Data Sheet

ManualsBrandsST Microelectronics ManualsElectronicsSPBTLE-1S Bluetooth Low Energy Module

Databrief

preliminary data

Very low power application module for Bluetooth

Smart v4.2

• Bluetooth v4.2 compliant

– Supports master and slave modes

– Multiple roles supported simultaneously

• High performance, ultra-low power Cortex-M0

32-bit based architecture core

• Programmable 160 KB Flash

• 24 KB RAM with retention

• Interfaces:

1 x UART, 2 x I2C, 1xSPI, 14 x GPIO, 2

x multifunction timer, 10-bit ADC,

Watchdog & RTC, DMA controller, PDM

stream processor, SWD debug Interface

• Bluetooth radio performance:

– Embedded BlueNRG-1Bluetooth SoC

– Max Tx power: + 5 dBm

– Rx sensitivity: - 88 dBm

– Provides up to 93 dB link budget with

excellent link reliability

• On-board chip antenna

• Small form factor: 11.5mmx13.5mm

• Complemented with Bluetooth low energy

protocol stack library (GAP, GATT, SM,

L2CAP, LL)

• AES security co-processor

• Bluetooth low energy profiles provided

separately

• Certifications:

– EU Type certificate (pending)

– FCC, IC modular approval certification

(pending)

– SRRC Chinese Certification (pending)

– BT SIG End Product QDID (pending)

• Pre programmed bootloader via UART

• Operating supply voltage: from 1.7 to 3.6 V

• Operating temperature range: -40 °C to 85 °C

Applications

• Internet of Things

• Smart Home

• Building and Industrial Automation

• Smart Lighting

• Remote and access control

• Fitness, wellness and sports

• Consumer medical

• Security and proximity

• Assisted living

• PC and smart phone peripherals

Description

The SPBTLE-1S is a Bluetooth

Smart

application processor certified module, compliant

with BT specifications v4.2 and BQE qualified.

The SPBTLE-1S module supports multiple roles

simultaneously and can act at the same time as

Bluetooth Smart master and slave device.

The SPBTLE-1S is based on BlueNRG-1 system-

on-chip and entire Bluetooth Low Energy stack

and protocols are embedded into module.

The SPBTLE-1S module provides a complete RF

platform in a tiny form factor. Radio, antenna and

high frequency oscillators are integrated to offer

a certified solution to optimize the time to market

of the final applications.

The SPBTLE-1S can be powered directly with a

pair of AAA batteries or any power source from

1.7 to 3.6 V.

SPBTLE-1S

Features

Summary of content (30 pages)

PAGE 1
Databrief - preliminary data SPBTLE-1S Very low power application module for Bluetooth® Smart v4.2 – EU Type certificate (pending) – FCC, IC modular approval certification (pending) – SRRC Chinese Certification (pending) – BT SIG End Product QDID (pending) • Pre programmed bootloader via UART • • Operating supply voltage: from 1.7 to 3.6 V Operating temperature range: -40 °C to 85 °C Applications Features • Bluetooth v4.
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SPBTLE-1S Contents 1 General description ................................................................................... 4 2 Block diagram ............................................................................................ 5 3 Software Development .............................................................................. 6 4 5 6 3.1 Software development Kit .............................................................................6 3.2 Software Architecture .................
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SPBTLE-1S 9 Traceability ...............................................................................................28 10 Revision history .......................................................................................29 Rev 0.
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SPBTLE-1S 1 General description The SPBTLE-1S is a Bluetooth Smart application processor module compliant with Bluetooth® specifications v4.2 with embedded ceramic antenna. The SPBTLE-1S module has been designed around the ST BlueNRG-1 SoC where its Cortex-M0 core can execute both Bluetooth protocols and customer application.
PAGE 5
SPBTLE-1S 2 Block diagram Figure 1: HW block diagram Rev 0.
PAGE 6
SPBTLE-1S 3 Software Development 3.1 Software development Kit The SPBTLE-1S module embeds the BlueNRG-1 application processor. Refer to the BlueNRG-1 web page (http://www.st.com/en/wireless-connectivity/bluenrg-1.html) to get access to: • • • • • • BlueNRG-1 datasheet development kit application notes user manuals tools & software design note and tips Software and firmware should be configured taking into account the SPBTLE-1 specific configuration as described in the block diagram chapter.
PAGE 7
SPBTLE-1S Figure 2: SPBTLE-1S Host less mode 2. Hosted mode: the module is configured as network module controlled by an external host connected via SPI or UART. A project named DTM is available in the Development Kit that configures the SPBTLE-1S module as a network module. Figure 3: Hosted mode Rev 0.
PAGE 8
SPBTLE-1S 4 Hardware specifications General conditions (VIN= 3.3 V and 25 °C) 4.1 Absolute maximum ratings Rating Min Typ. Max Unit Storage temperature range -40 - +85 °C Supply voltage, VIN -0.3 - 3.9 V I/O pin Voltage (VIO five-volt tolerant pin) -0.3 - 3.9 V - 8 - dBm Min Typ. Max Unit Storage temperature range -40 - +85 °C Supply voltage, VIN 1.7 3.3 3.6 V Signals & I/O pin voltage (according supply voltage) 1.7 - 3.
PAGE 9
SPBTLE-1S Current consumption values has been taken using the “BlueNRG current consumption estimation tool”, configured to match the SPBTLE-1S configuration. The tool is available on ST.com at: http://www.st.com/en/embedded-software/stsw-bnrg001.html 4.4 Pin assignment Figure 4: Pin connection Rev 0.
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SPBTLE-1S Module Pin # Module Pin Name BlueNRG-1 1 ADC2 D5 ADC input 2 2 ADC1 B4 ADC input 1 3 DIO4 C3 GPIO4 UART_RXD I2C2_CLK PWM0 4 DIO5 C2 GPIO5 UART_TXD I2C2_DAT PWM1 5 Vin A3, E6 6 A5 GPIO14 I2C1_CLK SPI_CLK ADC_DATA 7 ANATEST0/ DIO14/ DIO7/BOOT(*) D2 GPIO7 UART_CTS I2C2_DAT PDM_CLK 8 GND A4, B6, C1, F5 9 DIO6 D1 GPIO6 UART_RTS I2C2_CLK PDM_DATA 10 DIO8 D3 GPIO8 UART_TXD SPI_CLK PDM_DATA 11 DIO11 E2 GPIO11 UART_RXD SPI_CS1 - 12 DIO9 E1
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SPBTLE-1S 4.5 Mechanical dimensions Figure 5: Mechanical dimensions Figure 6: Recommend land pattern top view Rev 0.
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SPBTLE-1S 5 Hardware design Note: All unused pins should be left floating; do not ground. GND pin must be well grounded. Traces should not be routed underneath the module. The area around the module should be free of any ground planes, power planes, trace routings, or metal for 6 mm from the module antenna position, in all directions. - 5.1 Reset Circuitry The SPBTLE-1S module requires an external pull-up reset circuitry to ensure proper operation at power on.
PAGE 13
SPBTLE-1S 5.3 Reflow soldering The SPBTLE-1S is a high temperature strength surface mount Bluetooth® module supplied on a 23 pin, 4-layer PCB. The final assembly recommended reflow profiles are indicated here below. Soldering phase has to be executed with care: in order to avoid undesired melting phenomenon, particular attention has to be taken on the set up of the peak temperature. Here following some suggestions for the temperature profile based on following recommendations. Table 6.
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SPBTLE-1S Figure 8: Soldering profiles P a g e | 14 Rev. 0.
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SPBTLE-1S 6 Regulatory compliance 6.1 FCC certification This module has been tested and found to comply with the FCC part 15 rules. These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
PAGE 16
SPBTLE-1S 1. this device may not cause harmful interference, and 2. 6.1.2 this device must accept any interference received, including any interference that may cause undesired operation. Product manual instructions This section applies to OEM final products containing the SPBTLE-1S module, subject to FCC compliance.
PAGE 17
SPBTLE-1S 6.2 IC certification The SPBTLE-1S module has been tested and found compliant with the IC RSS-210 rules. These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
PAGE 18
SPBTLE-1S 6.2.2 Product manual instructions This section applies to OEM final products containing the SPBTLE-1S module, subject to IC compliance. The final product manual must contain the following statement (or a similar statement that conveys the same meaning): Warning: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
PAGE 19
SPBTLE-1S 6.3 EU Type approval for SPBTLE-1S module This module complies with the following European EMI/EMC and safety directives and standards: - 6.3.1 EN 62479:2010 EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013 ETSI EN 301 489-17 V3.1.1 (2017-02) ETSI EN 301 489-1 V2.1.1 (2017-02) ETSI EN 300 328 v 2.1.1 (2016-11) Labeling instructions Pending 6.3.2 Product manual instructions Pending 6.
PAGE 20
SPBTLE-1S Appendix A Déclaration de conformité A.1 Certification FCC Le module SPBTLE-1S a été testé et déclaré conforme avec la section 15 de la Règlementation FCC. Ces limitations sont stipulées afin de procurer une protection raisonnable contre les interférences gênantes dans les installations approuvées.
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SPBTLE-1S A.1.1 Instructions d'étiquetage Lors de l'intégration du module SPBTLE-1S dans le produit final, le fabricant doit s’assurer que les exigences en matière d'étiquetage de la FCC sont satisfaites. Une déclaration doit être placée sur l’étiquette extérieure du produit final indiquant que le produit comprend un module certifié.
PAGE 22
SPBTLE-1S “Remarque : Cet équipement a été testé et déclaré conforme aux limitations prévues dans le cadre de la classe B des appareils numériques, définies par la section 15 du règlement de la FCC. Ces limites sont conçues pour fournir une protection raisonnable contre toute interférence dangereuse issue d'une installation résidentielle.
PAGE 23
SPBTLE-1S A.2 Certification IC (a) Le module SPBTLE-1S a été testé et déclaré conforme avec la Règlementation IC CNR-210. Ces limitations sont stipulées afin de procurer une protection raisonnable contre les interférences gênantes en installations approuvées. Cet appareil génère, utilise et diffuse des ondes radio et, s’il n’est pas installé et utilisé en conformité avec les instructions dont il fait l’objet, peut causer des interférences gênantes sur les communications radio.
PAGE 24
SPBTLE-1S L'étiquette doit comporter les informations suivantes (ou une mention analogue que recouvre la même notion): Contient IC ID: 8976C-SPBTLE1S OU Ce produit contient IC ID: 8976C-SPBTLE1S Le sous-traitant doit inclure les énoncés suivants sur l’étiquette extérieure du produit final à moins que le produit ne soit trop petit (par exemple moins de 4 x 4 pouces): Cet appareil est en conformité aux normes IC.
PAGE 25
SPBTLE-1S Ces limites sont conçues pour fournir une protection raisonnable contre toute interférence dangereuse issue d'une installation résidentielle. Cet équipement produit, utilise et peut émettre de l'énergie radio électrique et, s'il n'est pas installé et utilisé conformément aux présentes instructions, peut causer des interférences nuisibles aux communications radio. Cependant, il se peut que des interférences se produisent dans une installation particulière.
PAGE 26
SPBTLE-1S A.3 Certification CE Le module SPBTLE-1S a obtenu une certification de conformité aux normes suivantes:- - EN 62479:2010 EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013 ETSI EN 301 489-17 V3.1.1 (2017-02) ETSI EN 301 489-1 V2.1.1 (2017-02) ETSI EN 300 328 v 2.1.1 (2016-11) Le module est certifié CE: P a g e | 26 Rev. 0.
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SPBTLE-1SS 7 Ordering information Order code Description Packing MOQ SPBTLE-1S Bluetooth® V4.2 smart module TBD TBD Figure 9: Ordering information 30 Rev 0.
PAGE 28
SPBTLE-1S 8 ECOPACK® In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 9 Traceability Each module is univocally identified by serial number stored in a 2D data matrix laser marked on the bottom side of the module itself.
PAGE 29
SPBTLE-1S 10 Revision history Date Revision Changes 02-Feb-2017 1 Initial release. 15-Feb-2017 2 Pinout updated. Certification updated. Minor updates. Figure 11: Document revision history Rev 0.
PAGE 30
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