YUECHUANGKONGJIAN ML3362T-P Version:RGBCW-US3335 2020 Embedded Wi-Fi Module 12, Release date: Sep. Features Support IEEE802.
-2Content 1. Overview ............................................................................................................................ - 3 2. Basic Specifications ............................................................................................................ - 3 2.1. Power Consumption ................................................................................................... - 3 2.2. Working Environment .......................................................................
-3- 1. Overview ML3362T-P is a cost-effective embedded Wi-Fi module designed by BroadLink, which supports 802.11 b/g/n standards and UART communication with other devices. The module integrates radio transceiver, MAC, baseband, all Wi-Fi protocols, configurations and network stack. It can be widely used in applications like smart home devices, remote monitoring devices and medical care instruments. The module integrates an ARM Cortex-M4 processor speed up to 160MHz with 352KB SRAM and 1MB flash. 2.
-4- 2.2. Working Environment Please refer to Table 2 for working environment data. Table 2 BL3363T-P Working Environment Data Symbol Description Min. Max. Units Ts Storage temperature -40 125 ℃ TA Ambient operating temperature -10 105 ℃ Vdd Supply voltage 3.3 4 V Vio Voltage on IO pin 0 VDD V ESD HBM 1000 2000 V 3. Radio Specifications 3.1. Basic Radio Specification Please refer to Table 3 for radio specification.
-5- 3.2. Radio Performance 3.2.1. IEEE 802.11b Table 4 Basic specifications under IEEE802.11b ITEM Specification Modulation Type DSSS / CCK Frequency range 2412MHz~2462MHz Channel CH1 to CH11 Data rate 1, 2, 5.5, 11Mbps Table 5 Transmitting performance under IEEE802.11b TX Characteristics Min. Typical Max. 17 Power@11Mbps dBm -10 Frequency Error Unit EVM@11Mbps +10 ppm -20 dB Transmit spectrum mask Pass Table 6 Receiving performance under IEEE802.
-6Channel CH1 to CH11 Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps Table 8 Transmitting performance under IEEE802.11g TX Characteristics Min. Typical Max. 14 Power@54Mbps dBm -10 Frequency Error -30 EVM@54Mbps Unit +10 ppm -29 dB Transmit spectrum mask Pass Table 9 Receiving performance under IEEE802.11g RX Characteristics Min. Typical Max. Unit -71 dBm -8 dBm Minimum Input Level Sensitivity 54Mbps Maximum Input Level (FER≦10%) 3.2.3 IEEE802.11n IEEE802.
-7Table 11 Transmitting performance under IEEE802.11n with 20MHz TX Characteristics Min. Typical 14 Power@HT20, MCS7 Unit dBm -10 Frequency Error Max. EVM@HT20, MCS7 +10 ppm -29 dB Transmit spectrum mask Pass Table 12 Receiving performance under IEEE802.11n with 20MHz RX Characteristics Min. Typical Max. Unit -69 dBm -8 dBm Minimum Input Level Sensitivity MCS7 Maximum Input Level (FER≦10%) IEEE802.11n 40MHz bandwidth mode Table 13 Basic specifications under IEEE802.
-8- Table 15 Receiving performance under IEEE802.11n with 40MHz RX Characteristics Min. Typical Max. Unit -68 dBm -8 dBm Minimum Input Level Sensitivity MCS7 Maximum Input Level (FER≦10%) 4. ML3362T-P Hardware Information 4.1. Footprint Sequence Please refer to Fig 1 for the footprint sequence of ML3362T-P.
-9- 4.2. Footprint Definitions Please refer to Table 16 for the footprint definitions of ML3362T-P.
- 10 17 TX0 18 GND GPIO_27 DOWN Note: 1. In default, UART2 (pin1 and pin2) are used for bypass communication and UART0 (pin16 and pin17) are used for output of debugging information and burning firmware. Please refer to the description in DC Characteristics for UART output current level. 2. PDN is hardware reset for the module and will be effective with VIL. Configuration information will be remained after module reset. The module has pull-up process for PDN designed internally. 3.
- 11 - Fig 2 BL3335-P Antenna The gain of PCB antenna on this module is about 0dB, as shown in Fig Fig 3. Fig 3 Simulated radiation pattern of antenna gain The following precautions should be considered during designing with PCB antenna: 1. Do not place any electrical components or grounding in antenna area on main board and it’s better to leave this area blank on PCB. 2.
- 12 antenna and not design any circuit or bond copper on main board under this area. 3. Do not use the module inside any metal case or containers with metal painting. 4. Keep the antenna of wifi module next to the edge of main board during design of PCB to ensure better performance of antenna, as illustrated below. Module Device PCB Fig 4 BL3335-P Recommended PCB layout 4.4. Mechanical Dimensions Please refer to Fig Fig 5 for the dimensions of BL3335-P module.
- 13 - Fig 5 BL3335-P Dimensions a. Note: Dimensions (13.3±0.2) mm * (21±0.2) mm * (2.6±0.2)mm (with shielding case) 4.5. Recommended Pad Size Please refer to Fig Fig 6 for the recommended pad size of BL3335-P module.
- 14 - 5. Reference Design 5.1. UART Interface Design For devices with 3.3V power supply, you can directly connect the device UART port with module UART port according to the illustration in Fig Fig 7. External MCU Wi-Fi module Capacitor Grounding Fig 7 Circuit diagram (3.3V) If your device is powered by 5V, you can refer to the circuit shown in Fig Fig 8 or design your own circuit for power conversion. The value of resistor can be adjusted according to actual circuit design.
- 15 - Fig 8 Circuit diagram (5V) 5.2. Power Supply Requirement If an LDO is used to supply the module with 3.3V power, C1 capacitor can be considered to be used with 10u-22u; If a DCDC is used to supply 3.3V power, C1 capacitor can be considered to be used with 22uF. It is recommended to supply the module with power higher than 400mA to ensure enough power supply to the module and avoid power down during data transmission.
- 16 - Revision History Date 2018-05-24 2020-02-19 Version 1.0 Updated Content Preliminary version 1.1 Copyrights It is prohibited to use or copy all or any part of contents in this manual without prior permission, especially applicable for trademarks, models, part numbers and figures. Contact Us Ms Wu SHENZHEN YUECHUANGKONGJIAN TECHNOLOGY CO.,LTD Add: Room 1401, Sangtai building, Lishan Road, Taoyuan Street, Nanshan District, Shenzhen Postcode: 310052 Tel: +86 18938933720 Email:amy.wu@lemaker.
- 17 website: http://www.lemaker.org/ 2.2 List of applicable FCC rules FCC Part 15.247 2.6 RF exposure considerations This equipment complies with the FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and any part of your body. 2.
- 18 portable configurations with respect to Part 2.1093 and difference antenna configurations. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. FCC Warning This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
- 19 authorized. Any antenna that is of the same type and of equal or less directional gain as an antenna that is authorized with the intentional radiator may be marketed with, and used with, that intentional radiator. NOTE 5: For all products market in US, OEM has to limit the operation channels to CH1 to CH11 for 802.11b/g/n-HT20 and CH3 to CH9 for 802.11n-HT40 by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to Regulatory Domain change.