Specifications

ManualsBrandsSIMCom ManualsElectronicsLTE /HSPA/GSM/GNSS MODULE

Table Of Contents

空白页面

SIM7600G/G-H_Hardware

Design_V1.01

Summary of content (50 pages)

PAGE 1
SIM7600G/G-H_Hardware Design_V1.
PAGE 2
Smart Machine Smart Decision Document Title SIM7600G/SIM7600G-H_Hardware Design Version 1.01 Date 2019-10-21 Status Released Document Control ID SIM7600G_SIM7600G-H_Hardware Design _V1.01 General Notes SIMCom offers this information as a service to its users to support the application and engineering efforts that use the products designed by SIMCom. The information provided is based on the requirements specifically from the users.
PAGE 3
Smart Machine Smart Decision FCC Caution: (1)Exposure to Radio Frequency Radiation. This equipment must be installed and operated in accordance with provided instructions and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter.
PAGE 4
Smart Machine Smart Decision Contents Contents .............................................................................................................................................3 Revision History ................................................................................................................................5 1 Introduction ................................................................................................................................6 1.1 Product Outline ........
PAGE 5
Smart Machine Smart Decision 3.16.1 3.16.2 3.16.3 Sink Current Source ..................................................................................................44 ADC ..........................................................................................................................45 LDO ..........................................................................................................................45 4 RF Specifications ...........................................................
PAGE 6
Smart Machine Smart Decision 1 Introduction This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and testing results of the SIMCom MODULE. With the help of this document and other software application notes/user guides, users can understand and use MODULE to design and develop applications quickly. 1.1 Product Outline Aimed at the global market, the MODULE support GSM, WCDMA, LTE-TDD and LTE-FDD.
PAGE 7
Smart Machine Smart Decision FDD B26 √ √ FDD B28 √ √ FDD B66 √ √ TDD B34 √ √ TDD B38 √ √ TDD B39 √ √ TDD B40 √ √ TDD B41 √ √ CAT1 CAT4 Category With a small physical dimension of 30*30*2.9 mm and with the functions integrated, the MODULE can meet almost any space requirement in users’ applications, such as smart phone, PDA, industrial handheld, machine-to-machine and vehicle application, etc. 1.
PAGE 8
Smart Machine Smart Decision 1.3 Hardware Block Diagram The block diagram of the MODULE is shown in the figure below. Figure 1: MODULE block diagram SIM7600G_SIM7600G-H_Hardware Design _V1.
PAGE 9
Smart Machine Smart Decision 1.4 Functional Overview Table 2: General features Feature Implementation Power supply Single supply voltage 3.4～4.2V, Recommend supply voltage 3.8V Power saving Current in sleep mode : <5mA Please refer to the table 1 GSM/GPRS power class: --GSM850: 4 (2W) --EGSM900: 4 (2W) --DCS1800: 1 (1W) --PCS1900: 1 (1W) EDGE power class: --GSM850: E2 (0.5W) --EGSM900: E2 (0.5W) --DCS1800: E1 (0.4W) --PCS1900: E1 (0.4W) UMTS power class: --WCDMA :3 (0.25W) LTE power class: 3 (0.
PAGE 10
Smart Machine Smart Decision Audio feature Support PCM interface Only support PCM master mode and short frame sync, 16-bit linear data formats UART interface A full modem serial port by default Baud rate: 300bps to 4Mbps(default:115200bps) Autobauding baud rate: 9600,19200,38400,57600,115200bps Can be used as the AT commands or data stream channel Support RTS/CTS hardware handshake Multiplex ability according to GSM 07.10 Multiplexer Protocol MMC/SD Support MMC and SD cards with 2.
PAGE 11
Smart Machine Smart Decision 2 Package Information 2.1 Pin Assignment Overview All functions of the MODULE will be provided through 135 pads that will be connected to the users’ platform. The following Figure is a high-level view of the pin assignment of the MODULE.
PAGE 12
Smart Machine Smart Decision Table 3: Pin definition Pin No. Pin name Pin No.
PAGE 13
Smart Machine Smart Decision 69 RI 70 DCD 71 TXD 72 DTR 73 PCM_OUT 74 PCM_IN 75 PCM_SYNC 76 PCM_CLK 77 GND 78 GND 79 GNSS_ANT 80 GND 81 GND 82 MAIN_ANT 83 COEX1●* 84 COEX2* 85 BOOT_CFG0●* 86 COEX3●* 87 GPIO77 88 RESERVED 89 RESERVED 90 RESERVED 91 RESERVED 92 RESERVED 93 GND 94 GPIO4 95 GPIO2 96 GPIO1 97 GPIO_54 98 GND 99 RESERVED 100 RESERVED 101 RESERVED 102 RESERVED 103 RESERVED 104 RESERVED 105 RESERVED 106 DBG_ RXD 107 RESERV
PAGE 14
Smart Machine Smart Decision 2.2 Pin Description Table 4: IO parameters definition Pin type Description PI Power input PO Power output AI Analog input AIO Analog input/output I/O Bidirectional input /output DI Digital input DO Digital output DOH Digital output with high level DOL Digital output with low level PU Pull up PD Pull down Table 5: Pin description Pin name Pin No.
PAGE 15
Smart Machine Smart Decision 0,131,13 2,133,13 4135 System Control PWRKEY 3 DI,PU System power on/off control input, active low. RESET 4 DI, PU System reset control input, active low. SD_CMD 21 I/O,PD SDIO command SD_DATA0 22 I/O,PD SD_DATA1 23 I/O,PD SD_DATA2 24 I/O,PD SD_DATA3 25 I/O,PD SD_CLK 26 DO SDIO clock SD_DET 48 DI,PU SD card insertion detect H: SD card is removed L: SD card is inserted The high voltage is 0.8V; RESET has been pulled up to 1.
PAGE 16
Smart Machine Smart Decision USB_DP 13 AI, AO Positive line of the differential, bi-directional USB signal.
PAGE 17
Smart Machine Smart Decision keep them open. SDIO_DATA0 30 I/O SDIO data0 SDIO_DATA3 31 I/O SDIO data3 SDIO_CLK 32 DO SDIO clock HSIC_STROBE 35 I/O HSIC strobe wakeup HSIC_DATA 36 HSIC interface I/O HSIC data If use, please refer to document [27] Otherwise please keep them open. PCM interface PCM_OUT 73 DO,PD PCM data output. PCM_IN 74 DI,PD PCM data input. PCM_SYNC 75 I/O,PD PCM data frame sync signal. PCM_CLK 76 I/O,PU PCM data bit clock.
PAGE 18
Smart Machine Smart Decision COEX2* COEX3●* BOOT_CFG0●* 84 86 85 I/O RFsynchronizing between Wi-Fi and LTE. I/O RF synchronizing between Wi-Fi and LTE. DI,PD Boot configuration input. Module will be forced into USB download mode by connect 85 pin to VDD_1V8 during power up. FLIGHTMODE* 54 DI,PU Flight Mode control input. High level(or open): Normal Mode Low level: Flight Mode GPIO3* 33 IO GPIO GPIO6* 34 IO GPIO IO Default: GPIO Optional: USIM card detecting input.
PAGE 19
Smart Machine Smart Decision 2.3 Mechanical Information The following figure shows the package outline drawing of MODULE. Figure 3: Dimensions (Unit: mm) SIM7600G_SIM7600G-H_Hardware Design _V1.
PAGE 20
Smart Machine Smart Decision 2.4 Footprint Recommendation Figure 4: Footprint recommendation (Unit: mm) SIM7600G_SIM7600G-H_Hardware Design _V1.
PAGE 21
Smart Machine Smart Decision 3 Interface Application 3.1 Power Supply The power supply pins of MODULE include 4 pins (pin 62&63, pin 38&39) named VBAT. The 4 VBAT pads supply the power to RF and baseband circuits directly. On VBAT pads, the ripple current up to 2A typically, due to GSM/GPRS emission burst (every 4.615ms), may cause voltage drop. So the power supply for these pads must be able to provide sufficient current up to more than 2A in order to avoid the voltage drop is more than 300mV.
PAGE 22
Smart Machine Smart Decision 3.1.1 Power Supply Design Guide Make sure that the voltage on the VBAT pins will never drop below 3.4V, even during a transmit burst, when current consumption may rise up to 2A. If the voltage drops below 3.4V, the RF performance may be affected. Note: If the power supply for VBAT pins can support up to 2A, more than 300uF capacitors are recommended .Otherwise users must use a total of 1000uF capacitors typically, in order to avoid of the voltage drop more than 300mV.
PAGE 23
Smart Machine Smart Decision 3.1.2 Recommended Power Supply Circuit It is recommended that a switching mode power supply or a linear regulator power supply is used. It is important to make sure that all the components used in the power supply circuit can resist a peak current up to 2A. The following figure shows the linear regulator reference circuit with 5V input and 3.8V output.
PAGE 24
Smart Machine Smart Decision 3.2 3.2.1 Power on/Power off/Reset Function Power on MODULE can be powered on by pulling the PWRKEY pin down to ground. The PWRKEY pin has been pulled up with a diode to 1.8V internally, so it does not need to be pulled up externally. It is strongly recommended to put a100nF capacitor, an ESD protection diode, close to the PWRKEY pin as it would strongly enhance the ESD performance of PWRKEY pin. Please refer to the following figure for the recommended reference circuit.
PAGE 25
Smart Machine Smart Decision Table 8: Power on timing and electronic characteristic Symbol Parameter Min. Ty p. Max. Unit Ton The time of active low level impulse of PWRKEY pin to power on MODULE 100 500 - ms Ton(status) The time from power-on issue to STATUS pin output high level(indicating power up ready ) 15 16 - Ton(uart) The time from power-on issue to UART port ready 13 14 - s Ton(vdd_aux) The time from power-on issue to VDD_AUX ready 2.
PAGE 26
Smart Machine Smart Decision Figure 11: Power off timing sequence Table 9: Power off timing and electronic characteristic Symbol Parameter Toff Time value Unit Min. Typ. Max. The active low level time pulse on PWRKEY pin to power off MODULE -- 2.
PAGE 27
Smart Machine Smart Decision Figure 12: Reference reset circuit Table 10: RESET pin electronic characteristic Symbol Description Min. Typ. Max. Unit Treset The active low level time impulse on RESET pin to reset MODULE 100 200 500 ms VIH Input high level voltage 1.17 1.8 2.1 V VIL Input low level voltage -0.3 0 0.8 V 3.3 UART Interface MODULE provides a 7-wire UART (universal asynchronous serial transmission) interface as DCE (Data Communication Equipment).
PAGE 28
Smart Machine Smart Decision Figure 13: UART full modem Figure 14: UART null modem The MODULE UART is 1.8V voltage interface. If user’s UART application circuit is 3.3V voltage interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR provided by Texas Instruments is recommended. The following figure shows the voltage matching reference design. VDD_1V8 or External 1V8 3.
PAGE 29
Smart Machine Smart Decision Figure 16: level matching circuit To comply with RS-232-C protocol, the RS-232-C level shifter chip should be used to connect MODULE to the RS-232-C interface, for example SP3238ECA, etc. Note1: User needs to use high speed transistors such as MMBT3904. Note2: MODULE supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. The default band rate is 115200bps. 3.3.
PAGE 30
Smart Machine Smart Decision Figure 177: RI behaviour（SMS and URC report） Normally RI will be kept at a high level until a voice call, then it will output periodic rectangular wave with 5900ms low level and 100ms high level. It will output this kind of periodic rectangular wave until the call is answered or hung up. Figure 188 : RI behaviour（voice call） Note: For more details of AT commands about UART, please refer to document [1] and [22]. DTR pin can be used to wake MODULE from sleep.
PAGE 31
Smart Machine Smart Decision Figure19: USB reference circuit Because of the high bit rate on USB bus, more attention should be paid to the influence of the junction capacitance of the ESD component on USB data lines. Typically, the capacitance should be less than 1pF. It is recommended to use an ESD protection component such as ESD9L5.0ST5G provided by On Semiconductor (www.onsemi.com ).
PAGE 32
Smart Machine Smart Decision Main features of SGMII:  Ethernet Mac integrated in the module  IEEE 802.3 Ethernet 10/100/1000Mbps, SGMII IF  Supports IEEE 1588, Precision Time Protocol (PTP)  Full duplex rated to 1 Gbps  Half/full duplex for 10/100 Mbps  Can be connected to external Ethernet PHY like AR8031/AR8033(industrial 10/100/1000Mbps), BCM89820(automotive 10/100Mbps)  Uses 8B10B encoding of data with effective baud data rate of 1 Gbps, data rate is always 1.
PAGE 33
Smart Machine Smart Decision 3.6.2 Reference schematic with BCM89820 Figure21: Reference SGMII circuit with BCM89820 Note: The module SGMII function default closed. If user need, please contact SIMCom for more details or refer to document [28] SIM7600G_SIM7600G-H_Hardware Design _V1.
PAGE 34
Smart Machine Smart Decision 3.7 USIM Interface MODULE supports both 1.8V and 3.0V USIM Cards. Table 12: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V) Symbol Parameter Min. Typ. Max. Unit USIM_ VDD LDO power output voltage 1.75 1.8 1.95 V VIH High-level input voltage 0.65*USIM_VDD - USIM_VDD +0.3 V VIL Low-level input voltage -0.3 0 0.35*USIM_VDD V VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V VOL Low-level output voltage 0 0 0.
PAGE 35
Smart Machine Smart Decision Figure 192: USIM interface reference circuit Note: USIM_DATA has been pulled up with a 10KΩ resistor to USIM_VDD in MODULE. A 100nF capacitor on USIM_VDD is used to reduce interference. For more details of AT commands about USIM, please refer to document [1].USIM_CLK is very important signal, the rise time and fall time of USIM_CLK should be less than 40ns, otherwise the USIM card might not be initialized correctly.
PAGE 36
Smart Machine Smart Decision SIM card circuit is susceptible, the interference may cause the SIM card failures or some other situations, so it is strongly recommended to follow these guidelines while designing:  Make sure that the SIM card holder should be far away from the antenna while in PCB layout.  SIM traces should keep away from RF lines, VBAT and high-speed signal lines.  The traces should be as short as possible.  Keep SIM holder’s GND connect to main ground directly.
PAGE 37
Smart Machine Smart Decision Recommended USIM Card Holder It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by Amphenol. User can visit http://www.amphenol.com for more information about the holder. Figure 214: Amphenol SIM card socket Table 134: Amphenol USIM socket pin description Pin C1 C2 C3 C5 C6 C7 Signal USIM_VDD USIM_RST USIM_CLK GND VPP USIM_DATA Description USIM Card Power supply. USIM Card Reset. USIM Card Clock. Connect to GND. NC USIM Card data I/O.
PAGE 38
Smart Machine Smart Decision 3.8 PCM Interface MODULE provides a PCM interface for external codec, which can be used in master mode with short sync and 16 bits linear format. Table 145: PCM format Characteristics Specification Line Interface Format Linear(Fixed) Data length 16bits(Fixed) PCM Clock/Sync Source Master Mode(Fixed) PCM Clock Rate 2048 KHz (Fixed) PCM Sync Format Short sync(Fixed) Data Ordering MSB Note: For more details about PCM AT commands, please refer to document [1]. 3.8.
PAGE 39
Smart Machine Smart Decision Figure 247: Module to EXT codec timing Table 16: PCM timing parameters Parameter Description Min. Typ. Max. Unit T(sync) PCM_SYNC cycle time – 125 – μs T(synch) PCM_SYNC high level time – 488 – ns T(syncl) PCM_SYNC low level time – 124.
PAGE 40
Smart Machine Smart Decision Figure 258: Audio codec reference circuit 3.9 SD Interface MODULE provides a 4-bit SD/MMC/eMMC interface with clock rate up to 200 MHz. When connected to a SD or MMC card, the voltage of SD interface is 1.8/2.85V, which is compatible with Secure Digital Physical Layer Specification version 3.0 and SDIO Card Specification version 3.0.It supports up to 128GB SD cards. When connected to a eMMC card, the interface voltage will be a single 1.
PAGE 41
Smart Machine Smart Decision Figure29: SD reference circuit Users should provide 2.85V to power eMMC card system and 1.8V to power the SDIO_DATA/CMD/CLK signals. The source of 2.85V should be able to provide more than 500mA* which showed below as VCC_eMMC, as the source of 1.8V should be able to provide more than 300mA* which showed below as VCCQ_1V8. ESD/EMI components should be arranged close to the eMMC card. Refer to the following application circuit.
PAGE 42
Smart Machine Smart Decision SD/MMC/eMMC card layout guide lines: ● Protect SD card signals from noisy signals (clocks, SMPS, etc.). ● Up to 200 MHz clock rate, 50 Ω nominal, ±10% trace impedance ● CLK to DATA/CMD length matching < 1 mm ● Total routing length < 50 mm ● Spacing to all other signals = 2x line width ● Bus capacitance < 10 pF 3.10 I2C Interface MODULE provides a I2C interface compatible with I2C specification, version 5.0, with clock rate up to 400 kbps. Its operation voltage is 1.8V.
PAGE 43
Smart Machine Smart Decision communication link with peripheral devices. Its operation voltage is 1.8V, with clock rates up to 50 MHz Note：For more details of the AT commands about the SPI, please refer to document [1]. 3.13 Network status The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the following figure. Figure32: NETLIGHT reference circuit Note: The value of the resistor named “R” depends on the LED characteristic.
PAGE 44
Smart Machine Smart Decision current consumption. Bidirectional ESD protection component is suggested to add on FLIGHTMODE pin, its reference circuit is shown in the following figure. Figure 33: Flight mode switch reference circuit Table 20: FLIGHTMODE pin status FLIGHTMODE pin status Input Low Level Input High Level Module operation Flight Mode: RF is closed AT+CFUN=0: RF is closed AT+CFUN=1:RF is working 3.15 Other interface 3.15.
PAGE 45
Smart Machine Smart Decision Figure34: ISINK reference circuit Note: The sinking current can be adjusted to meet the design requirement through the AT command “AT+ CLEDITST =<0>, ”.The “value” ranges from 0 to 8, on behalf of the current from 0mA to 40mA by 5mA step. 3.15.2 ADC MODULE has 2 dedicated ADC pins named ADC1 and ADC2.They are available for digitizing analog signals such as battery voltage and so on. These electronic specifications are shown in the following table.
PAGE 46
Smart Machine Smart Decision Table 23: Electronic characteristic Symbol Description Min. Typ. Max. Unit VVDD_AUX Output voltage 1.7 2.85 3.05 V IO Output current - - 150 mA Note：For more details of AT commands about VDD_AUX, please refer to document [1]. SIM7600G_SIM7600G-H_Hardware Design _V1.
PAGE 47
Smart Machine Smart Decision 4 RF Specifications 4.1 GSM/UMTS/LTE RF Specifications Table 16: Conducted transmission power Table 17: Operating frequencies Frequency GSM850 EGSM900 Receiving 869～894MHz Transmission 824～849 MHz 925～960MHz 880～915 MHz SIM7600G_SIM7600G-H_Hardware Design _V1.
PAGE 48
Smart Machine Smart Decision DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B19 1805～1880 MHz 1930~1990 MHz 2110～2170 MHz 1930~1990 MHz 2110~2155MHz 869～894 MHz 877~882MHz 925～960 MHz 875~890MHz 1710～1785 MHz 1850~1910 MHz 1920～1980 MHz 1850~1910 MHz 1710~1755MHz 824～849 MHz 832~837MHz 880～915 MHz 835~845MHz The LTE Operating frequencies are shown in the following table 24. Note: Operating frequencies of LTE TDD B41 for the MODULE is 100MHz BW, 2555～2655 MHz GPS 1574.
PAGE 49
Smart Machine Smart Decision Table 19: Conducted receive sensitivity Frequency GSM850 Receive sensitivity(Typical) < -109dBm Receive sensitivity(MAX) EGSM900 < -109dBm 3GPP DCS1800 < -109dBm 3GPP PCS1900 < -109dBm 3GPP WCDMA B1 < -110dBm 3GPP WCDMA B2 < -110dBm 3GPP WCDMA B4 < -110dBm 3GPP WCDMA B5 < -110dBm 3GPP WCDMA B6 < -110dBm 3GPP WCDMA B8 < -110dBm 3GPP WCDMA B19 < -110dBm LTE FDD/TDD See table 26. 3GPP 3GPP 3GPP Table 2620: Reference sensitivity (QPSK) E-UTR 1.
PAGE 50
Smart Machine Smart Decision 4.2 GSM /UMTS/LTE Antenna Design Guide Users should connect antennas to MODULE’s antenna pads through micro-strip line or other types of RF trace and the trace impedance must be controlled in 50Ω. SIMCom recommends that the total insertion loss between the antenna pads and antennas should meet the following requirements: Table 21: Trace loss Frequency Loss 700MHz-960MHz <0.5dB 1710MHz-2170MHz <0.9dB 2300MHz-2650MHz <1.