

• 1 uA power consumption in deep sleep mode

• Watchdog timer and power on reset

• Pins available for Non-Intrusive debug interface

(SIF)

• Single supply voltage (2.1V to 3.6V)

• Available Link and Activity outputs for external

Indication / monitor

• Integrated RF UFL connector for external antenna

(SPZB260C-PRO) or integrated antenna

(SPZB260A-PRO )

• CE compliant

• FCC compliant (FCC ID: S9NZB260B)

APPLICATIONS

• Industrial controls

• Sensor Networking

• Monitoring of remote systems

• Home applications

• Security systems

• Lighting controls

DESCRIPTION

SPZB260C-PRO /SPZB260A-PRO is a low power

consumption ZigBee

® module optimized for embedded

applications. It enables OEMs to easily add wireless

capability to electronic devices.

The module is based on the SN260 ZigBee

® Network

Processor which integrates a 2.4GHz, IEEE 802.15.4-

compliant RF and MAC.

A single supply voltage is requested to power the module.

The voltage supply also determines the I/O port level

allowing an easy interface with the host system .

SPZB260C-PRO integrates a RF UFL connector allowing

the use of an external antenna.

SPZB260A-PRO has a specific 2.4GHz Murata

integrated antenna aboard.

The module allows a great flexibility in its integration with

an host processor as it allows connection with the external

controller via SPI or UART interfaces.

For other information and details, please refer to SN260

datasheet available at www.st.com

)

Summary of content (10 pages)

PAGE 1
SPZB260C-PRO SPZB260A-PRO ZigBee® MODULE June 2009 FEATURES • Integrated 2.4 GHz, IEEE 802.15.4 compliant transceiver (PHY and MAC) • + 3 dBm nominal TX output power (at UFL connector level) • + 5 dBm in boost mode • -95 dBm typ RX sensitivity • RX filtering for co-existence with IEEE 802.11g and Bluetooth devices • Integrated VCO and loop filter • Enabled access to EZSP over synchronous serial interface (SPI) or to EZSP over asynchronous serial (UART) • Integrated EmberZNet network stack version 3.1.
PAGE 2
SPZB260C-PRO / SPZB260A-PRO Contents 1 Block diagram ……………………………………………………………………………. 3 2 Pin Setting………. …………………………………………………………………………3 2.1 Pin connection …………………………………………………………………………………….……… 3 2.2 Pin description …………………………………………………………………………………………..…4 3 Maximum rating………..………………………………………………………………. 4 3.1 Absolute Maximum Ratings …………………………………………………………… 4 3.2 Recommended Operating Conditions ……..…………………………………………… 5 4 Electrical characteristics .………………………………………………………………. 4 4.
PAGE 3
SPZB260C-PRO / SPZB260A-PRO 1 - BLOCK DIAGRAM Vdd SIF RF antenna 24 MHz XTAL SN 260 Tranceiver SPI / UART Balun Filter CONTR SIGN Figure 1. SPZB260C-PRO block diagram Vdd SIF SPI / UART 24 MHz XTAL SN 260 Tranceiver RF antenna Balun Filter CONTR SIGN Figure 2. SPZB260A-PRO block diagram 2 - PIN SETTING 2.1 PIN CONFIGURATION Figure 3.
PAGE 4
SPZB260C-PRO / SPZB260A-PRO 2.2 – PIN DESCRIPTION The SPZB260C-PRO/ SPZB260A-PRO allows the use of EZSP application from SPI or UART. The pin description is given in table1 for both the configurations. Note that the SPZB260C-PRO / SPZB260A-PRO is shipped with the SPI EZSP application installed. Table1.
PAGE 5
SPZB260C-PRO / SPZB260A-PRO 3.2 - RECOMMENDED OPERATING CONDITIONS Table 3. Recommended operating conditions Symbol VDD Tstg Parameter Module supply voltage Operating ambient temperature Conditions Min Typ Max Unit -40°C < T < 85°C 2.1 -40 3.3 3.6 +85 V °C Typ Max Unit 4 - ELECTRICAL CHARACTERISTICS 4.1 – DC ELECTRICAL CHARACTERISTICS Tabl4. DC Electrical Characteristics Symbol Parameter Conditions Min IRX IRX RX current ( boost mode) RX current ( normal mode) Vdd = 3.0 V Vdd = 3.
PAGE 6
SPZB260C-PRO / SPZB260A-PRO 5- Package mechanical dimensions In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
PAGE 7
SPZB260C-PRO / SPZB260A-PRO 6 - SOLDERING Soldering phase has to be execute with care : in order to avoid undesired melting phenomenon, particular attention has to be take on the set up of the Peak Temperature. Here following some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C ,July 2004 recommendations. Table7.
PAGE 8
SPZB260C-PRO / SPZB260A-PRO Appendix A - FCC Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
PAGE 9
SPZB260C-PRO / SPZB260A-PRO A.2 - Special requirement for Modular application The following requirements are fulfilled: 1) The modular transmitter must have its own RF shielding: The RF module used on the board fulfils the emission requirements of the FCC rules without additional shielding. 2) The modular transmitter must have buffered modulation/data inputs: The module has a memory management unit inside of the IC.
PAGE 10
SPZB260C-PRO / SPZB260A-PRO Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.