Specification Sheet

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Table Of Contents

EC25 Mini PCIe

Hardware Design

LTE Module Series

Rev. EC25_Mini_PCIe_Hardware_Design_V1.1

Date: 2017-01-24

www.quectel.com

Summary of content (43 pages)

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EC25 Mini PCIe Hardware Design LTE Module Series Rev. EC25_Mini_PCIe_Hardware_Design_V1.1 Date: 2017-01-24 www.quectel.
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LTE Module Series EC25 Mini PCIe Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: l e t l c a e i t u n Q ide f n o C http://www.quectel.com/support/salesupport.
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LTE Module Series EC25 Mini PCIe Hardware Design About the Document History l e t l c a e i t u n Q ide f n o C Revision Date Author Description 1.0 2016-06-07 Mountain ZHOU/ Frank WANG Initial Lyndon LIU/ Frank WANG 1. Deleted description of EC25-AUT Mini PCIe in Table 1. 2. Added description of EC25-AU and EC25-J Mini PCIe in Table 1. 3. Updated key features of EC25 Mini PCIe in Table 2. 4. Added current consumption in Chapter 4.7. 5.
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LTE Module Series EC25 Mini PCIe Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index .............................................................................................................................
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LTE Module Series EC25 Mini PCIe Hardware Design 5.2. 5.3. 5.4. 6 Mechanical Dimensions of EC25 Mini PCIe............................................................................ 38 Standard Dimensions of Mini PCI Express ............................................................................. 39 Packaging Specification........................................................................................................... 40 Appendix References .................................................
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LTE Module Series EC25 Mini PCIe Hardware Design Table Index TABLE 1: DESCRIPTION OF EC25 MINI PCIE ................................................................................................ 10 TABLE 2: KEY FEATURES OF EC25 MINI PCIE .............................................................................................. 11 TABLE 3: DEFINITION OF I/O PARAMETERS ................................................................................................. 14 TABLE 4: DESCRIPTION OF PINS .....
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LTE Module Series EC25 Mini PCIe Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 13 FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 17 FIGURE 3: REFERENCE DESIGN OF POWER SUPPLY ...............................................................................
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LTE Module Series EC25 Mini PCIe Hardware Design 1 Introduction This document defines EC25 Mini PCIe module, and describes its hardware interfaces which are connected with your application as well as its air interfaces. This document can help you to quickly understand the interface specifications, electrical and mechanical details as well as other related information of EC25 Mini PCIe module. To facilitate its application in different fields, relevant reference design documents are also provided.
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LTE Module Series EC25 Mini PCIe Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 Mini PCIe module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
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LTE Module Series EC25 Mini PCIe Hardware Design 2 Product Concept 2.1. General Description l e t l c a e i t u n Q ide f n o C EC25 Mini PCIe module provides data connectivity on LTE-FDD, LTE-TDD, WCDMA and GSM networks with PCI Express Mini Card 1.2 standard interface. It supports embedded operating systems such as WinCE, Linux, Android, etc., and also provides audio, high-speed data transmission and GNSS functionalities for your applications.
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LTE Module Series EC25 Mini PCIe Hardware Design 2.2. Description of Product Series The following table shows the product series of EC25 Mini PCIe module.
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LTE Module Series EC25 Mini PCIe Hardware Design 3. 3) B2 band on EC25-AU Mini PCIe module does not support receive diversity. 2.3. Key Features The following table describes the detailed features of EC25 Mini PCIe module. Table 2: Key Features of EC25 Mini PCIe Feature l e t l c a e i t u n Q ide f n o C Details Function Interface PCI Express Mini Card 1.2 Standard Interface Power Supply Supply voltage: 3.0~3.6V Typical supply voltage: 3.
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LTE Module Series EC25 Mini PCIe Hardware Design EDGE: Support EDGE multi-slot class 12 (12 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4, MCS 1-9 Uplink coding schemes: CS 1-4, MCS 1-9 Internet Protocol Features SMS USIM Interface UART Interface Audio Feature PCM Interface USB Interface Support TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/HTTPS*/SMTP*/ MMS*/FTPS*/SMTPS*/SSL* protocols Support the protocols PAP (Password Authentication Proto
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LTE Module Series EC25 Mini PCIe Hardware Design Temperature Range Operation temperature range: -35°C ~ +75°C1) Extended temperature range: -40°C ~ +80°C2) Firmware Upgrade USB interface and DFOTA* RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 3. “*” means under development. 1) Within operating temperature range, the module is 3GPP compliant.
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LTE Module Series EC25 Mini PCIe Hardware Design 3 Application Interface 3.1. General Description l e t l c a e i t u n Q ide f n o C The physical connections and signal levels of EC25 Mini PCIe comply with PCI Express Mini CEM specifications. This chapter mainly describes the following interfaces’ definition and application of EC25 Mini PCIe:        Power supply USIM card interface USB interface UART interface PCM&I2C interfaces Control signals Antenna interface 3.2.
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LTE Module Series EC25 Mini PCIe Hardware Design Table 4: Description of Pins Pin No. Mini PCI Express Standard Name EC25 Mini PCIe Pin Name I/O Description 1 WAKE# WAKE# OC Output signal can be used to wake up the host. 2 3.3Vaux VCC_3V3 PI 3.3V DC supply 3 COEX1 RESERVED Reserved 4 GND GND Mini card ground 5 COEX2 RESERVED 6 1.
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LTE Module Series EC25 Mini PCIe Hardware Design 24 3.3Vaux RESERVED Reserved 25 PERp0 UART_RTS 26 GND GND Mini card ground 27 GND GND Mini card ground 28 1.5V NC 29 GND GND DO UART request to send Connect to DTE’s CTS Mini card ground Require external pull-up to 1.8V.
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LTE Module Series EC25 Mini PCIe Hardware Design 48 1.5V NC 49 RESERVED PCM_DIN* 50 GND GND 51 RESERVED PCM_SYNC* IO PCM frame synchronization 52 3.3Vaux VCC_3V3 PI 3.3V DC supply DI PCM data input Mini card ground NOTES 1. 2. l e t l c a e i t u n Q ide f n o C Keep all NC, reserved and unused pins unconnected. “*” means the digital audio (PCM) function is only supported on Telematics version. 3.2.2.
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LTE Module Series EC25 Mini PCIe Hardware Design 3.3. Power Supply The following table shows pin definition of VCC_3V3 pins and ground pins. Table 5: Definition of VCC_3V3 and GND Pins Pin No. Pin Name I/O Power Domain Description 2, 39, 41, 52 VCC_3V3 PI 3.0~3.6V 3.3V DC supply l e t l c a e i t u n Q ide f n o C 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 GND Mini card ground The typical supply voltage of EC25 Mini PCIe is 3.3V.
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LTE Module Series EC25 Mini PCIe Hardware Design 3.4. USIM Card Interface The following table shows the pin definition of USIM card interface. Table 6: USIM Pin Definition Pin No. Pin Name I/O Power Domain Description 8 USIM_VDD PO 1.8V/3.0V Power source for the USIM card 10 USIM_DATA IO 1.8V/3.0V USIM data signal 12 USIM_CLK DO 1.8V/3.0V USIM clock signal 14 USIM_RST DO 1.8V/3.0V USIM reset signal l e t l c a e i t u n Q ide f n o C EC25 Mini PCIe supports 1.8V and 3.
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LTE Module Series EC25 Mini PCIe Hardware Design    To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS whose parasitic capacitance should not be more than 50pF. The 22 ohm resistors should be added in series between the module and the USIM card so as to suppress EMI spurious transmission and enhance ESD protection.
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LTE Module Series EC25 Mini PCIe Hardware Design In order to ensure the integrity of USB data line signal, components R1, R2, R3 and R4 must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. In order to ensure the USB interface design corresponding with the USB 2.
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LTE Module Series EC25 Mini PCIe Hardware Design The UART interface supports 9600, 19200, 38400, 57600, 115200 and 230400bps baud rate. The default is 115200bps. This interface can be used for AT command communication. NOTE AT+IPR command can be used to set the baud rate of the UART, and AT+IFC command can be used to set the hardware flow control (hardware flow control is disabled by default). Please refer to document [2] for details. l e t l c a e i t u n Q ide f n o C 3.7.
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LTE Module Series EC25 Mini PCIe Hardware Design In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, PCM_CLK supports 128, 256, 512, 1024 and 2048kHz for different speed codecs. The following figure shows the timing relationship in primary mode with 8kHz PCM_SYNC and 2048kHz PCM_CLK.
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LTE Module Series EC25 Mini PCIe Hardware Design Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. In addition, EC25 Mini PCIe’s firmware has integrated the configuration on some PCM codec’s application with I2C interface. Please refer to document [2] for details about AT+QDAI command. The following figure shows a reference design of PCM interface with an external codec IC.
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LTE Module Series EC25 Mini PCIe Hardware Design 3.8.1. RI Signal The RI signal can be used to wake up the host. When URC returns, there will be the following behavior on the RI pin after executing AT+QCFG=“risignaltype”,“physical” command. 120 ms High Low URC return l e t l c a e i t u n Q ide f n o C Figure 9: RI Behavior 3.8.2. DTR Signal The DTR signal supports sleep control function. Driving it to low level will wake up the module. 3.8.3.
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LTE Module Series EC25 Mini PCIe Hardware Design VCC_3V3 ≤460ms ≥150ms VIH≥2.3V PERST# VIL≤0.5V Module Status Running Resetting Restart l e t l c a e i t u n Q ide f n o C Figure 10: Timing of Resetting Module 3.8.5. LED_WWAN# Signal The LED_WWAN# signal of EC25 Mini PCIe is used to indicate the network status of the module, which can absorb the current up to 40mA. According to the following circuit, in order to reduce the current of the LED, a resistor must be placed in series with the LED.
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LTE Module Series EC25 Mini PCIe Hardware Design 3.8.6. WAKE# Signal The WAKE# signal is an open collector signal which is similar to RI signal, but a host pull-up resistor and AT+QCFG=“risignaltype”,“physical” command are required. When URC returns, there will be 120ms low level pulse output as below. 120ms High (external pull-up) l e t l c a e i t u n Q ide f n o C Low URC return Figure 12: WAKE# Behavior 3.9.
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LTE Module Series EC25 Mini PCIe Hardware Design The following figure shows the overall sizes of RF connector. l e t l c a e i t u n Q ide f n o C Figure 13: Dimensions of the RF Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the RF connector. Figure 14: Mechanicals of U.
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LTE Module Series EC25 Mini PCIe Hardware Design 4 Electrical and Radio Characteristics 4.1. General Description l e t l c a e i t u n Q ide f n o C This chapter mainly describes the following electrical and radio characteristics of EC25 Mini PCIe:       Power supply requirements I/O requirements Current consumption RF characteristics GNSS receiver ESD characteristics 4.2. Power Supply Requirements The input voltage of EC25 Mini PCIe is 3.
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LTE Module Series EC25 Mini PCIe Hardware Design 4.3. I/O Requirements The following table shows the I/O requirements of EC25 Mini PCIe. Table 15: I/O Requirements Parameter Description Min. Max. Unit VIH Input High Voltage 0.7 × VCC_3V3 VCC_3V3+0.3 V VIL Input Low Voltage -0.3 0.3 × VCC_3V3 V VOH Output High Voltage VCC_3V3-0.5 VCC_3V3 V VOL Output Low Voltage 0 0.4 V l e t l c a e i t u n Q ide f n o C NOTES S 1. The PCM and I2C interfaces belong to 1.
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LTE Module Series EC25 Mini PCIe Hardware Design LTE-TDD bands 23dBm±2dB <-44dBm Table 17: EC25-A Mini PCIe Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) WCDMA B2 -110.0dBm / / -104.7dBm WCDMA B4 -110.0dBm / / -106.7dBm WCDMA B5 l e t l c a e i t u n Q ide f n o C -110.5dBm / / -104.7dBm LTE FDD B2 (10M) -98.0dBm -98.0dBm -101.0dBm -94.3dBm LTE FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.3dBm LTE FDD B12 (10M) -96.5dBm -98.0dBm -101.
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LTE Module Series EC25 Mini PCIe Hardware Design Table 19: EC25-E Mini PCIe Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) GSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dbm WCDMA B1 -110.5dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm WCDMA B8 l e t l c a e i t u n Q ide f n o C -110.5dBm / / -103.7dBm LTE-FDD B1 (10M) -98.0dBm -98.0dBm -101.5dBm -96.3dBm LTE-FDD B3 (10M) -96.5dBm -98.5dBm -101.5dBm -93.
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LTE Module Series EC25 Mini PCIe Hardware Design XTRA file contains predicted GPS and GLONASS satellites coordinates and clock biases valid for up to 7 days. It is best if XTRA file is downloaded every 1-2 days. Additionally, EC25 Mini PCIe can support standard NMEA-0183 protocol and output NMEA messages with 1Hz via USB NMEA interface. EC25 Mini PCIe GNSS engine is switched off by default. You must switch on it by AT command.
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LTE Module Series EC25 Mini PCIe Hardware Design LTE-FDD PF=128 (USB disconnected) 4.8 mA WCDMA PF=64 (USB disconnected) 27.0 mA WCDMA PF=64 (USB connected) 40.0 mA LTE-FDD PF=64 (USB disconnected) 43.0 mA LTE-FDD PF=64 (USB connected) 59.0 mA WCDMA B2 HSDPA @22.63dBm 764.0 mA WCDMA B2 HSUPA @23.19dBm 741.0 mA WCDMA B4 HSDPA @22.45dBm 745.0 mA WCDMA B4 HSUPA @22.57dBm 752.0 mA WCDMA B5 HSDPA @22.49dBm 616.0 mA WCDMA B5 HSUPA @22.43dBm 637.0 mA LTE-FDD B2 @22.92dBm 977.
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LTE Module Series EC25 Mini PCIe Hardware Design LTE-FDD PF=128 (USB disconnected) 5.0 mA LTE-TDD PF=64 (USB disconnected) 5.8 mA LTE-TDD PF=128 (USB disconnected) 4.9 mA GSM DRX=5 (USB disconnected) 30.0 mA GSM DRX=5 (USB connected) 43.0 mA WCDMA PF=64 (USB disconnected) 31.0 mA l e t l c a e i t u n Q ide f n o C WCDMA PF=64 (USB connected) 45.0 mA LTE-FDD PF=64 (USB disconnected) 31.0 mA LTE-FDD PF=64 (USB connected) 44.0 mA LTE-TDD PF=64 (USB disconnected) 32.
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LTE Module Series EC25 Mini PCIe Hardware Design WCDMA data transfer (GNSS OFF) DCS1800 2DL/3UL @25.97dBm 440.0 mA DCS1800 1DL/4UL @25.82dBm 553.0 mA WCDMA B1 HSDPA @22.49dBm 798.0 mA WCDMA B1 HSUPA @21.87dBm 788.0 mA WCDMA B5 HSDPA @22.66dBm 781.0 mA WCDMA B5 HSUPA @21.99dBm 770.0 mA l e t l c a e i t u n Q ide f n o C LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call WCDMA B8 HSDPA @22.23dBm 655.0 mA WCDMA B8 HSUPA @21.68dBm 659.0 mA LTE-FDD B1 @23.12dBm 940.
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LTE Module Series EC25 Mini PCIe Hardware Design Table 24: Current Consumption of EC25-V Mini PCIe Parameter Description Sleep state IVBAT Conditions Typ. Unit AT+CFUN=0 (USB disconnected) 3.4 mA LTE-FDD PF=64 (USB disconnected) 4.8 mA LTE-FDD PF=128 (USB disconnected) 4.3 mA LTE-FDD PF=64 (USB disconnected) 30.0 mA LTE-FDD PF=64 (USB connected) 42.0 mA LTE-FDD B4 @23.3dBm 873.0 mA LTE-FDD B13 @22.13dBm 638.
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LTE Module Series EC25 Mini PCIe Hardware Design 5 Dimensions and Packaging 5.1. General Description l e t l c a e i t u n Q ide f n o C This chapter mainly describes mechanical dimensions as well as packaging specification of EC25 Mini PCIe module. 5.2.
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LTE Module Series EC25 Mini PCIe Hardware Design 5.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1] for detailed A and B.
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LTE Module Series EC25 Mini PCIe Hardware Design EC25 Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in the document [1]. The following figure takes the Molex 679100002 as an example. l e t l c a e i t u n Q ide f n o C Figure 17: Dimensions of the Mini PCI Express Connector (Molex 679100002, Unit: mm) 5.4. Packaging Specification The EC25 Mini PCIe is packaged in a tray. Each tray contains 10pcs of modules.
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LTE Module Series EC25 Mini PCIe Hardware Design 6 Appendix References Table 26: Related Documents SN Document Name Remark [1] PCI Express Mini Card Electromechanical Specification Revision 1.
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LTE Module Series EC25 Mini PCIe Hardware Design GNSS Global Navigation Satellite System GPS Global Positioning System GSM Global System for Mobile Communications HR Half Rate kbps Kilo Bits Per Second LED Light Emitting Diode LTE Mbps ME MIMO MMS MO MT PCM PDU PPP RF Rx USIM SIMO SMS UART l e t l c a e i t u n Q ide f n o C Long-Term Evolution Million Bits Per Second Mobile Equipment (Module) Multiple-Input Multiple-Output Multimedia Messaging Service Mobile Originated Mobile Terminated