Product Specs

ManualsBrandssilex technology ManualsElectronicsSX-SDMAC2

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CONFIDENTIAL

Title:

IEEE802.11ac wave2

SDIO wireless LAN module

SX-SDMAC2-2830

Drawing Type :

製品仕様書

Product specifications

Drawing No.:

JW205100XX

Date :

May 30, 2019

Summary of content (58 pages)

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Title: IEEE802.11ac wave2 SDIO wireless LAN module SX-SDMAC2-2830 Drawing Type : 製品仕様書 Product specifications Drawing No.: JW205100XX Date : May 30, 2019 © silex technology, Inc.
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Drawing No.：JW205100XX 改版履歴 (Revision history) Rev. Description Date Prepared by Checked by Approved by XX 初版 The first edtion May. 30, 19 Y.Kuroda K.Hamada Y.Shibuya © silex technology, Inc.
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Drawing No.：JW205100XX 目次 (Index) 1. 2. 3. 製品概要 (Product introduction) ........................................................................................................... 4 ハードウェアブロック図 (Hardware block diagram) ................................................................................. 6 基板仕様 (Board specifications) ........................................................................................................... 7 3.1. 3.2. 3.3. 3.4. 3.5. 3.6. 3.7. 3.8. 3.9. 3.10. 4.
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Drawing No.：JW205100XX 本書は SX-SDMAC2 について説明するものです。モデル名/ハードウェアバージョン識別番号(HVIN)は「SX-SDMAC2」です。 This document describes about SX-SDMAC2. Model name/Hardware Version Identification Number (HVIN) of this module is “SX-SDMAC2”. 1. 製品概要 (Product introduction) SX-SDMAC2 は、QCA9379-3 (Qualcomm Atheros 社)を採用した、2.4GHz/5GHz Dual Band IEEE 802.11 a/b/g/n/ac、Bluetooth 5.0 BR/EDR/LE (Class1) 及び SDIO3.0 準拠の無線モジュールです。本モジュールは、 MAC/BBP/RF/RF フロントエンド及び各種電源/クロックなどの外部回路を内蔵しています。 The SX-SDMAC2 is a 2.
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Drawing No.：JW205100XX 特徴 (Features) ￭ IEEE802.11a/b/g/n/ac 準拠(2.4 GHz, 5 GHz) IEEE802.11a/b/g/n/ac compliant (2.4 GHz, 5 GHz) ￭ 2 スペーシャルデータストリームシステム (2T2R) 2 spatial data stream system (2T2R) ￭ 5 GHz：20/40/80 MHz 帯域幅モード対応 (PHY データレート 867 Mbps) 2.4 GHz：20/40 MHz 帯域幅モード対応 (PHY データレート 300Mbps,拡張 PHY データレート 400Mbps) 5 GHz: 20/40/80 MHz bandwidth mode (PHY Data rate 867 Mbps) 2.4 GHz: 20/40 MHz bandwidth mode (PHY Data rate 300 Mbps, Extra PHY Data rate 400Mbps) PHY Data Rate ▢ 802.11b/g 1-54 Mbps ▢ 802.
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Drawing No.：JW205100XX 2. ハードウェアブロック図 (Hardware block diagram) 略語 (Acronyms) PMU DPX MHF I Power Management Unit Integrated Passive Device type Diplexer MHF-I co-axial connector (I-PEX) or compatible connector © silex technology, Inc.
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Drawing No.：JW205100XX 3. 基板仕様 (Board specifications) 3.1. 一般仕様 (General specifications) Items ホストボードへの接続方式 Connection with the host board アンテナポート Antenna port Specifications 68-pin Land Grid Array (Direct solder) MHF I connector x 3 Units Remarks － pcs アンテナポート特性 Antenna port characteristics 50 Ω SWR < 3 : 1 (2.4-2.5GHz, 5.18-5.85GHz) ホストインターフェイス Host interface SDIO v3.0 － For Wireless LAN UART － For Bluetooth IEEE802.11a/b/g/n/ac － IEEE802.11-2012 IEEE802.11ac-2013 Bluetooth 5.
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Drawing No.：JW205100XX 3.2. 環境条件 (Environmental conditions) Items Specifications Min. Typ. Max.
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Drawing No.：JW205100XX 3.3. 電気的仕様 (Electrical specifications) 絶対最大定格 (Absolute maximum rating) Specifications Items 主電源電圧 Main power supply (VDD33) IO 電源電圧 (VDDIO_GPIO1) IO Power supply voltage SDIO 電源電圧(VDDIO_SDIO) SDIO Power supply voltage Units Min. Typ. Max. -0.3 － +3.6 V -0.3 － +3.6 V -0.3 － +3.6 V Remarks 推奨動作条件 (Recommended operating conditions) 主電源 (Main power supply) Specifications Items 主電源電圧 Main power supply (VDD33) Min. Typ. Max. +3.14 +3.30 +3.
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Drawing No.：JW205100XX デジタル論理信号レベル (Digital logic signal level) 1) VIO (VDDIO_GPIO1, VDDIO_SDIO) = +3.3V operation Specifications Items Parameters Output/Input current Min. Typ. Max. Units VIH 入力 High レベル電圧 Input High voltage － 0.7 x VIO +3.3 VIO + 0.3 V VIL 入力 Low レベル電圧 Input Low voltage － -0.3 － 0.3 x VIO V VOH 出力 High レベル電圧 Output High voltage IOH = 3mA VIO - 0.4 －－ V VOL 出力 Low レベル電圧 Output Low voltage IOL = -11mA －－ 0.
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Drawing No.：JW205100XX 3.4.
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Drawing No.：JW205100XX NOTE1: NOTE2： Typ.: テストツールの連続送信/受信時における平均電流の個体バラつきの平均値。 Average value of unevenness of average current per unit with continuous transmit/receive mode of the test tool. Max.: テストツールの連続送信/受信時におけるピーク電流の個体バラつきの最大値。 Maximum value of unevenness of peak current per unit with continuous transmit/receive mode of the test tool. 総電力は VDD33(WLAN operating)と VDDIO_GPIO1 の総和になります。モードによる組合せにご注意ください。 Total power consumption is total of VDD33 (WLAN operating) and VDDIO_GPIO1.
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Drawing No.：JW205100XX 3.5. 無線 LAN 一般仕様 (Wireless LAN general specifications) Items チップセット Chipset 国/地域コード Country/Region code 動作周波数 Operating frequencies Specifications Units QCA9379-3 (Qualcomm Atheros) － 0x0000 － Band 2.4GHz 5GHz Modes Min Max 11b 2412 2472 MHz 11g/n/ac 20MHz 2412 2472 MHz 11g/n/ac 40MHz 2422 2462 MHz 11a/n/ac 20MHz 5180 5825 MHz 11n/ac 40MHz 5190 5795 MHz 11ac 80MHz 5210 5775 MHz 周波数間隔 2.
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Drawing No.：JW205100XX 利用可能チャネルリスト (Operatable channel list) 2.4GHz US/CA US 20MHz 40MHz 20MHz 40MHz 20MHz CA 40MHz 80MHz 20MHz EU/JP 40MHz 80MHz 20MHz EU/JP 5GHz 40MHz 80MHz © silex technology, Inc. Ch.1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 Ch.3, 4, 5, 6, 7, 8, 9 Ch.1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13 Ch.3, 4, 5, 6, 7, 8, 9, 10, 11 Ch.36,40,44,48,52,56,60,64,100,104,108,112,116,120, 124,128,132,136,140,149,153,157,161,165 Ch.38,46,54,62,102,110,118,126,134,151,159 Ch.42,58,106,122,155 Ch.
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Drawing No.：JW205100XX 3.6. 無線 LAN 送信仕様 (Wireless LAN transmitter specifications) IEEE 802.11 規格に準拠した最大送信電力値を示すものです。ただし、各チャネルの最終的な送信電力値は、各国の電波法認証により制限を受けます。 There is maximum TX power which is compliant with IEEE 802.11 standard. Actual TX Power value of each channel is limited by the regulatory certification of each country, however. 2.4GHz (+25℃) Data Rates Standard Modulation Index 802.11b 802.11g 802.11n/ac 802.
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Drawing No.：JW205100XX 5GHz (+25℃) Data Rates Standard Modulation Index 802.11a 802.11n/ac 802.11ac (optional) NOTE1 NOTE2 NOTE3 BPSK BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM 256 QAM 256 QAM 6 Mbps 9 Mbps 12 Mbps 18 Mbps 24 Mbps 36 Mbps 48 Mbps 54 Mbps MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 MCS8 MCS9 802.11a Typical +19.5 +19.5 +19.5 +19.5 +19.5 +18.5 +18.0 +17.0 5 GHZ TX Power with IEEE 802.11 EVM and Spectral Mask at +25℃ 802.11n/ac 802.
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Drawing No.：JW205100XX 送信パワーの不確かさ (Transmit power uncertainty) 動作温度 (Operating temperature) Specifications Items 周囲環境条件による送信パワーの不確かさ Power uncertainty due to environmental conditions ※温度、電源条件 Temperature, Power supply Modes Min. Typ. Max. Units 802.11a 6-54Mbps -2.0 － +2.0 dB 802.11b 1-11Mbps -2.0 － +2.0 dB 802.11g 6-54Mbps -2.0 － +2.0 dB 802.11n/ac MSC0-9 -2.0 － +2.
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Drawing No.：JW205100XX 3.7. 無線 LAN 受信仕様 (Wireless LAN Receiver specifications) 2.4GHz (動作温度 / Operating temperature） Items Receiver minimum sensitivity Modes 11b (FER<8%) 1x1 (1SS) 11g (PER<10%) 11n/ac 20MHz (PER<10%) 11n/ac 40MHz (PER<10%) © silex technology, Inc. Specifications Min. 1Mbps － 2Mbps － 5.
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Drawing No.：JW205100XX 5GHz (動作温度 / Operating temperature） Items Receiver minimum sensitivity Modes 11a (PER<10%) 1x1 (1SS) 11n/ac 20MHz (PER<10%) 11n/ac 40MHz (PER<10%) 11ac 80MHz (PER<10%) © silex technology, Inc. Specifications Min.
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Drawing No.：JW205100XX 3.8. Bluetooth 一般仕様 (Bluetooth general specifications) Items チップセット Chipset コア仕様 Core specification Specifications Units QCA9379-3 (Qualcomm Atheros) － Bluetooth 5.0 － Mode 動作周波数 Min Max 2402 2480 Remarks Operating Frequency range BR/EDR/LE 周波数間隔 BR/EDR 1 MHz Ch.1-Ch.79 Frequency step LE 2 MHz Ch.0-Ch.
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Drawing No.：JW205100XX 3.9. Bluetooth 送信仕様 (Bluetooth Transmitter specifications) Bluetooth BR/EDR/LE (+25℃) Specifications Items Standards Typ. Max. Units BR Class 1 Ch.1-Ch.79 -3.0 +2.5 +4.5 dBm EDR Class 1 Ch.1-Ch.79 -6.6 -0.9 +1.0 dBm LE Ch.0-Ch.39 -1.6 +2.5 +6.1 dBm BR Ch.1-Ch.79 2 － 8 dB EDR Ch.1-Ch.79 2.5 － 8 dB 最大送信電力 Maximum TX power Min.
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Drawing No.：JW205100XX 4.2. 信号仕様 (Signal specifications) Num Signal name Type I/O Domain 1 VDDIO_SDIO P P 2 VDDIO_GPIO1 P P 3 VDD33 P P 4 GND GND GND Descriptions WLAN SDIO 電源。SDIO power supply for WLAN. +1.71 ～ +3.46V IO 電源。IO power supply. +1.71 ～ +3.46V 主電源。Main power supply. +3.135～+3.465V Ground WLAN 用 SDIO Data[3]信号。Bootstrap option に使用されているため、 5 SDIO_D3 B VDDIO_SDIO Reset 解除まではドライブしないでください。内部 Pull-up。 SDIO Data [3] for WLAN.
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Drawing No.：JW205100XX Num Signal name Type I/O Domain Descriptions 16 GND GND GND Ground 17 GND GND GND Ground 18 BT_WKUP_HOST OD VDD33 19 RESERVED DI VDD33 Bluetooth wakeup the host. Active high. 未使用信号。未接続処理(Open)とする。 Un-used signal. Keep Open. Wake on wireless 信号。アクティブ High。オープンドレイン出力。要ホストシステムの IO 20 QoW B VDD33 電源への外部 Pull-up。 Wake on wireless signal. Active High. Open drain output. Need external pull-up to IO power rail of the host system.
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Drawing No.：JW205100XX Num Signal name Type I/O Domain Descriptions 35 GND GND GND Ground 36 GND GND GND Ground 37 GND GND GND Ground 38 GND GND GND Ground 39 GND GND GND Ground 40 GND GND GND Ground 41 GND GND GND Ground 42 GND GND GND Ground 43 GND GND GND Ground 44 GND GND GND Ground 45 GND GND GND Ground 46 GND GND GND Ground 47 GND GND GND Ground 48 GND GND GND Ground 49 GND GND GND Ground © silex technology, Inc.
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Drawing No.：JW205100XX Num Signal name Type I/O Domain Descriptions 50 GND GND GND Ground 51 GND GND GND Ground 52 VDD33 P P 53 RESERVED DI VDD33 主電源。Main power supply. +3.135～+3.465V 未使用信号。未接続処理(Open)とする。 Un-used signal. Keep Open. BT PCM IN 信号。BT Audio 未使用時は未接続処理(Open)とする。 *動作未検証機能。接続する I2S デバイスまたは CODEC との組み合わせで別途検証が必要と 54 PCM_IN DI VDDIO_GPIO1 なります。使用する場合はお問い合わせください。 BT PCM IN. Keep Open if BT Audio is not used. *No testing function.
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Drawing No.：JW205100XX Num Signal name Type I/O Domain Descriptions BT PCM SYNC 信号。BT Audio 未使用時は未接続処理(Open)とする。内部 Pull-down. *動作未検証機能。接続する I2S デバイスまたは CODEC との組み合わせで 62 PCM_SYNC DI VDDIO_GPIO1 別途検証が必要となります。使用する場合はお問い合わせください。 BT PCM SYNC. Keep Open if BT Audio is not used. Internal pull-down. *No testing function. Need to verify with your I2S device or CODEC. If you need this function please contact silex support.
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Drawing No.：JW205100XX 4.3. 信号定義 (Signal definitions) Symbols B DI DO OD P GND Descriptions CMOS 双方向デジタル信号 CMOS bidirectional digital signal CMOS デジタルインプット CMOS digital input CMOS デジタルアウトプット CMOS digital output オープンドレインデジタルアウトプット Open drain digital output 電源 Voltage supply グランド Ground © silex technology, Inc.
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Drawing No.：JW205100XX 5. インターフェイス/タイミング仕様 (Interface / timing specifications) 5.1. WLAN SDIO AC タイミング仕様 (WLAN SDIO AC timing specifications) Default Speed Symbols fPP fOD tWL tWH tTLH tTHL tISU tIH tODLY tODLY Items Clock frequency Data Transfer Mode Clock frequency Identification Mode Clock low time Clock high time Clock rise time Clock fall time Input setup time Input hold time Output Delay time during Data Transfer Mode Output Delay time during Identification Mode © silex technology, Inc.
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Drawing No.：JW205100XX High Speed Symbols fPP tWL tWH tTLH tTHL tISU tIH tODLY tOH Items Clock frequency Data Transfer Mode Clock low time Clock high time Clock rise time Clock fall time Input setup time Input hold time Output Delay time during Identification Mode Output Hold time © silex technology, Inc. Specifications Min. Max. 0 50 7 － 7 －－ 3 － 3 6 － 2 －－ 14 2.
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Drawing No.：JW205100XX Ultra High Speed (UHS/SDR mode) Symbols fCLK tCR tCF tIS tIH tIS tIH tODLY tODLY tOHLD tOP tODW NOTE1: Items Clock frequency Data Transfer Mode Clock rise time Clock fall time Input setup time Input hold time Input setup time Input hold time Output Delay time during Identification Mode Output Delay time during Identification Mode Output Hold time Card Output phase Output valid data window Specifications Min. Max. 0 208 － 0.2*1/ fCLK － 0.2*1/ fCLK 1.4 － 0.8 － 3.0 － 0.8 －－ 7.
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Drawing No.：JW205100XX SDIO 信号の配線について (SDIO signal length) SDIO 信号は SD_CLK を基準に外部回路等遅延配線としてください。 Skew of SDIO signal lines are recommended on the host board. Difference from Signals PCB SD_CLK 5.6581 0 mm SD_CMD 4.1752 -1.483 mm SD_DATA3 6.5884 +0.9303 mm SD_DATA2 5.4256 -0.2325 mm SD_DATA1 4.5592 -1.0989 mm SD_DATA0 3.727 -1.
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Drawing No.：JW205100XX 5.2. Bluetooth UART 仕様 (Bluetooth UART interface specifications) 本モジュールは HCI 上位レイヤーBluetooth スタック互換の HCI-UART 規格をサポートしています。 This module supports standard HCI-UART interface so it’s compatible with HCI upper layer Bluetooth stacks. Items Specification Units Baud rates 115200, 375000, 460800, 750000, 1500000, 3000000, 4000000 8 None 1 RTS/CTS bps Number of data bits Parity bit Stop bit Flow control Remarks bits － bit － ※フロー制御が必要です。 Flow control is necessary.
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Drawing No.：JW205100XX 5.3. Bluetooth 音声インターフェイス仕様(Bluetooth audio interface specifications) 本モジュールの Bluetooth オーディオインターフェイスは、ソフトウェアによるレジスタ設定によって PCM と I2S のプロトコルを切り替えて使用することができます。 The audio interface of this module is configurable either PCM or I2S protocol by top-level register setting of software.
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Drawing No.：JW205100XX 5.4. パワーON/OFF, リセットタイミング (Power on/off and reset timing) Power Up Sequence Power Down Sequence VDD33 TD TA TE TB VDDIO_GPIO1 WLAN_PWD_L BT_PWD_L WLAN load process TC WLAN load process (insmod or load script) (Software) BT load process BT load process (insmod or load script) (Software) Symbols Descriptions TA TB TC TD TE Specification Units Min. Max. If VDDIO_GPIO1 connected to 1.8 V 1 － μsec If VDDIO_GPIO1 connected to 3.
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Drawing No.：JW205100XX 6. 適合規格 (Standards Compliance) 6.1. 規格一覧 (Standard list) 適合規格 (Standards conformity) ￭IEEE802.11-2012 (a/b/g/n) ￭ IEEE802.11ac-2013 ￭ Bluetooth 5.0 BR/EDR/LE (DID: D036525) *アンテナ利得 (Antenna Gain) +4.0dBi (Max.) ￭ SDIO v3.
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Drawing No.：JW205100XX 6.2. 推奨アンテナリスト(Recommended Antenna List) 日本 (Japan) MIC Antenna 2.4GHz 5GHz No.19 No.19-2 No.19-3 No.19-3-2 Type Gain Gain 2.4GHz 2.484GHz W52/53 W56 Unictron PCB +2.9dBi +4.4dBi ✔ － ✔ ✔ Unictron PCB +2.8dBi +4.2dBi ✔ － ✔ ✔ Molex PCB +3.25dBi +5.0dBi ✔ － ✔ ✔ Ethertronics PIFA +2.5dBi +3.5dBi ✔ － ✔ ✔ VSO Rod +2.0dBi +2.0dBi ✔ － ✔ ✔ VSO Rod +1.5dBi +2.1dBi ✔ － ✔ ✔ Sansei-Denki Rod +2.0dBi +2.
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Drawing No.：JW205100XX 6.3. Federal Communications Commission (FCC) Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1) this device may not cause harmful interference and 2) this device must accept any interference received, including interference that may cause undesired operation of the device. 15.
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Drawing No.：JW205100XX FCC RF Radiation Exposure Statement: 1) This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 2) This equipment complies with RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body. Test Modes silex technology, Inc.
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Drawing No.：JW205100XX 6.4. Canada, Industry Canada (IC) This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence .
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Drawing No.：JW205100XX Antenna Type Supplier Antenna Part No. Freq. (MHz) Peak Antenna Gain (dBi) PCB ACON AEP8P-100000 2.4GHz 2 PCB ACON AEP8P-100001 2.4GHz 2 PCB ACON AEP8P-100003 2.4GHz 2 PCB ACON AEP8P-100004 2.4GHz 2 PCB ACON AEP8P-100005 2.4GHz 2 PCB molex 1461530100 2.4GHz 3.25 Dipole SANSEI TD16081A0C0 2.4GHz 2 Dipole SANSEI TD16081B0C0 2.4GHz 2 Dipole JOYMAX IWF-145XMPXX 2.4GHz 4 Antenna Type Supplier Antenna Part No. Freq.
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Drawing No.：JW205100XX 7. 機械的仕様 (Mechanical Specifications) 厚み Thickness Item SMT (単体) SMT (A simple substance) Thickness 3.1mm PCB 厚 PCB Thickness Item Thickness SMT (PCB) 1.00 mm +/- 0.15 mm Description Description 特に記載が無い場合、寸法公差は±0.15 mm All dimension tolerances are ±0.15mm, unless otherwise specified. © silex technology, Inc.
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Drawing No.：JW205100XX 9. 構成リスト (Components composition List) Categories 基板 Board ラベル Label 付属品 Accessory 梱包 Packing Items 基板(製品) Main Board EMI Label 個装箱ラベル Packing Label MSL 警告ラベル MSL Caution Label 集合箱ラベル Carton Label 温度表示シート Humidity Indicator 個装箱 Packing Box 集合箱 Carton Box アルミラミネート袋 Aluminum lamination bag リール Reel Set シリカゲル Silica gel © silex technology, Inc. Product No.
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Drawing No.：JW205100XX MSL 警告ラベル (MSL caution label) (mm) 湿度表示カード例 (Example of humidity indication card) © silex technology, Inc.
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Drawing No.：JW205100XX 11. 信頼性試験 (Reliability test) Requirements Test items DC 電圧試験 Standards － DC voltage test Description Electricity Appearance 電源電圧+3.0 V ~ +3.6 Vで動作確認を行う。・通信の停止や通信速度の異常が起こらないことを確認する。動作可能 Check to work with +3.0 - +3.6V voltage range. Workable NA ・Check no transaction stop or no throughput drop. 温湿度電圧－下記条件で動作確認を行う。サイクル試験・通信の停止や通信速度の異常が起こらないことを確認する。 Temperature/ Check to work with below conditions. Humidity cycle ・Check no transaction stop or no throughput drop.
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Drawing No.：JW205100XX Requirements Test items 衝撃試験 Mechanical shock Standards JEDEC JESD22-B104C Condition B test Description Electricity Appearance 衝撃を加えた後、動作確認を行う。検査仕様適合損傷無し・方向と回数：X1/2 (+ /-), Y1/2 (+ /-), Z1/2 (+ /-) 各5回 (計30回) Test spec in No damage ・衝撃を加えた後も破損/故障/RF性能が劣化しないことを確認する。 Check to work after shocking. ・Axis and number of times： X1/2 (+ /-), Y1/2 (+ /-), Z1/2 (+ /-) 5 times per direction (Total 30 times) ・Damage/Defect/RF degradation is not observed after shock.
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Drawing No.：JW205100XX Criteria Description 損傷無し No damage 試験後外観に損傷が無いこと。 No damage on the appearance after test. 検査仕様適合 Test spec in RF 検査仕様を満たすこと。 Meet to RF test specifications 動作可能 Workable 試験中動作が確認できること。 Can confirm to work during test. NOTE1 以下を除く全ての項目のサンプル数は 3 台・温度衝撃試験：10 台 Sample numbers for all test except below is 3 units. ・Thermal shock test：10 units © silex technology, Inc.
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Drawing No.：JW205100XX 12. 使用上の注意 (Notifications)  本製品の仕様は、§6. に掲げる法規制に適合していますが、以下の場合は仕様が変更になる可能性があります。 Specifications of this module compliant to law regulations of §6. Standards Compliance, but this shall not apply to following cases. 1) §6.1 に掲げる国以外で使う場合。 In case this module is used in the different country from the list of §6.1 2) §6.2 に掲げるアンテナ以外を使う場合。 In case this module is used with different antenna from the antenna list of §6.2 3) 認可の更新が必要な場合。 In case the certification must be renewed.
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Drawing No.：JW205100XX  本製品が使用する無線帯域において、同一周波数帯を利用する装置への影響又は装置からの影響を受ける場合があります。設置においては事前に環境の調査を実施してください。 This module will effect to some other device or be affected by the some other device using the same frequency band. Please investigate the environment to use this module beforehand.  本製品について分解や改造を行うと電波法に基づいた処罰を受ける事があります。 Disassembling or modifying the radio module leads to punishment based on radio law.
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Drawing No.：JW205100XX 13. 付録 A 参考ランド設計 (Appendix-A Reference land design) (mm) Top view （reference stencil design） © silex technology, Inc.
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Drawing No.：JW205100XX 14. 付録 B SMT リフロー条件 (Appendix -B SMT reflow profiles) 本推奨条件は、Sn/Ag/Cu Pb-フリーハンダを使用した場合のものです。使用するハンダの種類によって最適化することを推奨します。 This recommended condition assumes Sn/Ag/Cu solder. This condition should be optimized per using solder type. Sn/Ag/Cu Pb-フリー実装 (Sn/Ag/Cu Pb-Free Assembly) Profile Feature Conditions Parametric Min. Typ. Max. Units 0 － 3.
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Drawing No.：JW205100XX 15. 付録 C 仕向け毎の送信電力 (Appendix -C TX power at each destination) 15.1. Japan 2.4GHz (+25’C) Items Modes Rates Ch.1-Ch.13 送信電力 11b 1-11Mbps +11.5 Transmit Power 11g 6-24Mbps +14.5 36Mbps +14.5 48Mbps +14.5 54Mbps +14.5 11n/ac MCS 0-2 +14.5 20MHz MCS 3-4 +14.5 MCS 5 +14.5 MCS 6 +14.5 MCS 7 +14.5 MCS 8 +14.0 Target Power (dBm) Ch.3-Ch.11 11n/ac MCS 0-2 +14.5 40MHz MCS 3-4 +14.5 MCS 5 +14.5 MCS 6 +14.5 MCS 7 +14.5 MCS 8 +14.0 MCS 9 +13.
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Drawing No.：JW205100XX 15.2. EU 2.4GHz (+25’C) Items Modes Rates Ch.1-Ch.13 送信電力 11b 1-11Mbps +11.0 Transmit Power 11g 6-24Mbps +13.5 36Mbps +13.5 48Mbps +13.5 54Mbps +13.5 11n/ac MCS 0-2 +13.5 20MHz MCS 3-4 +13.5 MCS 5 +13.5 MCS 6 +13.5 MCS 7 +13.5 MCS 8 +13.5 Target Power (dBm) Ch.3-Ch.11 11n/ac MCS 0-2 +13.5 40MHz MCS 3-4 +13.5 MCS 5 +13.5 MCS 6 +13.5 MCS 7 +13.5 MCS 8 +13.5 MCS 9 +13.
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Drawing No.：JW205100XX 15.3. US 2.4GHz (+25’C) Items Modes Rates Ch.1 Ch.2-Ch.9 Ch.10 Ch.11 送信電力 11b 1-11Mbps +10.0 +10.0 +10.0 +10.0 Transmit Power 11g 6-24Mbps +15.0 +17.0 +16.5 +12.5 36Mbps +15.0 +17.0 +16.5 +12.5 48Mbps +15.0 +16.5 +16.5 +12.5 54Mbps +15.0 +15.5 +15.5 +12.5 11n/ac MCS 0-2 +14.5 +17.5 +17.5 +13.0 20MHz MCS 3-4 +14.5 +17.5 +17.5 +13.0 MCS 5 +14.5 +16.0 +16.0 +13.0 MCS 6 +14.5 +15.5 +15.5 +13.0 MCS 7 +14.5 +15.0 +15.0 +13.
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Drawing No.：JW205100XX 5GHz (+25’C) W56, W58 Items Modes Rates Ch.100 Ch.104-Ch.136 Ch.140 Ch.149-Ch.157 Ch.165 送信電力 11a 6-24Mbps +13.0 +15.0 +12.0 +14.5 +14.0 36Mbps +13.0 +15.0 +12.0 +14.5 +14.0 48Mbps +13.0 +14.5 +12.0 +14.5 +14.0 54Mbps +13.0 +13.5 +12.0 +13.5 +13.5 11n/ac MCS 0-2 +13.5 +15.0 +13.5 +14.5 +14.0 20MHz MCS 3-4 +13.5 +15.0 +13.5 +14.5 +14.0 MCS 5 +13.5 +14.5 +13.5 +14.5 +14.0 MCS 6 +13.5 +14.0 +13.5 +14.0 +14.0 MCS 7 +13.5 +13.