SPBTLE-RF Bluetooth® V4.1 Smart module Product preview Features Bluetooth Radio - Bluetooth specification v4.1 compliant - Master and slave Smart Bluetooth network processor module - Embedded Bluetooth low energy protocol stack: GAP, GATT, SM, L2CAP, LL, RF-PHY - Bluetooth low energy profiles provided separately Preliminary module picture 11.5 mm x 13.5 mm x 2.
SPBTLE-RF 1 Description The SPBTLE-RF is an easy to use Bluetooth® module, compliant with Bluetooth® v4.1. The module provides a complete RF platform in a tiny form factor. The SPBTLE-RF enables wireless connectivity into electronic devices, not requiring any RF experience or expertise for integration into the final product. The SPBTLE-RF module, being a certified solution, optimizes the time to market of the final applications. The module has been designed for maximum performance in a minimal space.
SPBTLE-RF 3 Block Diagram Figure 1. HW block diagram Battery or External Supply BLUETOOTH L.E.. 2014 Module INTERNAL 2.45 GHz RF antenna SUPPLY FILTER Bead Ferrite Host Controller interface RF BALUN + Filter SPI LINE BLUETOOTH BLUENRG 32.768 kHz Crystal 32 MHz clock Internal / Ext. 32.768 kHz clock External LPO (32.768 kHz) OPTIONAL PIN FUNCTION Rev 0.
SPBTLE-RF 4 Software Architecture Bluetooth Firmware implementation Figure 2. SPBTLE-RF Application Block Diagaram Page |4 Rev 0.
SPBTLE-RF 5 Hardware Specifications General Conditions (VIN= 2.2V and 25°C) 5.1 Absolute Maximum Ratings Table 1. Absolute maximum rating Rating Storage temperature range Min -40 Typical - Max +85 Unit °C Supply voltage, VIN I/O pin Voltage (VIO five-volt tolerant pin) RF saturation input power -0.3 - + 3.9 Volts -0.3 - + 3.9 Volts - 8 - dBm 5.2 Recommended Operating Conditions Table 2.
SPBTLE-RF Table 3. Pin Assignement Name Type Pin # Description ALT Function V max. Tolerant SPI Interface SPI_IRQ O 4 SPI IRQ(SLAVE has data for MASTER) Vin SPI_CLK I 7 SPI CLOCK (Max. 8 MHz) Vin SPI_MISO O 8 SPI MISO (MASTER in / SLAVE out) Vin SPI_MOSI I 9 SPI MOSI (MASTER out SLAVE in) Vin SPI_CS I 10 SPI “Chip Select” (SPI slave select) Vin (2.0V + 3.6V max.) Power and Ground Vin 5 Vin GND 6 GND I 11 Reset input (active low < 0.35 Vin) (2.0V + 3.6V max.).
SPBTLE-RF 6 Mechanical dimensions Figure 4. Mechanical dimensions Rev 0.
SPBTLE-RF Figure 5. Recommend land pattern top view Page |8 Rev 0.
SPBTLE-RF 7 Hardware design SPBTLE-RF module supports SPI hardware interfaces. Notes All unused pins should be left floating; do not ground. All GND pins must be well grounded. The area around the module should be free of any ground planes, power planes, trace routings, or metal for 6 mm from the module antenna position, in all directions. Traces should not be routed underneath the module.
SPBTLE-RF Figure 6. Soldering profiles 9 RoHS compliance ST Bluetooth modules comply with the ECOPACK2 level of RoHS compliance grade. 10 Ordering Information Table 5. Ordering information Order code Description Packing MOQ SPBTLE-RF Bluetooth® V4.0 Smart module Jedec tray 2’448 pcs P a g e | 10 Rev 0.
SPBTLE-RF 11 Traceability Each module is univocally identified by serial number stored in a 2D data matrix laser marked on the bottom side of the module itself. The serial number has the following format: WW YY D FF NNN where WW = week YY = year D = product ID family FF = production panel coordinate identification NNN = progressive serial number. Each module bulk is identified by a bulk ID. BULK ID and module 2D data matrix are linked by a reciprocal traceability link.
SPBTLE-RF 12 12.1 Regulatory compliance FCC certification This module has been tested and found to comply with the FCC part 15 rules. These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
SPBTLE-RF Product manual instructions This section applies to OEM final products containing the SPBTLE-RF module, subject to FCC compliance. The final product manual must contain the following statement (or a similar statement that conveys the same meaning): WARNING: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. (Part. 15.
SPBTLE-RF 12.2 IC certification The SPBTLE-RF module has been tested and found compliant with the IC RSS-210 rules. These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
SPBTLE-RF In the case where an OEM seeks Class B (residential) limits for the final product, the following statement must be included in the final product manual: NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
SPBTLE-RF CE certification for SPBTLE-RF module The SPBTLE-RF module has been certified according to the following standards: EN 60950-1:2006 + A11:2009 + A12:2011 + A1:2010 + A2:2013 + AC:2011 ETSI EN 301 489-1 V1.9.2:2011 ETSI EN 301 489-17 V2.2.1 ETSI EN 300 328 V1.8.1 :2012 ETSI EN 300 328 V1.9.1 (2015) EN62479 :2010 The module is CE certified: P a g e | 16 Rev 0.
SPBTLE-RF Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.
