Specifications

ManualsBrandsShenZhen BiLian Electronic ManualsElectronics802.11 a/b/g/n/ac 433Mbps WIFI USB Module

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BL-M8811CU2

802.11ac 433Mbps WiFi

USB Module Specification

SHENZHEN BILIAN ELECTRONIC CO., LTD

Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China

Web: www.b-link.net.cn

Summary of content (15 pages)

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BL-M8811CU2 802.11ac 433Mbps WiFi USB Module Specification SHENZHEN BILIAN ELECTRONIC CO., LTD Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China Web: www.b-link.net.
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Revision History Module Name: BL-M8811CU2 Module Type: 802.11a/b/g/n/ac 433MbpsWiFi USB Module Revision: V1.0 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revision 1.0 Summary Release Date Official release 2019-09-01 1http://www.b-link.net.
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1. Introduction BL-M8811CU2 module is designed base on RTL8811CU. It supports IEEE 802.11a/b/g/n/ac 1T1R with high throughput data rate for WLAN products and provides the highest PHY rate up to 433.3Mbps. It combines a WLAN MAC, a 1T1R capable WLAN baseband, modem and offers stable, high rate, long distance wireless connectivity through external antenna. It can be used on the IP Camera/ Smart TV and other wireless devices easily. 1.1 Features  Operating Frequencies: 2.4~2.4835GHz or 5.15~5.
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1.3 General Specifications Module Name BL-M8811CU2 WiFi USB Module Chipset RTL8811CU-CG WiFi Standards IEEE 802.11a/b/g/n/ac Host Interface USB2.0 Antenna Connect to the external antenna through half hole Dimension SMD 22Pins, 13.0*12.2*1.8mm (L*W*H) Power Supply DC 3.3V±0.2V @ 500 mA (Max) Operation Temperature -20℃ to +70℃ Operation Humidity 10% to 95% RH (Non-Condensing) 2. Pin Assignments (Top view) 2.
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4 GND P Ground 5 NC -- No connection(floating) 6 NC -- No connection(floating) 7 NC -- No connection(floating) 8 NC -- No connection(floating) 9 NC -- No connection(floating) 10 NC -- No connection(floating) 11 VDD33 P VDD 3.
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3.2 Digital I/O DC Specifications Symbol Parameter Min Typ Max Units VIH Input High Voltage 2.0 3.3 3.6 V VIL Input Low Voltage -- 0 0.9 V VOH Output High Voltage 2.97 -- 3.3 V VOL Output Low Voltage 0 -- 0.33 V 3.3 Current Consumption Conditions : VDD=3.3V ; Ta:25℃ VDD Current (average) Use Case Typ Max Units WIFI Unassociated (Linux) 130 160 mA 2.4G 11Mbps TX (RF test) 330 400 mA 2.4G HT40 MCS0 TX (RF test) 292 345 mA 2.
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802.11b (DSSS): DBPSK, DQPSK, CCK; Modulation 802.11a/g (OFDM): BPSK, QPSK, QAM16, QAM64; 802.11n (OFDM): BPSK, QPSK, QAM16, QAM64; 802.11b: 1, 2, 5.5, 11Mbps; Date Rate 802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps; 802.11n (HT20): MCS0~MCS7 6.5~72.2Mbps; 802.11n (HT40): MCS0~MCS7 13.5~150Mbps; Frequency Tolerance ≦ ±15ppm 2.4G Transmitter Specifications TX Rate TX Power（dBm） TX Power Tolerance（dB） EVM（dB） 802.11b@1~11Mbps 17 ±1 ≦-15 802.11g@6Mbps 15 ±1 ≦-15 802.11g@54Mbps 15 ±1 ≦-25 802.
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Channels Ch36, Ch40, Ch42, Ch44, Ch48; Ch149, Ch151, Ch153, Ch155, Ch157, Ch159, Ch161, Ch165 802.11a (OFDM): BPSK, QPSK, QAM16, QAM64; Modulation 802.11n (OFDM): BPSK, QPSK, QAM16, QAM64; 802.11ac (OFDM): BPSK, QPSK, QAM16, QAM64, QAM256; 802.11a: 6, 9, 12, 18, 24, 36, 48, 54Mbps; 802.11n (HT20): MCS0~MCS7 6.5~72.2Mbps; Date Rate 802.11n (HT40): MCS0~MCS7) 13.5~150Mbps; 802.11ac (VHT20): MCS0~MCS8 6.5~86.7Mbps; 802.11ac (VHT40): MCS0~MCS9 13.5~200Mbps; 802.11ac (VHT80): MCS0~MCS9 29.3~433.
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802.11ac@VHT80_MCS0 -82 -10 < 10% 802.11ac@VHT80_MCS9 -57 -10 < 10% 5. Mechanical Specifications 5.1 Module Outline Drawing Module dimension: 13.0*12.2*1.8mm(L*W*H; Tolerance: ±0.15mm) Module Bow and Twist：≤0.1mm 8http://www.b-link.net.
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5.2 Mechanical Dimensions 6. Application Information 6.1 Typical Application Circuit 9http://www.b-link.net.
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6.2 Recommend PCB Layout Footprint Top View 6.3 Reflow Soldering Standard Condition Please use the reflow within 2 times. Set up the highest temperature within 250℃. 10http://www.b-link.net.
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7. Key Components Of Module No. Parts Specification Manufacturer 1 Chipset RTL8811CU-CG Realtek Shenzhen Tie Fa Technology Guangdong KINGSHINE ELECTRONICS CO., LTD 2 PCB BL-M8821CU1 MILLION SOURCE PRINTED CIRCUIT BOARD CO., LTD Quzhou Sunlord Electronics Co., Ltd HUBEI TKD ELECTRONICS 2 Crystal 40MHz-15pF-10ppm2520 TECHNOLOGY CO., LTD HOSONIC ELECTRONIC CO., LTD 3 Diplexer DPX105850DT-6019A1 TDK China Co., Ltd 8. Package and Storage Information 8.1 Package Dimensions 11http://www.b-link.
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Package specification: 1. 2,000 modules per roll and 10,000 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 28mm (with a width of 24mm carrying belt). 4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag. 5. Each carton is packed with 5 boxes. 8.
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Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C&E has been investigated. It is applicable to the modular transmitter. 2.3 Specific operational use conditions This module is stand-alone modular.
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FCC Warning： This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.