BLE 5 MODULE DB809S S Product Manual Version Update Time Editor V1.00 2019-3-15 Alan Jiao V1.10 2019-4-17 Jack Wang V1.11 2019-4-22 Jack Wang V1.12 2020-6-16 Allen.Hu V1.13 2020-7-10 Joe .Zhou V1.
Contents 1. Product Introduction .......................................................................................... - 1 1.1 Product Overview .............................................................................................. - 1 - 2. Detail Param ....................................................................................................... - 2 2.1 2.2 2.3 2.4 Performance .........................................................................................................
BoB IOT service supplier who understands you best 1. Product Introduction 1.1 Product Overview DB809S is made by nRF52805 which is the baseline member of the nRF52 Series SoC family. It is built around an ARM® Cortex™-M4 CPU running at 64 MHz. It meets the challenge of bringing Bluetooth 5 feature sets and protocol concurrency to applications at a price point that makes adding Bluetooth 5 connectivity to an application compelling.
BoB IOT service supplier who understands you best 2. Detail Param 2.1 Performance Form 1: Performance Module DB809S Soc nRF52805 WLCSP FLASH 192KB RAM 24KB VDD 1.7V to 3.
BoB 2.2 IOT service supplier who understands you best Mechanical specifications Picture 1 is the PCB mechanical specifications of the module. Picture 1: PCB Mechanical Specifications dimensions in millimeters Form 2 Length Width PCB Height PAD Size（Bottom） PIN Gap 10.5mm 16mm 2.33mm 0.7mm*0.8mm 1.27mm Location：Rm.1502,East Tower,FIYTA Tech. Bldg.,Southern District of High-tech Industrial Park,Nanshan District,Shenzhen 518057,P.R.
BoB 2.3 IOT service supplier who understands you best PIN Description Form 3 Module PIN Description PIN PIN On nRF52 Description 1 GND GND 2 SWDIO Serial wire debug I/O for debug and programming 3 SWCLK Serial wire debug clock input for debug and programming 4 P0.21/NRESET Digital I/O / Configurable as pin reset 5 P0.20 Digital I/O 6 P0.18 Digital I/O 7 P0.16 Digital I/O 8 P0.12 Digital I/O 9 P0.14 Digital I/O 10 P0.05/AIN3 Analog input /Digital I/O 11 P0.
BoB 2.4 IOT service supplier who understands you best Soldering Reflow Guidelines Form 4 and picture 2 are reflow conditions and profile. Form4: Reflow conditions Picture 2: Reflow profile Location：Rm.1502,East Tower,FIYTA Tech. Bldg.,Southern District of High-tech Industrial Park,Nanshan District,Shenzhen 518057,P.R.
BoB IOT service supplier who understands you best 3. Attentions 1、This module contains CMOS devices, need be protected from ESD. 2、Module needs to connect GND well, to reduce parasitic inductance. 3、If module needs reflow, pay attention to reflow profile. 4、Area below the ANT of this module, should not use polygon. 5、ANT of this module should be far away from other circuit. 6、Module should be placed as far as possible away from the other low frequency circuits or digital circuits.
BoB IOT service supplier who understands you best 4. Sales And Service Network 4.1 Headquarter Shenzhen Headquarter Add ：Rm.1502,FIYTA Tech Building,#002 No.1 SouthernRd,Hi-Tech,Nanshan District,Shenzhen 518057,P.R.China Tel ：86-755-86018818 Fax ：86-755-86018808 4.2 North China Beijing Office Add ：Room1006,QuantumPlaza,No.23ZhiChunRoad,HaiDianDistrict,Beijing Tel ：86-10-82358601/2/3/4 Fax ：86-10-82358605 4.3 East China Shanghai Office Add :Rm.2005,MingshenCenterBuilding,No.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
