Specifications

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FRX-M79AU-21

802.11a/b/g/n/ac/ax 1200Mbps

WLAN + Bluetooth v5.2 Combo

USB3.0 Module Specification

Summary of content (21 pages)

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FRX-M79AU-21 802.11a/b/g/n/ac/ax 1200Mbps WLAN + Bluetooth v5.2 Combo USB3.
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Module Name: FRX-M79AU-21 Module Type: 802.11a/b/g/n/ac/ax 1200Mbps WLAN + Bluetooth v5.2 Combo USB3.0 Module Revision: V1.0 Customer Approval: Company: Title: Signature: Date: Title: Signature: Date: Revision History Revision 0.
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1. Introduction FRX-M79AU-21 is ahighlyintegratedDual-band WLAN+ Bluetooth v5.2Combomodule.It combines a 2T2R Dual-band WLAN subsystem and a Bluetooth v5.2 subsystem which features dual BT controllers.This modulecompatible IEEE 802.11a/b/g/n/ac/ax standard and provides the maximum PHYrate up to 1200Mbps, it supports BT / BLE dual mode with BT v5.2/v4.2/v2.1 compliant, offering feature-rich wireless connectivity at high standards, and delivering reliable, cost-effective throughput from an extended distance.
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1.2 General Specifications Module Name 802.11a/b/g/n/ac/ax 1200Mbps WLAN + Bluetooth v5.2 Combo USB3.0 Module Chipset MT7921AUN WLAN Standard IEEE802.11a/b/g/n/ac/ax BT Specification Bluetooth Core Specification v5.2/4.2/2.1 Host Interface USB3.0/USB2.0 for WLAN;USB2.0 for Bluetooth (Reserved UART interface for BT) Antenna IPEX / MHF-1 connector for external WLAN antenna; Half hole PADs for external BT antenna (Reserved IPEX connector for BT0) Dimension 27.0*17.8*2.
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(TOP View) 2.1 Pin Definition No. Level Module Pin Description Pin Name Type 1 GND RF RF Ground for WLAN_ANT1 2 NC RF NC（Reserved 2.4G / 5G RFPAD for WLAN_ANT1） 3 GND RF RF Ground for WLAN_ANT1 4 GND RF RF Ground for WLAN_ANT0 5 NC RF NC（Reserved 2.4G / 5G RFPAD for WLAN_ANT0） 6 GND RF RF Ground for WLAN_ANT0 7 GND RF RF Ground for BT_ANT1 8 BT_RF1 RF RF PAD for BT_ANT1 Function1、GPIO15，output shall not be used as input； 9 10 GPIO / UART_TXD GND 3.
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USB3.0 SuperSpeed Device Interface RX differential pair 17 SSRX+ （to connect USB 3.0 Host“SSTX+”） AI If USB3.0 is not used，this Pin can be left floating . 18 GND P 19 HSD+ A I/O 20 HSD- AI/O 21 VDD33 P Ground for Power and I/O USB2.0 HighSpeed Device Interfacedifferential pair （to connect USB 2.0 Host“HSD+”） USB2.0 HighSpeed Device Interfacedifferential pair （to connect USB 2.0 Host“HSD-”） DC 3.3V power supply Reset input，this Pin can externally shutdown/reset 22 Reset I/O 3.
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3. Electrical and Thermal Specifications 3.1 Recommended Operating Conditions Parameters Min Typ Max Units Ambient Operating Temperature -20 25 70 ℃ 1.7 2 / 3.1 3.3 3.5 V External Antenna VSWR Supply Voltage VDD33 3.2 Digital I/O DC Specifications Symbol Parameter Min Typ Max Units VIH Input High Voltage VDD33*0.625 -- VDD33+0.3 V VIL Input Low Voltage -0.3 -- VDD33*0.25 V VOH Output High Voltage VDD33*0.75 -- VDD33+0.3 V VOL Output Low Voltage -0.3 -- VDD33*0.
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Bluetooth Unassociated (Linux Driver, WLAN disable) TBD TBD mA BT BR_1M DH1 TX@9dBm (BT0 or BT1 RF test) TBD TBD mA BT LE_2M TX@7dBm (BT0 or BT1 RF test) TBD TBD mA BT BR_1M DH1 RX Active(BT0 or BT1 RF test) TBD TBD mA 4. WLAN& Bluetooth RF Specifications 4.1 2.4G WLAN RF Specification Conditions : VDD33=3.3V ; Ta:25℃ Features Description WLAN Standard IEEE 802.11b/g/n/ax, CSMA/CA Frequency Range 2.4~2.4835GHz (2.4GHz ISM Band) Channels Ch1~Ch13 (For 20MHz Channels) 802.
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2.4G Receiver Specifications RX Rate Min Input Level（dBm） Max InputLevel（dBm） PER 802.11b@1Mbps -94 -5 < 8% 802.11b@11Mbps -87 -5 < 8% 802.11g@6Mbps -92 -5 < 10% 802.11g@54Mbps -74 -5 < 10% 802.11n@HT20_MCS0 -92 -5 < 10% 802.11n@HT20_MCS7 -72 -5 < 10% 802.11n@HT40_MCS0 -89 -5 < 10% 802.11n@HT40_MCS7 -69 -5 < 10% 802.11ax@HE_SU 20M_MCS0 -91 -5 < 10% 802.11ax@HE_SU 20M_MCS11 -61 -5 < 10% 802.11ax@HE_SU 40M_MCS0 -88 -5 < 10% 802.
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Channels Ch36, Ch40, Ch44, Ch48; Ch149~Ch165(For 20MHz Channels) 802.11a (OFDM): BPSK, QPSK, QAM16, QAM64; 802.11n (OFDM): BPSK, QPSK, QAM16, QAM64; Modulation 802.11ac (OFDM): BPSK, QPSK, QAM16, QAM64, QAM256; 802.11ax (OFDMA): BPSK,BPSK_DCM,QPSK,QPSK_DCM, QAM16, QAM16_DCM, QAM64, QAM256, QAM1024; 802.11a: 6, 9, 12, 18, 24, 36, 48, 54Mbps; 802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps; 802.11n (HT20): MCS8~MCS15(2T2R_MIMO) 13~144.4Mbps; 802.11n (HT40): MCS0~MCS7(1T1R) 13.5~150Mbps; 802.
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5G Receiver Specifications Min Input Level（dBm） Max InputLevel（dBm） PER 802.11a@6Mbps -92 -5 < 10% 802.11a@54Mbps -74 -5 < 10% 802.11n@HT20_MCS0 -92 -5 < 10% 802.11n@HT20_MCS7 -72 -5 < 10% 802.11n@HT40_MCS0 -89 -5 < 10% 802.11n@HT40_MCS7 -69 -5 < 10% 802.11ac@VHT80_MCS0 -85 -5 < 10% 802.11ac@VHT80_MCS9 -59 -5 < 10% 802.11ax@HE_SU 80M_MCS0 -86 -5 < 10% 802.11ax@HE_SU 80M_MCS11 -56 -5 < 10% RX Rate 4.3 Bluetooth RF Specification Conditions: VDD33=3.
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Power Classes Bluetooth Classic: Class1; Bluetooth Low Energy: Class1.5; BR_1Mbps: GFSK; EDR_2Mbps: π/4-DQPSK; EDR_3Mbps: 8DPSK; Date Rate & Modulation LE_1Mbps: GFSK (Uncoded); Bluetooth Transmitter Specifications BR_1M (DH1) Modulation Characteristics Δf1avg 140KHz 158.6KHz 175KHz Δf2avg 140KHz 159.7KHz 175KHz Δf2max 115KHz 162.4KHz / Δf2avg/Δf1avg 0.8 1 / Items Min Typ Max EDR_3M(3DH5) EDR Carrier Frequency Stability and Modulation Accuracy ωi -75KHz 2.
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Δf2avg 225KHz 239.4KHz 275KHz Δf2max 185KHz 243.6KHz / Δf2avg/Δf1avg 0.8 0.96 / Items Min Typ Max Bluetooth Receiver Specifications Sensitivity Items Maximum Input Level Input Level(Typ） BER Input Level(Typ） BER BR_1M (DH1) -90dBm ≦0.1% -5dBm ≦0.1% EDR_3M (3DH5) -80 dBm ≦0.01% -5dBm ≦0.
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5. Mechanical Specifications 5.1 Module Outline Drawing Module dimension: 27.0*17.8*2.5mm(L*W*H; Tolerance: ±0.15mm) IPEX / MHF-1 connector dimension: 2.6*3.0*1.2mm (L*W*H, Ø2.0mm) Module Bow and Twist：≤0.
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5.
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6. Application Information 6.
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6.1 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250℃. 7. Key Components Of Module No. Parts Specification Manufacturer 1 Chipset MT7921AUN MediaTek Inc. Shenzhen Tie Fa TechnologyCO. LTD 2 PCB 7921AU1 Guangdong KINGSHINE ELECTRONICS CO., LTD QuzhouSunlordElectronics CO., LTD Lucki Electronics Co., Ltd Shenzhen Kaiyuexiang Electronics Co., 3 Crystal 40MHz-6pF-10ppm-2016 Ltd Chengde Oscillator Electronic Technology Co., Ltd.
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Advanced Ceramic X Corp. 8. Package and Storage Information 8.1 Package Dimensions Package specification: 1. 1000 modules per roll and 4,000 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 48mm (with a width of 44mm carrying belt). 4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag. 5. Each carton is packed with 4 boxes.
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8.2 StorageConditions Absolute Maximum Ratings: Storage temperature: -40℃ to +85℃, Storage humidity: 10% to 95（Non-Condensing） Recommended Storage Conditions: Storage temperature: 5℃ to +40℃, Storage humidity: 20% to 90% RH Please use this Module within 12month after vacuum-packaged. The Module shall be stored without opening the packing. After the packing opened, the Module shall be used within 72hours.
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FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’ s authority to operate the equipment.
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Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.