RE706B WIFI Module product specification Version ： V 1.
RE706B WIFI Module product specification Version update instructions DATE Version Updated content 2020-07-31 V1.0 Initial document 2020-08-07 V1.1 Update pin function 2020-10-25 V1.
RE706B WIFI Module product specification 1. Product Introduction .................................................................................................. 4 2. Product Features ........................................................................................................ 4 3. Application areas........................................................................................................ 4 4. Module size and pin definition ..........................................................
RE706B WIFI Module product specification 1. Product Introduction Introduction The RE706B wireless WIFI module adopts the latest low-power Simple-Chip WIFI SV6166F chip design from Southern Silicon Valley, and uses advanced design technology to achieve low power consumption and high throughput; the module hardware integrates WLAN MAC, Baseband , RF, integrated MCU inside the chip, clocked at 160MHz, built-in 192KB SRAM and 128K ROM. It works in the 2.4GHz frequency band and supports 802.
RE706B WIFI Module product specification 4. Module size and pin definition 4.1 Dimensions Single board size (mm): 24mm*16mm*2.4mm, PCB thickness 0.
RE706B WIFI Module product specification 4.2 Pin definition Pin numb Remark Pin name Function description 1 RERST Reset interface, active low 2 GPIO 20 I2S0_MCLK /ADC2/GPIO 3 LDO_EN Module enable 4 GPIO 12 I2S_DO / SPI_M_MOSI / I2C_M_SCL / GPIO 5 GPIO 10 I2S_DI / SPI_M_MISO / I2C_M_SDA / GPIO 6 GPIO 01 PWM 1 / GPIO PWM(0-20KHz) 7 GPIO 02 PWM 2 / GPIO PWM(0-20KHz) 8 VDD33 Power supply interface 3.
RE706B WIFI Module product specification IO high level VIH 0.8 - VCC V -0.3 - 0.24 V 0.8 - VCC V - - 0.1 V - - 12 mA input VIL IO low level input IO high level VOH output IO low level VOL output Imax IO drive current 6. RF performance 2.4G-TX: Mode 11b(EVM<35%) 11g（EVM<-25） 11n_HT20(EVM<-27) 11n_HT40(EVM<-27) Channel Rate Power（dBm） EVM 1 11Mbps 16.7 -31 11 11Mbps 16.8 -31 1 54Mbps 14.1 -30 11 54Mbps 14.4 -30 1 MCS7 13.6 -30 11 MCS7 13.
RE706B WIFI Module product specification PCB should not be wired or copper coated in the antenna area, so as not to affect the antenna performance. Ensure that there is no substrate medium under or above the printed antenna; ensure that the surrounding of the printed antenna is far away from the copper sheet, so as to ensure the radiation effect of the antenna to the greatest extent 8.
RE706B WIFI Module product specification 9. Packing and shipping method The module must be mounted by the SMT machine, and the mounting must be completed within 24 hours after unpacking and burning the firmware, otherwise the vacuum packaging must be re-packed, and the module must be baked before mounting. The storage conditions of the modules delivered are as follows: The moisture-proof bag must be stored in an environment where the temperature is less than 30℃ and the humidity is less than 70%RH.
RE706B WIFI Module product specification 10. FCC Warning 2.2 List of applicable FCC rules FCC Part 15.247 2.6 RF exposure considerations This equipment complies with the FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and any part of your body. 2.
RE706B WIFI Module product specification FCC Warning This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE 1: This product has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
