BL-R8801MS1 Product Specification IEEE 802.11b/g/n WLAN SDIO Module Version: 1.0 Customer Date Model Name BL-R8801MS1 Part NO.
B-LINK ELECTRONIC CO., LTD in shenzhen Content Content................................................................................................................................................................. 1 0. Revision History................................................................................................................................................1 1. General Description..........................................................................................................
B-LINK ELECTRONIC CO., LTD in shenzhen Date 2015/05/11 Document Product revision revision 1.0 V1.0 Change Description Draft initial release 1. General Description BL-R8801MS1 product is designed base on MARVELL 88W8801 chipset .It is a highly integrated single-band (2.4GHz) IEEE 802.11n 1X1 System-on-Chip (SoC), specifically designed to support High Throughput data rates for next generation WLAN products. It supports IEEE802.11i safety protocol, along with IEEE 802.11e standard service quality.
B-LINK ELECTRONIC CO., LTD in shenzhen 3.1 Function Block diagram 3.2 Electrical and Performance Specification Item Description Product Name BL-R8801MS1 Major Chipset MARVELL 88W8801 Host Interface SDIO Standard IEEE 802.11b, IEEE 802.11g,IEEE 802.11n, Frequency Range 2412MHz~2462MHz Modulation Type 802.11b: CCK, DQPSK, DBPSK 802.11g: 64-QAM,16-QAM, QPSK, BPSK 802.11n: 64-QAM,16-QAM, QPSK, BPSK Working Mode Infrastructure, Data Transfer Rate 1,2,5.
B-LINK ELECTRONIC CO., LTD in shenzhen 6M: -88dBm@10%PER 11M:-86dBm@8%PER 54M:-72dBm@10%PER 72.2M:- 68dBm@10%PER 15dBm @802.11b/g/n RF Power Antenna type Internal Antenna Antenna Gain 2.11dBi Dimension(L*W*H) 13 x 13.5 x 1.46mm (LxWxH) ;Tolerance: +-0.15mm Power supply 3.3V +/-0.2V Power Consumption standby mode 70mA@3.3V , TX mode 150mA@3.3V Clock source 38.4MHz Working Temperature -20°C to +70°C Storage temperature -40°C ~ +105°C 3.
B-LINK ELECTRONIC CO., LTD in shenzhen 3.4 Mechanical Specification Module dimension: Typical (W x L x H): 13mmx13.5mmx1.46mm Tolerance : +/-0.15mm 3.
B-LINK ELECTRONIC CO., LTD in shenzhen Function Description SD _2 SDIO data 2 1 SD _3 SDIO data 3 /GSPI chip select 2 SD _CMD SDIO command/GSPI data input 3 GND Ground 4 SD _CLK SDIO clock /GSPI clock 5 SD _D0 SDIO data 0 /GSPI data output 6 SD _D1 SDIO data 1 /GSPI data out 7 VCC3 3.3V power supply 8 PD_n Power down (active low) 9 GND Ground 10 ANT_RF WLAN RF pad 11 GND Ground 12 WK_IN Wake/Suspend input control 13 WK_OUT Wake/Suspend output control 14 4.
B-LINK ELECTRONIC CO., LTD in shenzhen TX mode 90 Rx mode 72 Sleep mode 65 150 mA 73 75 mA 66 68 mA 95 Specification : IEEE802.11n Mode OFDM Frequency 2412MHz - 2462MHz Data rate 6.5, 13, 19.5, 26, 39, 52, 58.5, 72.2Mbps DC Characteristics min Typ. max. unit TX mode 72 75 140 mA Rx mode 70 73 78 mA Sleep mode 65 66 68 mA 4.
B-LINK ELECTRONIC CO., LTD in shenzhen 5.
B-LINK ELECTRONIC CO., LTD in shenzhen 6. Precautions for use 1. Pls handle the module under ESD protection. 2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature 245℃. 3. Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours. Baking condition: 125 degree C, 12 hours Baking times: 1 time 4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
