User's Manual

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CONFIDENTIAL

Title:

IEEE802.11ac wave2 SDIO wireless LAN module

SX-SDMAC-2830 / SX-SDMAC-2831SX-SDCAC-2830

Drawing Type :

Operational description & User manual

Drawing No.:

JW202570AS

Date :

June 20, 2019

Summary of content (110 pages)

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Title: IEEE802.11ac wave2 SDIO wireless LAN module SX-SDMAC-2830 / SX-SDMAC-2831SX-SDCAC-2830 Drawing Type : Operational description & User manual Drawing No.: JW202570AS Date : June 20, 2019 © silex technology, Inc.
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Drawing No.：JW202570AS 改版履歴 (Revision History) Rev. Description AX The first release. (初版) AA §2 Corrected block diagram AB §1 Added “20/40MHz Co-existence is not supported” AC §4 Corrected typo.(BT_I2S_WS : pull-up > pull-down) AD AE Date Prepared Checked Approved Oct.19,16 M.Ieda K.Yoshikawa Y.Shibuya Oct.27,16 M.Ieda K.Yoshikawa Y.Shibuya Nov.11,16 M.Ieda K.Yoshikawa Y.Shibuya Dec.13,16 T.Minobe K.Okazaki Y.Shibuya §11 Updated the number of thermal shock cycles to 300.
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Drawing No.：JW202570AS 改版履歴 (Revision History) §1 特徴: FCC DFS Master 未取得の旨を記載 §1 Features: Added comment of FCC DFS Master is unacquired. AK §6.1 §1 の記載に伴う FCC/IC の内容変更 Jan.31,18 §6.1 Changed description of FCC/IC according to §1. 黒田家田渋谷 Y.Kuroda M.Ieda Y.Shibuya §6.2 AA258 及び AA222 のアンテナゲイン誤記修正 §6.2 Corrected antenna gain errors of AA258 and AA222. §3.6 仕向け毎の送信電力から IEEE 802.11 規格に準拠した最大送信電力値に変更 §3.6 Changed from TX power at each destination to maximum TX power compliant with IEEE 802.
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Drawing No.：JW202570AS 目次(Table of Contents) 目次(Table of Contents) ........................................................................................................................................................................................... 4 1. 製品概要 (Product introduction) ............................................................................................................................................................ 5 2. ハードウェアブロック図 (Hardware block diagram) ........................
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Drawing No.：JW202570AS 本書は SX-SDMAC-2830S と SX-SDMAC-2831S、SX-SDMAC-2831C、SX-SDCAC-2830 について説明するものです。モジュールのモデル名/ハードウェアバージョン識別番号(HVIN)は「SX-SDMAC」です。 This document describes about “SX-SDMAC-2830S”,“SX-SDMAC-2831S”,“SX-SDMAC-2831C” and “SX-SDCAC-2830”. Model name/Hardware Version Identification Number (HVIN) of this module is “SX-SDMAC”. 1. 製品概要 (Product introduction) SX-SDMAC は、QCA9377-3 (Qualcomm Atheros 社)を採用した、2.4GHz/5GHz Dual Band IEEE 802.11 a/b/g/n/ac、Bluetooth 5.0 BR/EDR/LE(Class2) 及び SDIO3.
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Drawing No.：JW202570AS 特徴 (Features) ￭ IEEE802.11a/b/g/n/ac 準拠(2.4 GHz, 5 GHz) IEEE802.11a/b/g/n/ac compliant (2.4 GHz, 5 GHz) ￭ 1 スペーシャルデータストリームシステム (1T1R) 1 spatial data stream system (1T1R) ￭ 5 GHz：20/40/80 MHz 帯域幅モード対応 (PHY データレート 433 Mbps) 2.4 GHz：20/40 MHz 帯域幅モード対応 (PHY データレート 150 Mbps,拡張 PHY データレート 200Mbps) *20/40MHz Co-existence には非対応。 5 GHz: Support 20/40/80 MHz bandwidth mode (PHY Data rate 433 Mbps) 2.
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Drawing No.：JW202570AS ※要 DFS Master 対応ソフトウェア、現時点では FCC DFS Master 未取得 DFS Master software is necessary. FCC DFS Master is not acquired at the moment. ￭ Bluetooth 5.0 BR/EDR/LE(Class2)。Bluetooth 1.x, 2.x, 3.0, 4.0, 4.1 下位互換 Bluetooth 5.0 BR/EDR/LE(Class2). Backward-compatible to Bluetooth 1.x, 2.x, 3.0, 4.0, 4.1 ￭ Wireless LAN ホストインターフェイスとして SDIO 3.0 対応 SDIO3.0 as the Wireless LAN host interface ￭ Bluetooth ホストインターフェイスとして UART 対応 UART as the Bluetooth host interface ￭主電源+3.3V, IO 電源(VDD_GPIO)+1.8V/+3.
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Drawing No.：JW202570AS 略語 (Acronyms) PMU Power Management Unit DCDC DC to DC converter (Switching regulator) IPD LPF Integrated Passive Device type Low Pass Filter IPD DPX Integrated Passive Device type Diplexer IPD CPL Integrated Passive Device type Coupler SPDT RFSW Single Pole Double Throw RF switch MHF MHF co-axial connector NOTE1: ANT1 または ANT2 のどちらか一方を選んで通信を行います。(同時送信はしません) One of antenna (ANT1/ANT2) is chosen to send/receive data. (No concurrent transmission) © silex technology, Inc.
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Drawing No.：JW202570AS 3. 基板仕様 (Board specifications) 3.1.
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Drawing No.：JW202570AS 3.2. 環境条件 (Environmental specifications) Specifications Items Min. Typ. Max.
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Drawing No.：JW202570AS NOTE2 部品倉庫などで長期間 (弊社出荷後 1 年間)保管する際の推奨条件です。ドライパック未開封状態の場合、この条件下でドライパック内の湿度が 10%RH 未満に保たれます。ドライパック内の湿度が 10%RH 以上となったかどうかの判断は、保管期間に関わらず、§10 に示す湿度表示シートでご確認ください。保管期間 1 年以上経過後や輸送時に保管条件を超えた可能性が有った場合は、製造前に湿度表示シートの確認やハンダ濡れ性の確認を実施することを推奨いたします。 This is condition to keep the product in the warehouse for long term (1 year after shipping from Silex). In case of unpacked of the dry pack, humidity of inside shall be keep less than 10%RH.
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Drawing No.：JW202570AS 3.3. 電気的仕様 (Electrical specifications) 絶対最大定格 (Absolute Maximum Ratings) Specifications Items 主電源電圧 (VDD) Main Power supply voltage IO 電源電圧 (VDD_GPIO) IO Power supply voltage SDIO 電源電圧(VDD_SDIO) SDIO Power supply voltage Units Min. Typ. Max. -0.30 － +3.65 V -0.30 － +4.00 V -0.30 － +4.00 V Remarks 推奨動作条件 (Recommended Operating Conditions) 主電源 / Bluetooth 電源(Main power supply/Bluetooth power supply) Items 主電源電圧 (VDD) Main Power supply voltage Specifications Min.
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Drawing No.：JW202570AS デジタル論理信号レベル (Digital logic signal level) 1) VIO (VDD_GPIO, VDD_SDIO) = +3.3V operation Items VIH VIL VOH VOL Parameters Specifications Min. Typ. Max. － 0.7 x VIO +3.3 VIO + 0.3 V － -0.3 － 0.3 x VIO V VIO - 0.4 －－ V －－ 0.1 x VIO V 入力 High レベル電圧 Input High Voltage 入力 Low レベル電圧 Input Low Voltage 出力 High レベル電圧 Output High Voltage 出力 Low レベル電圧 Output Low Voltage Units Output/Input current IOH = 3mA IOL = -11mA Remarks 2) VIO (VDD_GPIO, VDD_SDIO) = +1.
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Drawing No.：JW202570AS 3.4. 消費電流仕様 (Current consumption specifications) VDD (WLAN operating) Specifications Items 消費電流 Current consumption Modes Max. 11b 350 400 mA 11g 320 390 mA 11ng HT20 320 380 mA 11ng HT40 320 380 mA Rx All mode 70 110 mA Tx 11a 430 570 mA 11na HT20 440 570 mA 11na HT40 430 550 mA 11ac VHT80 430 530 mA All mode 90 140 mA 2.4GHz 消費電流 Current consumption Units Typ.
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Drawing No.：JW202570AS VDD_GPIO Specifications Items Modes 消費電流 Tx Current consumption Rx Units Typ. Max. +1.8V operation 7 15 mA +3.3V operation 7 15 mA +1.8V operation 7 15 mA +3.3V operation 7 15 mA Typ. Max. +1.8V operation 3 10 mA +3.3V operation 3 10 mA +1.8V operation 3 10 mA +3.3V operation 3 10 mA Remarks VDD_SDIO Specifications Items Modes 消費電流 Tx Current consumption Rx NOTE1: Units Remarks Typ.
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Drawing No.：JW202570AS 3.5. 無線 LAN 一般仕様 (Wireless LAN general specifications) Items チップセット Chipset 国/地域コード Country/Domain code 動作周波数 Operating Frequency range Specifications Units QCA9377-3 (Qualcomm Atheros) － 0x0000 － Band 2.4GHz 5GHz Modes Min Max 11b 2412 2472 MHz 11g/n/ac 20MHz 2412 2472 MHz 11g/n/ac 40MHz 2422 2462 MHz 11a/n/ac 20MHz 5180 5825 MHz 11n/ac 40MHz 5190 5795 MHz 11ac 80MHz 5210 5775 MHz 周波数間隔 2.
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Drawing No.：JW202570AS 利用可能チャネルリスト (Operatable channel list) 2.4GHz US/CA EU/JP 5GHz US CA EU/JP 20MHz Ch.1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 40MHz Ch.3, 4, 5, 6, 7, 8, 9 20MHz Ch.1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13 40MHz Ch.3, 4, 5, 6, 7, 8, 9, 10, 11 20MHz Ch.36,40,44,48,52,56,60,64,100,104,108,112,116,120,124,128,132,136,140,144,149,153,157,161,165 40MHz Ch.38,46,54,62,102,110,118,126,134,142,151,159 80MHz Ch.42,58,106,122,138,155 20MHz Ch.
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Drawing No.：JW202570AS 3.6. 無線 LAN 送信仕様 (Wireless LAN Transmitter specifications) IEEE 802.11 規格に準拠した最大送信電力値を示すものです。ただし、各チャネルの最終的な送信電力値は、各国の電波法認証により制限を受けます。 There is maximum TX power which is compliant with IEEE 802.11 standard. Actual TX Power value of each channel is limited by the regulatory certification of each country, however. 2.4GHz (+25℃) Data Rates Standard 802.11b 802.11g Modulation Index 2.4 GHz TX Power with IEEE 802.11 EVM and Spectral Mask at +25℃ 802.11b/g 802.11n/ac 20 MHz 802.
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Drawing No.：JW202570AS 5GHz (+25℃) Data Rates Standard Modulation BPSK 802.11a 5 GHZ TX Power with IEEE 802.11 EVM and Spectral Mask at +25℃ 802.11a 802.11n/ac 20 MHz 802.11n/ac 40 MHz 802.11n/ac 80 MHz Typical Typical Typical Typical 6 Mbps 13.5 - - - dBm Index Units BPSK 9 Mbps 13.5 - - - dBm QPSK 12 Mbps 13.5 - - - dBm QPSK 18 Mbps 13.0 - - - dBm 16 QAM 24 Mbps 12.5 - - - dBm 16 QAM 36 Mbps 10.5 - - - dBm 64 QAM 48 Mbps 10.
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Drawing No.：JW202570AS Transmit power uncertainty (Operating temperature) Specifications Items 周囲環境条件による送信パワーの不確かさ Power uncertainty due to environmental conditions ※温度、電源条件 Temperature, Power supply Modes Min. Typ. Max. Units 802.11a 6-54Mbps -2.0 － +2.0 dB 802.11b 1-11Mbps -2.0 － +2.0 dB 802.11g 6-54Mbps -2.0 － +2.0 dB 802.11n/ac MSC0-9 -2.0 － +2.0 dB Remarks Frequency accuracy (Operating temperature) Items 周波数精度 Frequency accuracy © silex technology, Inc.
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Drawing No.：JW202570AS 3.7. 無線 LAN 受信仕様 (Wireless LAN Receiver specifications) 2.4GHz 動作温度 (Operating temperature） Specifications Items Modes Min. Typ. Max. Units Remarks 最小受信感度 11b 1Mbps － -95 -80 dBm Receiver minimum (FER<8%) 2Mbps － -93 -80 dBm 5.
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Drawing No.：JW202570AS 5GHz 動作温度 (Operating temperature） Specifications Items Modes Min. Typ. Max.
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Drawing No.：JW202570AS 3.8. Bluetooth 一般仕様 (Bluetooth general specifications) Items チップセット Chipset コア仕様 Core specification Specifications Units QCA9377-3 (Qualcomm Atheros) － Bluetooth 5.0 － Mode 動作周波数 Min Max 2402 2480 Remarks Max antenna gain +5.0dBi@2.4GHz Operating Frequency range BR/EDR/LE 周波数間隔 BR/EDR 1 MHz Ch.1-Ch.79 Frequency step LE 2 MHz Ch.0-Ch.
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Drawing No.：JW202570AS 3.9. Bluetooth 送信仕様 (Bluetooth Transmitter specifications) Bluetooth BR/EDR/LE (+25℃) Specifications Items Standards 最大送信電力 Maximum TX power 送信電力ステップ Tx power step Min. Typ. Max. Units Remarks BR Class 2 Ch.1-Ch.79 -3.7 +0.5 +4.0 dBm Class 2 EDR Class 2 Ch.1-Ch.79 -6.7 -2.5 +1.0 dBm Class 2 LE Ch.0-Ch.39 -4.2 +1.5 +3.5 dBm BR/EDR Ch.1-Ch.79 2.0 － 8.
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Drawing No.：JW202570AS 4. 4.1. 信号仕様 (Signal pin specifications) SMT type ピン配置 (SMT type pin locations) SX-SDMAC-2830S (Bottom view) SX-SDMAC-2831S (Bottom view) © silex technology, Inc.
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Drawing No.：JW202570AS 4.2. SMT type 信号仕様 (SMT type signal descriptions) Pin Pin Name Number Type I/O Descriptions Domain 未使用信号。未接続処理(Open)とする。 1 RESERVED DI VDD_GPIO 2 RESERVED DO VDD_GPIO 3 GND GND GND Ground 4 NC NC NC NC pin 5 NC NC NC NC pin 6 VDD P P 7 WLAN_PWD_L PD VDD_GPIO Un-used signal. Keep Open. 未使用信号。未接続処理(Open)とする。 Un-used signal. Keep Open. 主電源 +3.135～+3.465V。 Main Power Supply +3.135V to +3.
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Drawing No.：JW202570AS Pin Pin Name Number 16 SD_CMD Type B I/O Descriptions Domain VDD_SDIO WLAN 用 SDIO Command 信号。 SDIO command for WLAN. WLAN 用 SDIO Data[3]信号。Bootstrap option に使用されているため、Reset 解除まではドラ 17 SD_D3 B VDD_SDIO イブしないでください。内部 Pull-up。 SDIO Data[3] for WLAN. Since this pin is used for Bootstrap option, you must not drive this pin until releasing the reset signal. Internal Pull-up.
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Drawing No.
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Drawing No.：JW202570AS Pin Number Pin Name Type I/O Descriptions Domain 未使用信号。VDD_GPIO へ外部 Pull-up、Test pad への接続を推奨。(もしくは Open とする。) 46 RESERVED OD Open drain オープンドレイン出力。 Un-used signal. Recommended to connect to a test pad and Pull-up by VDD_GPIO. (or keep Open) Open drain output. 47 WOW OD Open drain Wake on wireless 信号。アクティブ High。オープンドレイン出力。要 VDD への外部 Pull-up。 Wake on wireless signal. Active High. Open drain output. Need external pull-up to VDD.
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Drawing No.：JW202570AS Pin Pin Name Number 53 RESERVED 54 GND 55 Type I/O Descriptions Domain 未使用信号。OPEN とする。内部 Pull-down PD VDD GND GND RESERVED PD VDD 56 NC NA NA NC pin 57 GND GND GND Ground 58 BT_PWD_L PD VDD_GPIO 59 NC NA NA NC pin 60 NC NA NA NC pin © silex technology, Inc. Un-used signal. Keep Open. Internal Pull-down Ground 未使用信号。OPEN とする。内部 Pull-down Un-used signal. Keep Open. Internal Pull-down.
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Drawing No.：JW202570AS 4.4. B2B type 信号仕様 (B2B type signal descriptions) Pin Pin Name Number Type I/O Descriptions Domain 1 VDD P P 2 VDD P P 3 VDD P P 4 BT_UART_RTS DO VDD_GPIO 主電源 +3.135～+3.465V。 Main Power Supply +3.135V to +3.465V 主電源 +3.135～+3.465V。 Main Power Supply +3.135V to +3.465V 主電源 +3.135～+3.465V。 Main Power Supply +3.135V to +3.465V BT 用 UART RTS 信号。BT 未使用時は未接続処理(Open)とする。 UART RTS for BT. Keep Open if BT is not used.
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Drawing No.：JW202570AS Pin Pin Name Number 11 SD_D0 Type B I/O Descriptions Domain VDD_SDIO WLAN 用 SDIO Data[0]信号。 SDIO Data[0] for WLAN. WLAN 用 SDIO Data[1]信号。Bootstrap option に使用されているため、Reset 解除まではドラ 12 SD_D1 B VDD_SDIO イブしないでください。内部 Pull-up。 SDIO Data[1] for WLAN. Since this pin is used for Bootstrap option, you must not drive this pin until releasing the reset signal.
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Drawing No.：JW202570AS Pin Pin Name Number Type I/O Descriptions Domain WLAN HW リセット信号。(0=Disable, 1=Enable)内部 Pull-down。 21 WLAN_PWD_L PD VDD_GPIO 22 NC NA NA 23 RESERVED DO VDD_GPIO 24 RESERVED DI VDD_GPIO 25 NC NA NA NC pin 26 GND GND GND Ground WLAN reset. (0=Disable, 1=Enable) Internal Pull-down. NC pin 未使用信号。未接続処理(Open)とする。 Un-used signal. Keep Open. 未使用信号。未接続処理(Open)とする。 Un-used signal. Keep Open.
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Drawing No.：JW202570AS Pin Pin Name Number Type I/O Descriptions Domain BT PCM SYNC 信号。BT Audio 未使用時は未接続処理(Open)とする。内部 Pull-down. *動作未検証機能。接続する I2S デバイスまたは CODEC との組み合わせで別 31 BT_I2S_WS B VDD_GPIO 途検証が必要となります。使用する場合はお問い合わせください。 BT PCM SYNC. Keep Open if BT Audio is not used. Internal pull-down. *No testing function. Need to verify with your I2S device or CODEC. If you need this function please contact silex support.
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Drawing No.：JW202570AS 4.5. SDCARD type edge ピン配置 (SD Card type edge pin locations) 8 7 SD_D1 SD_D0 6 GND 5 SD_CLK 4 VDD 3 GND 2 SD_CMD 1 SD_D3 9 SD_D2 SD Card Edge (BOTTOM VIEW) © silex technology, Inc.
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Drawing No.：JW202570AS 4.6. SDCARD type エッジ信号仕様 (SDCARD type edge signal descriptions) Pin Pin Name Number Type I/O Descriptions Domain WLAN 用 SDIO Data[3]信号。+1.8V 動作のみ対応。Bootstrap option に使用されているため、 Internal 1 SD_D3 B Reset 解除まではドライブしないでください。内部 Pull-up。 +1.8V SDIO Data[3] for WLAN. Only +1.8V operation is supported. Since this pin is used for LDO Bootstrap option, you must not drive this pin until releasing the reset signal. Internal Pullup. Internal 2 SD_CMD DI +1.
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Drawing No.：JW202570AS 4.7. SDCARD type FFC ピン配置 (SD Card type FFC pin locations) FFC Connector (BOTTOM VIEW) © silex technology, Inc.
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Drawing No.：JW202570AS 4.8. SDCARD type FFC 信号仕様 (SDCARD type FFC signal descriptions) Pin Pin Name Number 1 GND 2 BT_UART_RTS Type I/O Descriptions Domain GND NA DO VDD_GPIO Ground BT 用 UART RTS 信号。BT 未使用時は未接続処理(Open)とする。 UART RTS for BT. Keep Open if BT is not used. BT 用 UART TXD 信号。Bootstrap option に使用されているため、Reset 解除まではドライブ 3 BT_UART_TXD DO VDD_GPIO しないでください。BT 未使用時は未接続処理(Open)とする。内部 Pull-up。 UART TXD for BT.
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Drawing No.：JW202570AS Pin Pin Name Number Type I/O Descriptions Domain BT PCM IN 信号。BT Audio 未使用時は未接続処理(Open)とする。 *動作未検証機能。接続する I2S デバイスまたは CODEC との組み合わせで別途検証が必要と 11 BT_I2S_SDI DI VDD_GPIO なります。使用する場合はお問い合わせください。 BT PCM IN. Keep Open if BT Audio is not used. *No testing function. Need to verify with your I2S device or CODEC. If you need this function please contact silex support.
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Drawing No.：JW202570AS 4.9. 信号定義 (Signal definitions) Symbols AI AO B DI DO OD PU PD P GND NC NA Internal +1.8V LDO Descriptions アナログインプット Analog input アナログアウトプット Analog output CMOS 双方向デジタル信号 CMOS bidirectional digital signal CMOS デジタルインプット CMOS digital input CMOS デジタルアウトプット CMOS digital output オープンドレインデジタルアウトプット Open drain digital output ウィークプルアップインプット信号 (+1.8V IO：120kohm, +3.3V IO：70kohm) Input signal with weak pull-up. (+1.8V IO：120kohm, +3.3V IO：70kohm) ウィークプルダウンインプット信号 (+1.8V IO：120kohm, +3.
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Drawing No.：JW202570AS インターフェイス/タイミング仕様 (Interface / timing specifications) 5. 5.1. WLAN SDIO AC タイミング仕様 (WLAN SDIO AC timing specifications) Default Speed Symbols Specifications Items Min. Max.
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Drawing No.：JW202570AS High Speed Symbols Specifications Items Min. Max. Units fPP Clock frequency Data Transfer Mode 0 50 MHz tWL Clock low time 7 － nsec tWH Clock high time 7 － nsec tTLH Clock rise time － 3 nsec tTHL Clock fall time － 3 nsec tISU Input setup time 6 － nsec tIH Input hold time 2 － nsec Output Delay time during Identification Mode － 14 nsec Output Hold time 2.5 － nsec tODLY tOH © silex technology, Inc.
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Drawing No.：JW202570AS Ultra-High Speed (UHS/SDR mode) Symbols Specifications Items Min. Max. Units Remarks fCLK Clock frequency Data Transfer Mode 0 208 MHz tCR Clock rise time － 0.2*1/ fCLK nsec NOTE1 tCF Clock fall time － 0.2*1/ fCLK nsec NOTE1 tIS Input setup time 1.4 － nsec SDR104 tIH Input hold time 0.8 － nsec SDR104 tIS Input setup time 3.0 － nsec SDR50 tIH Input hold time 0.8 － nsec SDR50 tODLY Output Delay time during Identification Mode － 7.
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Drawing No.：JW202570AS SDIO 信号の配線について (SDIO signal length) SDIO 信号は SD_CLK を基準に外部回路等遅延配線としてください。 Skew of SDIO signal lines are recommended on the host board.. SX-SDMAC-2830S/SX-SDMAC-2831S Signals QCA9377-3 SMT PCB Total length Difference from (Chip+PCB) SD_CLK signal Units SD_CLK 0.951 10.478 11.429 0 mm SD_CMD 0.368 14.825 15.193 +3.764 mm SD_DATA3 0.101 10.808 10.909 -0.520 mm SD_DATA2 0.264 11.090 11.354 -0.075 mm SD_DATA1 0.112 11.010 11.122 -0.307 mm SD_DATA0 0.
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Drawing No.：JW202570AS 5.2. Bluetooth UART 仕様 (Bluetooth UART interface specifications) 本モジュールは HCI 上位レイヤーBluetooth スタック互換の HCI-UART 規格をサポートしています。 This module supports standard HCI-UART interface so it’s compatible with HCI upper layer Bluetooth stacks.
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Drawing No.：JW202570AS Bluetooth 音声インターフェイス仕様(Bluetooth audio interface specifications) 5.3. 本モジュールの Bluetooth オーディオインターフェイスは、ソフトウェアによるレジスタ設定によって PCM と I2S のプロトコルを切り替えて使用することができます。 The audio interface of this module is configurable either PCM or I2S protocol by top-level register setting of software.
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Drawing No.：JW202570AS 接続図 (Connection) PCM mode Host system SX-SDMAC SX-SDMAC Master mode PCM_IN 6 PCM_IN PCM_OUT 43 PCM_SYNC PCM_SYNC 15 PCM_CLK PCM_CLK 16 PCM_OUT Audio Data Processor SX-SDMAC Slave mode (Default) Audio I/O Processor I2S mode Host system I2S_SD_OUT Audio Data Processor © silex technology, Inc.
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Drawing No.：JW202570AS 5.4. パワーON/OFF, リセットタイミング (Power on/off and reset timing) ￭ BT_PWD_L を常時 High(De-assert)で使用する場合 In case BT_PWD_L is always High (De-assert). © silex technology, Inc.
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Drawing No.：JW202570AS ￭ BT_PWD_L を常時 Low(Assert)で使用する場合 In case BT_PWD_L is always Low (Assert). © silex technology, Inc.
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Drawing No.：JW202570AS ￭ BT_PWD_L を常時 High(De-assert)で使用する場合のホットリセットタイミング Hot reset timing in case BT_PWD_L is always High (De-assert). ￭ BT_PWD_L を常時 Low(Assert)で使用する場合のホットリセットタイミング Hot reset timing in case BT_PWD_L is always Low (Assert). © silex technology, Inc.
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Drawing No.：JW202570AS TA TB TC TD TE TF Specifications Descriptions Symbols VDD_GPIO 電源が 90%に達してからその他の電源が 90%に達するまでの時間。 Time from VDD_GPIO reaches 90% to other power sources reach 90%. VDD_SDIO が 90%に達してから WLAN のリセット解除(De-assert)までの時間 Time from VDD_SDIO reaches 90% to WLAN reset release (De-assert). VDD が 90%に達してから WLAN のリセット解除(De-assert)までの時間 Time from VDD reaches 90% to WLAN reset release (De-assert).
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Drawing No.：JW202570AS 6. 6.1. 適合規格 (Standards Compliance) 規格一覧 (Standard list) 適合規格： Standards conformity ￭IEEE802.11-2012 (a/b/g/n) ￭ IEEE802.11ac-2013 ￭ Bluetooth 4.1 BR/EDR/LE (DID:D032832) ￭ Bluetooth 5.0 BR/EDR/LE (DID:D043700) ￭ SDIO v3.
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Drawing No.：JW202570AS ￭ ANATEL（only EAL Model） ID: 05593-18-09143 対応国： Countries ￭ Asia ・ Japan ￭ North America ・ United States ・ Canada ￭ South America ・ Brazil（only EAL Model）￭ EU Regulatory notice Channel Selection For product available in the USA/Canada market, only channel 1~11 can be operated. Selection of other channels is not possible.
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Drawing No.：JW202570AS FCC Rules Part 15 Subpart E §15.407(c) Compliance with FCC requirement 15.407(c) Data transmission is always initiated by software, which is the passed down through the MAC, through the digital and analog baseband, and finally to the RF chip. Several special packets are initiated by the MAC. These are the only ways the digital baseband portion will turn on the RF transmitter, which it then turns off at the end of the packet.
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Drawing No.：JW202570AS Frequency Band 5150 – 5250 MHz LE-LAN devices are restricted to indoor operation only in the band 5150-5250 MHz. Les dispositifs LAN-EL sont restreints à une utilisation à l'intérieur, dans la bande 5150-5250MHz. High-power radars are allocated as primary users (i.e. priority users) of the bands 5250-5350 MHz and 5650-5850 MHz and that these radars could cause interference and/or damage to LE-LAN devices.
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Drawing No.：JW202570AS 6.2. 推奨アンテナリスト (Recommended Antenna List) 日本 (Japan) MIC Antenna 2.4GHz 5GHz No.19 No.19-2 No.19-3 No.19-3-2 Type Gain Gain 2.4GHz 2.484GHz W52/53 W56 Unictron PCB +2.9dBi +4.4dBi ✔ － ✔ ✔ Unictron PCB +2.8dBi +4.2dBi ✔ － ✔ ✔ Molex PCB +3.25dBi +5.0dBi ✔ － ✔ ✔ Ethertronics PIFA +2.5dBi +3.5dBi ✔ － ✔ ✔ VSO Rod +2.0dBi +2.0dBi ✔ － ✔ ✔ VSO Rod +1.5dBi +2.1dBi ✔ － ✔ ✔ Sansei-Denki Rod +2.0dBi +2.
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Drawing No.：JW202570AS 7. 機械的仕様 (Mechanical Specifications) (mm) SX-SDMAC-2830S (Top view) (mm) SX-SDMAC-2830S (Bottom view) © silex technology, Inc.
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Drawing No.：JW202570AS 厚み (Thickness) Item Thickness SMT (単体) Remarks 2.6mm SMT (A simple substance) アンテナケーブル側の MHF コネクタにより 3 パターン有り。 SMT (コネクタ嵌合時) 2.9mm, 3.4mm, 3 patterns depend on MHF connector of antenna cable. SMT (Connector mating) 4.1mm (Max.) H2B1PC1A1C (Unictron)との嵌合時: 3.4mm Max In case mating with H2B1PC1A1C (Unictron) : 3.4mm Max B2B (単体) 4.8mm B2B (A simple substance) 推奨固定ねじサイズ M1.7 Recommended screw/washer is M1.7 アンテナケーブル側の MHF コネクタにより 3 パターン有り。 B2B (コネクタ嵌合時) 5.4mm, 5.
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Drawing No.：JW202570AS 8.
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Drawing No.
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Drawing No.：JW202570AS 3 or more MIC Mark dimension (mm) DFS Master 対応/非対応表 (Table of DFS Master support/non-support) Product No.
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Drawing No.：JW202570AS 9. 構成リスト (Components composition List) SX-SDMAC-2830S/SX-SDMAC-2830C/SX-SDCAC-2830 Product No.
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Drawing No.：JW202570AS SX-SDMAC-2831S/SX-SDMAC-2831C/SX-SDCAC-2831 Product No.
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Drawing No.：JW202570AS 10. 梱包仕様 (Packing specifications) サンプルパック (Sample pack) SX-SDMAC-2831C-SP/SX-SDMAC-2831C-EAL-SP SX-SDCAC-2830-SP/SX-SDCAC-2830-EAL-SP 総重量 Gross weight SX-SDMAC-2831C-SP/SX-SDMAC-2831C-EAL-SP SX-SDCAC-2830-SP/SX-SDCAC-2830-EAL-SP 1.6kg 1.7kg © silex technology, Inc.
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Drawing No.：JW202570AS Packing Label SX-SDMAC-2831C-SP SX-SDCAC-2830-SP SX-SDMAC-2831C-EAL-SP SX-SDCAC-2830-EAL-SP (mm) Carton Label SX-SDMAC-2831C-SP SX-SDCAC-2830-SP SX-SDMAC-2831C-EAL-SP SX-SDCAC-2830-EAL-SP (mm) © silex technology, Inc.
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Drawing No.：JW202570AS バルクパック (Bulk packing) SX-SDCAC-2830 SX-SDMAC-2831C 総重量 Gross weight SX-SDMAC-2831C/SX-SDMAC-2831C-EAL SX-SDCAC-2830/SX-SDCAC-2830-EAL 1.5kg 1.9kg © silex technology, Inc.
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Drawing No.：JW202570AS Carton Label SX-SDMAC-2831C SX-SDCAC-2830 SX-SDMAC-2831C-EAL SX-SDCAC-2830-EAL (mm) © silex technology, Inc.
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Drawing No.：JW202570AS リール (Reel) A B Center dimension (mm) SX-SDMAC-2830S SX-SDMAC-2831S SX-SDMAC-2830S-EAL SX-SDMAC-2831S-EAL A 45.4±1 33.4±1 B 49.4±1 37.4±1 400 160 (mm) © silex technology, Inc.
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Drawing No.：JW202570AS SX-SDMAC-2830S/SX-SDMAC-2830S-EAL (mm) SX-SDMAC-2831S/SX-SDMAC-2831S-EAL (mm) © silex technology, Inc.
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Drawing No.：JW202570AS Packing label Packing label Product (Reel) Aluminum lamination bag Silicagel Humidity Indicator MSL Caution Label Packing label Packing Box SX-SDMAC-2830S SX-SDMAC-2831S SX-SDMAC-2830S-EAL SX-SDMAC-2831S-EAL 総重量 Gross weight SX-SDMAC-2830S/SX-SDMAC-2830S-EAL SX-SDMAC-2831S/SX-SDMAC-2831S-EAL 9.7kg 7.6kg © silex technology, Inc.
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Drawing No.：JW202570AS Packing label Part No Product Name Product Name Part No SX-SDMAC-2830S ZXE03487 SX-SDMAC-2830S-SP ZXE03493 SX-SDMAC-2830S-EAL ZXE04016 SX-SDMAC-2830S-EAL-SP ZXE04020 Part No Product Name © silex technology, Inc.
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Drawing No.：JW202570AS 集合ラベル (Carton label) SX-SDMAC-2830S SX-SDMAC-2830S-SP SX-SDMAC-2831S SX-SDMAC-2831S-SP SX-SDMAC-2830S-EAL SX-SDMAC-2831S-EAL SX-SDMAC-2830S-EAL-SP (mm) SX-SDMAC-2831S-EAL-SP MSL 警告ラベル (MSL caution label) (mm) 湿度表示カード例 (Example of humidity indication card) © silex technology, Inc.
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Drawing No.：JW202570AS 11. 信頼性試験 (Reliability test) Test items DC 電圧試験 Standards － DC voltage test Requirements Description Electricity Appearance 電源電圧+3.0 V ~ +3.6 Vで動作確認を行う。・通信の停止や通信速度の異常が起こらないことを確認する。動作可能 Check to work with +3.0 - +3.6V voltage range. Workable NA ・Check no transaction stop or no throughput drop. 温湿度電圧－下記条件で動作確認を行う。サイクル試験・通信の停止や通信速度の異常が起こらないことを確認する。 Temperature/ Check to work with below conditions.
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Drawing No.：JW202570AS Test items Standards Requirements Description Electricity Appearance 衝撃試験 MIL-STD-202 衝撃を加えた後、動作確認を行う。検査仕様適合損傷無し Mechanical shock Method 213B ・方向と回数：X1/2 (+ /-), Y1/2 (+ /-), Z1/2 (+ /-) 各5回 (計30回) Test spec in No damage Condition A ・衝撃を加えた後も破損/故障/RF性能が劣化しないことを確認する。 test Check to work after shocking. ・Axis and number of times： X1/2 (+ /-), Y1/2 (+ /-), Z1/2 (+ /-) 5 times per direction (Total 30 times) ・Damage/Defect/RF degradation is not observed after shock.
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Drawing No.：JW202570AS Criteria Description 損傷無し試験後外観に損傷が無いこと。 No damage No damage on the appearance after test. 検査仕様適合 RF 検査仕様を満たすこと。 Test spec in Meet to RF test specifications 動作可能試験中動作が確認できること。 Workable Can confirm to work during test. NOTE1 以下を除く全ての項目のサンプル数は 3 台・温度衝撃試験：10 台 Sample numbers for all test except below is 3 units. ・Thermal shock test：10 units © silex technology, Inc.
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Drawing No.：JW202570AS 使用上の注意 (Notifications) 12. ￭本製品の仕様は、§6. に掲げる法規制に適合していますが、以下の場合は仕様が変更になる可能性があります。 Specifications of this module compliant to law regulations of §6. Standards Compliance, but this shall not apply to following cases. 1) §6. に掲げるアンテナ以外を使う場合。 In case this module is used with different antenna from the antenna list of §6. 2) §6. に掲げる国以外で使う場合。 In case this module is used in the different country from the list of §6 3) 認可の更新が必要な場合。 In case the certification must be renewed. ￭本製品は 2.
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Drawing No.：JW202570AS ￭本製品が使用する無線帯域において、同一周波数帯を利用する装置への影響又は装置からの影響を受ける場合があります。設置においては事前に環境の調査を実施してください。 This module will effect to some other device or be affected by the some other device using the same frequency band. Please investigate the environment to use this module beforehand. ￭本製品について分解や改造を行うと電波法に基づいた処罰を受ける事があります。 Disassembling or modifying the radio module leads to punishment based on radio law.
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Drawing No.：JW202570AS 13. 付録 A アンテナ性能 (Appendix -A Antenna performance) SX-SDMAC On board chip antenna performance. Y X Z XY 2450 5100 5500 5800 XY XY XY XY Peak Gain (dBi) -1.67 -2.43 0.95 -1.37 AveGain (dBi) -3.21 -7.05 -3.80 -5.05 2450 5100 5500 5800 YZ YZ YZ YZ Peak Gain (dBi) -2.72 -7.67 -3.19 -1.92 AveGain (dBi) -3.93 -10.86 -5.19 -4.93 2450 5100 5500 5800 ZX ZX ZX ZX Peak Gain (dBi) -1.62 -3.26 0.33 0.07 AveGain (dBi) -5.85 -7.94 -4.88 -5.
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Drawing No.：JW202570AS 14. 付録 B SMT リフロー条件 (Appendix -B SMT reflow profiles) 本推奨条件は、Sn/Ag/Cu Pb-Free ハンダを使用した場合のものです。使用するハンダの種類によって最適化することを推奨します。 This recommended condition assumes Sn/Ag/Cu solder. This condition should be optimized per using solder type. Sn/Ag/Cu Pb-Free Assembly Profile Feature Conditions Parametric Min. Typ. Max. Units Average ramp-up rate TL to Tp 1.5 － 3.
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Drawing No.：JW202570AS 15. 付録 C 動作温度定義条件 (Appendix -C Conditions of operating temperature definition) SX-SDMAC の温度上昇と周囲温度について参考情報として記載致します。使用温度についてはお客様のシステムにて十分にご検証ください。 This data of temperature rise and ambient temperature is the reference information. Customers need to evaluate to temperature in your products. 温度上昇データ Temperature rise data Device Temp. rise (˚C) Throughput (Mbps) 9.7 280 ① Mode : 5GHz 11ac VHT80 TCP/UDP: UDP Tx. © silex technology, Inc.
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Drawing No.：JW202570AS Conditions 以下に測定時の条件を記載します。 The following is the condition when we measured. 試験基板条件 DUT conditions 120mm 100mm Test board dimension © silex technology, Inc.
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Drawing No.：JW202570AS 構成図 Block diagram DUT SX-SDMAC PW102730BA － Test board PW102121XX － Host board MCIMX6Q-SDB NXP AP WXR-2533DHP Buffalo PC Probook HP Data logger LR8400+LR8500 Hioki Software Driver: Version 4.5.20.020 － iperf Version 1.7.0 for Windows － iperf 2.0.5 for Linux © silex technology, Inc.
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Drawing No.：JW202570AS 16. 付録 D 参考回路図 (Appendix-D Reference schematic) SX-SDMAC-2830S/SX-SDMAC-2831S SX-SDMAC-2831C © silex technology, Inc.
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Drawing No.：JW202570AS 17. 付録 E 参考ランド設計 (Appendix-E Reference land design) (mm) SX-SDMAC-2830S/SX-SDMAC-2831S Exposed PAD (Top View) NOTE1 ランド設計を CAD にインポートする必要が有る場合は、PW102270GX_land_design.dxf をご利用ください。 In case LGA pad design need to be imported to CAD system, please use PW102890CX_land_design.dxf. PW102270GX_land_design.dxf MD5 CHECK SUM : 78E48705BD35162B91CEBA61BF59329D © silex technology, Inc.
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Drawing No.：JW202570AS 付録 F 18. 18.1. 参考性能 (Appendix-F Performance data) 距離対スループット (Distance vs Throughput) SX-SDMAC の各距離におけるスループットを示します。 The following is SX-SDMAC throughput performance. (セットアップと環境 / Setup and Environment) Number Name Product name Vendor Serial# 1 PC2 E5540 DELL CU02565 2 PC1 E6540 DELL CU02096 3 AP AP-500AC silex - 4 Host board i.MX6 SoloX NXP - 5 PCB antenna 146153 Molex - Note MAC:84253F-0109AE. Board rev.
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Drawing No.：JW202570AS 18.2. カバレッジ (Coverage) SX-SDMAC の屋外での限界通信距離を示します The following is SX-SDMAC Maximum rage in outside. (セットアップと環境 / Setup and Environment) Number Name Product name Vendor Serial# 1 PC E5540 DELL CU02565 2 AP AP-500AC silex SX04696 3 Host board i.MX6 SoloX NXP - 4 PCB antenna 146153 Molex - Note MAC: 84253F-0109AE. Board rev.: PW1102110AX ANT2 (Secondary) (パフォーマンス / Performance) 2.4GHz 2422MHz HT40 Size(Byte) Distance(m) Signal level(dBm) 32 403.0 -89.
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Drawing No.：JW202570AS 付録 G 仕向け毎の送信電力 (Appendix -G TX power at each destination) 19. 日本/Japan 2.4GHz (+25℃) Specifications Items モード Min. Typ. Max. Units Remarks 送信電力 11b Ch.1-Ch.13 1-11Mbps +10.0 +12.5 +15.0 dBm Regulation compliant Transmit Power 11g Ch.1-Ch.13 6-24Mbps +14.0 +16.5 +19.0 dBm Regulation compliant 日本 36Mbps +12.5 +15.0 +17.5 dBm EVM compliant Japan 48Mbps +11.5 +14.0 +16.5 dBm EVM compliant 54Mbps +10.5 +13.0 +15.
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Drawing No.：JW202570AS 日本/Japan 5GHz (+25℃) Specifications Items Units Remarks Min. Typ. Max. 6-24Mbps +7.5 +10.0 +12.5 dBm EVM compliant Transmit Power 36Mbps +5.5 +8.0 +10.5 dBm EVM compliant 日本 48Mbps +5.0 +7.5 +10.0 dBm EVM compliant 54Mbps +4.0 +6.5 +9.0 dBm EVM compliant 6-24Mbps +7.5 +10.0 +12.5 dBm EVM compliant 36Mbps +5.5 +8.0 +10.5 dBm EVM compliant 48Mbps +5.0 +7.5 +10.0 dBm EVM compliant 54Mbps +4.0 +6.5 +9.0 dBm EVM compliant MCS0-2 +8.
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Drawing No.：JW202570AS Specifications Items Modes Units Remarks Min. Typ. Max. MCS0-2 +6.5 +9.0 +11.5 dBm Mask compliant HT/VHT MCS3-4 +6.5 +9.0 +11.5 dBm Mask compliant HT/VHT 日本 MCS5 +5.5 +8.0 +10.5 dBm EVM compliant, HT/VHT Japan MCS6 +4.5 +7.0 +9.5 dBm EVM compliant, HT/VHT MCS7 +4.0 +6.5 +9.0 dBm EVM compliant, HT/VHT MCS8 +2.5 +5.0 +7.5 dBm EVM compliant, VHT MCS9 +1.5 +4.0 +6.5 dBm EVM compliant, VHT MCS0-2 +6.5 +9.0 +11.
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Drawing No.：JW202570AS US 2.4GHz (+25℃) Specifications Items Modes Typ. Max. Units Remarks Ch.1 1-11Mbps +15.0 +17.5 +20.0 dBm Regulation compliant Transmit Power Ch.2-Ch.10 1-11Mbps +15.5 +18.0 +20.5 dBm Mask compliant アメリカ Ch.11 1-11Mbps +15.0 +17.5 +20.0 dBm Regulation compliant Ch.1 6-24Mbps +10.5 +13.0 +15.5 dBm Regulation compliant 36Mbps +10.5 +13.0 +15.5 dBm Regulation compliant 48Mbps +10.5 +13.0 +15.5 dBm Regulation compliant 54Mbps +10.5 +13.
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Drawing No.：JW202570AS Specifications Items Modes Units Remarks Min. Typ. Max. MCS0-2 +6.5 +9.0 +11.5 dBm Regulation compliant, HT/VHT MCS3-4 +6.5 +9.0 +11.5 dBm Regulation compliant, HT/VHT アメリカ MCS5 +6.5 +9.0 +11.5 dBm Regulation compliant, HT/VHT US MCS6 +6.5 +9.0 +11.5 dBm Regulation compliant, HT/VHT MCS7 +6.5 +9.0 +11.5 dBm Regulation compliant, HT/VHT MCS8 +6.5 +9.0 +11.5 dBm Regulation compliant, VHT MCS9 +6.5 +9.0 +11.
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Drawing No.：JW202570AS US 5GHz (+25℃) Specifications Items Units Remarks Min. Typ. Max. 6-24Mbps +6.5 +9.0 +11.5 dBm Regulation compliant Transmit Power 36Mbps +5.5 +8.0 +10.5 dBm EVM compliant アメリカ 48Mbps +5.0 +7.5 +10.0 dBm EVM compliant US 54Mbps +4.0 +6.5 +9.0 dBm EVM compliant 6-24Mbps +7.5 +10.0 +12.5 dBm EVM compliant 36Mbps +5.5 +8.0 +10.5 dBm EVM compliant 48Mbps +5.0 +7.5 +10.0 dBm EVM compliant 54Mbps +4.0 +6.5 +9.
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Drawing No.：JW202570AS Specifications Items Modes Units Remarks Min. Typ. Max. MCS0-2 +6.5 +9.0 +11.5 dBm Regulation compliant, HT/VHT MCS3-4 +6.5 +9.0 +11.5 dBm EVM compliant, HT/VHT アメリカ MCS5 +4.5 +7.0 +9.5 dBm EVM compliant, HT/VHT US MCS6 +4.0 +6.5 +9.0 dBm EVM compliant, HT/VHT MCS7 +4.0 +6.5 +9.0 dBm EVM compliant, HT/VHT MCS8 +2.5 +5.0 +7.5 dBm EVM compliant, VHT MCS0-2 +8.5 +11.0 +13.5 dBm Mask compliant, HT/VHT MCS3-4 +6.5 +9.0 +11.
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Drawing No.：JW202570AS Specifications Items Modes Units Remarks Min. Typ. Max. MCS0-2 +5.0 +7.5 +10.0 dBm Regulation compliant, HT/VHT MCS3-4 +5.0 +7.5 +10.0 dBm Regulation compliant, HT/VHT アメリカ MCS5 +4.5 +7.0 +9.5 dBm EVM compliant, HT/VHT US MCS6 +4.0 +6.5 +9.0 dBm EVM compliant, HT/VHT MCS7 +4.0 +6.5 +9.0 dBm EVM compliant, HT/VHT MCS8 +2.5 +5.0 +7.5 dBm EVM compliant, VHT MCS9 +0.0 +2.5 +5.0 dBm EVM compliant, VHT MCS0-2 +7.5 +10.0 +12.
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Drawing No.：JW202570AS Specifications Items Modes Units Remarks Min. Typ. Max. MCS0-2 +5.0 +7.5 +10.0 dBm Regulation compliant, HT/VHT MCS3-4 +5.0 +7.5 +10.0 dBm Regulation compliant, HT/VHT アメリカ MCS5 +5.0 +7.5 +10.0 dBm Regulation compliant, HT/VHT US MCS6 +4.5 +7.0 +9.5 dBm EVM compliant, HT/VHT MCS7 +4.0 +6.5 +9.0 dBm EVM compliant, HT/VHT MCS8 +2.5 +5.0 +7.5 dBm EVM compliant, VHT MCS9 +1.5 +4.0 +6.5 dBm EVM compliant, VHT MCS0-2 +5.5 +8.0 +10.
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Drawing No.：JW202570AS EU 2.4GHz (+25℃) Specifications Items Modes Min. Typ. Max. Units Remarks 送信電力 11b Ch.1-Ch.13 1-11Mbps +11.0 +13.5 +16.0 dBm Regulation compliant TX power 11g Ch.1-Ch.13 6-24Mbps +12.5 +15.0 +17.5 dBm Regulation compliant 36Mbps +12.5 +15.0 +17.5 dBm EVM compliant 48Mbps +11.5 +14.0 +16.5 dBm EVM compliant 54Mbps +10.5 +13.0 +15.5 dBm EVM compliant MCS0-2 +12.5 +15.0 +17.5 dBm Regulation compliant, HT/VHT MCS3-4 +12.5 +15.0 +17.
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Drawing No.：JW202570AS EU 5GHz (+25℃) Specifications Items Units Remarks Min. Typ. Max. 6-24Mbps +7.5 +10.0 +12.5 dBm EVM compliant Transmit Power 36Mbps +5.5 +8.0 +10.5 dBm EVM compliant ヨーロッパ 48Mbps +5.0 +7.5 +10.0 dBm EVM compliant EU 54Mbps +4.0 +6.5 +9.0 dBm EVM compliant 6-24Mbps +7.5 +10.0 +12.5 dBm EVM compliant 36Mbps +5.5 +8.0 +10.5 dBm EVM compliant 48Mbps +5.0 +7.5 +10.0 dBm EVM compliant 54Mbps +4.0 +6.5 +9.
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Drawing No.：JW202570AS Specifications Items Modes Units Remarks Min. Typ. Max. MCS0-2 +6.5 +9.0 +11.5 dBm Mask compliant, HT/VHT MCS3-4 +6.5 +9.0 +11.5 dBm Mask compliant, HT/VHT ヨーロッパ MCS5 +5.5 +8.0 +10.5 dBm EVM compliant, HT/VHT EU MCS6 +4.5 +7.0 +9.5 dBm EVM compliant, HT/VHT MCS7 +4.0 +6.5 +9.0 dBm EVM compliant, HT/VHT MCS8 +2.5 +5.0 +7.5 dBm EVM compliant, VHT MCS9 +1.5 +4.0 +6.5 dBm EVM compliant, VHT MCS0-2 +6.5 +9.0 +11.