FSC‐BW226 Datasheet FSC‐BW226 Single‐Chip 802.11b/g/n 1T1R WLAN with 4.2 Dual Mode Bluetooth Module Datasheet Version 1.4 Shenzhen Feasycom Technology Co.,Ltd. ‐1‐ www.feasycom.
FSC‐BW226 Datasheet Copyright © 2013‐2019 Feasycom Technology. All Rights Reserved. Feasycom Technology reserves the right to make corrections, modifications, and other changes to its products, documentation and services at anytime. Customers should obtain the newest relevant information before placing orders. To minimize customer product risks, customers should provide adequate design and operating safeguards.
FSC‐BW226 Datasheet C ontents 1. INTRODUCTION ........................................................................................................................................................... 5 2. GENERAL SPECIFICATION ............................................................................................................................................. 6 3. HARDWARE SPECIFICATION ..........................................................................................................
FSC‐BW226 Datasheet 9.3.1 Antenna Connection and Grounding Plane Design .................................................................................................. 23 10. PRODUCT PACKAGING INFORMATION...................................................................................................................... 24 10.1 DEFAULT PACKING ...............................................................................................................................................................
FSC‐BW226 Datasheet 1. INTRODUCTION Overview The FSC‐BW226 is a highly integrated WiFi + BT Combo module, it features a 2.4GHz ISM RF transceiver, Bluetooth V4.2 baseband controller, single‐Chip low power 802.11n WLAN network controller(combines an ARM‐cortex M3);With on board antenna for BT(External Antenna is optional); Need external antenna for WIFI or Equipped with the RF Connector, connect to the external antenna.
FSC‐BW226 Datasheet 2. General Specification Table 1: General Specifications Categories Features Implementation Version : Bluetooth V4.2 Dual Mode Frequency : 2.402 ‐ 2.480 GHz Transmit Power: +5.5 dBm (Maximum) Raw Data Rates (Air): 3 Mbps(Classic BT ‐ BR/EDR) IEEE 802.11 b/g/n compatible WLAN Frequency : 2.400～2.4835GHz Wireless Specification Transmit Power: 17.5dBm(11 b), 15.5dBm(11 g), 13.5dBm(11 n) WiFi 802.
FSC‐BW226 Datasheet PA): 450mA (MAX) IO Rating Current(including VDD_IO): 200mA Physical Environmental Miscellaneous Dimensions 13mm X 26.9mm X 2.0mm; Pad Pitch 1.5mm Operating ‐20°C to +70°C Storage ‐40°C to +85°C Lead Free Lead‐free and RoHS compliant Warranty One Year Humidity 10% ~ 90% non‐condensing MSL grade: MSL 3 ESD grade: Human Body Model: Class‐2 Machine Model: Class‐B 3. 3.
FSC‐BW226 Datasheet UART_TX UART_RX UART_CTS/PIO4 UART_RTS/PIO8 PCM_CLK PCM_OUT PCM_IN PCM_SYNC UART_LOG_OUT UART_ LOG_IN RESET/CHIP_EN VDD_3V3 GND NC NC PIO2/SWCLK PIO3/SWDIO GND WiFi_RF_OUT GND GND 1 2 3 4 5 6 7 8 9 10 11 12 13 BT_EXT_ANT GND PIO11 PIO10 PIO9 UART_RTS/PIO8 PIO7/I2C_SDA PIO6/I2C_SCL NC UART_CTS/PIO4 PIO3/SWDIO PIO2/SWCLK NC NC GND 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 14 15 16 17 18 19 20 21 Figure 3: FSC‐BW226 PIN Diagram(Top View) 3.
FSC‐BW226 Datasheet 13 GND Vss 14 NC NC 15 NC NC 16 PIO2/SWCLK I/O Debugging through the clk line(Default) Alternative Function: Programmable input/output line 17 PIO3/SWDIO I/O Debugging through the data line(Default) Alternative Function 1: Programmable input/output line Alternative Function 2: PWM 18 GND Vss Power Ground 19 WiFi_RF_OUT 20 GND Vss Power Ground 21 GND Vss Power Ground 22 GND Vss Power Ground 23 NC NC 24 NC NC 25 PIO2/SWCLK I/O Debugging through
FSC‐BW226 Datasheet signal coverage. If you need to use an external antenna, by modifying the module on the 0R resistance to block out the on‐board antenna; Or contact Feasycom for modification. PHYSICAL INTERFACE 4. 4.1 Power Supply The transient response of the regulator is important. If the power rails of the module are supplied from an external voltage source, the transient response of any regulator used should be 20μs or less. It is essential that the power rail recovers quickly. 4.
FSC‐BW226 Datasheet At reset the digital I/O pins are set to inputs for bi‐directional pins and outputs are tri‐state. The PIOs have weak pull‐ups. 4.4 General Purpose Digital IO GPO and GPI function Support interrupt detection with configurable polarity per GPIO Internal weak pull up and pull low per GPIO Multiplexed with other specific digital functions 4.5 RF Interface For This Module, the default mode for antenna is internal ,it also has the interface for external antenna(BT).
FSC‐BW226 Datasheet Table 3: Possible UART Settings Parameter Baudrate Possible Values Minimum 1200 baud (≤2%Error) Standard 115200bps(≤1%Error) Maximum 921600bps(≤1%Error) Flow control RTS/CTS, or None(TBD) Parity None, Odd or Even Number of stop bits 1 /1.5/2 Bits per channel 5/6/7/8 When connecting the module to a host, please make sure to follow . Figure 6: UART Connection 4.6.
FSC‐BW226 Datasheet Figure 7: I2C Bus Timing The device on‐chip I2C logic provides the serial interface that meets the I2C bus standard mode specification. The I2C port handles byte transfers autonomously. The I2C H/W interfaces to the I2C bus via two pins: SDA and SCL. Pull up resistor is needed for I2C operation as these are open drain pins. When the I/O pins are used as I2C port, user must set the pins function to I2C in advance. 4.
FSC‐BW226 Datasheet 4.8 Security Engine（WiFi only） 4.8.1 Features Provide low SW computing and high performance encryption Supported authentication algorichms: 1,MD5 2,SHA‐1 3,SHA‐2(SHA‐224/SHA‐256) 4,HMAC‐MD5 5,HMAC‐SHA1 6,HMAC‐SHA2 Supports Encryption/Decryption mechanisms: 1,DES(CBC/ECB) 2,3DES(CBC/ECB) 3,AES‐128(CBC/ECB/CTR) 4, AES‐192(CBC/ECB/CTR) 5, AES‐256(CBC/ECB/CTR) ELECTRICAL CHARACTERISTICS 5. 5.
FSC‐BW226 Datasheet TST ‐ Storage Temperature ‐40 25 +85 °C IIO ‐ Maximum Current sunk by a I/O pin 2 3 4 mA IIO ‐ Maximum Current sourced by a I/O pin 2 3 4 mA IDD‐ 3.3V Rating Current (With internal regulator and integrated COMS PA) (Wifi only) ‐ ‐ 450 mA 5.3 Input/output Terminal Characteristics Table 6: DC Characteristics (VDD ‐ VSS = 3 ~ 3.
FSC‐BW226 Datasheet 5.6 Specifications of Power‐on Reset Table 9: Specifications of Power‐on Reset Parameter Min Type Max Unit ‐20 25 +70 °C ‐ 33 50 uA 1.6 2 2.4 V ‐ ‐ 100 mV VDD Raising Rate to Ensure Power‐on Reset 0.025 ‐ ‐ V/ms tPOR‐ Minimum Time for VDD Stays at VPOR to Ensure Power on Reset 0.
FSC‐BW226 Datasheet Note: 1. Guaranteed by design, not tested in production. 2. HCLK must be higher than 2 MHz to achieve the maximum standard mode I2C frequency. It must be higher than 8 MHz to achieve the maximum fast mode I2C frequency. 3. I2C controller must be retriggered immediately at slave mode after receiving STOP condition. 4. The device must internally provide a hold time of at least 300 ns for the SDA signal in order to bridge the undefined region of the falling edge of SCL. 5.
FSC‐BW226 Datasheet 6. MSL & ESD Table 12: MSL and ESD Parameter Value MSL grade: MSL 3 ESD grade: Human Body Model: Class‐2 Machine Model: Class‐B 7. RECOMMENDED TEMPERATURE REFLOW PROFILE Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment.
FSC‐BW226 Datasheet Figure 10: Typical Lead‐free Re‐flow Pre‐heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components.
FSC‐BW226 Datasheet MECHANICAL DETAILS 8. 8.1 Mechanical Details Dimension: 13mm(W) x 26.9mm(L) x 2.0mm(H) Tolerance: ±0.1mm Module size: 13mm X 26.9mm Tolerance: ±0.2mm Pad size: 1mmX0.8mm Tolerance: ±0.2mm Pad pitch: 1.5mm Tolerance: ±0.1mm Figure 11: FSC‐BW226 footprint Shenzhen Feasycom Technology Co., Ltd. ‐20‐ www.feasycom.
FSC‐BW226 Datasheet 8.2 Host PCB Land Pattern and Antenna Keep‐out for FSC‐BW226 Please check the Figure 12 for Pad Structure and Keep Out Area: Figure 12: Host PCB‐Top View 9. 9.1 HARDWARE INTEGRATION SUGGESTIONS Soldering Recommendations FSC‐BT906 is compatible with industrial standard reflow profile for Pb‐free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used.
FSC‐BW226 Datasheet 9.2 Layout Guidelines(Internal Antenna) It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or any metal near antenna deteriorates its operation by having effect on the matching properties. Metal shield around the antenna will prevent the radiation and thus metal case should not be used with the module.
FSC‐BW226 Datasheet As indicated in Figure below, RF critical circuits of the module should be clearly separated from any digital circuits on the system board. All RF circuits in the module are close to the antenna port. The module, then, should be placed in this way that module digital part towards your digital section of the system PCB. Figure 14: Placement the Module on a System Board 9.3.
FSC‐BW226 Datasheet Antenna Wrong Antenna Antenna PCB PCB PCB Better Best Figure 16: Recommended Trace Connects Antenna and the Module Routing of the RF‐connection underneath the module should be avoided. The distance of the micro strip line to the ground plane on the bottom side of the receiver is very small and has huge tolerances. Therefore, the impedance of this part of the trace cannot be controlled. Use as many vias as possible to connect the ground planes. 10. 10.
FSC‐BW226 Datasheet Figure 17: Tray vacuum 10.2 Packing box(Optional) * If require any other packing, must be confirmed with customer * Package: 1000PCS Per Carton (Min Carton Package) Figure 18: Packing Box Shenzhen Feasycom Technology Co., Ltd. ‐25‐ www.feasycom.
FSC‐BW226 Datasheet 11. APPLICATION SCHEMATIC Shenzhen Feasycom Technology Co., Ltd. ‐26‐ www.feasycom.
FCC Statement 15.19 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. 15.21 Note: The grantee is not responsible for any changes or modifications not expressly approved by the party responsible for compliance. Such modifications could void the user’s authority to operate the equipment.
observed to ensure compliance with current FCC / IC RF exposure guidelines. ⚫ The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. ⚫ This Module is full modular approval, it is limited to OEM installation ONLY. ⚫ The module is limited to installation in mobile application.
