BL-M8723DS1 IEEE 802.11b/g/n 150Mbps 1T1R SDIO WiFi and BT combo Module SHENZHEN BILIAN ELECTRONIC CO., LTD Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China Web: www.b-link.net.
Module Name: BL-M8723DS1 Module Type: 802.11b/g/n 150Mbps 1T1R SDIO WiFi and BT combo Module Revision: V1.0 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revision 1.0 1 Summary Release Date Official release 2020-07-03 http://www.b-link.net.
1. Introduction BL-M8723DS1 is a highly integrated WiFi+BT combo module, it contains a WLAN and a BT MAC, a 1T1R capable base band. It supports IEEE 802.11b/g/n standard and provides the highest PHY rate up to 150Mbps, and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.2. This module can offering feature-rich wireless connectivity and reliable throughput from an extended distance. 1.1 Features Operating Frequencies: 2.4~2.4835GHz Host Interface is SDIO 2.0 and UART IEEE Standards: IEEE 802.
1.3 General Specifications Module Name BL-M8723DS1 WiFi and BT combo Module Chipset RTL8723DS-CG WiFi Standards IEEE802.11b/g/n/, 1T1R, 2.4GHz, 150Mbps (Max) BT Standards BT 4.2/4.2LE/2.1EDR/2.1BR Host Interface SDIO 2.0 for WIFI; UART for BT Antenna Connect to the external antennas through half hole pad Dimension SMD 44Pins, 12*12*1.6mm (L*W*H) Power Supply DC 3.3±0.
4 NC / NC 5 NC / NC 6 BT_WAKE I HOST wake-up Bluetooth device VDIO 7 BT_WAKE_HOST O Bluetooth device to wake-up HOST VDIO 8 NC / NC 9 VDD33 P 3.
37 NC / NC 38 NC / NC 39 NC / NC 40 NC / NC 41 GND P Ground connections 42 UART_OUT O HOST Data output 43 UART_IN I HOST Data input 44 UART_CTS I HOST_CTS P: Power, I: Input, O: Output, I/O: In/Output, RF: Analog RF Port 3. Electrical and Thermal Specifications 3.1 Recommended Operating Conditions Parameters Min Typ Max Units Ambient Operating Temperature -10 25 70 ℃ External Antenna VSWR 1 1.7 2 / 3.1 3.3 3.5 V Supply Voltage VDD33/VDIO 3.
2.4G 6Mbps RX (RF-Test) 63 77 mA 2.4G 54Mbps TX (RF-Test) 260 270 mA 2.4G 54Mbps RX (RF-Test) 60 65 mA 2.4G MCS0(HT20) TX (RF-Test) 255 272 mA 2.4G MCS0(HT20) RX (RF-Test) 65 70 mA 2.4G MCS7(HT20) TX (RF-Test) 220 285 mA 2.4G MCS7(HT20) RX (RF-Test) 63 70 mA 2.4G MCS7(HT40) TX (RF-Test) 220 270 mA 2.
4.2 SDIO Timing 5. WiFi RF Specifications 5.1 2.4G WiFi RF Specification Conditions : VDD33=3.3V ; Ta:25℃ Features Description WLAN Standard IEEE 802.11b/g/n CSMA/CA Frequency Range 2.4~2.4835GHz (2.4GHz ISM Band) Channels Ch1~Ch13 (For 20MHz Channels) 802.11b (DSSS): DBPSK, DQPSK, CCK; Modulation 802.11g (OFDM): BPSK, QPSK, 16QAM, 64QAM; 802.11n (OFDM): BPSK, QPSK, 16QAM, 64QAM; 7 http://www.b-link.net.
802.11b: 1, 2, 5.5, 11Mbps; Date Rate 802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps; 802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps; 802.11n (HT40): MCS0~MCS7(1T1R_SISO) 13.5~150Mbps; Frequency Tolerance ≦ ±15ppm 5.2 Bluetooth RF Specifications Conditions : VDD33=3.3V ; Ta:25℃ Features Bluetooth Specification Frequency Range Channels 8 Description Bluetooth v2.1+EDR/3.0+HS (Bluetooth Classic _ BT BR/EDR), Bluetooth 4.2 (Bluetooth Low Energy _ BT_LE) FHSS 2.4~2.4835GHz (2.
Power Classes Bluetooth Classic: Class1; Bluetooth Low Energy: Class1.5; BR_1Mbps: GFSK; Date Rate & Modulation EDR_2Mbps: π/4-DQPSK; EDR_3Mbps: 8DPSK; LE_1Mbps: GFSK; Bluetooth Transmitter Specifications Items Min Typ Max BR_1M TX Power 1 6 8 EDR_2/3M TX Power 1 6 8 LE_125K~1M TX Power 1 6 8 1DH1 TX Power 1 6 8 2DH3 TX Power 1 6 8 3DH5 TX Power 1 6 8 145kHz 163kHz -- 143kHz 146kHz -- 1.01 0.
Δf2max] (LE_1M) Δf1avg / Δf2max(LE_1M) 1.06 1.08 -- Bluetooth Receiver Specifications Items Sensitivity Maximum Input Level Input Level(Typ) BER Input Level(Typ) BER BR_1M -92dBm ≦0.1% -20dBm ≦0.1% EDR_2M -90dBm ≦0.01% -20dBm ≦0.1% EDR_3M -86dBm ≦0.01% -20dBm ≦0.1% LE_1M -92dBm ≦30.8% -20dBm ≦0.1% 1DH1 -92dBm ≦30.8% -20dBm ≦0.1% 2DH3 -90dBm ≦30.8% -20dBm ≦0.1% 3DH5 -86dBm ≦30.8% -20dBm ≦0.1% 6. Mechanical Specifications 6.
Module Bow and Twist：≤0.1mm 6.2 Mechanical Dimensions 11 http://www.b-link.net.
7. Application Information 7.1 Typical Application Circuit 12 http://www.b-link.net.
7.2 Recommend PCB Layout Footprint Design size mm Top View 13 http://www.b-link.net.
7.3 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250℃. 8. Key Components Of Module No. Parts Specification Manufacturer 1 Chipset RTL8723DS-CG Realtek Note Shen Zhen Tie Fa Technology limited 2 PCB BL-M8723DS1 Guangdong KINGSHINE ELECTRONICS CO., LTD Quzhou Sunlord Electronics Co., Ltd HUBEI TKD ELECTRONICS TECHNOLOGY CO., LTD. LUCKI CM ELECTRONICS CO., LTD 3 Crystal 24MHz-12pF-10ppm-2520 HOSONIC ELECTRONIC CO., LTD.
9. Package and Storage Information 9.1 Package Dimensions Package specification: 1. 2,000 modules per roll and 10,000 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 25.3mm (with a width of 21.3mm carrying belt). 4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag. 5. Each carton is packed with 5 boxes. 15 http://www.b-link.net.
9.2 Storage Conditions Absolute Maximum Ratings: Storage temperature: -45℃ to +85℃ Storage humidity: 10% to 95% RH（Non-Condensing） Recommended Storage Conditions: Storage temperature: 5℃ to +40℃ Storage humidity: 20% to 90% RH Please use this Module within 12month after vacuum-packaged. The Module shall be stored without opening the packing. After the packing opened, the Module shall be used within 72hours.
FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’ s authority to operate the equipment.
Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.
