DATASHEET: ZM5304 FULLY INTEGRATED Z-WAVE® WIRELESS MODEM WITH ON-BOARD ANTENNA Features Complete Z-Wave stack available over UART or USB 32kB of byte addressable NVM memory Fully Integrated crystal, EEPROM, SAW filter, matching circuit, and antenna Supply voltage range from 2.3V-3.6V for optional battery operation No external components required FCC modular approval CE self-certified ITU G.
Datasheet: ZM5304 1 CONTENT 2 OVERVIEW .......................................................................................................................................................................... 4 2.1 PERIPHERALS ........................................................................................................................................................................... 4 2.1.1 Advanced Encryption Standard Security Processor .....................................................
Datasheet: ZM5304 8.3 9 SOLDERING INFORMATION ....................................................................................................................................................... 26 ORDERING INFORMATION ................................................................................................................................................ 28 9.1 TAPE AND REEL INFORMATION .............................................................................................................
Datasheet: ZM5304 2 OVERVIEW The ZM5304 Modem is a fully integrated module with an on-board antenna that allows the establishment of a Z-Wave network with minimum risk. The SD3503 modem chip is used with an external NVM (EEPROM), 32MHz crystal, power supply decoupling, SAW filter, matching circuit, and a helical antenna. Figure 2.1 shows the main blocks of the ZM5304 Modem, while Figure 2.2 illustrates the firmware stack of an example application.
Datasheet: ZM5304 the frame payload and the message authentication code to ensure privacy and authenticity of messages. The processor supports Output FeedBack (OFB), Cipher-Block Chaining (CBC), and Electronic CodeBook (ECB) modes to target variable length messages. Payload data is streamed in OFB mode, and authentication data is processed in CBC mode as required by the Z-Wave protocol.
Datasheet: ZM5304 2.1.5 POWER-ON-RESET / BROWN-OUT DETECTOR When a cold start-up occurs, an internal Power-On-Reset (POR) circuit ensures that code execution does not begin unless the supply voltage is sufficient. After which, an internal Brown-Out Detector (BOD) circuit guarantees that faulty code execution does not occur by entering the reset state, if the supply voltage drops below the minimum operating level. These guarantees apply equally in both the active and sleep modes. 2.1.
Datasheet: ZM5304 ZM5304 USB_DP USB_DM Host Figure 2.4: USB interface 2.1.9 WATCHDOG The watchdog helps prevents the CPU from entering a deadlock state. A timer that is enabled by default achieves this by triggering a reset event in case it overflows. The timer overflows in 1 second, therefore it is essential that the software clear the timer periodically. The watchdog is disabled when the chip is in power down mode, and automatically restarts with a cleared timer when waking up to the active mode. 2.
Datasheet: ZM5304 2.3 MODULE PROGRAMMING The firmware of the ZM5304 Modem can be upgraded through the UART or USB interface. [3] In-System Programming is the default mode delivered from the factory. 2.3.1 ENTERING IN-SYSTEM PROGRAMMING MODE The module can be placed into the UART In-System Programming (ISP) mode by asserting the active low RESET_N signal for 4.2ms. The programming unit of the module then waits for the “Interface Enable” serial command before activating the ISP mode over the UART. 2.3.
Datasheet: ZM5304 3 TYPICAL APPLICATION An illustration of two application examples using the ZM5304 Modem implementation follows. The host application located on an external microcontroller accesses the Z-Wave stack via the serial API. Figure 3.1 depicts the scenario when the UART is used 1 as the primary interface to the ZM5304 Modem, while Figure 3.2 shows the scenario when the USB is used.
Datasheet: ZM5304 4 PAD CONFIGURATION GND NC NC NC NC NC NC NC NC NC NC NC NC GND 48 47 46 45 44 43 42 41 40 39 38 37 36 35 The layout of the Exposed Pads (EP) on the ZM5304 Modem is shown in Figure 4.1.
Datasheet: ZM5304 Table 4.3: UART interface signals RXD Pad Location 5 TXD 4 Pad Name Type I O Function in Reset State Waits for the “Interface Enable” serial command after 4.2ms. Enters ISP mode after command is received from the host. Serial data transmit when in ISP mode, high impedance otherwise. Function in Active State Receive data from host serial port. Transmit data to host serial port. Table 4.
Datasheet: ZM5304 5 ELECTRICAL CHARACTERISTICS This section describes the electrical parameters of the ZM5304 Modem module. 5.1 TEST CONDITIONS Characterization in Lab (TA=-10°C to +85°C, VDD=+2.3 to +3.6V) Sorting criterion specified with Min and Max values Manufactured Modules Statistics with Min, Typ, and Max values Final Test in Production (TA=+25°C, VDD=+3.3V) Tested Modules Figure 5.1: Testing flow The following conditions apply for characterization in the lab, unless otherwise noted. 1. 2.
Datasheet: ZM5304 5.2 ABSOLUTE MAXIMUM RATINGS The absolute ratings specify the limits beyond which the module may not be functional. Exposure to absolute maximum conditions for extended periods may cause permanent damage to the module. Table 5.1: Voltage characteristics Symbol VDD-GND VIN-GND ESDHBM ESDMM ESDCDM Description Main supply voltage Voltage applied on any I/O pad JEDEC JESD22-A114F Human Body Model JEDEC JESD22-A115C Machine Model JEDEC JESD22-C101E Field-Induced Charged-Device Model Min -0.
Datasheet: ZM5304 Table 5.5: Current consumption in active modes Symbol IDD_ACTIVE IDD_ACTIVE_USB IDD_RX IDD_TX_0 IDD_TX_2 Description MCU running at 32MHz MCU running at 32MHz and USB PHY active MCU and radio receiver active MCU and radio transmitter active, 0dBm MCU and radio transmitter active, +2dBm Min Typ Max 16 TBD 34 TBD TBD Unit mA mA mA mA mA - 15 TBD 32 36 40 -6 -3 0 3 2.0 2.0 Max TBD 2.
Datasheet: ZM5304 Table 5.8: Transition between operating modes Symbol tACTIVE_SLEEP tSLEEP_ACTIVE Description Transition time from the active state to the sleep state Transition time from the sleep state to the active state ready to execute code Min Typ - Max 125 - Unit ns µs - - Max +2.3 Unit V - - 1.0 ms 160 Table 5.
Datasheet: ZM5304 5.7 ANALOG-TO-DIGITAL CONVERTER Measured at an ambient temperature of TA=-10°C to +85°C and a supply voltage of VDD=+2.3V to +3.6V. Table 5.14: 12 bit ADC characteristics Symbol VBG VREF+ VREFDNLADC ACC8b ACC12b fS-8b fS-12b 5.
Datasheet: ZM5304 Table 5.17: Digital input characteristics, supply voltage of VDD=+3.0V to +3.
Datasheet: ZM5304 3 Transmit Power (dBm) 0 -3 -6 -9 -12 -15 -18 -21 -24 -27 0 5 10 15 20 25 30 35 40 45 50 55 60 RFPOW Setting Figure 5.3: Typical transmit power vs. RFPOW setting TBD Figure 5.4: Typical output impedance 5.9.2 RECEIVER Measured over an ambient temperature of TA=-10°C to +85°C and a supply voltage of VDD=+2.3V to +3.6V. Table 5.20: Receiver sensitivity Symbol P9.6 P40 P100 18 Description Sensitivity at 9.
Datasheet: ZM5304 -91 Sensitivity (dBm) -93 -95 -97 9.6 kbps -99 40 kbps -101 100 kbps -103 -105 -50 -25 0 25 50 75 100 Temperature (°C) Figure 5.5: Typical sensitivity vs. temperature Measured at an ambient temperature of TA=+25°C and a supply voltage of VDD=+3.3V. Table 5.
Received Power (dBm) Datasheet: ZM5304 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 -105 -110 35 40 45 50 55 60 65 70 75 80 85 Received Signal Strength Indicator Value Figure 5.6: Typical input power vs. RSSI value TBD Figure 5.
Datasheet: ZM5304 5.9.3 ANTENNA Figure 5.8: Radiatian pattern measured starting from the top with the antenna placed to the left on the ZX plane Figure 5.9: Radiatian pattern measured starting from the top with the antenna facing up on the XY plane Figure 5.
Datasheet: ZM5304 Table 5.22: Antenna performance Frequency Range (MHz) 868 908 923.5 Orientation XY plane, horizontal XY plane, vertical YZ plane, horizontal YZ plane, vertical ZX plane, horizontal ZX plane, vertical XY plane, horizontal XY plane, vertical YZ plane, horizontal YZ plane, vertical ZX plane, horizontal ZX plane, vertical XY plane, horizontal XY plane, vertical YZ plane, horizontal YZ plane, vertical ZX plane, horizontal ZX plane, vertical Average Gain (dBi) -11.6 -5.4 -6.2 -14.3 -7.3 -8.
Datasheet: ZM5304 6 Z-WAVE FREQUENCIES Table 6.1: Z-Wave RF specification Data rate 9.6kbps 40kbps 100kbps Frequency Shift Keying (FSK) FSK Gaussian Frequency Shift Keying (GFSK) fC±20kHz fC±20kHz fC±29.3kHz Manchester encoded Non-return to Zero (NRZ) NRZ United Arab Emirates 868.42 MHz 868.40 MHz 869.85 MHz E Australia 921.42 MHz 921.40 MHz 919.80 MHz H Brazil 921.42 MHz 921.40 MHz 919.80 MHz H Canada 908.42 MHz 908.40 MHz 916.00 MHz U Chile 908.42 MHz 908.40 MHz 916.
Datasheet: ZM5304 7.1 MODULE INFORMATION MODULE MARKING FCC ID Table 7.1: Marking description REGION: E Regional information U H US regulatory information FCC ID A N T E N N A REGION 7 Figure 7.1: Marking placement NB: The shield is mounted only on the U regional module. 7.2 MODULE DIMENSIONS ZM5304 vHW/vFW PRODCODE REGION YYWWDD FCC ID: TBD 15.20 Shield FCC ID A N T E N N A 0 27 0 * All dimensions are in millimeters (mm) Figure 7.2: Top view of module 5.5 3.
Datasheet: ZM5304 14.85 RECOMMENDED PCB MOUNTING PATTERN 36 37 38 39 40 41 42 43 44 45 46 47 48 0 0.15 8.1 PCB MOUNTING AND SOLDERING 15.05 35 8 12.10 1 34 11.10 2 33 10.10 3 32 9.10 4 8.10 5 7.10 6 29 6.10 7 28 5.10 8 27 4.10 9 26 3.10 10 25 31 30 11 12 13 14 15 16 17 18 19 20 21 22 23 24 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Top View 0.15 0 0 0 1.70 0.65 P A D * All dimensions are in millimeters (mm) Figure 8.
Datasheet: ZM5304 8.2 RECOMMENDED PLACEMENT ON PCB Recommended metal free space > 50mm recommended 24 23 22 25 21 26 10 20 27 9 19 28 8 18 29 7 17 30 6 16 31 5 15 32 4 14 33 3 13 34 2 12 1 11 > 55mm recommended 35 36 37 38 39 40 41 42 43 44 45 46 47 48 > 5mm recommended > 55mm recommended > 50mm recommended PCB ground plane with components Copper free PCB Figure 8.2: Top view of recommended placement of module on PCB 8.
Datasheet: ZM5304 Table 8.2: Typical reflow profile Symbol TP to TL TS tS TL tL TP tP TP to TL t Description Ramp-up rate Preheat temperature Preheat time Heating temperature Heating time Peak temperature Time within 5°C of actual peak temperature Ramp-down rate Time 25°C to peak temperature Min Max 150 60 215 60 28 - 3 200 120 220 150 260 32 6 8 Unit °C/s °C s °C s °C s °C/s min Figure 8.
Datasheet: ZM5304 9 ORDERING INFORMATION Table 9.1: Ordering codes Orderable Device Status ZM5304AE-CME3R ACTIVE Package Type 5 SOM ZM5304AU-CME3R ACTIVE ZM5304AH-CME3R ACTIVE 5 48 Minimum Order Quantity 500 pcs. SOM 48 500 pcs. SOM 48 500 pcs.
Datasheet: ZM5304 9.1 TAPE AND REEL INFORMATION Figure 9.
Datasheet: ZM5304 Figure 9.
Datasheet: ZM5304 10 REVISION HISTORY Date 2013/07/02 Version 3A Affected §1, §2, §5 2013/07/02 2B §2.1.9, §10 2013/07/01 2A §2.1, §2.3, §7.2, §6 2013/06/03 2013/05/31 2013/05/30 1F 1E 1D §5.
Datasheet: ZM5304 11 REFERENCES [1] [2] [3] [4] 32 Sigma Designs, “Serial API Host Application Programming Guide,” INS12350, Denmark, 2012. Sigma Designs, “Z-Wave 500 Series Application Programmers Guide v6.50.00,” INS12308, Denmark, 2012. Sigma Designs, “500 Series Z-Wave Single Chip Programming Mode,” INS11681, Denmark, 2012. Sigma Designs, “ZDB5304 Z-Wave Development Board,” DSH12468, Denmark, 2013.
Datasheet: ZM5304 DISCLAIMER The information in this document is subject to change without notice. Sigma Designs reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that the datasheet is current before placing orders. Information furnished by Sigma Designs is believed to be accurate and reliable.
Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required.