BL-M8189FS6(VC) 802.11n 150Mbps WiFi SDIO Module Specification SHENZHEN BILIAN ELECTRONIC CO., LTD Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China Web: www.b-link.net.
Module Name: BL-M8189FS6(VC) Module Type: 802.11b/g/n 150Mbps 1T1R WiFi SDIO Module Revision: V1.0 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revision 1.0 1 Summary Release Date Official release 2020-03-25 http://www.b-link.net.
1. Introduction BL-M8189FS6(VC) is a highly integrated WiFi module, it contains a WLAN MAC, a 1T1R capable WLAN base band. It supports IEEE 802.11b/g/n standard and provides the highest PHY rate up to 150Mbps, offering feature-rich wireless connectivity and reliable throughput from an extended distance. 1.1 Features Operating Frequencies: 2.412~2.462GHz Host Interface is SDIO 2.0 IEEE Standards: IEEE 802.
1.3 General Specifications Module Name BL-M8189FS6(VC) WiFi Module Chipset RTL8189FTV-VC-CG WiFi Standards IEEE802.11b/g/n/, 1T1R, 2.4GHz, 150Mbps (Max) Host Interface SDIO 3.0 Antenna Connect to the external antennas through half hole pad Dimension SMD 44Pins, 12*12*1.5mm (L*W*H) DC 3.3±0.2V(main power) @ 350 mA (Max) Power Supply DC 3.3±0.2V or 1.8±0.1V(SDIO and Digital I/O power) Operation Temperature -10℃ to +70℃ Operation Humidity 10% to 95% RH (Non-Condensing) 2.
NC / NC 6 NC / NC 7 NC / NC 8 NC / NC 9 VDD33 P 3.
39 NC / NC 40 NC / NC 41 NC / NC 42 NC / NC 43 NC / NC 44 NC / NC P: Power, I: Input, O: Output, I/O: In/Output, RF: Analog RF Port 3. Electrical and Thermal Specifications 3.1 Recommended Operating Conditions Parameters Min Typ Max Units Ambient Operating Temperature -10 25 70 ℃ External Antenna VSWR 1 1.92 2.5 / VDD33 3.1 3.3 3.5 V VDIO(1.8V) 1.7 1.8 2.0 V Supply Voltage 3.2 Current Consumption Conditions : VDD33=3.
2.4G 54Mbps TX (RF-Test) 260 270 mA 2.4G 54Mbps RX (RF-Test) 60 65 mA 2.4G MCS0(HT20) TX (RF-Test) 275 287 mA 2.4G MCS0(HT20) RX (RF-Test) 60 70 mA 2.4G MCS7(HT20) TX (RF-Test) 265 282 mA 2.4G MCS7(HT20) RX (RF-Test) 59 70 mA 2.4G MCS7(HT40) TX (RF-Test) 275 291 mA 2.4G MCS7(HT40) RX (RF-Test) 60 80 mA 4. Interface Functional and Timing Specifications 4.1 SDIO Power On Sequence 6 http://www.b-link.net.
4.2 SDIO Timing 5. WiFi RF Specifications 5.1 2.4G WiFi RF Specification Conditions : VDD33=3.3V ; Ta:25℃ Features Description WLAN Standard IEEE 802.11b/g/n CSMA/CA Frequency Range 2.412~2.462GHz (2.4GHz ISM Band) Channels Ch1~Ch11 (For 20MHz Channels) 802.11b (DSSS): DBPSK, DQPSK, CCK; Modulation 802.11g (OFDM): BPSK, QPSK, 16QAM, 64QAM; 802.11n (OFDM): BPSK, QPSK, 16QAM, 64QAM; 802.11b: 1, 2, 5.5, 11Mbps; Date Rate 802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps; 802.
6. Mechanical Specifications 6.1 Module Outline Drawing Module dimension: 12.0*12.0*1.5mm (L*W*H; Tolerance: ±0.15mm) 8 http://www.b-link.net.
Module Bow and Twist：≤0.1mm 6.2 Mechanical Dimensions 7. Application Information 7.1 Typical Application Circuit 9 http://www.b-link.net.
7.2 Recommend PCB Layout Footprint Design size mm Top View 7.3 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250℃. 10 http://www.b-link.net.
8. Key Components Of Module No. Parts Specification Manufacturer 1 Chipset RTL8189FTV-VC-CG Realtek Note Shenzhen Tie Fa Technology limited 2 PCB BL-M8189FS6 Guangdong KINGSHINE ELECTRONICS CO., LTD Quzhou Sunlord Electronics Co., Ltd HUBEI TKD ELECTRONICS TECHNOLOGY CO., LTD. LUCKI CM ELECTRONICS CO., LTD 3 Crystal 26MHz-9pF-10ppm-3225 HOSONIC ELECTRONIC CO., LTD. SHENZHEN KAIYUEXIANG ELECTRONICS CO., LTD WAY ON ELECTRONIC CO., LTD. 4 TVS diode TVS diode 0402 UN Semiconductor Co.
Package specification: 1. 2000 modules per roll and 10,000 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 28mm (with a width of 24mm carrying belt). 4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag. 5. Each carton is packed with 5 boxes. 9.
ISED Statement ‐ English: This device complies with Industry Canada license‐exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, a nd (2) This device must accept any interference, including interference that may cause undesired operation of the device. The digital apparatus complies with Canadian CAN ICES‐3 (B)/NMB‐3(B). ‐ French: Le présentappareilestconforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
separate Canada authorization. Note Importante: Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l' IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.
FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’ s authority to operate the equipment.
Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.
