Product Specification Revision V1.0 Date 2018-11-23 Model Name Product Name BL-M8822BU3 IEEE 802.11b/g/n/ac(2T2R) USB3.0 WLAN & BT Module Bilian Approve Field Engineer QC Sales Customer Approve Field Engineer QC Manufactory Purchasing Shenzhen Bilian Electronic Co., Ltd Address: 10-11F, Building A1, Huaqiang idea park, Guangming district, Shenzhen.Guangdong, China Homepage: www.b-link.net.
Table of Contents Revision History ......................................................................................... 1 1. Introduction .......................................................................................... 1 1.1 General Description ........................................................................ 1 1.2 Features ......................................................................................... 1 1.3 Applications .......................................................
Revision History Document Product Revision Revision 2018/09/18 0.1 V0.1 Preliminary release 2018/11/23 1.0 V1.0 Batch production Date Description 1. Introduction 1.1 General Description BL-M8822BU3 product is a highly integrated module that support 2-stream 802.11ac solutions with Multi-user MIMO (Multiple In, Multiple Out) with wlan USB2.0/3.0 network interface controller.It supports Bluetooth ,It combines a WLAN MAC, a 2T2R capable WLAN baseband, and RF in a single chip.
3. Product Technical Specifications 3.1 General Specifications Item Description Product Name BL-M8822BU3 Main Chip RTL8822BU Host Interface USB2.0/ USB3.0 IEEE Standards IEEE 802.11a/b/g/n/ac Operating Frequencies 2.4GHz~2.4835GHz /5.15~5.85Hz WIFI: 802.11b: CCK, DQPSK, DBPSK 802.11a/g: 64-QAM,16-QAM, QPSK, BPSK Modulation 802.11n: 64-QAM,16-QAM, QPSK, BPSK 802.11ac: 256-QAM,64-QAM,16-QAM, QPSK, BPSK BT: 8DPSK,π/4DQPSK, GFSK Working Mode Infrastructure, Ad-Hoc WIFI: 802.11b: 1, 2 ,5.
ESD CAUTION: Although this module is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this module. It must be protected from ESD at all times and handled under the protection of ESD. 3.2 DC Power Consumption Vcc=5V，Ta = 25 °C，unit: mA Supply current Standby (RF disabled) 802.11b Typ. Max 99 112 1Mbps 11Mbps Supply current Typ. Max. Typ. Max. TX mode 301 355 263 296 Rx mode 89.7 100 89.5 99 802.11g 6Mbps 54Mbps Supply current Typ. Max. Typ. Max.
Rx mode 94.1 802.11ac 106 95.2 105 MCS0 MCS9 Supply current Typ. Max. Typ. Max. TX mode 380 408 272 296 Rx mode 104 116 108 114 2T2R 802.11n HT40(2.4G) MCS8 MCS15 Supply current Typ. Max. Typ. Max. TX mode 573 621 489 525 Rx mode 93.9 107 94.5 105 802.11n HT40(5G) MCS8 MCS15 Supply current Typ. Max. Typ. Max. TX mode 613 687 616 651 Rx mode 95.2 105 95.3 106 802.11ac(5G) NSS2-MCS0 NSS2-MCS9 Supply current Typ. Max. Typ. Max.
3.4 Bluetooth RF Specification RF Characteristics for BT Items Contents Host Interface USB Specification BT V4.2/V4.1/V3.0/V2.1 Modulation FHSS: GFSK, π/4-DQPSK, 8DPSK Channel frequency 2.401~2.481 GHz Data rate 1Mbps,2Mbps,3Mbps TX Characteristics min. typ. max. Unit Power level(BR/EDR) 0 4 10 dBm Power level(BLE) 0 4 10 dBm RX Characteristics min. typ. max. Unit Minimum input level(Muti-slot packages sensitivity mode<0.
4. Pin Assignments Figure 4-Pin Assignments (Top view) Pin No： Pin Name Type Description 1 USB3_TXN I USB3.0TX data- 2 USB3_TXP I USB3.0TX data+ 3 USB3_RXN O USB3.0RX data- 4 USB3_RXP O USB3.0RX data+ 5 GND p Ground 6 USB_DP I/O USB data+ (USB2.0) 7 USB_DM I/O USB data- (USB2.
17 NC / NC 18 GND p Ground 19 WL-RF1 20 GND p Ground 21 GND p Ground 22 WL-RF0 23 GND p Ground 24 GND p Ground 25 GND p Ground 26 WL-WAKE-HOST 27 BT-REG-ON I GPIO: Control BT device enabled ON: pull high,OFF:pull low 28 WL-REG-ON I GPIO: Control WIFI device enabled ON: pull high,OFF:pull low 29 GND p Ground 30 VDD33 I 3.
5. Typical Application Circuit RF reference circuit Figure 5-Typical application circuit NOTE： 1.RF trace need to keep 50 ohm impedance. 2.RF(WIFI) connect to external antenna through the ipex connector，if choose the RF signals connect to the half hole, please refer to the black box matching circuit 3. Module supports USB2.0 by default 4. Modular antenna supports IPEX by default 5.
6. Mechanical Specifications Module dimension: Typical (L*W * H): 27*18*2.0mm Tolerance: +/-0.
7. Others 7.1 Package Information Figure 7-Package Information 7.2 Storage Temperature and Humidity 1. Storage Condition: Moisture barrier bag must be stored under 30℃, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12-months from the bag seal date. Humidity indicator cards must be blue, <30%. 2. Products require baking before mounting if humidity indicator cards reads > 30% temp < 30℃, humidity < 70% RH, over 96 hours. Baking condition: 125℃, 12 hours.
FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’ s authority to operate the equipment.
Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.
