MC5720, MC5725, MC8755, MC8765 MiniCard Hardware Integration Guide Proprietary and Confidential 2130114 Rev 1.
Preface Limitation of Liability The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless.
MC5720/5725/8755/8765 Hardware Integration Guide Trademarks AirCard and “Heart of the Wireless Machine” are registered trademarks of Sierra Wireless. Sierra Wireless, the Sierra Wireless logo, the red wave design, the red‐tipped antenna, and Watcher are trademarks of Sierra Wireless. Windows® is a registered trademark of Microsoft Corporation. Qualcomm® is a registered trademark of Qualcomm Incorpo‐ rated. Other trademarks are the property of the respective owners.
Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 The Universal Development Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Required connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Guide organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Related documents. . . . . . . . . . . . .
MC5720/5725/8755/8765 Hardware Integration Guide Host/Module Communication Interface . . . . . . . . . . . . . . . . . . . . . 17 LED output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Safety and hazards . . . . . . . . . . . . . . .
1 1: Introduction Sierra Wireless’ MiniCard modules form the radio component for the products in which they are embedded.
MC5720/5725/8755/8765 Hardware Integration Guide MC8755/MC8765 Universal Development Kit board is a Molex 67910‐0001. • Industry‐standard USIM/RUIM connector: The actual connector you use depends on how your device exposes the USIM/RUIM socket. For example, the USIM/RUIM connector used on the MC5720/MC5725/MC8755/MC8765 Universal Development Kit is an ITT CCM03‐3518. Guide organization This guide includes the following sections: 1. Introduction (this section) 2. Power Interface (p.
Introduction Table 1-1: Related documentation Document title AT Command Set for User Equipment (UE) (Release 6) Description This 3GPP technical specification describes standard AT commands for GSM/UMTS devices. The document (3GPP TS 27.007) can be downloaded from www.3gpp.org. CDMA 1X Standard This standard describes the technical requirements for CDMA systems, including details on sleep cycle index (SCI) values.
MC5720/5725/8755/8765 Hardware Integration Guide Table 1-1: Related documentation (Continued) Document title 8 Description MC87xx Modem Extended AT Command Reference (Document 2130616) This document describes proprietary AT commands for the MC8755/MC8765.
2 2: Power Interface Overview of operation Note: This chapter contains information for both the CDMA (MC5720/ 5725) and GSM (MC8755/8765) modules. Information that is unique to one module type is clearly identified. The module is designed to use a 3.3V (nominal) power supply, provided by the host. It is the host’s responsibility to provide safe and continuous power to the module at all times; the module does NOT have an independent power supply, or protection circuits to guard against electrical issues.
MC5720/5725/8755/8765 Hardware Integration Guide Note: ESD protection is highly recommended for the SIM connector at the point where the contacts are exposed, and any other signals from the host interface that would be subjected to ESD by the user of the end product. Module power states Note: The module unit defaults to the Normal state when VCC3.3 is first applied in the absence of W_Disable# control. At any time, the module will be in one of four power states: • Disconnected No power to the module.
Power Interface Normal state Note: This is the default state when VCC3.3 is first applied in the absence of W_Disable# control. This is the active state of the module. While in this state: • The module is fully powered. • The module is capable of placing/receiving calls or estab‐ lishing data connections on the wireless network. • The USB interface is fully active. Low power mode In this power state, RF (both Rx and Tx) is disabled in the module, but the USB interface is still active.
MC5720/5725/8755/8765 Hardware Integration Guide This example model applies to a battery‐operated device. In practice, because the module will be isolated from the battery (the host device manages the power source), the mAh ratings will depend on the device’s supply efficiency. The module automatically enters slotted sleep mode when there is no transmission or reception occurring (SCI = 2). Transmit power is assumed to be +3 dBm.
3 3: RF Integration RF connection Consider the following when attaching an antenna to the module: Note: To disconnect the antenna, make sure you use the Hirose U.FL connector removal tool (P/N UFL-LP-N-2(01) to prevent damage to the module or coaxial cable assembly. • Use a Hirose U.FL connector (model U.FL #CL331‐0471‐0‐10) to attach an antenna to a connection point on the module, as shown in Figure 3‐1 (The main RF connector on the top side; the diversity RF connector on the bottom side).
MC5720/5725/8755/8765 Hardware Integration Guide Shielding The module is fully shielded to protect against EMI and to ensure compliance with FCC Part 15 ‐ “Radio Frequency Devices” (or equivalent regulations in other jurisdictions). Note: The module shields must NOT be removed. Antenna and cabling When selecting the antenna and cable, it is critical to RF perfor‐ mance to match antenna gain and cable loss.
RF Integration etc.). If the cables are near the noise sources, the noise may be coupled into the RF cable and into the antenna. Disabling the diversity antenna (MC5720/5725) If your host device is not designed to use the MC5720/5725’s diversity antenna, terminate the interface with a no‐connect.
MC5720/5725/8755/8765 Hardware Integration Guide Device-generated RF Note: The module can cause interference with other devices such as hearing aids and onboard speakers. Wireless devices such as the MiniCard transmit in bursts (pulse transients), for set durations (RF burst frequencies). Hearing aids and speakers convert these burst frequencies into audible frequencies, resulting in audible noise.
4 4: Host/Module Communication Interface This chapter provides information about the Host‐Module communication interface (USB interface) and lists of extended AT commands that may be useful for hardware integration testing. Note: On any given interface (USB, USIM/RUIM, etc.), leave unused inputs and outputs as no-connects. LED output The module drives the LED output according to the PCI‐ Express MiniCard specification (summarized in Table 4‐1, below).
MC5720/5725/8755/8765 Hardware Integration Guide Figure 4-1: Example LED VCC 3.
5 5: Regulatory Information Important notice Because of the nature of wireless communications, trans‐ mission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
MC5720/5725/8755/8765 Hardware Integration Guide Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. The MC5720/ MC5725/MC8755/MC8765 modem may be used normally at this time. Important compliance information for North American users The MC5720/MC5725/MC8755/MC8765 modem has been granted modular approval for mobile applications.
Regulatory Information 5. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC / IC RF exposure guidelines. The end product with an embedded MC5720/MC5725/ MC8755/MC8765 modem may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15.
MC5720/5725/8755/8765 Hardware Integration Guide 22 2130114
A A: Acronyms and Definitions .
MC5720/5725/8755/8765 Hardware Integration Guide Table 5-1: Acronyms and definitions Acronym or term 24 Definition MC8755 / MC8765 Sierra Wireless MiniCards used on GSM networks MHz MegaHertz = 10E6 Hertz (Hertz = 1 cycle/second) MIO Module Input/Output MPE Maximum Permissible Exposure — the level of radiation to which a person may be exposed without hazardous effect or adverse biological changes OTA Over The Air or Radiated through the antenna PCS Personal Communication System - PCS spans th
Index A acronyms and definitions 23–24 airplane mode 11 antenna connection and mounting points 13 connection considerations 13 custom, considerations 14 diversity antenna, disabling 15 limit, matching coaxial connections 13 location, considerations 14 matching, considerations 14 maximum cable loss 13 AT commands 3GPP specification, details 7 extended, MC5720/5725 7 extended, MC8755/8765 8 low power mode, setting 11 C cable loss antenna, maximum 13 CnS MC5720 reference, details 7 MC8755 reference, details 7
MC5720/5725/8755/8765 Hardware Integration Guide N safety and hazards 19 RF antenna cable loss, maximum 13 antenna connection, considerations 13 cable type, required 5 desense device‐generated 16 integration 13–16 interference other devices 16 power supply 15 wireless devices 15 noise leakage, minimizing 13 RF interference, power supply 15 normal, module power state 11 O off, module power state 10 P PCI Express mini card specification details 8 power disconnected, characteristics 10 normal, characteris
