BL-M2268BU1--B 802.11ac 867Mbps W WLAN + BT5.0 MT7668BU USB2.0 Module Specification PDF pdfFactory Pro www.fineprint.
Module Name: BL-M2268BU1-B Module Type: 802.11a/b/g/n/ac 867Mbps WLAN + Bluetooth 5.0 USB2.0 Module Revision: V1.0 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: PDF pdfFactory Pro Date: www.fineprint.
Revision History Revision Summary Release Date 0.1 First release 2020-09-3 1.0 Official release 2020-10-20 1. Introduction BL-M2268BU1-B is a highly integrated module composed of two independent Dual-band WLAN 2T2R USB2.0 submodules, it is designed base on MT7668BU chipset. The independent submodules support IEEE 802.11a/b/g/n/ac standard and provides the maximum PHY data rate up to 867Mbps, and supports 802.11ac Wave-2 MU-MIMO and 802.11n MIMO for 2.4/5G band. 7668BU includes Bluetooth 2.1+EDR/4.
Block Diagram General Specifications Module Name M2268BU1-B BL-M2268BU1 867Mbps WLAN + BT5.0 USB2.0 Module Chipset MT7668BU WLAN Standards IEEE802.11a/b/g/n/ac Host Interface USB2.0 Antenna WLAN: PIFA antenna, BT: PCB printed antenna Dimension 200*19*5.5mm mm (L (L*W*H) Power Supply MT7668BU:: DC 5.0 5.0V±0.
2. Pin Assignments 1 10 Pin Definition No Pin Name Type Voltage Module Pin Description 7668BU - B 1 DC_EN I 5V Power enable, active low module power disable, pull high internal 2 BT_WAKE_HOST I 3.3V BT wake up host, 200ms pulse, low level effective or high level effective can be configured 3 VDD P 5V 4 USB_D- I/O USB differential data line 5 USB_D+ I/O USB differential data line 6 GND RF GND 7 GND RF GND 8 NC -- -- 9 CHIP_IN I 3.
3. Electrical and Thermal Specifications Recommended Operating Conditions Parameters Min Typ Max Units Ambient Operating Temperature -20 25 70 ℃ 4.7 5 5.3 V Supply Voltage VDD Digital I/O DC Specifications Symbol Parameter Min Typ Max Units VIH Input High Voltage 2.0 3.3 3.6 V VIL Input Low Voltage -- 0 0.9 V VOH Output High Voltage 2.97 -- 3.3 V VOL Output Low Voltage 0 -- 0.
5G TX HT20 MCS8 @ 13dBm (RF-Test) 448 479 mA 5G TX HT20 MCS15 @ 13dBm (RF-Test) 327 255 mA 5G TX HT40 MCS8 @ 13dBm (RF-Test) 442 470 mA 5G TX HT40 MCS15 @ 13dBm (RF-Test) 290 322 mA 5G TX HT80 MCS0 @ 12dBm (RF-Test) 381 415 mA 5G TX HT80 MCS9 @ 11dBm (RF-Test) 252 285 mA 5G RX Active VHT80 MCS9 (RF-Test) 115 145 mA BT Unassociated (Linux Driver) 21.8 35 mA Bluetooth TX @ 5dBm 159 186 mA Bluetooth RX 138 165 mA BT 4. WIFI& Bluetooth RF Specifications 2.
02.11b@11Mbps -86 0 < 8% 802.11g@6Mbps -89 0 < 10% 802.11g@54Mbps -73 0 < 10% 802.11n@HT20_MCS0 -88 0 < 10% 802.11n@HT20_MCS7 -70 0 < 10% 802.11n@HT40_MCS0 -87 0 < 10% 802.11n@HT40_MCS7 -68 0 < 10% 5G WIFI RF Specification Conditions : VDD=5V ; Ta:25℃ Features Description WLAN Standard IEEE 802.11a/n/ac, CSMA/CA Frequency Range Channels 5.15~5.25GHz; 5.25~5.35GHz; 5.47~5.73GHz; 5.735~5.
MT7668BU 5G Receiver Specifications Min Input Level（dBm） Max InputLevel（dBm） PER 802.11a@6Mbps -89 0 < 10% 802.11a@54Mbps -73 0 < 10% 802.11n@HT20_MCS0 -88 0 < 10% 802.11n@HT20_MCS7 -70 0 < 10% 802.11n@HT40_MCS0 -87 0 < 10% 802.11n@HT40_MCS7 -66 0 < 10% 802.11ac@VHT80_MCS0 -85 0 < 10% 802.11ac@VHT80_MCS9 -56 0 < 10% RX Rate Bluetooth RF Specification Conditions: VDD=5V; Ta:25℃ Features Description Bluetooth Specification Bluetooth v2.1+EDR/3.0+HS/4.2/5.
BR_1Mbps: GFSK; EDR_2Mbps: π/4-DQPSK; EDR_3Mbps: 8DPSK; Date Rate & Modulation LE_125Kbps: GFSK (Coded_S=8); LE_500Kbps: GFSK (Coded_S=2); LE_1Mbps: GFSK (Uncoded); LE_2Mbps: GFSK (Uncoded); Bluetooth Receiver Specifications Sensitivity Items Maximum Input Level Input Level BER (Typ: dBm） Input Level (Typ: dBm） BER BR_1M -90 ≦0.1% -5dBm ≦0.1% EDR_2M -80 ≦0.01% -5dBm ≦0.1% EDR_3M -70 ≦0.01% -5dBm ≦0.1% Input Level(Typ) PER Input Level (Typ) PER LE_125K -80 ≦30.8% -5dBm ≦30.
5. Mechanical Specifications Module Outline Drawing Module dimension:200*19*5.5mm(L*W*H; L*W*H; Tolerance: ±0.15mm) Module Bow and Twist：≤0.1mm Mechanical Dimensions 6. Application Information 6.1 Antenna Information The module supports on-board board PCB printed antenna for BT and PIFA antenna for WLAN, max gain 4dBi, PDF pdfFactory Pro www.fineprint.
linear polarization, return loss2.412GHz~2.483GHz< loss2.412GHz~2.483GHz<-7dB，5.15GHz~5.835GHz<-7dB.. Make sure that the area around the antenna should be keep clear of metallic components, connectors, via, traces and other materials that can interfere with the radio signal. Figure 1 3D radiation pattern of left PIFA antenna Figure 2 PDF pdfFactory Pro Left PIFA antenna return loss www.fineprint.
Figure 3 3D radiation pattern of right PIFA antenna Figure 4 Right PIFA antenna return loss PDF pdfFactory Pro www.fineprint.
Figure 5 3D radiation pattern of PCB printed antenna Figure 6 PCB printed antenna return loss Structural design The material that around the module should be plastic. In order to get stable high rate wireless connectivity keep the module away from metal and metallic components as far as possible especially around the antenna, antenna far away from metal at least 15cm m is suggested. Recommend PCB Layout Footprint Please use 10 PIN 1.25 GH connector. PDF pdfFactory Pro www.fineprint.
7. Key Components Of Module No. Parts Specification Manufacturer MT7668BUN MediaTek CO., LTD Shenzhen Tie Fa TechnologyCO. LTD 2 PCB Guangdong KINGSHINE ELECTRONICS BL-M2268BU1-B CO., LTD Quzhou Sunlord Electronics CO., LTD HUBEI TKD ELECTRONICS CO., LTD 3 Crystal 40MHz-12pF-10ppm-3225 Shenzhen Kaiyuexiang Electronics Co., Ltd Lucki Electronics Co., Ltd 4 Diplexer DP1608-R2455BUT-LF ACXCO., LTD 8. Package and Storage Information Package Dimensions Package specification: 1.
Please use this Module within 12month after vacuum-packaged. The Module shall be stored without opening the packing. After the packing opened, the Module shall be used within 72hours. When the color of the humidity indicator in the packing changed, The Module shall be baked before soldering. Baking condition: 60℃, 24hours, 1time. ESD Sensitivity： The Module is a static-sensitive electronic device. Do not operate or store near strong electrostatic fields.
FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’ s authority to operate the equipment.
Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC Part 15.247 and FCC Part 15.407 has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.
