BL-M7663BU2 IEEE 802.11a/b/g/n/ac 2T2R USB WiFi +Bluetooth 5.
Module Name: BL-M7663BU2 Module Type: IEEE 802.11a/b/g/n/ac 2T2R USB WiFi+Bluetooth 5.0 Module Revision: V1.0 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revision Summary Release Date 0.1 Initial release 2021-07-30 1.0 Official version 2021-08-04 1http://www.b-link.net.
1. Introduction The BL-M7663BU2 is a highly integrated 2T2R 802.11a/b/g/n/ac Wireless LAN (WLAN) network and bluetooth combo module. The module’s interface is USB 1.0/1.1/2.0. It combines a WLAN MAC, a 2T2R capable WLAN base band. Bluetooth support 5.1 performance. The BL-M7663BU2 module provides a complete solution for a high throughput performance integrated wireless LAN and BT device. 1.1 Features Operating Frequencies: 2.4~2.4835GHz and 5.15~5.85GHz Host Interface is USB2.
1.3 General Specifications Module Name BL-M7663BU2 Chipset MT7663BUN WLAN Standard IEEE 802.11 a/b/g/n/ac BT Specification Bluetooth Core Specification v5.1/4.2/4.1/2.1 Host Interface USB2.0 for WiFi and Bluetooth Antenna Connect to the external antennas through IPEX connectors Dimension SMD 22Pins --27.0*17.7*3.1mm (L*W*H), Tolerance: +/-0.15mm Power Supply DC 3.3V±0.2V @ 1500 mA (Max) Operation Temperature -20℃ to +70℃ Operation Humidity 10% to 95% RH (Non-Condensing) 2.
3 USB_DP I/O USB differential data line 4 USB_DM I/O USB differential data line 5 RESET I 6 VDD33 P 7 WLAN_WAKE O 8 NC 9 GND RF GND 10 NC RF NC(Reserved 2.4G / 5G RF PAD for WLAN_ANT1) 11 GND RF GND 12 GND RF GND 13 NC RF NC(Reserved 2.4G / 5G RF PAD for WLAN_ANT0) 14 GND RF GND 15 GND RF GND 16 NC RF NC(Reserved BT RF PAD) 17 GND RF GND 18 NC NC 19 NC NC 20 NC NC 21 NC NC 22 GND P GND IPEX 0 WLAN_RF0 RF IPEX connector for 2.
3.2 Current Consumption Conditions : VDD33=3.3V ; Ta:25℃ ; Use Case VDD33 Current (average) Typ WLAN Unassociated (Linux Driver, BT_Disable) 68 2.4G 11b 1Mbps TX @ 19dBm (1TX RF test) Max Units 75 mA 368 398 mA 2.4G 11b 1Mbps RX (1RX RF test) 98 128 mA 2.4G 11g 6Mbps TX@18dBm (1TX RF test) 331 361 mA 2.4G 11g 6Mbps RX (1RX RF test) 96 126 mA 2.4G 11n HT20 MCS8 TX@14dBm (2TX RF test) 591 621 mA 2.4G 11n HT20 MCS8 RX (2RX RF test) 125 155 mA 2.
Features Description WLAN Standard IEEE 802.11b/g/n/ac, CSMA/CA Frequency Range 2.4~2.4835GHz (2.4GHz ISM Band) Channels Ch1~Ch13 (For 20MHz Channels) 802.11b (DSSS): CCK, DQPSK, DBPSK; Modulation 802.11g (OFDM): BPSK, QPSK, QAM16, QAM64; 802.11n (OFDM): BPSK, QPSK, QAM16, QAM64; 802.11ac (OFDM): BPSK, QPSK, QAM16, QAM64, QAM256; 802.11b: 1, 2, 5.5, 11Mbps; 802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps; 802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps; 802.11n (HT20): MCS8~MCS15(2T2R_MIMO) 13~144.
02.11n@HT40_MCS0 -86dBm -5 < 10% 802.11n@HT40_MCS7 -68dBm -5 < 10% 802.11ac@VHT40_MCS9 -63dBm -5 < 10% 4.2 5G WLAN RF Specification Conditions: VDD33=3.3V ; Ta:25℃ Features Description WLAN Standard IEEE 802.11a/n/ac, CSMA/CA 5.15~5.25GHz; 5.735~5.835GHz (5GHz ISM Band) Frequency Range Ch36, Ch40, Ch44, Ch48; Channels Ch149~Ch165 802.11a (OFDM): BPSK, QPSK, QAM16, QAM64; Modulation 802.11n (OFDM): BPSK, QPSK, QAM16, QAM64; 802.11ac (OFDM): BPSK, QPSK, QAM16, QAM64, QAM256; 802.
802.11n@HT20_MCS0 16dBm ±2 ≦-10dB 16dBm ±2 ≦-28dB 16dBm ±2 ≦-10dB 802.11n@HT40_MCS7 16dBm ±2 ≦-28dB 802.11ac@VHT80_MCS0 16dBm ±2 ≦-10dB 802.11ac@VHT80_MCS9 16dBm ±2 ≦-32dB 802.11ac@VHT20_MCS0 802.11n@HT20_MCS7 802.11ac@VHT20_MCS7 802.11n@HT40_MCS0 802.11ac@VHT40_MCS0 5G Receiver Specifications (WLAN_ANT0 & WLAN_ANT1) Min Input Level(dBm) Max Input Level(dBm) PER 802.11a@6Mbps -91 -5 < 10% 802.11a@54Mbps -74 -5 < 10% 802.11n@HT20_MCS0 -90 -5 < 10% 802.
BR_1Mbps: GFSK; EDR_2Mbps: π/4-DQPSK; EDR_3Mbps: 8DPSK; Date Rate & Modulation LE_125Kbps: GFSK (Coded_S=8); LE_500Kbps: GFSK (Coded_S=2); LE_1Mbps: GFSK (Uncoded); LE_2Mbps: GFSK (Uncoded); Bluetooth Transmitter Specifications Items Min(dBm) Typ(dBm) Max(dBm) BR_1M -5 0 4 EDR_2/3M -5 0 4 LE_125K/500K/1M/2M -5 0 2 Min Typ Max Δf1avg 140KHz 158.9.kHz 175KHz Δf2avg / 159.15.kHz / Δf2max 115KHz 154.3kHz / Δf2avg/Δf1avg 0.8 0.
Δf2avg/Δf1avg 0.8 0.93 / Items Min Typ Max Δf1avg 450KHz 501.3KHz 550KHz Δf2avg / 234.2KHz / Δf2max 370KHz 502.5KHz / 0.8 0.99 / LE_2M Modulation Characteristics Δf2avg/Δf1avg Bluetooth Receiver Specifications(BT_ANT) Sensitivity Items Maximum Input Level Input Level(Typ) BER Input Level(Typ) BER BR_1M (DH1) -91 dBm ≦ 0.1% -5 dBm ≦ 0.1% EDR_3M (3DH5) -80 dBm ≦ 0.01% -5 dBm ≦ 0.
Module dimension: 27.0mm*17.7mm*3.0mm (L*W*H ; Tolerance: ±0.15mm) IPEX / MHF-1 connector dimension: 2.6*3.0*1.2mm (L*W*H, Ø2.0mm) Module Bow and Twist:≤0.1mm 5.2 Mechanical Dimensions Top View 11http://www.b-link.net.
6. Application Information 6.1 Recommend PCB Layout Footprint Bottom View 12http://www.b-link.net.
6.2 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250℃. 7. Key Components Of Module No. Parts Specification Manufacturer 1 Chipset MT7663BUN MediaTek Inc. Shenzhen Tie Fa Technology CO. LTD 2 PCB BL-M7663BU2 V1.0 Guangdong KINGSHINE ELECTRONICS CO., LTD Quzhou Sunlord Electronics CO., LTD Lucki Electronics Co., Ltd 3 Crystal 40MHz-12pF-10ppm-3225 Shenzhen Kaiyuexiang Electronics Co.
8. Package and Storage Information 8.1 Package Dimensions Package specification: 1. 1000 modules per roll and 5,000 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 48mm (with a width of 44mm carrying belt). 4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag. 14http://www.b-link.net.
8.2 Storage Conditions Absolute Maximum Ratings: Storage temperature: -40℃ to +85℃, Storage humidity: 10% to 95(Non-Condensing) Recommended Storage Conditions: Storage temperature: 5℃ to +40℃, Storage humidity: 20% to 90% RH Please use this Module within 12month after vacuum-packaged. The Module shall be stored without opening the packing. After the packing opened, the Module shall be used within 72hours.
FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’ s authority to operate the equipment.
Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.