FTY-RM23-DS-C Module Data sheet FTY Technology Co.
FTY-RM23-DS-C Module Data sheet Office: 602, Building 1, Aidimengtuo Industrial Park, the 4th Industrial Zone, shutianpu Community, Ma Tian Street, Guangming District, Shenzhen CHINA Factory: 602, Building 1, Aidimengtuo Industrial Park, the 4th Industrial Zone, shutianpu Community, Ma Tian Street, Guangming District, Shenzhen CHINA Website: www.phaten.com Customer Approval Company Title Signature Date FTY FTY Technology Co.
Version Update Record Version V1.0 Date 2020/05/27 FTY Technology Co.
CONTENTS 1 Overview.......................................................................................................... 1 1.1 Introduction...........................................................................................1 1.2 Features................................................................................................. 2 1.3 Block Diagram........................................................................................3 1.4 General Specification...............................
1 Overview 1.1 Introduction FTY-RM23-DS-C is a small size and low profile of WiFi+BT combo module with LGA (Land-Grid Array) footprint, board size is 12mm*12mm with module height of 1.6mm. It can be easily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides GSPI/SDIO interface for WiFi to connect with host processor and high speed UART interface for BT.
1.2 Features Operate at ISM frequency bands (2.4GHz) GSPI/SDIO for Wi-Fi and UART for Bluetooth IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE 802.11e, IEEE 802.11h, IEEE 802.11i Fully Qualified for Bluetooth 2.1 + EDR 4.2 Supports Bluetooth 4.2 Low Energy(BLE) HS-UART interface for Bluetooth data Enterprise level security which can apply WPA/WPA2 certification for Wi-Fi.
1.3 Block Diagram 1.4 General Specification Model Name FTY-RM23-DS-C Product Description Support WLAN-Bluetooth coexistence Dimension L x W x H: 12x 12x 1.6 mm Wi-Fi Interface Support GSPI / SDIO BT interface Support UART Operating temperature -10° C ~ 70° C Storage temperature -20° C ~ 85°C RoHS All hardware components are fully compliant with EU RoHS directive FTY Technology Co.
1.5 DC Characteristics Power Supply Characteristics symbol Para eter Minimum Typical Maximum Uni ts VCC 3.3V supply voltage 3.0 3.3 3.6 V VDDIO I/O supply voltage 1.75 3.3 3.6 V VCC 3.3V rating current -- -- 600 mA VCC 3.3V Current Consumption (linking) -- -- 150 mA Antenna： 1. Size(mm) PROVIDER：Dongguan chuancheng Electronics Co., LTD PART NAME：External antenna SPEC：wifi 2412-2462MHz， BT 2402-2480MHz Gain：0dBi connector :RP-SMA 2.Antenna matching circuit FTY Technology Co.
2 RF Specifications 2.1 2.4GHz RF Specification Features Description WLAN Standard WLAN 11b/g/n Frequency Range 2.412 ~ 2.462GHz 1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120 and maximum of 150Mbps Data Transfer Rate Modulation Method Spread Spectrum OS Support BPSK/ QPSK/ 16-QAM/ 64-QAM IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum) IEEE 802.11g/n:OFDM (Orthogonal Frequency Division Multiplexing) Windows 2000,XP32-64,Vista 32/64,Win7 32/64,Linux,Mac, Android, WIN CE 2.
2.2 Bluetooth Section: Feature Description General Specification Bluetooth Standard Bluetooth BLE4.0,Compatible with Bluetooth v2.1+EDR and v4.2 Systems Host Interface UART Antenna Reference PCB antenna with 0dBi peak gain Frequency Band 2402 MHz ~ 2480 MHz Number of Channels 0~78 channels Modulation GFSK, DPSK, DQPSK RF Specification Sensitivity @ BER=0.1% for GFSK (1Mbps) Sensitivity @ BER=0.01% for π/4-DQPSK (2Mbps) Sensitivity @ BER=0.01% for 8DPSK (3Mbps) Min. Typical. Max.
3 Pin Assignments 3.1 Pin Outline FTY Technology Co.
3.2 Pin Definition PIN Function Description 1 GND Ground 2 WIFI/BT_ANT WIFI/BT_ANT 3 NC NC 4 NC NC 5 NC NC 6 BT_WAKE HOST wake-up Bluetooth device 7 BT_HOST_WAKE Bluetooth device to wake-up HOST 8 NC NC 9 VABT 3.3V 10 NC NC 11 NC NC Shared with GPIO11 This Pin CanExternally Shutdown the RTL8723DS WLAN WL_DISn is 12 WL_DSI# Pulled Low. When this pin deasserted, SDIO interface will be disabled.
22 VDD_IO 1.8V / 3.3V 23 NC NC 24 SUSCLK_IN Shared with GPIO8. External 32K or RTC clock input with.
4 Dimensions 4.1Module Picture L x W : 12 x 12 (+0.3-0.1) mm H:1.6(±0.2)mm 4.2 Module Physical Dimensions (Unit: mm) < TOP VIEW > FTY Technology Co.
5 Reference Design Note: 1. ANT are all support 2.4G function,ANT is support Bluetooth also; 2. The module requires independent power supply, supply capacity ≥ 1000mAand ripple less than 150mV; 3. Do not share power with amplifier, camera, etc. 6 The Key Material List No. Parts Specification Manufacturer 1 Chipset RTL8723DS-CG/QFN48 Realtek Semiconductor Corp 2 PCB FTY_RM23_DS_V1.0 Shenzhen xiangyu circuit co.
7 Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : ≤2 times 8 Package Information 8.1Reel A roll of 2000pcs FTY Technology Co.
8.2 Carrier Tape Detail 8.3 Packaging Detail FTY Technology Co.
8.4 Moisture sensitivity The Modules is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH). b)Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
